Piezoelectric sensor

Abstract

The utility model provides a piezoelectric sensor, which comprises a packaging structure formed by a main body and an upper shell, a packaging cavity is arranged on the main body, a PCB is arranged in the packaging cavity, the packaging cavity is divided into a piezoelectric element arrangement space and an electronic element arrangement space by the PCB, and the piezoelectric element arrangement space and the electronic element arrangement space are arranged in the packaging cavity. A piezoelectric element arrangement space is formed in the PCB, a piezoelectric ceramic piece and a gasket are arranged in the piezoelectric element arrangement space, and the piezoelectric ceramic piece is arranged on the PCB and electrically connected with the PCB; and the gasket is arranged between the piezoelectric ceramic piece and the upper shell and is used for reinforcing the matching between the piezoelectric ceramic piece and the upper shell. According to the utility model, various performances such as sensitivity and the like of the piezoelectric sensor can be improved, so that the requirements of users are met.

Description

Technical Field

[0001] The utility model relates to the technical field of sensors, and more specifically, to a piezoelectric sensor. Background Art

[0002] Piezoelectric sensors are sensors that utilize the piezoelectric effect generated by certain dielectrics when subjected to force. The so-called piezoelectric effect refers to the phenomenon that when certain dielectrics are deformed by an external force in a certain direction, the polarization of internal charges will generate charges on their surface.

[0003] At present, piezoelectric sensors are mainly used in industrial automation control and automotive fields. In order to solve the problem of insufficient sensitivity of piezoelectric ceramic pieces, the utility model urgently needs to provide a new piezoelectric sensor. Utility Model Content

[0004] In view of the above problems, the purpose of the present invention is to provide a piezoelectric sensor to improve the sensitivity and other performance of the piezoelectric sensor to meet the needs of users.

[0005] The utility model provides a piezoelectric sensor, comprising a packaging structure formed by a main body and an upper shell, wherein a packaging cavity is provided on the main body, a PCB is provided in the packaging cavity, and the PCB divides the packaging cavity into a piezoelectric element arrangement space and an electronic element arrangement space, wherein:

[0006] A piezoelectric ceramic sheet and a gasket are arranged in the piezoelectric element arrangement space, wherein the piezoelectric ceramic sheet is arranged on the PCB and electrically connected to the PCB;

[0007] The gasket is arranged between the piezoelectric ceramic sheet and the upper shell, and is used to strengthen the acting force between the piezoelectric ceramic sheet and the upper shell.

[0008] In addition, a preferred structure is that a fixing column is provided inside the packaging cavity, and a through hole is provided on the PCB.

[0009] The PCB is fixed on the fixing column by screws adapted to the through holes.

[0010] In addition, a preferred structure is that a preset distance is set between the top of the fixing post and the bottom of the packaging cavity, the PCB is fixed on the top of the fixing post, and is suspended in the packaging cavity through the fixing post.

[0011] In addition, a preferred structure is that the number of the piezoelectric ceramic sheets is 2, and the piezoelectric ceramic sheets are arranged corresponding to the gaskets.

[0012] In addition, a preferred structure is that the piezoelectric ceramic sheet is used to receive elastic waves or pressing force transmitted from the outside.

[0013] In addition, a preferred structure is that the piezoelectric ceramic sheet is electrically connected to the PCB via a power line, an FPC or a patch.

[0014] In addition, a preferred structure is that the gasket is a soft foam gasket, a silicone gasket or a hard plastic gasket.

[0015] In addition, a preferred structure is that the main body includes an assembly part and an external connection part, the packaging cavity is provided on the assembly part, and an external connection port is provided on the external connection part, wherein,

[0016] The main body is connected to an external circuit through the external connection port.

[0017] In addition, a preferred structure is that the PCB is electrically connected to the electronic components in the electronic component arrangement space through welding pins.

[0018] In addition, a preferred structure is that the upper shell is fixed to the main body by ultrasonic welding.

[0019] As can be seen from the above technical solution, the piezoelectric sensor provided by the present invention is electrically connected to a PCB via a piezoelectric ceramic sheet. When subjected to elastic waves or compressive forces transmitted from the outside, the piezoelectric ceramic sheet converts the elastic waves or compressive forces into electrical signals and transmits them to the PCB, which then processes the received signals. Furthermore, a gasket is provided between the upper shell and the piezoelectric ceramic sheet to absorb machining errors in the upper shell or main body, ensuring a tight fit between the piezoelectric ceramic sheet and the upper shell.

[0020] To achieve the above and related purposes, one or more aspects of the present invention include features described in detail below. The following description and accompanying drawings detail certain exemplary aspects of the present invention. However, these aspects are merely indicative of some of the various ways in which the principles of the present invention may be employed. Furthermore, the present invention is intended to include all such aspects and their equivalents. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] By referring to the following description in conjunction with the accompanying drawings, and with a more comprehensive understanding of the present invention, other objects and results of the present invention will become more clear and easy to understand. In the accompanying drawings:

[0022] Figure 1 This is a schematic diagram of the explosion structure of a piezoelectric sensor according to an embodiment of the present utility model;

[0023] Figure 2 Schematic diagram of the top view of the piezoelectric sensor according to an embodiment of the present invention;

[0024] Figure 3 Schematic diagram of the side view of the piezoelectric sensor according to an embodiment of the present invention.

[0025] Reference numerals include:

[0026] 1. Upper shell, 2. Gasket, 3. Piezoelectric ceramic sheet, 4. PCB, 5. Main body; 51. Packaging part, 511. Packaging cavity, 512. Fixing column, 52. External connection part, 521. External port.

[0027] The same reference numerals throughout the drawings indicate similar or corresponding features or functions. DETAILED DESCRIPTION

[0028] In the following description, for illustrative purposes, numerous specific details are set forth to provide a comprehensive understanding of one or more embodiments. However, it will be apparent that the embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form to facilitate description of one or more embodiments.

[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0030] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0031] In order to illustrate the structure of the piezoelectric sensor provided by the utility model, Figures 1 to 3 The structure of the piezoelectric sensor is illustrated from different angles. Specifically, Figure 1 The explosion structure of the piezoelectric sensor according to the embodiment of the present utility model is shown; Figure 2 The top view structure of the piezoelectric sensor according to an embodiment of the present utility model is shown; Figure 3 The side view structure of the piezoelectric sensor according to the embodiment of the present invention is shown.

[0032] like Figures 1 to 3As shown together, the piezoelectric sensor provided by the present invention includes a packaging structure formed by a main body 5 and an upper shell 1, a packaging cavity 511 is arranged on the main body 5, and a PCB4 is arranged in the packaging cavity 511, and the PCB4 separates the packaging cavity 511 into a piezoelectric element arrangement space and an electronic component arrangement space, wherein a piezoelectric ceramic piece 3 and a gasket 2 are arranged in the piezoelectric element arrangement space, wherein the piezoelectric ceramic piece 3 is arranged on the PCB4 and electrically connected to the PCB4; the gasket 2 is arranged between the piezoelectric ceramic piece 3 and the upper shell 1, and is used to strengthen the fit between the piezoelectric ceramic piece 3 and the upper shell 1.

[0033] In the embodiment of the present invention, the main body 5 includes a packaging portion 51 and an external connection portion 52. The packaging portion 51 and the upper shell 1 form a packaging structure. The packaging cavity 511 is provided on the packaging portion 51. The PCB 4, the piezoelectric ceramic plate 3, and the gasket are all disposed within the packaging cavity 511. The external connection portion 52 is provided with an external connection port 521, through which the PCB 4 in the main body 1 is connected to an external circuit.

[0034] Among them, a fixing column 512 is provided at the corner inside the packaging cavity 511, and four through holes are provided on the four corners of the PCB4. The through holes are screw holes, and each through hole is adapted to a screw. The PCB4 is fixed to the fixing column 512 through the four through holes and the screws adapted to the through holes.

[0035] A preset distance is set between the top of the fixing column 512 and the bottom of the packaging cavity 511, and the PCB4 is fixed on the top of the fixing column 512. The PCB4 is suspended in the packaging cavity 511 through the fixing column 512, and the PCB4 divides the packaging cavity 511 into two parts, namely the piezoelectric component arrangement space and the electronic component arrangement space.

[0036] The various electronic components of the piezoelectric sensor are arranged in the electronic component arrangement space, and the piezoelectric element is encapsulated in the piezoelectric element arrangement space. The piezoelectric element includes a PCB4, two piezoelectric ceramic sheets 3 arranged on the PCB4, and a gasket 2 arranged on each piezoelectric ceramic sheet 3, that is, the piezoelectric ceramic sheet 3 and the gasket 2 are arranged in a one-to-one correspondence.

[0037] The piezoelectric ceramic 3 receives elastic waves or compressive forces from an external source, converts them into electrical signals, and transmits these signals to the PCB 4. The piezoelectric ceramic 3 can be electrically connected to the PCB 4 in a variety of ways, including using a power cord, flexible printed circuit board (FPC), or patch cord. In specific applications, the appropriate electrical connection method is selected based on practical circumstances and is not limited to a specific method.

[0038] Among them, the gasket 2 is arranged between the piezoelectric ceramic piece 3 and the upper shell 1. The gasket 2 adopts a soft foam gasket, a silicone gasket or a hard plastic gasket. The function of the gasket 2 is to absorb the processing error of the upper shell 1 or the main body 5 caused by processing, so that the piezoelectric ceramic piece 3 and the upper shell 1 can fit tightly. In specific applications, the upper shell 1 is subjected to elastic waves or pressure, which will be transmitted to the piezoelectric ceramic piece 3 through the gasket 2. The piezoelectric ceramic piece 3 converts the received elastic waves or pressure into electrical signals and transmits them to the PCB 4. It should be noted that the material of the gasket 2 is not limited to a specific material. In specific applications, a suitable material can be used according to the actual situation as long as the tight fit between the piezoelectric ceramic piece 3 and the upper shell 1 is met.

[0039] The PCB 4 is electrically connected to the electronic components in the electronic component arrangement space through welding pins, and the PCB 4 is electrically connected to the external circuit through the external connection portion 52. The PCB 4 can be connected to all existing universal interfaces and adapted to all known electronic interfaces, such as Figure 2 In the embodiment shown, the device is connected to the outside via the external connection port 521 .

[0040] In addition, in the embodiment of the present invention, the upper shell 1 is fixed to the main body 5 by ultrasonic welding. In specific applications, the upper shell 1 and the main body 5 can also be fixed by other methods, which are not specifically limited here.

[0041] In a specific embodiment of the present invention, a piezoelectric sensor is applied to a car trunk. Before the piezoelectric sensor is applied to the car, a command to knock twice to open the car trunk is set in advance. The piezoelectric sensor is attached to a specific position of the car, wherein the upper shell is attached to a certain position of the car by double-sided tape or other fixing methods. When the car trunk needs to be opened, the surface corresponding to the upper shell 1 is knocked. The knocking force is transmitted to the upper shell 1 through the surface, and then to the piezoelectric ceramic plate 3 through the upper shell 1 and the gasket 2. The piezoelectric ceramic plate 3 processes the received force and transmits the generated electrical signal to the PCB 4. The PCB 4 transmits the signal to the car's onboard system through the external port 521, thereby completing the opening of the car trunk.

[0042] The above description is merely an optional embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made based on the contents of the present invention specification and drawings, or direct / indirect application in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A piezoelectric sensor, comprising a packaging structure formed by a main body and an upper shell, wherein a packaging cavity is provided on the main body, characterized in that: A PCB is provided in the packaging cavity, and the PCB divides the packaging cavity into a piezoelectric element arrangement space and an electronic element arrangement space, wherein: A piezoelectric ceramic sheet and a gasket are arranged in the piezoelectric element arrangement space, wherein the piezoelectric ceramic sheet is arranged on the PCB and electrically connected to the PCB; The gasket is arranged between the piezoelectric ceramic sheet and the upper shell, and is used to strengthen the acting force between the piezoelectric ceramic sheet and the upper shell.

2. The piezoelectric sensor according to claim 1, wherein A fixing column is provided inside the packaging cavity, and a through hole is provided on the PCB. The PCB is fixed on the fixing column by screws adapted to the through holes.

3. The piezoelectric sensor according to claim 2, wherein: A preset distance is set between the top of the fixing post and the bottom of the packaging cavity. The PCB is fixed on the top of the fixing post and is suspended in the packaging cavity through the fixing post.

4. The piezoelectric sensor according to claim 1, wherein The number of the piezoelectric ceramic sheets is 2, and the piezoelectric ceramic sheets are arranged corresponding to the gaskets.

5. The piezoelectric sensor according to claim 1, wherein The piezoelectric ceramic piece is used to receive elastic waves or pressing force transmitted from the outside.

6. The piezoelectric sensor according to claim 1, wherein The piezoelectric ceramic sheet is electrically connected to the PCB via a power line, an FPC or a patch.

7. The piezoelectric sensor according to claim 1, wherein The gasket is a soft foam gasket, a silicone gasket or a hard plastic gasket.

8. The piezoelectric sensor according to claim 1, wherein The main body includes an assembly part and an external connection part, the packaging cavity is arranged on the assembly part, and an external connection port is arranged on the external connection part, wherein, The main body is connected to an external circuit through the external connection port.

9. The piezoelectric sensor according to claim 1, wherein The PCB is electrically connected to the electronic components in the electronic component arrangement space through welding pins.

10. The piezoelectric sensor according to claim 1, wherein The upper shell is fixed to the main body by ultrasonic welding.

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