Bluetooth earphone mainboard welding device

Abstract

The utility model relates to the technical field of Bluetooth headset accessory processing, and discloses a Bluetooth headset mainboard welding device which comprises a processing table, a guide rail, a carrying seat, a welding head and a sliding seat, the guide rail is fixedly installed on the processing table, the carrying seat is in sliding connection with the guide rail, a positioning groove is formed in the surface of the carrying seat, and the welding head is arranged in the positioning groove. A driving assembly used for driving the carrying base to move is arranged on the guide rail, an electric push rod is fixedly installed at the upper end of the machining table, the welding head is fixedly installed at the telescopic end of the electric push rod through a lifting base, a vertical frame is fixedly installed on the carrying base, and the sliding base is in sliding connection with the vertical frame. A transmission stud is rotationally installed on the vertical frame, and a guide rod penetrates through the sliding seat in a sliding mode, the stability of the chip module when the chip module is welded on the Bluetooth headset mainboard is improved, the hidden danger that the chip module deviates is reduced, and the attaching degree of pins of the chip module and the Bluetooth headset mainboard is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of processing accessories of Bluetooth earphones, and more specifically, to a Bluetooth earphone mainboard welding device. Background Art

[0002] Bluetooth headsets are wireless headsets that use Bluetooth technology. The principle of Bluetooth headsets is that the decoding chip in the mobile phone decodes music files such as MP3, generates digital signals and sends them to the Bluetooth headset via Bluetooth. The Bluetooth headset receives the digital signal and converts it into an analog signal that the human ear can understand through the digital-to-analog conversion chip inside the Bluetooth headset. The motherboard is the core component of the Bluetooth headset. When processing the Bluetooth headset motherboard, it needs to be soldered to the chip module.

[0003] During the use of the existing Bluetooth headset motherboard welding device, due to the lack of limiting functional components, the chip module has poor stability when welding on the Bluetooth headset motherboard, which increases the hidden danger of chip module offset, and the pins of the chip module have poor fit with the Bluetooth headset motherboard, which easily affects the overall welding effect. Based on this, the utility model designs a Bluetooth headset motherboard welding device to solve the above problems. Utility Model Content

[0004] The purpose of the present invention is to provide a Bluetooth headset motherboard welding device to solve the problems raised in the above background technology.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A Bluetooth headset motherboard welding device comprises a processing table, a guide rail, a carrier, a welding head and a slide, the guide rail is fixedly mounted on the processing table, the carrier is slidably connected to the guide rail, a positioning groove is provided on the surface of the carrier, a driving assembly for driving the carrier to move is provided on the guide rail, an electric push rod is fixedly mounted on the upper end of the processing table, the welding head is fixedly mounted on the telescopic end of the electric push rod through a lifting seat, a vertical frame is fixedly mounted on the carrier, the slide is slidably connected to the vertical frame, a transmission stud is rotatably mounted on the vertical frame, the slide is threadedly sleeved on the outside of the transmission stud, a guide rod is slidably penetrated on the slide, and a pressure plate is fixedly mounted on the bottom end of the guide rod, a spring is fixedly connected between the slide and the pressure plate, and a plurality of limit pressure columns are fixedly connected to the bottom surface of the pressure plate at intervals.

[0007] As a preferred technical solution of the present invention, a stopper is fixedly sleeved on the outside of the transmission stud and located below the slide seat, and the cross-section of the stopper is annular.

[0008] As an optimal technical solution of the present invention, the drive assembly includes a motor and a screw shaft, the motor is fixedly installed at one end of the guide rail, the screw shaft is fixedly connected to the driving shaft of the motor, and the carrier is threadedly sleeved on the outside of the screw shaft.

[0009] As a preferred technical solution of the present invention, a bearing seat is fixedly installed on the inner side of the guide rail, and the bearing seat is rotatably connected to the end of the screw shaft.

[0010] As a preferred technical solution of the present invention, the transmission stud movably passes through the top of the stand, and the upper end of the transmission stud is fixedly connected to a knob block.

[0011] As a preferred technical solution of the present invention, an anti-slip gasket is fixedly installed on the bottom of the limiting pressure column, and the anti-slip gasket is a component made of rubber.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0013] The utility model places the Bluetooth headset mainboard on the positioning groove of the carrier, and the chip module is attached to the corresponding part of the Bluetooth headset mainboard. When the transmission stud is screwed and rotated, the slide can be driven to move downward, so that the various limiting pressure columns of the pressure plate are pressed toward the chip module, and the spring gradually contracts until the slide contacts the stop block. The stop block can block the slide when it descends, preventing the limiting pressure columns from exerting excessive pressure on the chip module, thereby facilitating the chip module to be pressed and limited on the Bluetooth headset mainboard, improving the stability of the chip module when it is welded on the Bluetooth headset mainboard, reducing the hidden danger of the chip module being offset, and ensuring the fit between the pins of the chip module and the Bluetooth headset mainboard, which is conducive to ensuring the overall welding effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the three-dimensional structure of a Bluetooth headset motherboard welding device of the present utility model;

[0015] Figure 2 This is a schematic cross-sectional view of a Bluetooth headset motherboard welding device of the present invention;

[0016] Figure 3 This is a front view structural diagram of a Bluetooth headset motherboard welding device of the present invention;

[0017] Figure 4 The utility model is a schematic diagram of the three-dimensional structure of a slide seat and a pressure plate in a Bluetooth headset motherboard welding device.

[0018] In the figure: 1. Processing table; 101. Electric push rod; 102. Lifting seat; 2. Guide rail; 201. Drive assembly; 202. Motor; 203. Screw shaft; 204. Bearing seat; 3. Carrier; 301. Positioning groove; 4. Welding head; 5. Stand; 501. Slide; 502. Drive stud; 503. Stop block; 6. Guide rod; 601. Pressure plate; 602. Limit pressure column; 603. Anti-slip gasket; 7. Spring; 8. Bluetooth headset motherboard; 9. Chip module. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] like Figures 1 to 4 As shown, the utility model provides a Bluetooth headset motherboard welding device, including a processing table 1, a guide rail 2, a carrier 3, a welding head 4 and a slide 501, the guide rail 2 is fixedly installed on the processing table 1, the carrier 3 is slidably connected to the guide rail 2, and a positioning groove 301 is opened on the surface of the carrier 3. The Bluetooth headset motherboard 8 can be placed on the positioning groove 301 of the carrier 3, and the chip module 9 is attached to the corresponding part of the Bluetooth headset motherboard 8. A driving component 201 for driving the carrier 3 to move is provided on the guide rail 2. An electric push rod 101 is fixedly installed on the upper end of the processing table 1, and the welding head 4 is fixedly installed on the telescopic end of the electric push rod 101 through a lifting seat 102. The electric push rod 101 can be used to The welding head 4 is driven to move up and down to adjust the height position of the welding head 4. A stand 5 is fixedly installed on the carrier 3, and the slide 501 is slidably connected to the stand 5. A transmission stud 502 is rotatably installed on the stand 5, and the slide 501 is threadedly sleeved on the outside of the transmission stud 502. A guide rod 6 slides through the slide 501, and a pressure plate 601 is fixedly installed on the bottom end of the guide rod 6. A spring 7 is fixedly connected between the slide 501 and the pressure plate 601, and a plurality of limiting pressure columns 602 are fixedly connected to the bottom surface of the pressure plate 601 at intervals. When the transmission stud 502 is screwed and rotated, the slide 501 can be driven to move downward, so that the limiting pressure columns 602 of the pressure plate 601 are pressed toward the chip module 9.

[0021] Among them, such as Figure 2 As shown, the outside of the transmission screw 502 is fixedly sleeved with a stopper 503 located below the slide 501. The cross-sectional shape of the stopper 503 is annular. The stopper 503 can block the slide 501 when it descends, preventing the limiting pressure column 602 from exerting excessive pressure on the chip module 9.

[0022] Among them, such as Figure 2 As shown, the driving assembly 201 includes a motor 202 and a screw shaft 203. The motor 202 is fixedly installed at one end of the guide rail 2, the screw shaft 203 is fixedly connected to the driving shaft of the motor 202, and the carrier 3 is threadedly sleeved on the outside of the screw shaft 203. The motor 202 is used to drive the screw shaft 203 to rotate, which can drive the carrier 3 to move along the guide rail 2.

[0023] Among them, such as Figure 2 As shown, a bearing seat 204 is fixedly installed on the inner side of the guide rail 2, and the bearing seat 204 is rotatably connected to the end of the screw shaft 203 to ensure the operating stability of the screw shaft 203 when rotating.

[0024] Among them, such as Figure 1 As shown, the transmission stud 502 is movable through the top of the stand 5, and the upper end of the transmission stud 502 is fixedly connected with a knob block, so as to facilitate the rotation of the transmission stud 502.

[0025] Among them, such as Figure 4 As shown, an anti-skid pad 603 is fixedly installed on the bottom of the limiting pressure column 602. The anti-skid pad 603 is a component made of rubber, which makes the bottom of the limiting pressure column 602 have good buffering and anti-skid performance.

[0026] The working principle of this utility model:

[0027] When the Bluetooth headset motherboard 8 is in use, the Bluetooth headset motherboard 8 is placed on the positioning groove 301 of the carrier 3, and the chip module 9 is attached to the corresponding part of the Bluetooth headset motherboard 8. When the transmission stud 502 is screwed and rotated using the knob block, the slide 501 can be driven to move downward, so that the various limit pressure columns 602 of the pressure plate 601 are pressed toward the chip module 9, and the spring 7 gradually contracts until the slide 501 contacts the stop block 503. The stop block 503 can be used to block the slide 501 during descent to prevent the limit pressure columns 602 from exerting excessive pressure on the chip module 9. At this time, the chip module 9 is pressed and limited on the Bluetooth headset motherboard 8. The electric push rod 101 is used to drive the welding head 4 to move up and down to adjust the height position of the welding head 4. The chip module 9 can be spot-welded on the Bluetooth headset motherboard 8. The motor 202 is used to drive the screw shaft 203 to rotate, which can drive the carrier 3 to move along the guide rail 2, thereby adjusting the horizontal position of the Bluetooth headset motherboard 8 and the chip module 9, which is convenient for continuous spot welding.

[0028] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0029] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A Bluetooth headset motherboard welding device, characterized by: It comprises a processing table (1), a guide rail (2), a carrier (3), a welding head (4) and a slide (501); The guide rail (2) is fixedly mounted on the processing table (1), the carrier (3) is slidably connected to the guide rail (2), a positioning groove (301) is provided on the surface of the carrier (3), a driving assembly (201) for driving the carrier (3) to move is provided on the guide rail (2), an electric push rod (101) is fixedly mounted on the upper end of the processing table (1), and the welding head (4) is fixedly mounted on the telescopic end of the electric push rod (101) through a lifting seat (102); A stand (5) is fixedly mounted on the carrier (3), the slide (501) is slidably connected to the stand (5), a transmission stud (502) is rotatably mounted on the stand (5), the slide (501) is threadedly sleeved on the outside of the transmission stud (502), a guide rod (6) is slidably passed through the slide (501), a pressure plate (601) is fixedly mounted on the bottom end of the guide rod (6), a spring (7) is fixedly connected between the slide (501) and the pressure plate (601), and a plurality of limit pressure columns (602) are fixedly connected to the bottom surface of the pressure plate (601) at intervals.

2. A Bluetooth headset motherboard welding device according to claim 1, characterized in that: The outside of the transmission stud (502) is located below the slide seat (501) and is fixedly sleeved with a stopper (503), and the cross-section of the stopper (503) is annular.

3. The Bluetooth headset motherboard welding device according to claim 1, characterized in that: The driving assembly (201) comprises a motor (202) and a screw shaft (203); the motor (202) is fixedly mounted on one end of the guide rail (2); the screw shaft (203) is fixedly connected to the driving shaft of the motor (202); and the carrier (3) is threadedly sleeved on the outside of the screw shaft (203).

4. The Bluetooth headset motherboard welding device according to claim 3, characterized in that: A bearing seat (204) is fixedly mounted on the inner side of the guide rail (2), and the bearing seat (204) is rotatably connected to the end of the screw shaft (203).

5. The Bluetooth headset motherboard welding device according to claim 1, characterized in that: The transmission stud (502) is movably inserted into the top of the stand (5), and the upper end of the transmission stud (502) is fixedly connected to a knob block.

6. The Bluetooth headset motherboard welding device according to claim 1, characterized in that: An anti-skid pad (603) is fixedly mounted on the bottom of the position-limiting pressure column (602), and the anti-skid pad (603) is a component made of rubber.

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