Equipment suitable for thinning packaged product

Abstract

The utility model discloses equipment suitable for thinning packaged products, which comprises a frame body, a conveying assembly, a polishing assembly and a detection device, and the frame body is provided with a polishing position; the conveying assembly is arranged on the frame body and comprises a chuck capable of moving to a polishing position, and a rotating mechanism is arranged at the bottom of the chuck to drive a product located on the chuck to rotate; the polishing assembly comprises a fine polishing assembly and a rough polishing assembly which are adjacently arranged, and the fine polishing assembly and the rough polishing assembly are connected to the frame body and can move to the position above the polishing position; the detection device is arranged on the frame body and comprises a first detection assembly making contact with the product and a second detection assembly spaced from the product so as to detect the thickness of the product above the base plate, the product does not need to be moved in the polishing process, and only the rough polishing assembly and the fine polishing assembly need to be sequentially moved to the position above the polishing position. And the influence of low production efficiency caused by thinning of packaged products due to back-and-forth movement of the products in the prior art is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a device suitable for thinning packaged products. Background Art

[0002] Traditional packaging technologies, such as flip-chip packaging and wire bonding, utilize complex interconnect structures, including wires, vias, and solder balls, for signal interconnects. These complex interconnect structures can affect the performance of chip signal transmission. In fan-out packaging, the rewiring process is divided into two main processes: chip-first and chip-last, depending on the order of the rewiring process. Furthermore, the chip placement method is divided into two main processes: face-up and face-down.

[0003] Based on the operational convenience of the four aforementioned processes, packaging houses have developed three combined processes: face-up die-first, face-down die-first, and face-down die-last. The face-up die-first process primarily involves die reassembly, encapsulation, polishing to expose copper pillars, rewiring and balling, and carrier removal.

[0004] In the process of grinding the exposed copper pillars, existing packaging product thinning equipment usually adopts a concentric configuration of fine grinding wheels and coarse grinding wheels. The packaging product is first thinned by the coarse grinding wheel on the outer peripheral side, and then the packaging product is moved under the fine grinding wheel on the inner peripheral side to be polished again. The polishing process requires the packaging product to move back and forth and the thinning equipment to move up and down, which makes the production efficiency of packaging product thinning low.

[0005] Therefore, how to avoid the impact of low production efficiency caused by thinning of packaged products to improve the production efficiency of thinning of packaged products is a technical problem that those skilled in the art currently need to solve. Utility Model Content

[0006] The purpose of the utility model is to provide a device suitable for thinning packaged products, so as to avoid the influence of low production efficiency of thinning packaged products and improve the production efficiency of thinning packaged products.

[0007] To achieve the above-mentioned purpose, the present invention provides a device suitable for thinning packaged products, comprising:

[0008] The frame is equipped with a grinding position;

[0009] The conveying assembly is arranged on the frame, and the conveying assembly includes a chuck that can be moved to the grinding position, and a rotating mechanism is provided at the bottom of the chuck to drive the product on the chuck to rotate;

[0010] The grinding assembly includes a fine grinding assembly and a coarse grinding assembly arranged adjacent to each other, the fine grinding assembly and the coarse grinding assembly being connected to the frame and both being able to move above the grinding position;

[0011] The detection device is arranged on the frame and comprises a first detection component contacting the product and a second detection component spaced apart from the product to detect the thickness of the product above the substrate.

[0012] Preferably, a circular first positioning module and a square second positioning module are provided on the top of the chuck, and through holes are provided on the first positioning module and the second positioning module, and the vacuum component is connected to the through holes to adsorb the product.

[0013] Preferably, the frame includes a first bracket for fixing the conveying assembly, a second bracket for fixing the polishing assembly, and a third bracket for fixing the detection device, the second bracket and the third bracket are spaced apart and both are located above the first bracket, and a first slide rail is provided on a side of the second bracket facing the third bracket;

[0014] The fine grinding assembly includes a first fixing assembly and a fine grinding spindle arranged on a side of the first fixing assembly away from the second bracket;

[0015] The rough grinding assembly includes a second fixing assembly and a rough grinding spindle arranged on a side of the second fixing assembly away from the second bracket;

[0016] The first fixing assembly and the second fixing assembly are both provided with a first sliding block capable of slidingly cooperating with the first sliding rail.

[0017] Preferably, the first fixing assembly includes a first connecting plate on which the first slider is provided and a first mounting plate capable of vertically moving relative to the first connecting plate, and the fine grinding spindle is mounted on the first mounting plate;

[0018] The second fixing assembly includes a second connecting plate on which the first slider is provided and a second mounting plate capable of vertically moving relative to the second connecting plate, wherein the rough grinding spindle is mounted on the second mounting plate;

[0019] The fine grinding spindle and the rough grinding spindle can move vertically and rotate around their own axes to grind the product.

[0020] Preferably, there are two first slide rails, which are spaced apart in the upper and lower directions. A ball screw is provided between the two first slide rails. The first mounting plate and the second mounting plate are both provided with sleeves for the ball screw to pass through. One end of the ball screw is connected to the output end of the first power source to drive the first mounting plate and the second mounting plate to move back and forth along the axial direction of the ball screw.

[0021] Preferably, a fixed frame is provided at the bottom of the chuck, and the first bracket is also provided with a loading position and a moving mechanism connected to the fixed frame. The loading position and the grinding position are respectively located at the two ends of the moving mechanism, and the moving mechanism can drive the fixed frame to move back and forth between the loading position and the grinding position.

[0022] Preferably, it also includes a brush cleaning assembly and a chuck cleaning assembly. A second slide rail is provided on the top of the third bracket. The chuck cleaning assembly is movably connected to the second slide rail through a first adapter plate to clean the chuck that has been moved to the loading position. The brush cleaning assembly is movably connected to the second slide rail through a second adapter plate to clean the polished product.

[0023] Preferably, it also includes a two-fluid cleaning component arranged on the first bracket, the two-fluid cleaning component is located on the side of the third bracket away from the second bracket, and the two-fluid cleaning component is used to clean and dry the product after being cleaned by the brush cleaning component.

[0024] Preferably, a grinding wheel dressing unit is further provided on the first bracket, and the grinding wheel dressing units are arranged at intervals on both sides of the grinding position to dress the grinding wheels located at the bottom of the fine grinding spindle and the rough grinding spindle.

[0025] Compared with the above-mentioned background technology, the equipment suitable for thinning packaged products provided by the present invention includes a frame, a conveying assembly, a grinding assembly and a detection device, the frame is provided with a grinding position; the conveying assembly is arranged on the frame, the conveying assembly includes a chuck that can be moved to the grinding position, and the bottom of the chuck is provided with a rotating mechanism to drive the product located on the chuck to rotate; the grinding assembly includes a fine grinding assembly and a rough grinding assembly arranged adjacent to each other, the fine grinding assembly and the rough grinding assembly are connected to the frame and can both be moved above the grinding position; the detection device is arranged on the frame, the detection device includes a first detection assembly that contacts the product and a second detection assembly spaced from the product to detect the thickness of the product above the substrate.

[0026] Specifically, the adjacent rough grinding components and fine grinding components are moved relative to the frame in turn to the top of the grinding position to grind the product. The product is always located at the grinding position during the grinding process. The first detection component in contact with the product and the second detection component separated from the product detect the thickness of the product in real time to control the grinding process. With this arrangement, the product does not need to be moved during the grinding process. The rough grinding component and the fine grinding component only need to be moved to the top of the grinding position in turn. This avoids the low production efficiency of the thinning of the packaged product caused by the need to move the product back and forth and align different grinding parts in the prior art, thereby improving the production efficiency of the thinning of the packaged product. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0028] Figure 1A schematic structural diagram of a device for thinning packaged products provided by an embodiment of the present utility model;

[0029] Figure 2 for Figure 1 A partial enlarged view of .

[0030] in:

[0031] 110 - first bracket, 111 - moving mechanism, 112 - two-fluid cleaning assembly, 113 - grinding wheel dressing unit, 120 - second bracket, 121 - first slide rail, 122 - ball screw, 123 - first power source, 130 - third bracket, 131 - second slide rail;

[0032] 200-chuck;

[0033] 310-first fixed assembly, 320-fine grinding spindle;

[0034] 410 - second fixing assembly, 420 - rough grinding spindle;

[0035] 510 - first detection component, 520 - second detection component;

[0036] 600-brush cleaning assembly;

[0037] 700-Chuck cleaning assembly. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0039] In order to enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0040] In the description of the present invention, it should be understood that the terms "up", "down", "top", "bottom", "left" and "right" indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the positions or elements referred to must have a specific direction, be constructed and operate in a specific direction. Therefore, they should not be understood as limitations of the present invention.

[0041] The purpose of the utility model is to provide a device suitable for thinning packaged products, so as to avoid the influence of low production efficiency of thinning packaged products and improve the production efficiency of thinning packaged products.

[0042] It should be noted that, in this embodiment, the direction X in the accompanying drawings is defined as the first direction.

[0043] See also Figure 1 and Figure 2 To achieve the above-mentioned purpose, the utility model provides a device suitable for thinning packaged products, including a frame, a conveying component, a polishing component and a detection device.

[0044] The frame is provided with a grinding position; the conveying assembly is arranged on the frame, and the conveying assembly includes a chuck 200 that can be moved to the grinding position, and a rotating mechanism is provided at the bottom of the chuck 200 to drive the product located on the chuck 200 to rotate.

[0045] The grinding assembly includes a fine grinding assembly and a rough grinding assembly arranged adjacent to each other. The fine grinding assembly and the rough grinding assembly are connected to the frame and can be moved above the grinding position. The grinding of the product sealing and testing end often removes a large amount of material. The use of fine grinding assembly and rough grinding assembly can greatly reduce the consumption of grinding wheels, reduce production costs, and improve the grinding quality of products.

[0046] The detection device is mounted on the frame and includes a first detection component 510 contacting the product and a second detection component 520 spaced apart from the product to detect the thickness of the product above the substrate.

[0047] The product is polished by moving the adjacent rough polishing components and fine polishing components relative to the frame to the top of the polishing position in turn. The product is always located at the polishing position during the polishing process. The first detection component 510 in contact with the product and the second detection component 520 spaced apart from the product detect the thickness of the product in real time to control the polishing process. With this arrangement, the product does not need to be moved during the polishing process. It is only necessary for the rough polishing components and the fine polishing components to be moved to the top of the polishing position in turn. This avoids the low production efficiency of the thinning of the packaged product caused by the need to move the product back and forth and align different polishing parts in the prior art, thereby improving the production efficiency of the thinning of the packaged product.

[0048] A circular first positioning module and a square second positioning module are provided on the top of the chuck 200 , and through holes are provided on the first positioning module and the second positioning module, and the vacuum component is connected to the through holes to adsorb the product.

[0049] The circular first positioning module and the square second positioning module on the chuck 200 are compatible with products of different sizes, such as products with sizes of 300×300 mm, 510×415 mm, 515×510 mm and a diameter of 200 mm.

[0050] In this embodiment, the frame includes a first bracket 110 for fixing the conveying component, a second bracket 120 for fixing the grinding component, and a third bracket 130 for fixing the detection device. The second bracket 120 and the third bracket 130 are spaced apart and are both located above the first bracket 110. The second bracket 120 is provided with a first slide rail 121 on the side facing the third bracket 130; the fine grinding component includes a first fixed component 310 and a fine grinding spindle 320 arranged on the side of the first fixed component 310 away from the second bracket 120; the rough grinding component includes a second fixed component 410 and a rough grinding spindle 420 arranged on the side of the second fixed component 410 away from the second bracket 120; the first fixed component 310 and the second fixed component 410 are both provided with a first slider that can slide with the first slide rail 121.

[0051] Through the cooperation of the first slider and the first slide rail 121, the rough grinding assembly and the fine grinding assembly can move along the extension direction of the first slide rail 121. At the same time, the fine grinding spindle 320 and the rough grinding spindle 420 are suspended on the first slide rail 121 on one side of the second bracket 120 through the first slider, so that the fine grinding spindle 320 and the rough grinding spindle 420 can be separated from the chuck 200 up and down.

[0052] The first fixing assembly 310 includes a first connecting plate on which a first slider is provided and a first mounting plate that can move vertically relative to the first connecting plate, and the fine grinding spindle 320 is mounted on the first mounting plate; by setting a lifting assembly, the first mounting plate can be moved up and down relative to the first connecting plate to drive the bottom of the fine grinding spindle 320 away from and close to the product located on the grinding position.

[0053] The second fixing assembly 410 includes a second connecting plate on which a first slider is provided and a second mounting plate that can move vertically relative to the second connecting plate, and a rough grinding spindle 420 is mounted on the second mounting plate; by setting a lifting mechanism, the second mounting plate can be moved up and down relative to the second connecting plate to drive the bottom of the rough grinding spindle 420 away from and close to the product located on the grinding position.

[0054] The fine grinding spindle 320 and the rough grinding spindle 420 can move vertically. At the same time, a rotating device can be set on the fine grinding spindle 320 and the rough grinding spindle 420 respectively to drive the grinding parts at the bottom of the fine grinding spindle 320 and the rough grinding spindle 420 to rotate around their own axes to grind the product.

[0055] It can be understood that there are two first slide rails 121, which are spaced apart in the upper and lower directions. A ball screw 122 is provided between the two first slide rails 121. The first mounting plate and the second mounting plate are both provided with sleeves for the ball screw 122 to pass through. One end of the ball screw 122 is connected to the output end of the first power source 123 to drive the first mounting plate and the second mounting plate to move back and forth along the axial direction of the ball screw 122.

[0056] It should be noted that the same ball screw 122 is passed through the sleeve on the first mounting plate and the second mounting plate, and the first power source 123 drives the ball screw 122 to rotate, which can drive the first mounting plate and the second mounting plate to move synchronously. The positions of the fine grinding spindle 320 and the rough grinding spindle 420 in the first direction can be regarded as a whole. When moving synchronously to the right, the rough grinding spindle 420 can be moved above the grinding position. When moving synchronously to the left, the fine grinding spindle 320 can be moved above the grinding position.

[0057] In addition, a grinding wheel dressing unit 113 is provided on the first bracket 110, and the grinding wheel dressing units 113 are spaced apart on both sides of the grinding position to dress the grinding wheels located at the bottom of the fine grinding spindle 320 and the rough grinding spindle 420. When the rough grinding spindle 420 moves to above the grinding position, the fine grinding spindle 320 can be moved to the grinding wheel dressing unit 113 located on the right side of the grinding position to dress the grinding workpiece; when the fine grinding spindle 320 moves to above the grinding position, the rough grinding spindle 420 can be moved to the grinding wheel dressing unit 113 located on the left side of the grinding position to dress the grinding workpiece. Large-size products can be ground through the grinding workpiece, and grinding workpieces of various composite materials (EMC, Cu, Si) can be dressed through the grinding wheel dressing unit 113 to ensure the processing performance of the grinding workpiece.

[0058] In some embodiments, the ball screw 122 and the first power source 123 can be set into two groups, and the ball screw 122 and the sleeve correspond one to one, so that when the first power source 123 drives the corresponding ball screw 122 to rotate, only one of the fine grinding spindle 320 and the rough grinding spindle 420 moves along the first direction. In this way, it is convenient to accurately control the positions of the fine grinding spindle 320 and the rough grinding spindle 420, thereby increasing the convenience of operation.

[0059] A fixed frame is provided at the bottom of the chuck 200, and the first bracket 110 is also provided with a loading position and a moving mechanism 111 connected to the fixed frame. The loading position and the grinding position are respectively located at the two ends of the moving mechanism 111, and the moving mechanism 111 can drive the fixed frame to move back and forth between the loading position and the grinding position. The moving mechanism 111 can be a combination of a screw nut pair and a moving guide rail. The moving guide rail is used to bear the weight of the fixed frame and play a guiding role, and the screw nut pair is used to provide power for the reciprocating movement of the fixed frame.

[0060] In this embodiment, the equipment suitable for thinning the packaged product also includes a brush cleaning assembly 600 and a chuck cleaning assembly 700. A second slide rail 131 is provided on the top of the third bracket 130. The chuck cleaning assembly 700 is movably connected to the second slide rail 131 through a first adapter plate to clean the chuck 200 that has been moved to the loading position. The brush cleaning assembly 600 is movably connected to the second slide rail 131 through a second adapter plate to clean the polished product.

[0061] The moving mechanism 111 drives the chuck 200 connected to the fixed frame to move to the bottom of the chuck cleaning assembly 700 or the brush cleaning assembly 600. The chuck cleaning assembly 700 and the brush cleaning assembly 600 move to the corresponding positions through the second slide rail 131 to complete the cleaning of the chuck 200 and the preliminary cleaning of the polished product.

[0062] The equipment suitable for thinning the packaged product also includes a two-fluid cleaning component 112 arranged on the first bracket 110. The two-fluid cleaning component 112 is located on the side of the third bracket 130 away from the second bracket 120. The two-fluid cleaning component 112 is used to clean and dry the product after being cleaned by the brush cleaning component 600 to further clean the product surface. The product surface is dried by rotating the chuck 200 and the air nozzle, reducing the pressure of the rear-end product cleaning.

[0063] The specific processing process is: the product is placed on the chuck 200, and the chuck 200 vacuum absorbs the product; the moving mechanism 111 drives the chuck 200 to move to the grinding position; the rough grinding component begins to descend and grinds the product to a first preset thickness, and then the rough grinding component is lifted and leaves the product along the first direction; the fine grinding component moves along the first direction to above the product and begins to descend and grind the product to a second preset thickness, and then the fine grinding component is lifted to leave the product; the rough grinding component and the fine grinding component move along the first direction to restore the position of the rough grinding component to be above the grinding position; the moving mechanism 111 moves the chuck 200 and the product on the chuck 200 to the loading position, and the brush cleaning component 600 brushes the product processing surface to remove large particles of impurities, and then the two-fluid cleaning component 112 uses two fluids to further clean the product surface. After cleaning is completed, the chuck 200 rotates and the air nozzle to complete the drying of the product surface, and the product processing is completed.

[0064] When one of the grinding spindles is working, the other grinding spindle will dress the grinding wheel at the grinding wheel dressing unit 113 to ensure the processing performance of the grinding wheel. The detection device can detect the first preset thickness and the second preset thickness, and stop grinding in time through the detection results of the second detection component 520 (non-contact detection device) and the first detection component 510 (contact detection device) to complete the grinding.

[0065] It should be noted that, in this specification, relational terms such as first and second are merely used to distinguish one entity from other entities, but do not necessarily require or imply any actual relationship or order between these entities.

[0066] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0067] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only intended to help understand the method and core concept of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from the principles of the present invention, and such improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. A device suitable for thinning packaged products, characterized in that: include: The frame is equipped with a grinding position; A conveying assembly is provided on the frame, the conveying assembly includes a chuck that can be moved to the grinding position, and a rotating mechanism is provided at the bottom of the chuck to drive the product on the chuck to rotate; A grinding assembly, comprising a fine grinding assembly and a coarse grinding assembly arranged adjacent to each other, wherein the fine grinding assembly and the coarse grinding assembly are connected to the frame and can be moved above the grinding position; The detection device is arranged on the frame, and comprises a first detection component contacting the product and a second detection component spaced apart from the product, so as to detect the thickness of the product above the substrate.

2. The device for thinning packaged products according to claim 1, characterized in that: A circular first positioning module and a square second positioning module are provided on the top of the chuck, and through holes are provided on the first positioning module and the second positioning module. A vacuum component is connected to the through holes to adsorb the product.

3. The device for thinning packaged products according to claim 1, characterized in that: The frame includes a first bracket for fixing the conveying assembly, a second bracket for fixing the polishing assembly, and a third bracket for fixing the detection device, the second bracket and the third bracket are spaced apart and both are located above the first bracket, and a first slide rail is provided on a side of the second bracket facing the third bracket; The fine grinding assembly includes a first fixing assembly and a fine grinding spindle arranged on a side of the first fixing assembly away from the second bracket; The rough grinding assembly includes a second fixing assembly and a rough grinding spindle arranged on a side of the second fixing assembly away from the second bracket; The first fixing assembly and the second fixing assembly are both provided with a first sliding block capable of slidingly cooperating with the first sliding rail.

4. The device for thinning packaged products according to claim 3, characterized in that: The first fixing assembly includes a first connecting plate on which the first sliding block is provided and a first mounting plate capable of vertically moving relative to the first connecting plate, wherein the fine grinding spindle is mounted on the first mounting plate; The second fixing assembly includes a second connecting plate on which the first sliding block is provided and a second mounting plate capable of vertically moving relative to the second connecting plate, wherein the rough grinding spindle is mounted on the second mounting plate; The fine grinding spindle and the rough grinding spindle can move vertically and rotate around their own axes to grind the product.

5. The device for thinning packaged products according to claim 4, characterized in that: There are two first slide rails, which are spaced apart in an upper and lower manner. A ball screw is provided between the two first slide rails. The first mounting plate and the second mounting plate are both provided with sleeves for the ball screw to pass through. One end of the ball screw is connected to the output end of the first power source to drive the first mounting plate and the second mounting plate to reciprocate along the axial direction of the ball screw.

6. The device for thinning packaged products according to claim 3, characterized in that: A fixed frame is provided at the bottom of the chuck, and the first bracket is also provided with a loading position and a moving mechanism connected to the fixed frame. The loading position and the grinding position are respectively located at two ends of the moving mechanism, and the moving mechanism can drive the fixed frame to move back and forth between the loading position and the grinding position.

7. The device for thinning packaged products according to claim 6, characterized in that: It also includes a brush cleaning assembly and a chuck cleaning assembly. A second slide rail is provided on the top of the third bracket. The chuck cleaning assembly is movably connected to the second slide rail through a first adapter plate to clean the chuck moved to the loading position. The brush cleaning assembly is movably connected to the second slide rail through a second adapter plate to clean the product after polishing.

8. The device for thinning packaged products according to claim 7, characterized in that: It also includes a two-fluid cleaning component arranged on the first bracket, the two-fluid cleaning component is located on the side of the third bracket away from the second bracket, and the two-fluid cleaning component is used to clean and dry the product after being cleaned by the brush cleaning component.

9. The device for thinning packaged products according to claim 3, characterized in that: The first bracket is also provided with a grinding wheel dressing unit, and the grinding wheel dressing units are arranged at intervals on both sides of the grinding position to dress the grinding wheels located at the bottom of the fine grinding spindle and the rough grinding spindle.

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