Vacuum pump water cooling mechanism of sputter coating machine
By introducing a water cooling device and a gate structure into the sputtering coating machine, the problem of vacuum equipment damage due to high temperature is solved, gas cooling and impurity blocking are achieved, and the stability and life of the vacuum equipment are ensured.
Patent Information
- Application Number
- CN202422816303.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-19
- Publication Date
- 2025-09-26
- Estimated Expiration
- 2034-11-19
AI Technical Summary
In the prior art, the vacuum heating chamber is easily damaged by high temperature during the vacuuming process.
A water-cooling mechanism for the vacuum pump of a sputtering coating machine was designed. An annular water-cooling device was set at the first connecting valve to cool the gas before entering the vacuum equipment. Combined with the hollow structure design of the gate plate and the connecting valve, the gas was cooled and impurity particles were blocked to prevent high-temperature gas from entering the vacuum equipment.
It effectively prevents vacuum equipment from being damaged by high-temperature gas, maintaining the stability of the vacuum environment and the service life of the equipment.
Smart Images
Figure CN223386214U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of sputtering coating, and more specifically to a vacuum pump water cooling mechanism of a sputtering coating machine. Background Art
[0002] Sputtering is the process of bombarding the target surface with ions. The phenomenon of atoms being ejected from the target is called sputtering, and the deposition of the sputtered atoms on the substrate surface to form a film is called sputtering coating. To obtain high-quality thin films, a magnetron sputtering device is filled with a certain amount of working gas. By applying a voltage to two corresponding electrode plates, the electric field generated by the electrode plates will be able to generate sufficient energy to collide with the gas molecules between the electrode plates, ionizing them and generating ions. Under the influence of the electric and magnetic fields, the ions strike the target material, sputtering the target atoms and depositing them on the substrate to form a film. Accurately controlling parameters such as the reaction gas pressure, the distance between the target and the substrate, and the sputtering power allows for precise control of the deposition rate to achieve high-quality thin film materials.
[0003] In the prior art, a vacuum heating chamber needs to be equipped with a vacuum device for evacuation, and higher temperatures can easily damage the vacuum device. Utility Model Content
[0004] In view of this, in order to solve the above problems, the present invention proposes a vacuum pump water cooling mechanism of a sputtering coating machine, including a process coating chamber, one end of the process coating chamber is connected to a vacuum pumping device 10, which is used to perform a vacuum operation on the process coating chamber, and a vacuum gate valve mechanism is provided between the vacuum pumping device 10 and the process coating chamber. When the partition 25 rises to the hollow structure of the gate plate 22, the vacuum gate valve mechanism is in a closed state, separating the process coating chamber and the vacuum pumping device 10. When vacuuming is required, the vacuum gate valve mechanism is closed. When the vacuum pump 10 is in the process of vacuuming, the lifting cylinder 21 drives the partition 25 to descend, so that the hollow structure of the gate plate 22, the first connecting valve 23, and the second connecting valve 24 are connected with the process coating cavity and the vacuum equipment 10, so that the vacuum equipment 10 performs a vacuum operation on the process coating cavity. It is characterized in that: an annular water cooling device 30 is provided at the first connecting valve 23, which is used to cool the gas before entering the vacuum equipment 10, so as to prevent the vacuum equipment 10 from entering the gas with a higher temperature and causing damage to the vacuum equipment 10.
[0005] A vacuum pump water cooling mechanism of a sputtering coating machine includes a process coating cavity, one end of the process coating cavity is connected to a vacuum pumping device 10 for performing a vacuum operation on the process coating cavity, a vacuum gate valve mechanism is provided between the vacuum pumping device 10 and the process coating cavity, the vacuum gate valve mechanism includes a lifting cylinder 21, a gate plate 22, a first connecting valve 23, and a second connecting valve 24, one side of the gate plate 22 is provided with a first connecting valve 23, which is connected to the process coating cavity through the first connecting valve 23, and the other side of the gate plate 22 is provided with a second connecting valve 24, which is connected to the vacuum pumping device 10 through the second connecting valve 24, the gate plate 22, the first connecting valve 23, and the second connecting valve 24 are all hollow structures, the gate plate 22, the first connecting valve 23, and the second connecting valve 24 are arranged in a one-to-one correspondence, and the gate valve mechanism includes a lifting cylinder 21, a gate plate 22, a first connecting valve 23, and a second connecting valve 24. A lifting cylinder 21 is provided at the bottom of the plate 22, and the gate plate 22 is a sandwich structure. A partition 25 is provided in the sandwich structure of the gate plate 22, and the bottom of the partition 25 is connected to the lifting cylinder 21. When the partition 25 rises to the hollow structure of the gate plate 22, the vacuum gate valve mechanism is in a closed state, separating the process coating cavity and the vacuum equipment 10. When vacuuming is required, the lifting cylinder 21 drives the partition 25 to descend, so that the hollow structure of the gate plate 22, the first connecting valve 23, and the second connecting valve 24 are connected to the process coating cavity and the vacuum equipment 10, so that the vacuum equipment 10 performs a vacuum operation on the process coating cavity, which is characterized in that: an annular water cooling device 30 is provided at the first connecting valve 23, which is used to cool the gas before entering the vacuum equipment 10.
[0006] Furthermore, the first connecting valve 23 and the second connecting valve 24 are both hollow annular structures, and the water cooling device 30 includes an annular water channel 31, which is placed on the outer ring of the connection between the first connecting valve 23 and the process coating cavity.
[0007] Furthermore, a water inlet 32 and a water outlet 33 are provided at the bottom of the annular water channel 31 for connecting to a circulating cooling water device so that the cooling water in the annular water channel 31 always maintains a low temperature and exchanges heat with the gas before entering the vacuum equipment 10.
[0008] In some embodiments, there are multiple partially stacked anti-fog plates 40 at the hollow structure of the gate plate 22, and gaps are provided between adjacent anti-fog plates 40. The anti-fog plates 40 are used to block impurity particles in the gas before entering the vacuum equipment 10, so that they adhere to the surface of the anti-fog plates 40, thereby effectively protecting the vacuum equipment 10.
[0009] Furthermore, the anti-seizure plate 40 is fixed to the hollow structure of the gate plate 22 through an insertion rod 41. The anti-seizure plate 40 is an annular sheet structure, and the insertion rod 41 is a cross structure. The anti-seizure plate 40 is centered on the center of the insertion rod 41 and is stacked outward in sequence.
[0010] Furthermore, the diameter of two adjacent anti-collision plates 40 close to the center of the penetration rod 41 is smaller than that of the two adjacent anti-collision plates 40 far from the center of the penetration rod 41 .
[0011] Furthermore, the main body of the anti-fouling plate 40 is a curved structure inclined toward the process coating chamber, so as to better adhere to the impurity particles in the gas before entering the vacuum pumping equipment 10 .
[0012] In some embodiments, the second connecting valve 24 is connected to the vacuum equipment 10 through a right-angle pipe 50. The right-angle pipe 50 is a right-angle pipe 50 that bends downward. One end of the right-angle pipe 50 is connected to the second connecting valve 24, and the other end is connected to the vacuum equipment 10, which is used to extend the time of the gas entering the vacuum equipment 10, thereby indirectly assisting in cooling the gas before entering the vacuum equipment 10.
[0013] In some embodiments, the area of the partition 25 is not less than the area of the hollow structure of the gate 22, so that the partition 25 can seal the hollow structure of the gate 22, thereby ensuring a vacuum environment in the heating chamber.
[0014] Furthermore, a plurality of reinforcing plates 60 are provided on both sides of the gate plate 22 . The reinforcing plates 60 are integrally formed with the gate plate 22 to enhance the structural strength of the gate plate 22 .
[0015] Furthermore, an adapter 70 is provided on one side of the lifting cylinder 21 for connecting to an external control mechanism, and the lifting cylinder 21 is electrically connected to the external control mechanism.
[0016] The beneficial effects of the present invention are as follows: The present invention proposes a vacuum pump water cooling mechanism for a sputtering coating machine, comprising a process coating chamber, one end of the process coating chamber being connected to a vacuum pumping device 10 for performing a vacuum operation on the process coating chamber, a vacuum gate valve mechanism being provided between the vacuum pumping device 10 and the process coating chamber, when the partition 25 rises to the hollow structure of the gate plate 22, the vacuum gate valve mechanism is in a closed state, separating the process coating chamber and the vacuum pumping device 10, when vacuuming is required, the lifting cylinder 21 drives the partition plate 25 down, so that the hollow structure of the gate plate 22, the first connecting valve 23, and the second connecting valve 24 are connected to the process coating chamber and the vacuum pumping device 10, thereby enabling the vacuum pumping device 10 to perform a vacuum operation on the process coating chamber, characterized in that an annular water cooling device 30 is provided at the first connecting valve 23, for cooling the gas before entering the vacuum pumping device 10, so as to prevent the vacuum pumping device 10 from entering a gas with a higher temperature and causing damage to the vacuum pumping device 10. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is an overall structural diagram of the vacuum pump water cooling mechanism of the sputtering coating machine of the present invention.
[0018] Figure 2 It is a right view of the vacuum pump water cooling mechanism of the sputtering coating machine of the present invention.
[0019] Figure 3 for Figure 2 sectional view.
[0020] Figure 4 It is a front view of the vacuum pump water cooling mechanism of the sputtering coating machine of the present invention.
[0021] Figure 5 for Figure 4 sectional view.
[0022] Description of main component symbols
[0023] Vacuuming equipment 10, lifting cylinder 21, gate 22, first connecting valve 23, second connecting valve 24, partition 25, water cooling device 30, annular water channel 31, water inlet 32, water outlet 33, anti-attachment plate 40, insertion rod 41, right-angle pipe 50, reinforcement plate 60, adapter 70.
[0024] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION Example 1:
[0025] like Figure 1 、 Figure 2 and Figure 4As shown, a vacuum pump water cooling mechanism of a sputtering coating machine includes a process coating chamber, one end of the process coating chamber is connected to a vacuum pumping device 10 for performing a vacuum operation on the process coating chamber, a vacuum gate valve mechanism is provided between the vacuum pumping device 10 and the process coating chamber, the vacuum gate valve mechanism includes a lifting cylinder 21, a gate plate 22, a first connecting valve 23, and a second connecting valve 24, one side of the gate plate 22 is provided with a first connecting valve 23, which is connected to the process coating chamber through the first connecting valve 23, and the other side of the gate plate 22 is provided with a second connecting valve 24, which is connected to the vacuum pumping device 10 through the second connecting valve 24, the gate plate 22, the first connecting valve 23, and the second connecting valve 24 are all hollow structures, the gate plate 22, the first connecting valve 23, and the second connecting valve 24 are arranged in a one-to-one correspondence, the bottom of the gate plate 22 is provided with a lifting cylinder 21, the gate plate 22 is a sandwich structure, and the sandwich structure of the gate plate 22 is provided with a The partition 25, the bottom of which is connected to the lifting cylinder 21, when the partition 25 rises to the hollow structure of the gate plate 22, the vacuum gate valve mechanism is in a closed state, separating the process coating chamber and the vacuum equipment 10, the area of the partition 25 is not less than the area of the hollow structure of the gate plate 22, so that the partition 25 can seal the hollow structure of the gate plate 22, thereby ensuring the vacuum environment in the heating chamber, when vacuuming is required, the lifting cylinder 21 drives the partition 25 to descend, so that the hollow structure of the gate plate 22, the first connecting valve 23, and the second connecting valve 24 are connected to the process coating chamber and the vacuum equipment 10, so that the vacuum equipment 10 performs a vacuum operation on the process coating chamber, and the first connecting valve 23 is provided with an annular water cooling device 30 for cooling the gas before entering the vacuum equipment 10, and the first connecting valve 23 and the second connecting valve 24 are both hollow annular structures.
[0026] The second connecting valve 24 is connected to the vacuum pumping device 10 via a right-angle pipe 50. The right-angle pipe 50 is a right-angle pipe 50 that bends downward. One end of the right-angle pipe 50 is connected to the second connecting valve 24, and the other end is connected to the vacuum pumping device 10, so as to extend the time for the gas to enter the vacuum pumping device 10, thereby indirectly assisting in cooling the gas before entering the vacuum pumping device 10.
[0027] A plurality of reinforcing plates 60 are provided on both sides of the gate plate 22 . The reinforcing plates 60 are integrally formed with the gate plate 22 to enhance the structural strength of the gate plate 22 .
[0028] An adapter 70 is provided on one side of the lifting cylinder 21 for connecting to an external control mechanism. The lifting cylinder 21 is electrically connected to the external control mechanism.
[0029] like Figure 3As shown, the water cooling device 30 includes an annular water channel 31, which is placed on the outer ring of the connection between the first connecting valve 23 and the process coating cavity. A water inlet 32 and a water outlet 33 are provided at the bottom of the annular water channel 31 for connecting to a circulating cooling water device, so that the cooling water in the annular water channel 31 always maintains a low temperature and exchanges heat with the gas before entering the vacuum equipment 10.
[0030] like Figure 5 As shown, the hollow structure of the gate plate 22 is provided with multiple partially stacked anti-adhesion plates 40, and gaps are provided between adjacent anti-adhesion plates 40. The anti-adhesion plates 40 are used to block impurity particles in the gas before entering the vacuum equipment 10, so that they adhere to the surface of the anti-adhesion plates 40, thereby effectively protecting the vacuum equipment 10. The anti-adhesion plates 40 are fixed to the hollow structure of the gate plate 22 by insertion rods 41. The anti-adhesion plates 40 are annular sheet structures, and the insertion rods 41 are cross-cross structures. The anti-adhesion plates 40 are stacked outward in sequence with the center of the insertion rod 41 as the center. The diameter of two adjacent anti-adhesion plates 40 close to the center of the insertion rod 41 is smaller than the diameter away from the center of the insertion rod 41. The body of the anti-adhesion plate 40 is a curved structure inclined toward the process coating cavity, so as to better adhere to the impurity particles in the gas before entering the vacuum equipment 10.
[0031] The beneficial effects of the present invention are as follows: The present invention proposes a vacuum pump water cooling mechanism for a sputtering coating machine, comprising a process coating chamber, one end of the process coating chamber being connected to a vacuum pumping device 10 for performing a vacuum operation on the process coating chamber, a vacuum gate valve mechanism being provided between the vacuum pumping device 10 and the process coating chamber, when the partition 25 rises to the hollow structure of the gate plate 22, the vacuum gate valve mechanism is in a closed state, separating the process coating chamber and the vacuum pumping device 10, when vacuuming is required, the lifting cylinder 21 drives the partition plate 25 down, so that the hollow structure of the gate plate 22, the first connecting valve 23, and the second connecting valve 24 are connected to the process coating chamber and the vacuum pumping device 10, thereby enabling the vacuum pumping device 10 to perform a vacuum operation on the process coating chamber, characterized in that an annular water cooling device 30 is provided at the first connecting valve 23, for cooling the gas before entering the vacuum pumping device 10, so as to prevent the vacuum pumping device 10 from entering a gas with a higher temperature and causing damage to the vacuum pumping device 10.
[0032] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.
Claims
1. A vacuum pump water cooling mechanism of a sputtering coating machine, comprising a process coating chamber, one end of the process coating chamber being connected to a vacuum pumping device (10) for performing a vacuum operation on the process coating chamber, a vacuum gate valve mechanism being provided between the vacuum pumping device (10) and the process coating chamber, the vacuum gate valve mechanism comprising a lifting cylinder (21), a gate plate (22), a first connecting valve (23), and a second connecting valve (24), one side of the gate plate (22) being provided with a first connecting valve (23), and being connected to the process coating chamber via the first connecting valve (23), the other side of the gate plate (22) being provided with a second connecting valve (24), and being connected to the vacuum pumping device (10) via the second connecting valve (24), the gate plate (22), the first connecting valve (23), and the second connecting valve (24) being all hollow structures, the gate plate (22), the first connecting valve (23), and the second connecting valve (24) being all hollow structures, The connecting valve (23) and the second connecting valve (24) are arranged in a one-to-one correspondence. A lifting cylinder (21) is provided at the bottom of the gate plate (22). The gate plate (22) is a sandwich structure. A partition plate (25) is provided in the sandwich structure of the gate plate (22). The bottom of the partition plate (25) is connected to the lifting cylinder (21). When the partition plate (25) rises to the hollow structure of the gate plate (22), the vacuum gate valve mechanism is in a closed state, separating the process coating cavity and the vacuum pumping equipment (10). When vacuuming is required, the lifting cylinder (21) drives the partition plate (25) to descend, so that the hollow structure of the gate plate (22), the first connecting valve (23) and the second connecting valve (24) are connected to the process coating cavity and the vacuum pumping equipment (10), so that the vacuum pumping equipment (10) performs a vacuuming operation on the process coating cavity. The invention is characterized in that: An annular water cooling device (30) is provided at the first connecting valve (23) for cooling the gas before entering the vacuum pumping equipment (10).
2. The vacuum pump water cooling mechanism of the sputtering coating machine according to claim 1, characterized in that: The first connecting valve (23) and the second connecting valve (24) are both hollow annular structures. The water cooling device (30) includes an annular water channel (31). The annular water channel (31) is placed on the outer ring of the connection between the first connecting valve (23) and the process coating cavity.
3. The vacuum pump water cooling mechanism of the sputtering coating machine according to claim 2, characterized in that: The bottom of the annular water channel (31) is provided with a water inlet (32) and a water outlet (33) for connecting to a circulating cooling water device, so that the cooling water in the annular water channel (31) always maintains a low temperature and exchanges heat with the gas before entering the vacuum pumping device (10).
4. The vacuum pump water cooling mechanism of the sputtering coating machine according to claim 1, characterized in that: The hollow structure of the gate plate (22) is provided with a plurality of partially stacked anti-adhesion plates (40), with gaps being provided between adjacent anti-adhesion plates (40). The anti-adhesion plates (40) are used to block impurity particles in the gas before entering the vacuum pumping equipment (10), so that the impurity particles adhere to the surface of the anti-adhesion plates (40), thereby effectively protecting the vacuum pumping equipment (10).
5. The vacuum pump water cooling mechanism of the sputtering coating machine according to claim 4, characterized in that: The anti-stick plate (40) is fixed to the hollow structure of the gate plate (22) through an insertion rod (41). The anti-stick plate (40) is an annular sheet structure, and the insertion rod (41) is a cross structure. The anti-stick plates (40) are stacked outward in sequence with the center of the insertion rod (41) as the center. The diameter of two adjacent anti-stick plates (40) close to the center of the insertion rod (41) is smaller than that away from the center of the insertion rod (41).
6. The vacuum pump water cooling mechanism of the sputtering coating machine according to claim 4, characterized in that: The main body of the anti-adhesion plate (40) is a curved surface structure inclined toward the process coating cavity, thereby better adhering to impurity particles in the gas before entering the vacuum pumping equipment (10).
7. The vacuum pump water cooling mechanism of the sputtering coating machine according to claim 1, characterized in that: The second connecting valve (24) is connected to the vacuum pumping device (10) via a right-angle pipe (50). The right-angle pipe (50) is a right-angle pipe (50) that bends downward. One end of the right-angle pipe (50) is connected to the second connecting valve (24), and the other end is connected to the vacuum pumping device (10), so as to prolong the time for the gas to enter the vacuum pumping device (10), thereby indirectly assisting in cooling the gas before entering the vacuum pumping device (10).
8. The vacuum pump water cooling mechanism of the sputtering coating machine according to claim 1, characterized in that: The area of the partition (25) is not less than the area of the hollow structure of the gate (22), so that the partition (25) can seal the hollow structure of the gate (22), thereby ensuring a vacuum environment in the heating cavity.
9. The vacuum pump water cooling mechanism of the sputtering coating machine according to claim 1, characterized in that: A plurality of reinforcing plates (60) are provided on both sides of the gate plate (22); the reinforcing plates (60) are integrally formed with the gate plate (22) and are used to strengthen the structural strength of the gate plate (22).
10. The vacuum pump water cooling mechanism of the sputtering coating machine according to claim 1, characterized in that: An adapter (70) is provided on one side of the lifting cylinder (21) for connecting to an external control mechanism, and the lifting cylinder (21) is electrically connected to the external control mechanism.