Flying dust particle buffering device

Abstract

The utility model provides a dust particle buffer device which is arranged on the side wall of one side, far away from an evaporation process area, of a buffer area, a plating pot is arranged at the top of the evaporation process area, an evaporation source is arranged at the bottom of the evaporation process area, and an opening is formed in one side wall, close to the height of the evaporation source, of the evaporation process area and communicated with the buffer area. The buffering device comprises a flow guide seat, the outer side wall of the buffering area is connected with a closing plate, the outer side of the closing plate is connected with an electromagnetic valve, the inner side of the closing plate is connected with the flow guide seat, the flow guide seat is of a hollow structure defined by a flow guide seat shell, an airflow main channel is formed in the hollow structure of the flow guide seat, and a plurality of airflow dissipation holes are evenly formed in the side wall of the flow guide seat shell at intervals. The airflow main channel is communicated with the airflow dissipation holes, and when vacuum needs to be broken, the electromagnetic valve is opened, so that a strong airflow enters from the airflow main channel and is uniformly divided into a plurality of scattered small airflows through the airflow dissipation holes to be jetted into the buffer area, and the amount and density of flying dust are effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of coating, and more specifically to a dust particle buffer device. Background Art

[0002] During the evaporation process, the film material will be vaporized and exist in the form of atoms. In the vacuum, it will adhere to the product to be filmed due to the saturated pressure of the air. The area above the entire evaporation source is the area where the film material can adhere. The film material will condense into some tiny particles such as particles and dust and exist in the vacuum. They will adhere to places other than the surface of the product, and there is a certain connection strength, resulting in the film layer being unable to effectively and highly adhere to the product. It may settle to the bottom of the cavity due to the use, vibration, and contact during manual disassembly of the equipment.

[0003] After the coating process is complete, the vacuum chamber must be opened to remove the product and return the chamber to atmospheric pressure. This is called breaking the vacuum. This requires filling the chamber with inert gas. Once the chamber is opened, the pressure inside the compressed gas cylinder at the facility's facility is higher than atmospheric pressure, creating a high-pressure state. The vacuum chamber, which is now at negative pressure, experiences a significant pressure differential and generates a strong airflow. The high speed and intensity of the airflow during this vacuum-breaking process can lift particles and dust that had settled at the bottom of the chamber and cause them to disperse disorderly within the chamber.

[0004] When the next process is carried out, vacuum is required to place the product in. However, it takes a certain amount of time for the particles and dust raised by the last vacuum to settle again, so that a certain amount of incompletely settled particles and dust will remain in the space between the evaporation source and the product during vacuuming. These particles and dust may block the flight path of molecules during normal evaporation, that is, the molecules collide with particles and dust during flight and cannot reach the product, or the molecules carry particles and dust with them and attach to the product, resulting in a certain amount of particle contamination on the product when the film is finally formed, resulting in a decrease in the electrical and conductive properties of the product.

[0005] Existing technologies employ a buffer device within the airflow channel to prevent concentrated, strong airflow from rushing into the vacuum chamber. Typically, this device is placed directly on the sidewall of the evaporation process area. This makes the buffer device very close to the evaporation source and settled particles and dust, and since there is no air resistance within the vacuum, its effect on reducing dust emissions is minimal. Therefore, a buffer space is required so that the airflow buffered by the buffer device is first buffered within the buffer space rather than being blown directly into the evaporation process area. The buffer device also provides direct airflow blocking and lateral airflow avoidance. Utility Model Content

[0006] In view of this, in order to solve the above problems, the utility model proposes a dust particle buffer device. By setting a porous structure discharge on the side wall of the buffer device 5, an airflow is divided into multiple small airflows, and the straight impact is converted into side buffering, which reduces the energy of the dust impact and greatly reduces the amount and density of the dust.

[0007] A dust particle buffer device, the buffer device 5 is arranged in the buffer zone 2, the buffer zone 2 is connected to the evaporation process zone 1, and is characterized in that: the buffer device 5 is arranged on the side wall of the buffer zone 2 away from the evaporation process zone 1, the top of the evaporation process zone 1 is provided with a plating pot, the bottom of the evaporation process zone 1 is provided with an evaporation source, and the side wall of the evaporation process zone 1 near the height of the evaporation source is provided with an opening connected to the buffer zone 2, so that the gas blown out by the buffer device 5 is first buffered by the buffer zone 2 before reaching the evaporation process zone 1, the buffer device 5 includes a guide seat 51, and the outer wall of the buffer zone 2 is connected to a stuffy plate 4, the stuffy plate 4 is connected to the electromagnetic valve 3, and the inner side of the blocking plate 4 is connected to the guide seat 51. The guide seat 51 is a hollow structure formed by the guide seat shell. A main airflow channel 7 is provided in the hollow structure of the guide seat 51. A plurality of airflow dissipation holes 9 are evenly spaced on the side wall of the guide seat shell. The main airflow channel 7 is connected to the plurality of airflow dissipation holes 9. When it is necessary to break the vacuum, the electromagnetic valve 3 is opened to allow a strong airflow to enter from the main airflow channel 7, and is evenly divided into multiple scattered small airflows through the plurality of airflow dissipation holes 9 and sprayed into the buffer zone 2, so that the strong airflow is not directly sprayed toward the evaporation process area 1, effectively reducing the amount and density of dust.

[0008] Furthermore, an input hole 6 is provided at the input end of the main airflow channel 7, and a plurality of connecting tubes 8 are provided at the output end of the main airflow channel 7. Each of the airflow dissipation holes 9 corresponds one-to-one to the connecting tube 8 and is connected to the main airflow channel 7 through the connecting tube 8.

[0009] In some embodiments, the guide seat 51 is cylindrical or block-shaped.

[0010] Furthermore, the guide seat 51 is a cylinder, the input hole 6 is located at the center of the input end of the main airflow channel 7, and the input hole 6 is connected to the blocking plate 4. A plurality of circles of airflow dissipation holes 9 are provided on the side wall along the length direction of the cylinder. The strong airflow enters the main airflow channel 7 from the input hole 6, is sprayed to the end face at the other end of the main airflow channel 7, and then rebounds, and is converted into multiple small airflows that are sprayed to several connecting tubes 8 corresponding to the airflow dissipation holes 9, and then dissipated and discharged from the side wall through the plurality of circles of airflow dissipation holes 9.

[0011] Furthermore, each circle of the airflow dissipation holes 9 is arranged radially from the center of the cylinder.

[0012] Furthermore, the guide seat 51 is block-shaped, the input hole 6 is located at the center of the input end of the main airflow channel 7, and the input hole 6 is connected to the blocking plate 4. A number of airflow dispersion holes 9 are evenly spaced on the side adjacent to the main airflow channel 7. The strong airflow enters the main airflow channel 7 from the input hole 6, and is converted into multiple small airflows after being sprayed onto the inner wall of the main airflow channel 7. The strong airflow is sprayed onto several connecting tubes 8 corresponding to the airflow dispersion holes 9, and then evenly divided into multiple scattered small airflows through the airflow dispersion holes 9 for dissipation and discharge.

[0013] Furthermore, the cross-sectional area of ​​the main airflow channel 7 is smaller than the sum of the cross-sectional areas of the other airflow dissipation holes 9, so that the total cross-sectional area for the airflow to enter does not become smaller, thereby causing the airflow intensity to become smaller.

[0014] Furthermore, the cross-sectional area of ​​the main airflow channel 7 is at least 1.5 times smaller than the sum of the cross-sectional areas of the other airflow dissipation holes 9 .

[0015] Furthermore, the smaller the airflow dissipation holes 9 are, the better the buffering effect is, which facilitates the formation of a thin and small airflow without causing a large amount of dust.

[0016] Furthermore, a connection port 22 is provided on the outer side wall of the buffer zone 2 protruding outward, and the outer side of the connection port 22 is detachably connected to the blocking plate 4 .

[0017] Furthermore, the strong airflow rushing in when breaking the vacuum is nitrogen.

[0018] Furthermore, a cryogenic pump 11 is provided below the buffer zone 2 to achieve the exhaust effect by adsorbing gas molecules through the low-temperature surface.

[0019] The beneficial effects of the present invention are as follows: a dust particle buffer device, the buffer device 5 is arranged in the buffer zone 2, the buffer zone 2 is connected to the evaporation process zone 1, the buffer device 5 is arranged on the side wall of the buffer zone 2 away from the evaporation process zone 1, the top of the evaporation process zone 1 is provided with a plating pot, the bottom of the evaporation process zone 1 is provided with an evaporation source, and the side wall of the evaporation process zone 1 near the height of the evaporation source is provided with an opening connected to the buffer zone 2, so that the gas blown out by the buffer device 5 is first buffered by the buffer zone 2 before reaching the evaporation process zone 1, the buffer device 5 includes a guide seat 51, and the outer wall of the buffer zone 2 is connected with a stuffy plate 4. The outer side of the blocking plate 4 is connected to the solenoid valve 3, and the inner side of the blocking plate 4 is connected to the guide seat 51. The guide seat 51 is a hollow structure formed by a guide seat shell. A main airflow channel 7 is provided in the hollow structure of the guide seat 51. A number of airflow dispersion holes 9 are evenly spaced on the side wall of the guide seat shell. The main airflow channel 7 is connected to the number of airflow dispersion holes 9. When it is necessary to break the vacuum, the solenoid valve 3 is opened to allow a strong airflow to enter from the main airflow channel 7, and is evenly divided into multiple scattered small airflows through the number of airflow dispersion holes 9 and sprayed into the buffer zone 2, so that the strong airflow is not directly sprayed toward the evaporation process area 1, effectively reducing the amount and density of dust. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is an overall schematic diagram of the installation position of the dust particle buffer device of the present invention.

[0021] Figure 2 This is an overall schematic diagram of the installation position of the dust particle buffer device of the present invention.

[0022] Figure 3 This is a partial schematic diagram of the installation position of the dust particle buffer device of the present invention.

[0023] Figure 4 This is a schematic diagram of the overall structure of Example 1 of the dust particle buffer device of the present invention.

[0024] Figure 5 This is a cross-sectional view of Example 1 of the dust particle buffer device of the present invention.

[0025] Figure 6 This is a schematic diagram of the overall structure of Example 2 of the dust particle buffer device of the present invention.

[0026] Figure 7 This is a cross section of Example 2 of the dust particle buffer device of the present invention Figure 1 .

[0027] Figure 8 This is a cross section of Example 2 of the dust particle buffer device of the present invention Figure 2 .

[0028] Description of main component symbols

[0029] Evaporation process area 1, cryogenic pump 11, buffer zone 2, connection port 22, solenoid valve 3, blocking plate 4, buffer device 5, flow guide seat 51, input hole 6, main air flow channel 7, connecting tube 8, air flow dissipation hole 9.

[0030] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0031] like Figure 1 As shown, it is a schematic diagram of the overall installation position of the dust particle buffer device of the present invention; Figure 2 As shown, it is a schematic diagram of the overall installation position of the dust particle buffer device of the present invention; Figure 3 As shown, it is a partial schematic diagram of the installation position of the dust particle buffer device of the present invention; Figure 4 As shown, it is a schematic diagram of the overall structure of the embodiment 1 of the dust particle buffer device of the present invention; Figure 5 As shown, it is a cross-sectional view of embodiment 1 of the dust particle buffer device of the present invention; Figure 6 As shown, it is a schematic diagram of the overall structure of the embodiment 2 of the dust particle buffer device of the present invention; Figure 7 The figure shows a cross section of the embodiment 2 of the dust particle buffer device of the present invention. Figure 1 ;like Figure 8 The figure shows a cross section of the embodiment 2 of the dust particle buffer device of the present invention. Figure 2 . Example 1:

[0032] A dust particle buffer device, the buffer device 5 is provided in the buffer zone 2, the buffer zone 2 is connected to the evaporation process zone 1, the buffer device 5 is provided on the side wall of the buffer zone 2 away from the evaporation process zone 1, the top of the evaporation process zone 1 is provided with a plating pot, the bottom of the evaporation process zone 1 is provided with an evaporation source, and the side wall of the evaporation process zone 1 near the height of the evaporation source is provided with an opening connected to the buffer zone 2, so that the gas blown out by the buffer device 5 is first buffered by the buffer zone 2 before reaching the evaporation process zone 1, the buffer device 5 includes a guide seat 51, the outer wall of the buffer zone 2 is connected to the blocking plate 4, and the outer side of the blocking plate 4 is connected to the solenoid valve 3 The inner side of the blocking plate 4 is connected to the guide seat 51, which is a hollow structure formed by a guide seat shell. A main airflow channel 7 is provided in the hollow structure of the guide seat 51, and a number of airflow dissipation holes 9 are evenly spaced on the side wall of the guide seat shell. The main airflow channel 7 is connected to the several airflow dissipation holes 9. When it is necessary to break the vacuum, the solenoid valve 3 is opened to allow a strong airflow to enter from the main airflow channel 7. The strong airflow rushing in when breaking the vacuum is nitrogen, which is evenly divided into multiple scattered small airflows through the several airflow dissipation holes 9 and sprayed into the buffer zone 2, so that the strong airflow is not directly sprayed to the evaporation process area 1, effectively reducing the amount and density of dust.

[0033] The input end of the main airflow channel 7 is provided with an input hole 6, and the output end of the main airflow channel 7 is provided with a plurality of connecting tubes 8. Each of the airflow dissipation holes 9 corresponds to a connecting tube 8 one by one and is connected to the main airflow channel 7 through the connecting tube 8.

[0034] The guide seat 51 is a cylinder, and the input hole 6 is located at the center of the input end of the main airflow channel 7. The input hole 6 is connected to the blocking plate 4. A plurality of circles of airflow dissipation holes 9 are provided on the side wall along the length direction of the cylinder. A strong airflow enters the main airflow channel 7 from the input hole 6, is sprayed to the end face at the other end of the main airflow channel 7, and then rebounds, and is converted into multiple small airflows that are sprayed to several connecting tubes 8 corresponding to the airflow dissipation holes 9, and then dissipated and discharged from the side wall through the plurality of circles of airflow dissipation holes 9.

[0035] Each circle of the airflow dissipation holes 9 is arranged radially from the center of the cylinder.

[0036] The cross-sectional area of ​​the main airflow channel 7 is smaller than the sum of the cross-sectional areas of the other airflow dissipation holes 9, so that the total cross-sectional area for the airflow to enter does not become smaller, thereby causing the airflow intensity to become smaller.

[0037] The cross-sectional area of ​​the main airflow channel 7 is at least 1.5 times smaller than the sum of the cross-sectional areas of the other airflow dissipation holes 9 .

[0038] The outer side wall of the buffer zone 2 is protruded outwardly to form a connection port 22 , and the outer side of the connection port 22 is detachably connected to the blocking plate 4 .

[0039] A cryogenic pump 11 is provided below the buffer zone 2 to achieve exhaust by adsorbing gas molecules through a low-temperature surface. Example 2:

[0040] A dust particle buffer device, the buffer device 5 is arranged in the buffer zone 2, the buffer zone 2 is connected to the evaporation process zone 1, and is characterized in that: the buffer device 5 is arranged on the side wall of the buffer zone 2 away from the evaporation process zone 1, the top of the evaporation process zone 1 is provided with a plating pot, the bottom of the evaporation process zone 1 is provided with an evaporation source, and the side wall of the evaporation process zone 1 near the height of the evaporation source is provided with an opening connected to the buffer zone 2, so that the gas blown out by the buffer device 5 is first buffered by the buffer zone 2 before reaching the evaporation process zone 1, the buffer device 5 includes a guide seat 51, the outer side wall of the buffer zone 2 is connected to the stuffy plate 4, and the outer side of the stuffy plate 4 is connected to the electric The inner side of the magnetic valve 3 and the blocking plate 4 is connected to the guide seat 51, which is a hollow structure formed by a guide seat shell. A main airflow channel 7 is provided in the hollow structure of the guide seat 51, and a number of airflow dispersion holes 9 are evenly spaced on the side wall of the guide seat shell. The main airflow channel 7 is connected to the several airflow dispersion holes 9. When it is necessary to break the vacuum, the solenoid valve 3 is opened to allow a strong airflow to enter from the main airflow channel 7. The strong airflow rushing in when breaking the vacuum is nitrogen, which is evenly divided into multiple scattered small airflows through the several airflow dispersion holes 9 and sprayed into the buffer zone 2, so that the strong airflow is not directly sprayed to the evaporation process area 1, effectively reducing the amount and density of dust.

[0041] The input end of the main airflow channel 7 is provided with an input hole 6, and the output end of the main airflow channel 7 is provided with a plurality of connecting tubes 8. Each of the airflow dissipation holes 9 corresponds to a connecting tube 8 one by one and is connected to the main airflow channel 7 through the connecting tube 8.

[0042] The guide seat 51 is block-shaped, the input hole 6 is located at the center of the input end of the main airflow channel 7, and the input hole 6 is connected to the blocking plate 4. A number of airflow dissipation holes 9 are evenly spaced on the side adjacent to the main airflow channel 7. The strong airflow enters the main airflow channel 7 from the input hole 6, and is converted into multiple small airflows after being sprayed onto the inner wall of the main airflow channel 7. The strong airflow is sprayed onto several connecting tubes 8 corresponding to the airflow dissipation holes 9, and then evenly divided into multiple scattered small airflows through the airflow dissipation holes 9 for dissipation and discharge.

[0043] The cross-sectional area of ​​the main airflow channel 7 is smaller than the sum of the cross-sectional areas of the other airflow dissipation holes 9, so that the total cross-sectional area for the airflow to enter does not become smaller, thereby causing the airflow intensity to become smaller.

[0044] The cross-sectional area of ​​the main airflow channel 7 is at least 1.5 times smaller than the sum of the cross-sectional areas of the other airflow dissipation holes 9 .

[0045] The outer side wall of the buffer zone 2 is protruded outwardly to form a connection port 22 , and the outer side of the connection port 22 is detachably connected to the blocking plate 4 .

[0046] A cryogenic pump 11 is provided below the buffer zone 2 to achieve exhaust by adsorbing gas molecules through a low-temperature surface.

[0047] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A dust particle buffer device, wherein the buffer device (5) is arranged in a buffer zone (2), the buffer zone (2) is connected to a vapor deposition process zone (1), and is characterized in that: The buffer device (5) is arranged on the side wall of the buffer zone (2) away from the evaporation process zone (1), the top of the evaporation process zone (1) is provided with a plating pot, the bottom of the evaporation process zone (1) is provided with an evaporation source, and a side wall of the evaporation process zone (1) close to the evaporation source is provided with an opening connected to the buffer zone (2), so that the gas blown out by the buffer device (5) is first buffered by the buffer zone (2) before reaching the evaporation process zone (1), the buffer device (5) includes a guide seat (51), the outer side wall of the buffer zone (2) is connected to a blocking plate (4), the outer side of the blocking plate (4) is connected to the solenoid valve (3), and the inner side of the blocking plate (4) is connected to the electromagnetic valve (3). The guide seat (51) is connected to the guide seat, which is a hollow structure formed by the guide seat shell. A main airflow channel (7) is provided in the hollow structure of the guide seat (51). A plurality of airflow dissipation holes (9) are evenly spaced on the side wall of the guide seat shell. The main airflow channel (7) is connected to the plurality of airflow dissipation holes (9). When it is necessary to break the vacuum, the solenoid valve (3) is opened to allow a strong airflow to enter from the main airflow channel (7), and is evenly divided into multiple small airflows through the plurality of airflow dissipation holes (9) and sprayed into the buffer zone (2). In this way, the strong airflow is not directly sprayed toward the evaporation process area (1), thereby effectively reducing the amount and density of dust.

2. The dust particle buffer device according to claim 1, characterized in that: The input end of the main airflow channel (7) is provided with an input hole (6), and the output end of the main airflow channel (7) is provided with a plurality of connecting tubes (8). Each of the airflow dissipation holes (9) corresponds to a connecting tube (8) one by one and is connected to the main airflow channel (7) through the connecting tube (8).

3. The dust particle buffer device according to claim 1, characterized in that: The guide seat (51) is cylindrical or block-shaped.

4. The dust particle buffer device according to claim 2, characterized in that: The guide seat (51) is a cylinder. The input hole (6) is located at the center of the input end of the main airflow channel (7), and the input hole (6) is connected to the blocking plate (4). A plurality of circles of airflow dissipation holes (9) are provided on the side wall along the length direction of the cylinder. A strong airflow enters the main airflow channel (7) from the input hole (6), is ejected to the end surface of the other end of the main airflow channel (7), and then rebounds, converting into a plurality of small airflows that are ejected to a plurality of connecting tubes (8) corresponding to the airflow dissipation holes (9), and then is dissipated and discharged from the side wall through the plurality of circles of airflow dissipation holes (9).

5. The dust particle buffer device according to claim 1, characterized in that: Each circle of airflow dissipation holes (9) is arranged radially around the center of the cylinder.

6. The dust particle buffer device according to claim 2, characterized in that: The guide seat (51) is block-shaped, the input hole (6) is located at the center of the input end of the main airflow channel (7), and the input hole (6) is connected to the blocking plate (4). A plurality of airflow dispersing holes (9) are evenly spaced apart on a side adjacent to the main airflow channel (7). A strong airflow enters the main airflow channel (7) from the input hole (6), is sprayed onto the inner wall of the main airflow channel (7), and is converted into a plurality of small airflows, which are sprayed onto a plurality of connecting tubes (8) corresponding to the airflow dispersing holes (9), and then evenly divided into a plurality of dispersed small airflows through the airflow dispersing holes (9) for dissipation and discharge.

7. The dust particle buffer device according to claim 1, characterized in that: The cross-sectional area of ​​the main airflow channel (7) is smaller than the sum of the cross-sectional areas of the other airflow dissipation holes (9), so that the total cross-sectional area for airflow to enter does not decrease, thereby causing the airflow intensity to decrease.

8. The dust particle buffer device according to claim 1, characterized in that: The cross-sectional area of ​​the main airflow channel (7) is at least 1.5 times smaller than the sum of the cross-sectional areas of the other airflow dissipation holes (9).

9. The dust particle buffer device according to claim 1, characterized in that: The outer side wall of the buffer zone (2) is protruding outwards and is provided with a connection port (22), and the outer side of the connection port (22) is detachably connected to the blocking plate (4).

10. The dust particle buffer device according to claim 1, characterized in that: The strong air flow that rushes in when the vacuum is broken is nitrogen.

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