Quantitative gas transmission device of atomic layer deposition equipment

Abstract

The utility model discloses a quantitative gas transmission device of atomic layer deposition equipment, and relates to the technical field of atomic layer deposition. The device comprises an atomic deposition frame, a gas transmission cylinder and a quantitative gas transmission component, the atomic deposition frame, the gas transmission cylinder and the quantitative gas transmission component are distributed and connected from bottom to top, the quantitative gas transmission component comprises a plurality of quantitative gas storage tanks arranged at the top end of the gas transmission cylinder, and one side of each quantitative gas storage tank is provided with a gas inlet pipe and a gas outlet pipe; the air inlet pipe and the air outlet pipe are provided with a first valve and a second valve respectively, and one end of the air outlet pipe extends into the air conveying cylinder. Gas can be quantitatively stored through the quantitative gas storage tank, and during atomic layer deposition reaction processing, the gas in the quantitative gas storage tank can be completely discharged outwards through the gas pushing component, so that gas waste is avoided, and meanwhile, the gas conveying efficiency can be improved; and the stability of the atomic layer deposition processing technology of the wafer body is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of atomic layer deposition, in particular to a quantitative gas delivery device for atomic layer deposition equipment. Background Art

[0002] Atomic layer deposition (ALD) is a method that sequentially injects different reactive gases into a reaction chamber, causing them to react on the target surface, thereby forming a single atomic film layer by layer. To ensure the consistency of the deposited layer on the target surface, the amount of gas entering the reaction chamber must be guaranteed each time. However, the gas source providing the reactive gas typically has a high pressure, and the amount of gas entering the reaction chamber cannot be precisely controlled by a valve, resulting in poor process stability.

[0003] The Chinese utility model patent application number 202222279873.3 discloses an atomic layer deposition device and a quantitative gas supply device for the atomic layer deposition device. The above technical solution uses a quantitative gas intake component to first allow the gas to enter a quantitative chamber with a fixed volume, and then allow the gas in the quantitative chamber to enter the reaction chamber. It can effectively control the volume of gas delivered to the reaction chamber each time, thereby ensuring the stability of the process and the consistency of the deposited layer, and has great practical significance.

[0004] During actual use, gas enters the quantitative chamber. During air intake, since there is no corresponding exhaust structure, it can only rely on the self-diffusion of the gas, which reduces the gas delivery efficiency. During exhaust, when the air pressure in the quantitative chamber is consistent with the air pressure inside the atomic layer deposition equipment, it will cause part of the gas in the quantitative chamber to be difficult to discharge outward, resulting in gas waste. Therefore, even if the gas is quantified in the quantitative chamber, it is still difficult to ensure the quantitative delivery of the gas during the subsequent reaction process, and it is still difficult to ensure the stability of the process in the future.

[0005] For this purpose, a quantitative gas supply device for atomic layer deposition equipment is proposed. Utility Model Content

[0006] In order to solve the problems existing in the prior art, the utility model provides a quantitative gas supply device for atomic layer deposition equipment.

[0007] In order to achieve the above-mentioned purpose, the present invention specifically adopts the following technical solutions:

[0008] A quantitative gas supply device for atomic layer deposition equipment includes an atomic deposition frame, a gas supply cylinder and a quantitative gas supply component, wherein the atomic deposition frame, the gas supply cylinder and the quantitative gas supply component are distributed and connected from bottom to top, the quantitative gas supply component includes a plurality of quantitative gas storage tanks arranged at the top of the gas supply cylinder, an air inlet pipe and an air outlet pipe are provided on one side of the quantitative gas storage tank, a first valve and a second valve are provided on the air inlet pipe and the air outlet pipe respectively, one end of the air outlet pipe extends to the interior of the gas supply cylinder, a piston is slidingly provided inside the quantitative gas storage tank, a cavity is provided on one side of the piston, an air pushing component for pushing the piston to move is provided on the quantitative gas storage tank, the air pushing component includes a mounting bracket arranged on one side of the quantitative gas storage tank, an electric telescopic rod is provided on one side of the mounting bracket, and the telescopic end of the electric telescopic rod extends to the interior of the quantitative gas storage tank.

[0009] Furthermore, an exhaust pipe is provided at the bottom end of the atomic deposition frame, and a supporting leg is provided at the bottom end of the atomic deposition frame.

[0010] Furthermore, a sealing door is hinged on one side of the atomic deposition frame, and a handle is provided on one side of the sealing door.

[0011] Furthermore, the gas delivery cylinder includes a first cylinder section, a second cylinder section and a third cylinder section, and the inner wall of the gas delivery cylinder is smooth.

[0012] Furthermore, a placement platform is provided inside the atomic deposition frame, and a wafer body is provided on the top of the placement platform.

[0013] Furthermore, a second mounting groove is provided on one side of the piston, a touch sensor is provided inside the second mounting groove, and a first mounting groove is provided on one side inside the quantitative gas storage tank, a touch block is provided inside the first mounting groove.

[0014] The beneficial effects of the utility model are as follows:

[0015] The utility model can store gas in a quantitative manner through the provided quantitative gas storage tank. When the atomic layer deposition reaction processing is carried out later, the provided gas pushing component can completely discharge the gas inside the quantitative gas storage tank to the outside, thereby avoiding gas waste. At the same time, it can also improve the efficiency of gas transportation and ensure the stability of the atomic layer deposition processing technology for the wafer body. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model;

[0017] Figure 2 It is a cross-sectional view of the utility model;

[0018] Figure 3 This is an enlarged view of part A of the utility model;

[0019] Figure 4 It is an enlarged view of part B of the present utility model.

[0020] Figure numerals: 1. Atomic deposition frame; 101. Exhaust pipe; 2. Sealing door; 201. Handle; 3. Support leg; 4. Gas cylinder; 401. First cylinder section; 402. Second cylinder section; 403. Third cylinder section; 5. Quantitative gas delivery component; 501. Quantitative gas storage tank; 502. Air inlet pipe; 503. First valve; 504. Air outlet pipe; 505. Second valve; 506. Piston; 507. Cavity; 6. Air pushing component; 601. Mounting frame; 602. Electric telescopic rod; 7. Placement platform; 8. Wafer body; 9. First mounting groove; 901. Touch block; 902. Second mounting groove; 903. Touch sensor. DETAILED DESCRIPTION

[0021] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0023] It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. In addition, the terms "first," "second," etc. are used only to distinguish the descriptions and are not to be understood as indicating or implying relative importance.

[0024] In the description of the embodiments of the present invention, it should be noted that the terms "inside", "outside", "upper", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the present invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as a limitation on the present invention.

[0025] like Figure 1-4As shown, a quantitative gas delivery device for an atomic layer deposition device includes an atomic deposition frame 1, a gas delivery cylinder 4 and a quantitative gas delivery component 5. The atomic deposition frame 1, the gas delivery cylinder 4 and the quantitative gas delivery component 5 are distributed and connected from bottom to top. The quantitative gas delivery component 5 includes a plurality of quantitative gas storage tanks 501 arranged at the top of the gas delivery cylinder 4. An air inlet pipe 502 and an air outlet pipe 504 are provided on one side of the quantitative gas storage tank 501. A first valve 503 and a second valve 505 are provided on the air inlet pipe 502 and the air outlet pipe 504 respectively. One end of the air outlet pipe 504 extends to the interior of the gas delivery cylinder 4. A piston 506 is slidingly provided inside the quantitative gas storage tank 501. A cavity 507 is provided on one side of the piston 506. The quantitative gas storage tank 501 is provided with a gas pushing component 6 for pushing the piston 506 to move. The gas pushing component 6 includes a mounting bracket 601 arranged on one side of the quantitative gas storage tank 501. An electric telescopic rod is provided on one side of the mounting bracket 601 602, the telescopic end of the electric telescopic rod 602 extends to the interior of the quantitative gas storage tank 501; specifically, the first valve 503 is opened, and the gas can enter the internal storage of the quantitative gas storage tank 501. After the gas enters, it pushes the piston 506 to move. When the piston 506 moves to the other side of the quantitative gas storage tank 501, the touch sensor 903 can contact the touch block 901. The touch sensor 903 senses the touch signal and sends a signal to the external controller. The controller controls the first valve 503 to close, so that a certain amount of gas can be delivered. When atomic layer precipitation is required, the second valve 505 is opened, and the electric telescopic rod 602 is extended to push the piston 506 to move, thereby pushing the gas inside the quantitative gas storage tank 501 outward. When in use, the piston 506 moves to the other side of the quantitative gas storage tank 501 to completely push the gas outward, thereby avoiding gas waste.

[0026] like Figure 2 As shown, an exhaust pipe 101 is provided at the bottom end of the atomic deposition frame 1 , and a supporting leg 3 is provided at the bottom end of the atomic deposition frame 1 ; specifically, excess gas after gas reaction atomic deposition can be discharged outward through the exhaust pipe 101 .

[0027] like Figure 1 As shown, a sealing door 2 is hinged on one side of the atomic deposition frame 1, and a handle 201 is provided on one side of the sealing door 2; specifically, the atomic deposition frame 1 can be sealed by the sealing door 2, and when the wafer body 8 is placed, the sealing door 2 is opened for easy placement.

[0028] like Figure 2As shown, the gas cylinder 4 includes a first cylinder section 401, a second cylinder section 402 and a third cylinder section 403, and the inner wall of the gas cylinder 4 is smooth; specifically, the first cylinder section 401 is funnel-shaped, and the third cylinder section 403 is an inverted funnel-shaped. When gas is transmitted, the gas can be gathered under the action of the third cylinder section 403, thereby accelerating the mixing between the gases. Under the action of the first cylinder section 401, the gas can diffuse, thereby enabling the atomic layer to be evenly deposited on the surface of the wafer body 8.

[0029] like Figure 2 As shown, a placement platform 7 is provided inside the atomic deposition frame 1 , and a wafer body 8 is provided on the top of the placement platform 7 .

[0030] like Figure 3 and 4 As shown, a second mounting groove 902 is provided on one side of the piston 506, and a touch sensor 903 is provided inside the second mounting groove 902. A first mounting groove 9 is provided on one side of the interior of the quantitative gas storage tank 501, and a touch block 901 is provided inside the first mounting groove 9. Specifically, the piston 506 is provided to slide in a sealed manner inside the quantitative gas storage tank 501 to avoid air leakage. When air is taken in, the gas can push the piston 506 to move. After the piston 506 moves to the corresponding position, the touch sensor 903 touches the touch block 901, indicating that the gas is fully filled. The touch sensor 903 is a prior art, so its principle, structure and model will not be described in detail here. Since the piston 506 has a certain friction with the quantitative gas storage tank 501, it will not be affected by the impact of the gas and move too far. It can move evenly as the gas continues to increase.

[0031] In summary: when the first valve 503 is opened, the gas can enter the internal storage of the quantitative gas storage tank 501. After the gas enters, it pushes the piston 506 to move. When the piston 506 moves to the other side of the quantitative gas storage tank 501, the touch sensor 903 can contact the touch block 901. The touch sensor 903 senses the touch signal and sends a signal to the external controller. The controller controls the first valve 503 to close, so that a certain amount of gas can be delivered. When atomic layer precipitation is required, the second valve 505 is opened, and the electric telescopic rod 602 is extended to push the piston 506 to move, thereby pushing the gas inside the quantitative gas storage tank 501 outward. When in use, the piston 506 moves to the other side of the quantitative gas storage tank 501 to completely push the gas outward, thereby avoiding gas waste.

[0032] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions merely illustrate the principles of the present invention. Various changes and improvements are possible without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed for the present invention is defined by the appended claims and their equivalents.

Claims

1. A quantitative gas delivery device for an atomic layer deposition device, characterized in that: The invention comprises an atomic deposition frame (1), an air delivery cylinder (4) and a quantitative air delivery component (5), wherein the atomic deposition frame (1), the air delivery cylinder (4) and the quantitative air delivery component (5) are connected from bottom to top, and the quantitative air delivery component (5) comprises a plurality of quantitative air storage tanks (501) arranged at the top of the air delivery cylinder (4), an air inlet pipe (502) and an air outlet pipe (504) are arranged on one side of the quantitative air storage tank (501), a first valve (503) and a second valve (505) are respectively arranged on the air inlet pipe (502) and the air outlet pipe (504), and one end of the air outlet pipe (504) extends To the interior of the gas delivery cylinder (4), a piston (506) is slidably provided inside the quantitative gas storage tank (501), a cavity (507) is provided on one side of the piston (506), and a gas pushing component (6) is provided on the quantitative gas storage tank (501) to push the piston (506) to move, and the gas pushing component (6) includes a mounting frame (601) provided on one side of the quantitative gas storage tank (501), and an electric telescopic rod (602) is provided on one side of the mounting frame (601), and the telescopic end of the electric telescopic rod (602) extends to the interior of the quantitative gas storage tank (501).

2. The quantitative gas supply device of the atomic layer deposition equipment according to claim 1, characterized in that: An exhaust pipe (101) is provided at the bottom end of the atomic deposition frame (1), and a supporting leg (3) is provided at the bottom end of the atomic deposition frame (1).

3. The quantitative gas supply device of the atomic layer deposition equipment according to claim 1, characterized in that: A sealing door (2) is hinged on one side of the atomic deposition frame (1), and a handle (201) is provided on one side of the sealing door (2).

4. The quantitative gas supply device of the atomic layer deposition equipment according to claim 1, characterized in that: The gas delivery cylinder (4) comprises a first cylinder section (401), a second cylinder section (402) and a third cylinder section (403), and the inner wall of the gas delivery cylinder (4) is smooth.

5. The quantitative gas supply device of the atomic layer deposition equipment according to claim 1, characterized in that: A placement platform (7) is provided inside the atomic deposition frame (1), and a wafer body (8) is provided on the top of the placement platform (7).

6. The quantitative gas supply device of the atomic layer deposition equipment according to claim 1, characterized in that: A second mounting groove (902) is provided on one side of the piston (506), a touch sensor (903) is provided inside the second mounting groove (902), a first mounting groove (9) is provided on one side of the interior of the quantitative gas storage tank (501), and a touch block (901) is provided inside the first mounting groove (9).

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