Electroplating device for PCB (printed circuit board) production

Abstract

The utility model provides an electroplating device for producing a PCB (Printed Circuit Board), which comprises an electroplating bath, a bracket is fixedly arranged at the top of the electroplating bath, an air cylinder is fixedly arranged at the top of the bracket, a fixed plate is fixedly arranged at the moving end of the air cylinder, and suspenders are arranged on the two sides of the lower surface of the fixed plate and can be transversely adjusted. Telescopic adjusting rods are fixedly arranged at the lower ends of the two hanging rods correspondingly, and L-shaped clamping plates are fixedly arranged at the two ends of the two telescopic adjusting rods correspondingly. According to the utility model, the four corners of the PCB can be clamped and fixed, so that metal pins or metal contact points on the side edges of the PCB are prevented from being blocked, and the electroplating quality of the PCB is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB line board production, in particular to an electroplating device for PCB line board production. Background Art

[0002] PCB electroplating is an important process performed during the manufacturing of printed circuit boards. It involves plating a layer of metal on the printed circuit board. Common metals include copper, nickel, and gold to enhance its conductivity and corrosion resistance.

[0003] During electroplating, existing PCBs are typically placed in a plating tank using a clamping mechanism. Some PCBs have metal parts on their sides for electrical connections, such as specially designed PCBs with metal pins or metal contacts for connecting to other devices. To ensure good conductivity and signal transmission, these sides require electroplating. However, conventional clamping mechanisms obscure these metal pins or contacts, reducing plating quality. Therefore, a plating device for PCB production is proposed. Utility Model Content

[0004] Based on the above technical problems, the utility model provides an electroplating device for PCB line board production, including an electroplating tank, a bracket is fixedly provided on the top of the electroplating tank, a cylinder is fixedly provided on the top of the bracket, a fixed plate is fixedly provided on the movable end of the cylinder, and both sides of the lower surface of the fixed plate can be adjusted laterally with suspension rods, the lower ends of the two suspension rods are fixed with telescopic adjustment rods, and both ends of the two telescopic adjustment rods are fixed with L-shaped splints.

[0005] Preferably, a mounting seat is fixedly provided at the upper end of the suspension rod, a screw is provided at the top of the mounting seat, mounting openings are provided on both sides of the fixing plate, and the rod wall of the screw passes through the interior of the mounting opening and is threaded with a nut.

[0006] Preferably, a gripping ring is provided at the upper end of the nut.

[0007] Preferably, the telescopic adjustment rod includes a sleeve, a connecting rod and a bolt. The connecting rod is plugged into both ends of the sleeve. The bolt is threadedly arranged on the pipe wall of the sleeve and tightens the connecting rod.

[0008] Preferably, the connecting rod is an L-shaped rod, and the end surface of the sleeve and the end surface of the connecting rod are both square structures.

[0009] Preferably, the side wall of the L-shaped clamping plate is provided with a plurality of evenly distributed flow holes.

[0010] The beneficial effects of the utility model are:

[0011] 1. The utility model is provided with a fixed plate, a hanging rod, a telescopic adjustment rod and an L-shaped clamping plate. The hanging rod can be adjusted in the horizontal position on the fixed plate, and the telescopic adjustment rod can be adjusted to adjust the position of the L-shaped clamping plate, so that the two corners on one side of the PCB line board can be clamped. At the same time, the two corners on one side of the PCB line board are clamped by the two L-shaped clamping plates on the other side, so that the four corners of the PCB line board can be clamped and fixed, avoiding the side metal pins or metal contact points of the PCB line board from being blocked, thereby improving the electroplating quality of the PCB line board.

[0012] 2. The utility model adds a mounting seat, a screw, a mounting port and a nut. When the lateral position of the L-shaped splint needs to be adjusted, the nut can be rotated by hand to release the position fixation between the screw and the fixing plate, and then the screw can be moved laterally inside the mounting port to move the L-shaped splint laterally. Then, the nut can be tightened to adjust the position of the suspension rod, thereby fixing the lateral position of the L-shaped splint.

[0013] 3. The present invention adds a sleeve, a connecting rod and a bolt. When the distance between the two L-shaped splints needs to be adjusted, the bolt is loosened with a wrench so that the connecting rod can move inside the sleeve, thereby increasing or decreasing the distance between the two L-shaped splints. The bolt is then tightened with a wrench to fix the position of the two L-shaped splints. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is the overall structural entity diagram of the utility model;

[0015] Figure 2 for Figure 1 A top view of the middle boom, telescopic adjustment rod, and L-shaped clamping plate;

[0016] Figure 3 for Figure 1 A magnified view of the structure of part A in the middle;

[0017] Figure 4 for Figure 1 Top view of the center fixing plate.

[0018] As shown in the figure: 1- electroplating tank, 2- bracket, 3- cylinder, 4- fixed plate, 5- suspension rod, 6- telescopic adjustment rod, 7- L-shaped clamp, 8- mounting seat, 9- screw rod, 10- mounting port, 11- nut, 12- sleeve, 13- connecting rod, 14- bolt, 15- flow hole. DETAILED DESCRIPTION

[0019] Reference Figure 1-4The present invention provides an electroplating device for PCB production, comprising an electroplating tank 1, a bracket 2 is fixed on the top of the electroplating tank 1, a cylinder 3 is fixed on the top of the bracket 2, a fixed plate 4 is fixed on the movable end of the cylinder 3, and both sides of the lower surface of the fixed plate 4 can be adjusted laterally with a suspension rod 5, the lower ends of the two suspension rods 5 are fixed with a telescopic adjustment rod 6, and both ends of the two telescopic adjustment rods 6 are fixed with an L-shaped clamping plate 7. The side wall of the L-shaped clamping plate 7 is provided with a plurality of evenly distributed flow holes 15, which can ensure that the electroplating solution penetrates and contacts the side wall of the PCB line board. It should be emphasized here that the metal lead The feet or metal contact points are generally in the middle of the side of the PCB board, and there are no feet or metal contact points on the corner side, so there will be no obstruction. The suspension rod 5 can be adjusted in the horizontal position on the fixed plate 4, and the telescopic adjustment rod 6 can be adjusted to adjust the position of the L-shaped clamping plate 7, so that the two corners on one side of the PCB board can be clamped. At the same time, the two corners on one side of the PCB board are clamped by the two L-shaped clamping plates 7 on the other side, so that the four corners of the PCB board can be clamped and fixed, avoiding the side metal pins or metal contact points of the PCB board from being blocked, thereby improving the electroplating quality of the PCB board.

[0020] A mounting seat 8 is fixed to the upper end of the boom 5, a screw 9 is provided on the top of the mounting seat 8, mounting openings 10 are provided on both sides of the fixing plate 4, the rod wall of the screw 9 passes through the interior of the mounting opening 10 and is threaded with a nut 11, and a gripping ring is provided on the upper end of the nut 11. The manual hand holds the gripping ring and rotates the nut 11 so that the position between the screw 9 and the fixing plate 4 can be fixed or released, thereby allowing the screw 9 to move inside the mounting opening 10 and adjust the horizontal position of the telescopic adjustment rod 6 and the L-shaped splint 7 laterally to the left and right.

[0021] The telescopic adjustment rod 6 includes a sleeve 12, a connecting rod 13 and a bolt 14. The connecting rod 13 is inserted at both ends of the sleeve 12. The bolt 14 is threaded on the pipe wall of the sleeve 12 and tightens the connecting rod 13. The connecting rod 13 is an L-shaped rod. The end face of the sleeve 12 and the end face of the connecting rod 13 are both square structures. By loosening the bolt 14 with a wrench, the connecting rod 13 can be moved to the internal position of the sleeve 12, so that the distance between the two L-shaped clamps 7 is increased or decreased, and then the bolt 14 is tightened with a wrench to fix the position of the two L-shaped clamps 7.

[0022] When the present invention is in use, the position of the L-shaped clamping plate 7 is manually adjusted according to the size of the PCB line board, so that the spacing between the L-shaped clamping plates 7 on both sides conforms to the length of the PCB line board, and the spacing between the two L-shaped clamping plates 7 on both sides is adjusted at the same time, so that the spacing between the L-shaped clamping plates 7 is adapted to the width of the PCB line board. Finally, the four corners of the PCB line board are clamped and fixed by the L-shaped clamping plates 7 distributed at the four corners to prevent the side metal pins or metal contact points of the PCB line board from being blocked, and then the cylinder 3 is controlled to extend, and the extension of the cylinder 3 drives the PCB line board to move down into the interior of the electroplating tank 1 and perform the electroplating operation.

[0023] The above shows and describes the basic principles, main features and advantages of the present invention. The various components mentioned in the present invention are common technologies in the existing field. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements fall within the scope of the present invention. The scope of protection claimed in this utility model is defined by the appended claims and their equivalents.

Claims

1. An electroplating device for PCB production, comprising an electroplating tank (1), characterized in that: A bracket (2) is fixedly provided on the top of the electroplating tank (1), a cylinder (3) is fixedly provided on the top of the bracket (2), a fixed plate (4) is fixedly provided on the movable end of the cylinder (3), and both sides of the lower surface of the fixed plate (4) are laterally adjustable with suspension rods (5), the lower ends of the two suspension rods (5) are fixedly provided with telescopic adjustment rods (6), and both ends of the two telescopic adjustment rods (6) are fixedly provided with L-shaped clamping plates (7).

2. The electroplating device for PCB production according to claim 1, characterized in that: A mounting seat (8) is fixedly provided at the upper end of the suspension rod (5), a screw rod (9) is provided at the top of the mounting seat (8), mounting openings (10) are provided on both sides of the fixing plate (4), and the rod wall of the screw rod (9) passes through the interior of the mounting opening (10) and is threadedly provided with a nut (11).

3. The electroplating device for PCB production according to claim 2, characterized in that: The upper end of the nut (11) is provided with a gripping ring.

4. The electroplating device for PCB production according to claim 1, characterized in that: The telescopic adjustment rod (6) comprises a sleeve (12), a connecting rod (13) and a bolt (14); the connecting rod (13) is plugged into the two ends of the sleeve (12); the bolt (14) is threadedly arranged on the wall of the sleeve (12) and presses the connecting rod (13) against the sleeve (12).

5. The electroplating device for PCB production according to claim 4, characterized in that: The connecting rod (13) is an L-shaped rod, and the end surface of the sleeve (12) and the end surface of the connecting rod (13) are both square structures.

6. The electroplating device for PCB production according to claim 1, characterized in that: The side wall of the L-shaped clamping plate (7) is provided with a plurality of evenly distributed flow holes (15).

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