Cooling equipment for semiconductor laser power supply production and processing

Abstract

The utility model belongs to the technical field of semiconductor laser power supply production, and particularly relates to cooling equipment for semiconductor laser power supply production and processing, which comprises a water tank and a support, the support is fixedly mounted on the right side of the water tank, a cooling device is arranged above the water tank, and the cooling device comprises a cooling unit, a drying unit and a circulating unit. According to the cooling equipment for production and processing of the semiconductor laser power supply, the cooling unit is arranged, a shell of the semiconductor laser power supply to be cooled is placed on the top of the conveying belt, then the conveying belt is started to convey the shell of the power supply, meanwhile, a first pump body is started to pump out cooling liquid in a water tank, and then the cooling liquid is sprayed out through a spray head to cool the shell; according to the semiconductor laser power supply shell cooling device, power supply shells can be cooled in batches, the machining efficiency of semiconductor laser power supplies is improved, and the problems that in the background technology, only one semiconductor laser power supply shell can be clamped at a time in the using process, the next shell can be machined only after the previous shell is cooled, use is inconvenient, and efficiency is low are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor laser power supply production, in particular to cooling equipment for production and processing of semiconductor laser power supplies. Background Art

[0002] A semiconductor laser power supply consists of a metal housing and circuitry, which includes a voltage regulator, laser power supply pulse control circuit, pulse generation circuit, and protection circuitry. Digital semiconductor laser power supplies, with digital integrated circuits at their core, are designed to enable intelligent control of semiconductor laser power supplies. Therefore, during the production and processing of semiconductor laser power supplies, the housing must be hardened to increase its stability. After hardening, the housing must be cooled to facilitate further processing.

[0003] The existing technology uses a method of providing a cleaning component and a filtering component for processing, but the device is not convenient for moving the workpiece that needs to be cooled during use, so it is not convenient to remove the coolant attached to the outer surface of the workpiece when cooling the workpiece, which reduces the practicality of the cooling equipment.

[0004] For example, a cooling device for producing and processing semiconductor laser power supplies disclosed in announcement number CN220981666U uses a cooling box, a conveying component, and a clamping component to assist in cooling the outer shell of the semiconductor laser power supply, thereby increasing the functionality of the cooling device.

[0005] However, the device can only hold one shell of a semiconductor laser power supply at a time during use, and the next shell can only be processed after the previous shell cools down, which is inconvenient to use and has low efficiency.

[0006] For this reason, we urgently need to provide a cooling device for the production and processing of semiconductor laser power supplies. Utility Model Content

[0007] The purpose of the utility model is to provide a cooling device for the production and processing of semiconductor laser power supplies, so as to solve the problem proposed in the above background technology that during use, only one semiconductor laser power supply shell can be clamped at a time, and the next shell can only be processed after the previous shell has cooled down, which is inconvenient to use and low efficiency.

[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a cooling device for the production and processing of semiconductor laser power supplies, comprising a water tank and a bracket, wherein the bracket is fixedly installed on the right side of the water tank, and a cooling device is provided above the water tank, wherein the cooling device comprises a cooling unit, a drying unit and a circulation unit.

[0009] The cooling unit is arranged above the water tank, the drying unit is arranged inside the water tank bracket, and the circulation unit is arranged in front of the water tank.

[0010] The cooling unit includes a conveyor belt, a baffle, a water tank, a pump body, a liquid dispensing pipe and a nozzle. The conveyor belt is installed at the upper end of the water tank, the baffle is fixedly installed on the top of the conveyor belt, the water tank is installed on the left side of the front of the water tank, the pump body is installed on the top of the water tank, the liquid dispensing pipe is connected to the output end of the pump body, and the nozzle is connected to the side of the liquid dispensing pipe away from the pump body.

[0011] Preferably, the baffles are equidistantly distributed on the surface of the conveyor belt, and the baffles are used to block the left side of the housing of the semiconductor laser power supply to prevent the housing of the semiconductor laser power supply from slipping on the conveyor belt during transportation.

[0012] Preferably, a water leakage groove is provided on the surface of the conveyor belt. After the shell of the semiconductor laser power supply is placed on the conveyor belt, the conveyor belt is started to transport the shell of the semiconductor laser power supply. At the same time, the pump body is started to extract the coolant in the water tank and then spray it out from the nozzle to cool the shell. The used coolant flows through the water leakage groove to the water tank for storage.

[0013] Preferably, the drying unit includes a hot air blower, a connecting pipe and an air outlet pipe, the hot air blower is installed on the top of the bracket, the connecting pipe is connected to the output end of the hot air blower, and the air outlet pipe is installed inside the connecting pipe.

[0014] Preferably, the circulation unit includes a filter, a cooling box, a second pump body, a water outlet pipe, a third pump body and a circulation pipe. The filter is installed inside the water tank at the lower end of the baffle. The cooling box is installed on the right side of the front of the water tank. The second pump body is installed on the back of the cooling box. The water outlet pipe is connected to the output end of the second pump body. The third pump body is installed on the front of the water tank, and the circulation pipe is connected to the output end of the third pump body.

[0015] Preferably, the end of the water outlet pipe away from the pump body 2 is connected to the water tank, and the end of the circulation pipe away from the pump body 3 is connected to the cooling box. By starting the pump body 2, the coolant in the water tank is pumped into the cooling box through the water outlet pipe, and then the pump body 3 pumps the coolant in the cooling box into the water tank through the circulation pipe, thereby realizing the recycling of the coolant.

[0016] Preferably, a semiconductor refrigeration plate is installed inside the cooling box, and the cooling end of the semiconductor refrigeration plate is located inside the cooling box, and the heat dissipation end is located outside the cooling box. The coolant in the cooling box is cooled by the semiconductor refrigeration plate, thereby improving the cooling effect of the circulating coolant.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] 1. The cooling equipment for the production and processing of semiconductor laser power supplies is provided with a cooling unit. The shell of the semiconductor laser power supply to be cooled is placed on top of a conveyor belt. The conveyor belt is then started to transport the power supply shell. At the same time, the pump body is started to extract the coolant in the water tank and then spray it out through the nozzle to cool the shell. The power supply shells can be cooled in batches, thereby improving the processing efficiency of semiconductor laser power supplies. This solves the problem proposed in the background technology that only one semiconductor laser power supply shell can be clamped at a time during use, and the next shell can only be processed after the previous shell has cooled down, which is inconvenient to use and low efficiency.

[0019] 2. The cooling equipment for the production and processing of semiconductor laser power supplies is provided with a circulation unit. By starting the second pump body, the coolant in the water tank is pumped into the cooling box through the outlet pipe, and then the third pump body pumps the coolant in the cooling box into the water tank through the circulation pipe, thereby realizing the recycling of the coolant. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0021] Figure 2 This is a schematic diagram of the internal structure of the water tank of the present invention;

[0022] Figure 3 This is a schematic structural diagram of the connection between the cooling unit and the circulation unit of the present invention;

[0023] Figure 4 This is a schematic structural diagram of the drying unit of the present utility model.

[0024] In the figure: 1. Water tank; 2. Bracket; 301. Conveyor belt; 302. Baffle; 303. Water tank; 304. Pump body 1; 305. Liquid distribution pipe; 306. Nozzle; 401. Hot air blower; 402. Connecting pipe; 403. Air outlet pipe; 501. Filter; 502. Cooling box; 503. Pump body 2; 504. Water outlet pipe; 505. Pump body 3; 506. Circulation pipe. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] See also Figures 1-4 , the utility model provides a technical solution:

[0027] Example 1:

[0028] A cooling device for producing and processing semiconductor laser power supplies includes a water tank 1 and a bracket 2. The bracket 2 is fixedly installed on the right side of the water tank 1. A cooling device is provided above the water tank 1. The cooling device includes a cooling unit, a drying unit and a circulation unit.

[0029] The cooling unit is arranged above the water tank 1 , the drying unit is arranged inside the bracket 2 of the water tank 1 , and the circulation unit is arranged in front of the water tank 1 .

[0030] The cooling unit includes a conveyor belt 301, a baffle 302, a water tank 303, a pump body 304, a liquid distribution pipe 305 and a nozzle 306. The conveyor belt 301 is installed at the upper end of the water tank 1. A water leakage groove is opened on the surface of the conveyor belt 301. After the shell of the semiconductor laser power supply is placed on the conveyor belt 301, the conveyor belt 301 is started to transport the shell of the semiconductor laser power supply. At the same time, the pump body 304 is started to extract the coolant in the water tank 303 and then spray it out from the nozzle 306 to cool the shell. The used coolant flows through the water leakage groove. To be stored in the water tank 1, the baffle 302 is fixedly installed on the top of the conveyor belt 301, and the baffles 302 are equidistantly distributed on the surface of the conveyor belt 301. The baffle 302 blocks the left side of the shell of the semiconductor laser power supply to prevent the shell of the semiconductor laser power supply from slipping on the conveyor belt 301 during transportation. The water tank 303 is installed on the left side of the front of the water tank 1, the pump body 304 is installed on the top of the water tank 303, the dispensing tube 305 is connected to the output end of the pump body 304, and the nozzle 306 is connected to the side of the dispensing tube 305 away from the pump body 304.

[0031] The drying unit includes a hot air blower 401, a connecting pipe 402 and an air outlet pipe 403. The hot air blower 401 is installed on the top of the bracket 2, the connecting pipe 402 is connected to the output end of the hot air blower 401, and the air outlet pipe 403 is installed on the inner side of the connecting pipe 402. By starting the hot air blower 401, the hot air is blown from the connecting pipe 402 to the surface of the power supply casing through the air outlet pipe 403 to dry the power supply casing.

[0032] Example 2: Based on Example 1: The circulation unit includes a filter 501, a cooling box 502, a second pump body 503, a water outlet pipe 504, a third pump body 505 and a circulation pipe 506. The filter 501 is installed inside the water tank 1 at the lower end of the baffle 302. The used coolant is filtered through the filter 501 to prevent the internal impurities from clogging the nozzle 306 when the coolant is circulated. The cooling box 502 is installed on the right side of the front of the water tank 1, the second pump body 503 is installed on the back of the cooling box 502, and the water outlet pipe 504 is connected to the second pump body. The output end of 503, pump body three 505 is installed on the front of the water tank 303, the circulation pipe 506 is connected to the output end of the pump body three 505, the end of the water outlet pipe 504 away from the pump body two 503 is connected to the water tank 1, and the end of the circulation pipe 506 away from the pump body three 505 is connected to the cooling box 502. By starting the pump body two 503, the coolant in the water tank 1 is pumped into the cooling box 502 through the water outlet pipe 504, and then the coolant in the cooling box 502 is pumped into the water tank 303 through the circulation pipe 506 by the pump body three 505, thereby realizing the recycling of the coolant.

[0033] Example 3: Based on Example 2: A semiconductor refrigeration plate is installed inside the cooling box 502, and the cooling end of the semiconductor refrigeration plate is located inside the cooling box 502, and its heat dissipation end is located outside the cooling box 502. The coolant in the cooling box 502 is cooled by the semiconductor refrigeration plate, thereby improving the cooling effect of the circulating coolant.

[0034] During use, the shell of the semiconductor laser power supply to be cooled is placed on the top of the conveyor belt 301, and then the conveyor belt 301 is started to transport the power supply shell. At the same time, the pump body 1 304 is started to extract the coolant in the water tank 303 and then spray it out by the nozzle 306 to cool the shell. When the shell is transported to the inside of the bracket 2, the hot air blower 401 is started to blow hot air along the connecting pipe 402 through the air outlet pipe 403 to dry the power supply shell, thereby completing the cooling of the semiconductor laser power supply shell. When the coolant inside the water tank 1 needs to be recycled, the pump body 2 503 is started to pump the coolant in the water tank 1 into the cooling box 502 through the outlet pipe 504, and then the semiconductor refrigeration plate cools the coolant in the cooling box 502. The cooled coolant is then pumped into the water tank 303 through the circulation pipe 506 by the pump body 3 505, thereby realizing the recycling of the coolant.

[0035] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a..." does not exclude the presence of additional identical elements in the process, method, article, or device comprising the element.

Claims

1. A cooling device for producing and processing semiconductor laser power supplies, comprising a water tank (1) and a bracket (2), wherein the bracket (2) is fixedly mounted on the right side of the water tank (1), and is characterized in that: A cooling device is provided above the water tank (1), and the cooling device comprises a cooling unit, a drying unit and a circulation unit; The cooling unit is arranged above the water tank (1), the drying unit is arranged inside the bracket (2) of the water tank (1), and the circulation unit is arranged on the front side of the water tank (1); The cooling unit comprises a conveyor belt (301), a baffle (302), a water tank (303), a pump body (304), a liquid dispensing pipe (305) and a nozzle (306); the conveyor belt (301) is installed at the upper end of the interior of the water tank (1); the baffle (302) is fixedly installed on the top of the conveyor belt (301); the water tank (303) is installed on the left side of the front of the water tank (1); the pump body (304) is installed on the top of the water tank (303); the liquid dispensing pipe (305) is connected to the output end of the pump body (304); and the nozzle (306) is connected to the side of the liquid dispensing pipe (305) away from the pump body (304).

2. The cooling device for producing and processing semiconductor laser power supplies according to claim 1, characterized in that: The baffles (302) are evenly distributed on the surface of the conveyor belt (301).

3. The cooling device for producing and processing semiconductor laser power supplies according to claim 1, characterized in that: A water leakage groove is provided on the surface of the conveyor belt (301).

4. The cooling device for producing and processing semiconductor laser power supplies according to claim 1, characterized in that: The drying unit comprises a hot air blower (401), a connecting pipe (402) and an air outlet pipe (403); the hot air blower (401) is installed on the top of the bracket (2); the connecting pipe (402) is connected to the output end of the hot air blower (401); and the air outlet pipe (403) is installed on the inner side of the connecting pipe (402).

5. The cooling device for producing and processing semiconductor laser power supplies according to claim 1, characterized in that: The circulation unit comprises a filter (501), a cooling box (502), a second pump body (503), a water outlet pipe (504), a third pump body (505) and a circulation pipe (506); the filter (501) is installed inside the water tank (1) and is located at the lower end of the baffle (302); the cooling box (502) is installed on the right side of the front of the water tank (1); the second pump body (503) is installed on the back of the cooling box (502); the water outlet pipe (504) is connected to the output end of the second pump body (503); the third pump body (505) is installed on the front of the water tank (303); and the circulation pipe (506) is connected to the output end of the third pump body (505).

6. The cooling device for producing and processing semiconductor laser power supplies according to claim 5, characterized in that: The end of the water outlet pipe (504) away from the second pump body (503) is connected to the water tank (1), and the end of the circulation pipe (506) away from the third pump body (505) is connected to the cooling box (502).

7. The cooling device for producing and processing semiconductor laser power supplies according to claim 5, characterized in that: A semiconductor refrigeration chip is installed inside the cooling box (502), and the cooling end of the semiconductor refrigeration chip is located inside the cooling box (502), and the heat dissipation end is located outside the cooling box (502).

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