Semiconductor heat exchanger

Abstract

The utility model relates to the technical field of heat exchangers, in particular to a semiconductor heat exchanger. The cooling tube group is used for cooling a semiconductor, the radiating tube group can perform medium circulation with the cooling tube group and radiate the medium, the radiating tube group comprises at least two finned tubes which are distributed side by side and are sequentially connected in series, and the outermost finned tube is communicated with the cooling tube group through a flow guide joint; the finned tubes are matched on the mounting frame in a rotating mode, the adjacent finned tubes are connected in series through the connecting bends, and the finned tubes are matched with the connecting bends and the flow guide connectors in a sealed rotating mode. In the dust cleaning process, the heat exchanger does not need to be shut down, the finned tubes do not need to be disassembled, and online dust cleaning of the heat exchanger in the non-shutdown state can be achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat exchangers, in particular to a semiconductor heat exchanger. Background Art

[0002] A semiconductor refers to a material whose electrical conductivity at room temperature is between that of a conductor and an insulator. A semiconductor heat exchanger is a device that uses the Peltier effect of semiconductor materials to transfer heat. It can effectively and quickly remove the high heat generated by the chip, ensuring stable operation of the computer without malfunctioning due to overheating.

[0003] After the semiconductor heat exchanger heats up through heat exchange with the semiconductor material, it needs to cool down through heat exchange with the air through a heat pipe. Most existing heat pipes, as described in the text entitled "A Type of Heat Dissipation Fin Tube for a Semiconductor Heat Exchanger" with Chinese Patent Publication No. CN212843114U, adopt a form in which a number of fins are arranged on the outside of the pipe. Although this fin tube form has a good heat dissipation effect, after long-term use, a large amount of dust easily accumulates in the gaps between the fins, seriously affecting the heat dissipation effect of the fin tube. Therefore, it is necessary to wipe around the circumference of the fin tube to clean the dust in the fin gaps. In a molded semiconductor heat exchanger, the fin tubes are often arranged in parallel, and the installation between adjacent fin tubes is relatively dense. This creates a dead corner in the fin gap between adjacent fin tubes that cannot be cleaned. During the dust cleaning process, the heat exchanger needs to be shut down and the fin tubes removed before the dead corner can be properly cleaned. But obviously, on the one hand, the disassembly process is cumbersome and the assembly process takes a long time, which makes the installation and disassembly time-consuming and labor-intensive; on the other hand, considering that the semiconductor's continuous high-temperature working environment requires a heat exchanger to continuously cool down, if the heat exchanger is installed or disassembled, it is necessary to shut down the computer for processing, causing the computer's working rhythm to stagnate, which brings more troubles to actual work. Utility Model Content

[0004] In order to avoid and overcome the technical problems existing in the prior art, the utility model provides a semiconductor heat exchanger. During the dust cleaning process, the heat exchanger does not need to be shut down or the fin tubes need not be disassembled, and online dust cleaning of the heat exchanger can be achieved without shutting down the heat exchanger.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A semiconductor heat exchanger includes a cooling tube group for cooling semiconductors and a heat dissipation tube group capable of circulating a medium with the cooling tube group and dissipating heat from the medium. The heat dissipation tube group includes at least two fin tubes distributed side by side and connected in series, and the outermost fin tube is connected to the cooling tube group via a guide joint. The fin tubes are rotatably fitted on a mounting frame, and adjacent fin tubes are connected in series via connecting elbows. The connections between the fin tubes, the connecting elbows, and the guide joints are all sealed and rotatably fitted.

[0007] As a further solution of the present invention: the heat dissipating fins on the finned tube are distributed in a spiral shape.

[0008] As a further solution of the present invention: a driven gear is coaxially fixed on the fin tube, and the driven gears on adjacent fin tubes are meshed with each other. A motor is installed on the mounting frame, and a driving gear meshing with any driven gear is fixed on the output shaft of the motor.

[0009] As a further solution of the present invention: the cooling tube group and the heat dissipation tube group are distributed in sequence up and down, a heat conduction platform fixed to the mounting frame is provided above the cooling tube group, and the cooling tube group is provided with a corrugated structure that fits the lower plate surface of the heat conduction platform.

[0010] As a further solution of the present invention: the upper and lower surfaces of the heat conducting platform are both provided with a heat conducting coating.

[0011] As a further solution of the present invention: it also includes a liquid supply component, which is connected in series in the circulation pipeline formed between the cooling tube group and the heat dissipation tube group, and the liquid supply component includes a liquid pump for circulating the medium among the cooling tube group, the heat dissipation tube group and the liquid supply component.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] 1. The fin tubes in the present application are in an active state that can be rotated at any time. Therefore, when cleaning the fin tubes, compared with the fin tubes in a fixed state, manual work is required to wipe the dust around the outer periphery of the fin tubes, resulting in a cleaning dead corner. In the present application, it is only necessary to manually arrange the cleaning assembly on one side of the fin tube. By rotating the fin tube, the side of the fin tube originally located in the cleaning dead corner can be rotated to the cleaning assembly for cleaning, so that there is no dust cleaning dead corner, and the dust on the outer periphery of the fin tube can be evenly cleaned online without stopping the radiator for disassembly.

[0014] 2. The heat dissipating fins on the fin tube are distributed in a spiral shape, so that the gaps formed by the heat dissipating fins form an integral spiral groove structure. Compared with the several annular grooves formed by the traditional annular fin tubes with spaced distribution, the integral spiral groove structure is more convenient to clean dust.

[0015] 3. The motor drives the active gear to engage with the driven gear to realize the rotation of all fin tubes, thus eliminating the need to manually rotate the fin tubes separately, improving the convenience of dust cleaning.

[0016] 4. By using an external liquid supply component, in extreme heat dissipation conditions, the coolant in the liquid supply component can be replaced to ensure that the cooling tube group has a good cooling effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of the cooling tube group and the heat dissipation tube group in the utility model.

[0018] Figure 2 This is a schematic diagram of the three-dimensional back structure of the utility model.

[0019] Figure 3 It is a schematic diagram of the three-dimensional front structure of the utility model.

[0020] In the figure: 10, heat conduction platform; 20, mounting frame; 30, cooling tube group; 40, heat dissipation tube group; 41, fin tube; 42, heat dissipation fin; 43, driven gear; 44, connecting elbow; 50, liquid supply assembly; 51, liquid pump; 60, diversion joint; 70, motor; 71, driving gear. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] For ease of understanding, the specific structure and working mode of the present invention are further described below with reference to the accompanying drawings:

[0023] The specific structure of the utility model refers to Figure 1-3As shown, its main structure includes a cooling tube assembly 30 for cooling semiconductors and a heat dissipation tube assembly 40 that circulates a medium with and dissipates heat from the cooling tube assembly 30. The heat dissipation tube assembly 40 comprises at least two finned tubes 41 arranged side by side and connected in series. The outermost finned tube 41 is connected to the cooling tube assembly 30 via a flow guide joint 60. Furthermore, the finned tubes 41 are rotatably mounted on the mounting frame 20, and adjacent finned tubes 41 are connected in series via connecting elbows 44. The connections between the finned tubes 41, the connecting elbows 44, and the flow guide joint 60 are all sealed and rotatable, ensuring that the finned tubes 41 are in a ready-to-rotate state. Therefore, when cleaning the fin tube 41, since the fin tube 41 is in a fixed state, manual work is required to wipe the dust around the periphery of the fin tube 41, resulting in a cleaning dead corner. In the present application, it is only necessary to manually arrange the cleaning assembly on one side of the fin tube 41. By rotating the fin tube 41, the side of the fin tube 41 originally located in the cleaning dead corner can be rotated to the cleaning assembly for cleaning, so that there is no dust cleaning dead corner, and the dust on the periphery of the fin tube 41 can be evenly cleaned online without stopping the radiator for disassembly.

[0024] Further, such as Figure 1 As shown, the heat dissipating fins 42 on the fin tube 41 are distributed in a spiral shape, so that the heat dissipating fins 42 form gaps to form an integral spiral groove structure. Compared with the traditional spaced-apart annular fin tube 41 formed with a plurality of spaced-apart annular grooves, the integral spiral groove structure is more convenient for cleaning dust.

[0025] In addition, if Figure 2 As shown, a driven gear 43 is coaxially fixed to the fin tube 41, and the driven gears 43 on adjacent fin tubes 41 are meshed with each other. A motor 70 is mounted on the mounting frame 20, and the output shaft of the motor 70 is fixed with a driving gear 71 that meshes with any driven gear 43. The motor 70 is used to drive the driving gear 71 to mesh with the driven gear 43 to achieve the rotation of all the fin tubes 41, thereby eliminating the need to manually rotate the fin tubes 41 separately. In this embodiment of the automatic rotation of the fin tube 41, the present application can further extend the automatic cleaning of the fin tube 41; for example, a wiping sponge driven by a linear drive mechanism is provided. Under normal circumstances, the wiping sponge is distributed with a gap between the fin tube 41. When dust needs to be cleaned, the wiping sponge is driven to fit the outer periphery of the fin tube 41 to achieve automatic cleaning of the fin tube 41.

[0026] On the basis of the above, if Figure 1 and Figure 3As shown, the cooling tube group 30 and the heat dissipation tube group 40 are arranged in a vertical sequence. Above the cooling tube group 30 is a heat conduction platform 10 fixed to the mounting frame 20. The cooling tube group 30 is designed with a corrugated structure that fits against the lower surface of the heat conduction platform 10 to achieve uniform heat dissipation over a large area of ​​the semiconductor. Furthermore, the upper and lower surfaces of the heat conduction platform 10 are coated with a thermally conductive coating to ensure effective heat exchange between the cooling tube group 30 and the heat conduction platform 10.

[0027] In addition, if Figure 3 As shown, the system also includes a liquid supply assembly 50, which is connected in series to the circulation pipeline formed between the cooling tube assembly 30 and the heat dissipation tube assembly 40. The liquid supply assembly 50 includes a liquid pump 51 for circulating the medium between the cooling tube assembly 30, the heat dissipation tube assembly 40, and the liquid supply assembly 50. By externally placing the liquid supply assembly 50, the coolant in the liquid supply assembly 50 can be replaced in extreme heat dissipation situations to ensure that the cooling tube assembly 30 maintains a good cooling effect.

[0028] Of course, it will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, but also encompasses the same or similar structures that can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and it is intended that all variations that fall within the meaning and range of equivalents of the claims be encompassed within the present invention. Any reference signs in the claims should not be construed as limiting the claim to which they relate.

[0029] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0030] The technology, shape and structure that are not described in detail in this utility model are all well-known technologies.

Claims

1. A semiconductor heat exchanger comprising a cooling tube group (30) for cooling a semiconductor and a heat dissipation tube group (40) capable of circulating a medium with the cooling tube group (30) and dissipating heat from the medium, characterized in that: The heat dissipation tube group (40) comprises at least two fin tubes (41) arranged side by side and connected in series, and the outermost fin tube (41) is connected to the cooling tube group (30) via a flow guide joint (60); the fin tubes (41) are rotatably fitted on the mounting frame (20), and adjacent fin tubes (41) are connected in series via connecting elbows (44); and the connections between the fin tubes (41), the connecting elbows (44) and the flow guide joint (60) are all sealed rotatably fitted.

2. The semiconductor heat exchanger according to claim 1, characterized in that: The heat dissipation fins (42) on the fin tube (41) are distributed in a spiral shape.

3. The semiconductor heat exchanger according to claim 2, characterized in that: A driven gear (43) is coaxially fixed on the fin tube (41), and the driven gears (43) on adjacent fin tubes (41) are meshed with each other. A motor (70) is mounted on the mounting frame (20), and a driving gear (71) meshing with any driven gear (43) is fixed to the output shaft of the motor (70).

4. A semiconductor heat exchanger according to any one of claims 1 to 3, characterized in that: The cooling tube group (30) and the heat dissipation tube group (40) are sequentially distributed up and down. A heat conduction platform (10) fixed to the mounting frame (20) is provided above the cooling tube group (30). The cooling tube group (30) is provided with a corrugated structure that fits on the lower plate surface of the heat conduction platform (10).

5. The semiconductor heat exchanger according to claim 4, characterized in that: The upper and lower surfaces of the heat-conducting platform (10) are both provided with heat-conducting coatings.

6. A semiconductor heat exchanger according to any one of claims 1 to 3, characterized in that: The invention also includes a liquid supply assembly (50), which is connected in series in a circulation pipeline formed between the cooling tube assembly (30) and the heat dissipation tube assembly (40), and the liquid supply assembly (50) includes a liquid pump (51) for circulating the medium among the cooling tube assembly (30), the heat dissipation tube assembly (40) and the liquid supply assembly (50).

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