Platform for flatly fixing small crystal grains of wafer

Abstract

The utility model discloses a platform for flatly fixing small crystal grains of wafers, which relates to the technical field of chip detection and comprises an objective table with a hollow structure inside, a longitudinal support is fixedly mounted on the rear portion of the top end of the objective table, a transverse support is fixedly mounted on the top end of the longitudinal support, and a telescopic mechanism is fixedly mounted on the front portion of the bottom end of the transverse support. A leveling head is fixedly installed at the execution end of the telescopic mechanism, and a main control unit is arranged on the front side of the top end of the objective table and comprises a main control board installed in the objective table, a displayer embedded into the top end of the objective table and a plurality of control buttons arranged on the objective table on the right side of the displayer. According to the utility model, the flattening head is driven by the telescoping mechanism to accurately flatten the small crystal grains of the wafer, so that the bottom ends of the small crystal grains are ensured to be completely attached to the top end of the carrier, and the quality and the performance of the wafer are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip detection, in particular to a flat and fixed wafer small grain platform. Background Art

[0002] A grain is a small piece cut from a wafer (commonly known as a wafer grain). As the basic material for semiconductor manufacturing, the wafer will be cut into multiple such small grains after a series of processing steps. Each grain contains a designed complete circuit and is the basic functional unit in electronic equipment.

[0003] Currently, the inspection of grains (volume [micrometers]: 60*60*500 high) involves a variety of inspections that require cutting the grains to obtain cross-sections, such as grain size inspection, metallographic inspection, material performance research, and failure analysis. Before inspection, the grains are generally adhered to a specific carrier with an adhesive, and then manually pressed flat with a pressing plate. However, due to the small size of the grains, manual pressing is difficult to ensure that the top of the grain is flat, which can easily cause inaccurate cross-sections. Utility Model Content

[0004] The purpose of the present invention is to provide a flat and fixed wafer small grain platform to solve the problems raised in the above background technology.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions: a flat and fixed wafer small grain platform, comprising a carrier with a hollow structure inside, a longitudinal bracket fixedly installed on the rear part of the top of the carrier, a transverse bracket fixedly installed on the top of the longitudinal bracket, a telescopic mechanism fixedly installed on the front part of the bottom end of the transverse bracket, a flattening head fixedly installed on the execution end of the telescopic mechanism, a main control unit is provided on the front side of the top of the carrier, the main control unit comprises a main control board installed in the carrier, a display embedded in the top of the carrier and a plurality of control buttons arranged on the carrier to the right of the display, and the main control board is respectively connected to the telescopic mechanism, the display and the plurality of control buttons by signal.

[0006] Furthermore, the leveling head includes a mounting block fixedly mounted on the execution end of the telescopic mechanism, the bottom end of the mounting block is provided with a mounting groove for installing a pressure sensor, the top end of the inner wall of the mounting groove is provided with a boss along its inner wall, the top end of the pressure sensor abuts against the bottom end of the boss, the bottom end of the mounting block is bonded with a rubber pad covering the pressure sensor, the rubber pad is in contact with the pressure sensor, and the pressure sensor is connected to the main control board signal.

[0007] Furthermore, it also includes a clamping mechanism, which includes a mounting plate arranged in the worktable and a driving unit installed on the top of the mounting plate, wherein the driving unit includes a driving motor connected to the main control board signal, and the execution end of the driving motor is transmitted and connected to two driving gears, and two linkage units are symmetrically arranged on the mounting plates on the left and right sides of the driving motor, and the linkage unit includes a fixed block symmetrically arranged on the top of the mounting plate front and back, and a bidirectional screw rod is rotatably connected between the two fixed blocks, the rear end of the bidirectional screw rod passes through the corresponding side fixed block and is transmitted and connected to a transmission gear, and the two transmission gears are respectively connected to the two driving gears through two transmission chains, and two clamping blocks are symmetrically and threadedly connected on the bidirectional screw rod, and two slides are symmetrically arranged on the top of the loading platform on the left and right sides, and the outer walls of the two clamping blocks on the same bidirectional screw rod are both fitted with and slidably connected to the inner walls of the corresponding side slides, and the top of the clamping block passes through the slide and extends out of the top of the loading platform.

[0008] Furthermore, the top ends of the two clamping blocks on the same bidirectional screw on opposite sides are both integrally provided with pressing blocks.

[0009] Furthermore, rubber pads are provided on opposite sides of the two pressing blocks located on the same bidirectional screw, on the bottom ends of the pressing blocks, and on opposite sides of the two clamping blocks.

[0010] Furthermore, the four corners of the mounting plate are provided with limit holes, and the limit rods are slidably connected in the limit holes. The two ends of the limit rods are respectively fixedly connected to the upper and lower inner walls of the loading platform. The bottom end of the mounting plate is provided with a lifting mechanism connected to the signal of the main control board, and the bottom end of the lifting mechanism is fixedly connected to the bottom end of the inner wall of the loading platform.

[0011] The beneficial effects achieved by the utility model are:

[0012] 1. The telescopic mechanism drives the leveling head to precisely level the small grains on the wafer, ensuring that the bottom of the small grain is completely aligned with the top of the carrier, thereby improving the accuracy of the wafer's later sectioned surface.

[0013] 2. The clamping mechanism can stably clamp the carrier to prevent it from moving horizontally or vertically during the leveling process, ensuring the accuracy of the leveling operation.

[0014] 3. The flattening head has a built-in pressure sensor that can monitor and display the pressure changes during the flattening process in real time, helping staff to judge the flattening status of small grains on the wafer.

[0015] 4. The main control unit is equipped with a display and control buttons, providing an intuitive operation interface for easy control and monitoring by staff.

[0016] 5. The entire leveling process can be automatically controlled by the main control panel, reducing manual intervention and improving work efficiency.

[0017] 6. Use rubber pads and rubber pads to protect wafer small dies and carriers during leveling and clamping to prevent damage.

[0018] 7. The lifting mechanism can adjust the height of the clamping mechanism as needed to adapt to carriers and small wafer grains of different thicknesses. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic diagram of the structure of a flat fixed wafer small grain platform in an embodiment;

[0020] Figure 2 is a cross-sectional view of a flattening head in an embodiment;

[0021] Figure 3 is a cross-sectional view of the stage in the embodiment;

[0022] Figure 4 is a top view of the driving unit and the linkage unit in the embodiment;

[0023] Figure 5 It is a three-dimensional pressure display diagram in the embodiment. DETAILED DESCRIPTION

[0024] The present invention will be further described below with reference to the accompanying drawings.

[0025] like Figure 1-3 As shown, the utility model discloses a flat and fixed wafer small grain platform, comprising: a carrier 1 with a hollow structure inside, a longitudinal bracket 2 fixedly installed at the rear part of the top of the carrier 1, a transverse bracket 2 fixedly installed at the top of the longitudinal bracket 2, a telescopic mechanism 3 (telescopic pump) fixedly installed at the front part of the bottom end of the transverse bracket 21, a flattening head 4 fixedly installed at the execution end of the telescopic mechanism 3, a main control unit 6 is provided on the front side of the top of the carrier 1, the main control unit 6 includes a main control board 61 installed in the carrier 1, a display 62 embedded in the top of the carrier 1 and a plurality of control buttons 63 arranged on the carrier 1 to the right of the display 62, and the main control board 61 is respectively connected to the telescopic mechanism 3, the display 62 and the plurality of control buttons 63 by signal.

[0026] Further, such as Figure 1-2As shown, the leveling head 4 includes a mounting block 41 fixedly mounted and connected to the execution end of the telescopic mechanism 3, and a mounting groove 411 for mounting a pressure sensor 42 (MEMS pressure sensor / fiber optic pressure sensor) is provided at the bottom end of the mounting block 41, and a boss 412 is provided along the top of the inner wall of the mounting groove 411, and the top of the pressure sensor 42 abuts against the bottom end of the boss 412, and a rubber pad 43 covering the pressure sensor 42 is bonded to the bottom end of the mounting block 41, and the rubber pad 43 is in contact with the pressure sensor 42, and the pressure sensor 42 is connected to the main control board 61 for signal connection.

[0027] Further, such as Figure 1 、 3 -4, it also includes a clamping mechanism 5, the clamping mechanism 5 includes a mounting plate 51 set in the stage 1 and a driving unit 52 installed on the top of the mounting plate 51, the driving unit 52 includes a driving motor 521 connected to the main control board 61 signal, the execution end of the driving motor 521 is connected to two driving gears 522, and two linkage units 53 are symmetrically arranged on the mounting plate 51 on the left and right sides of the driving motor 521. The linkage unit 53 includes a fixed block 531 symmetrically set on the top of the mounting plate 51 in front and back, and a bidirectional wire is rotatably connected between the two fixed blocks 531. Rod 532, the rear end of the bidirectional screw rod 532 passes through the corresponding side fixed block 531, and is connected to the transmission gear 533. The two transmission gears 533 are respectively connected to the two driving gears 522 through two transmission chains 534. There are two clamping blocks 54 symmetrically and threadedly connected on the bidirectional screw rod 532. Two slides 11 are symmetrically arranged on the top of the worktable 1. The outer walls of the two clamping blocks 54 on the same bidirectional screw rod 532 are both fitted with and slidably connected to the inner walls of the corresponding side slides 11. The top of the clamping block 54 passes through the slide 11 and extends out of the top of the worktable 1.

[0028] Further, such as Figure 1 and 3 As shown, the top ends of the two clamping blocks 54 on the same bidirectional screw rod 532 on opposite sides are both integrally provided with pressing blocks 541 .

[0029] Further, such as Figure 1 and 3 As shown, rubber pads 542 are provided on opposite sides of the two pressing blocks 541 on the same bidirectional screw rod 532 , the bottom ends of the pressing blocks 541 , and opposite sides of the two clamping blocks 54 .

[0030] Further, such as Figure 3-4As shown, the four corners of the mounting plate 51 are provided with limit holes 511, and the limit rods 512 are slidably connected in the limit holes 511. The two ends of the limit rods 512 are respectively fixedly connected to the upper and lower inner walls of the loading platform 1. The bottom end of the mounting plate 51 is provided with a lifting mechanism 55 (telescopic pump) connected to the signal of the main control board 61, and the bottom end of the lifting mechanism 55 is fixedly connected to the bottom end of the inner wall of the loading platform 1.

[0031] Based on the above structure, Figure 1-4 As shown, the execution end of the telescopic mechanism 3 is completely retracted, and the opposite sides of the two clamping blocks 54 on the same bidirectional screw 532 are respectively in contact with the two ends of the same side slide 11, and the execution end of the lifting mechanism 55 is completely extended;

[0032] During use, the staff places the carrier carrying the wafer small grains bonded thereto on the stage 1 and aligns it with the bottom end of the leveling head 4. Then, by pressing the corresponding control button 63, the main control board 61 controls the drive motor 521 to drive the two drive gears 522 to rotate. The two drive gears 522 respectively drive the transmission gear 533 to rotate through the two transmission chains 534. The transmission gear 533 drives the bidirectional screw rod 532 to rotate. The bidirectional screw rod 532 drives the two clamping blocks 54 above it to move to the opposite side through the threaded connection until the corresponding sides of the two clamping blocks 54 are in contact with the outer walls of the two sides of the carrier, thereby preventing the carrier from producing a planar movement.

[0033] Then, by pressing the corresponding control button 63, the main control board 61 controls the actuator end of the lifting mechanism 55 to retract. The lifting mechanism 55 drives the clamping block 54 downward through the mounting plate 51, the fixing block 531, and the bidirectional screw rod 532 in sequence until the bottom end of the pressing block 541 abuts against the top end of the carrier, thereby preventing the carrier from generating vertical movement.

[0034] Finally, by pressing the corresponding control button 63, the main control board 61 controls the actuator end of the telescopic mechanism 3 to extend, and the actuator end of the telescopic mechanism 3 drives the leveling head 4 to press down until the bottom end of the rubber pad 43 abuts against the top end of the wafer small grain. The leveling head 4 is controlled to continue to press down, and the pressed bottom end of the wafer small grain continuously fits with the top end of the carrier until the bottom end of the wafer small grain completely fits with the top end of the carrier. At this time, the top end of the wafer small grain is flat.

[0035] When the flattening head 4 presses the small crystal grains on the wafer, the small crystal grains on the wafer generate a reaction force on the rubber pad 43, and the rubber pad 43 is recessed into the mounting groove 411. When the rubber pad 43 is recessed, it generates a planar pressure on the pressure sensor 42. The pressure sensor 42 transmits the real-time detected pressure value to the main control board 61. The main control board 61 has a built-in calculation module, and the calculation module converts the pressure value into a three-dimensional pressure display diagram (such as Figure 5 As shown), and displayed on the display 62, the staff confirms whether the top of the small crystal grain on the wafer is flat through the display 62.

[0036] The above are only preferred specific implementation methods of the present invention, but the protection scope of the present invention is not limited to them. Any technician familiar with the technical field can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention within the technical scope disclosed by the present invention, and they should be covered by the protection scope of the present invention.

Claims

1. A flat fixed wafer small grain platform, characterized in that: The invention comprises a loading platform (1) with a hollow structure inside, a longitudinal bracket (2) fixedly mounted on the rear part of the top of the loading platform (1), a transverse bracket (21) fixedly mounted on the top of the longitudinal bracket (2), a telescopic mechanism (3) fixedly mounted on the front part of the bottom end of the transverse bracket (21), a flattening head (4) fixedly mounted on the execution end of the telescopic mechanism (3), a main control unit (6) arranged on the front side of the top of the loading platform (1), the main control unit (6) comprising a main control board (61) mounted in the loading platform (1), a display (62) embedded in the top of the loading platform (1) and a plurality of control buttons (63) arranged on the loading platform (1) to the right of the display (62), the main control board (61) being respectively connected to the telescopic mechanism (3), the display (62) and the plurality of control buttons (63) by signals.

2. The flat and fixed wafer small grain platform according to claim 1, characterized in that: The leveling head (4) comprises a mounting block (41) fixedly mounted and connected to the execution end of the telescopic mechanism (3); a mounting groove (411) for mounting a pressure sensor (42) is provided at the bottom end of the mounting block (41); a boss (412) is provided around the top end of the inner wall of the mounting groove (411); the top end of the pressure sensor (42) abuts against the bottom end of the boss (412); a rubber pad (43) covering the pressure sensor (42) is bonded to the bottom end of the mounting block (41); the rubber pad (43) is in contact with the pressure sensor (42); and the pressure sensor (42) is connected to the main control board (61) for signal connection.

3. The flat and fixed wafer small grain platform according to claim 1, characterized in that: The invention also includes a clamping mechanism (5), wherein the clamping mechanism (5) includes a mounting plate (51) arranged in the loading platform (1) and a driving unit (52) mounted on the top of the mounting plate (51), wherein the driving unit (52) includes a driving motor (521) connected to the main control board (61) by signal, and the execution end of the driving motor (521) is connected to two driving gears (522) by transmission, and two linkage units (53) are symmetrically arranged on the mounting plate (51) on the left and right sides of the driving motor (521), and the linkage unit (53) includes a fixed block (531) symmetrically arranged on the top of the mounting plate (51) in a front-back direction, and a bidirectional screw rod is rotatably connected between the two fixed blocks (531). (532), the rear end of the bidirectional screw rod (532) passes through the corresponding side fixed block (531) and is connected to the transmission gear (533), and the two transmission gears (533) are respectively connected to the two driving gears (522) through two transmission chains (534). Two clamping blocks (54) are symmetrically and threadedly connected on the bidirectional screw rod (532), and two slideways (11) are symmetrically arranged on the top of the work platform (1). The outer walls of the two clamping blocks (54) on the same bidirectional screw rod (532) are both fitted with the inner walls of the corresponding side slideways (11) and are slidably connected. The top of the clamping block (54) passes through the slideway (11) and extends out of the top of the work platform (1).

4. The flat and fixed wafer small grain platform according to claim 3, characterized in that: The top ends of the two clamping blocks (54) on the same bidirectional screw rod (532) on opposite sides are both integrally provided with a pressing block (541).

5. The flat and fixed wafer small grain platform according to claim 4, characterized in that: Rubber pads (542) are provided on opposite sides of the two pressing blocks (541) on the same bidirectional screw rod (532), the bottom ends of the pressing blocks (541) and opposite sides of the two clamping blocks (54).

6. The flat and fixed wafer small grain platform according to claim 5, characterized in that: The four corners of the mounting plate (51) are each provided with a limiting hole (511), a limiting rod (512) is slidably connected in the limiting hole (511), and both ends of the limiting rod (512) are fixedly connected to the upper and lower inner walls of the loading platform (1), respectively. The bottom end of the mounting plate (51) is provided with a lifting mechanism (55) connected to the main control board (61) by signal, and the bottom end of the lifting mechanism (55) is fixedly connected to the bottom end of the inner wall of the loading platform (1).

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