Probe card transfer auxiliary mechanism for integrated circuit test

The probe card transfer auxiliary mechanism for integrated circuit testing achieves precise movement and angle calibration of the probe card, solving the problem of inaccurate positioning in wafer testing, improving test accuracy and production efficiency, and reducing material loss.

CN223389796UActive Publication Date: 2025-09-26DONGGUAN CITY QIAN YING ELECTRONICS CO LTD
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Patent Information

Application Number
CN202422516105.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-17
Publication Date
2025-09-26
Estimated Expiration
2034-10-17

AI Technical Summary

Technical Problem

During wafer testing, inaccurate probe card positioning can lead to invalid test data or physical damage to the die.

Method used

A probe card transfer auxiliary mechanism for integrated circuit testing is designed. The relative position of the wafer and the probe card is monitored by a monitor, and the probe card is accurately moved and calibrated using slide rails and motors. The card rod and elastic parts are combined to prevent the probe card from falling off, ensuring accurate contact with the bare die test points.

Benefits of technology

It improves the accuracy and production efficiency of wafer testing, reduces the possibility of material loss and test failure, and reduces wafer damage caused by inaccurate positioning.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a transfer auxiliary mechanism, in particular to a probe card transfer auxiliary mechanism for testing an integrated circuit. A probe card transferring auxiliary mechanism for integrated circuit testing comprises a workbench, a controller, a displayer, a containing disc, a first sliding rail, a second sliding rail and the like, the controller is fixedly connected to one side of the front portion of the workbench, and the displayer is fixedly connected to the other side of the front portion of the workbench; the top of the workbench is rotationally connected with the containing disc, one side of the top of the workbench is fixedly connected with the first sliding rail, and the first sliding rail is slidably connected with the second sliding rail. According to the utility model, the relative position of the wafer and the probe card is monitored through the monitor, and then the controller starts the first slide rail, the second slide rail and the third slide rail, so that the probe card can accurately move up and down, left and right and front and back.
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Description

Technical Field

[0001] The utility model relates to a transfer auxiliary mechanism, in particular to a transfer auxiliary mechanism for a probe card used for integrated circuit testing. Background Art

[0002] Integrated circuit testing is a crucial step in ensuring that integrated circuits function properly and meet design specifications. Testing is divided into three phases: wafer testing, final testing, and system-level testing. Wafer testing, also known as probe testing, is performed before the wafer is cut into individual dies.

[0003] At present, probe card positioning is one of the indispensable parts in the wafer testing process. The probe card is a special interface board equipped with tiny metal probes for contacting the test points of each bare die on the wafer. A precise positioning device is required for positioning to accurately transfer the probe card onto the wafer to ensure that the probe can accurately contact the test point of each bare die. If the probe fails to accurately contact the test point on the wafer during the transfer process, it is easy to lead to the inability to obtain valid test data, introduce additional noise or signal attenuation, and affect the accuracy of the test results. The bare die is mistakenly judged as unqualified, resulting in unnecessary waste. If the probe pressure is too high or the position is improper, the bare die on the wafer surface may be crushed, causing physical damage.

[0004] Therefore, it is necessary to design an integrated circuit test probe card transfer auxiliary mechanism to solve the above technical problems. Utility Model Content

[0005] In order to overcome the shortcomings that if the probe fails to accurately contact the test point, the test data will be invalid, the bare chip may be mistakenly judged as unqualified, resulting in waste; if the probe pressure is too high or the position is improper, the bare chip may be physically damaged, the technical problem of the utility model is to provide a probe card transfer auxiliary mechanism for integrated circuit testing.

[0006] A probe card transfer auxiliary mechanism for integrated circuit testing includes a workbench, a controller, a display, a placement plate, a first slide rail, a second slide rail, a third slide rail, a monitor, a slider and a probe card. The controller is fixedly connected to one side of the front of the workbench, the display is fixedly connected to the other side of the front of the workbench, the display is electrically connected to the controller, the placement plate is rotatably connected to the top of the workbench, the first slide rail is fixedly connected to one side of the top of the workbench, the second slide rail is slidably connected to the first slide rail, the third slide rail is slidably connected to the second slide rail, the front of the third slide rail is fixedly connected to the monitor, the monitor, the first slide rail, the second slide rail and the third slide rail are all electrically connected to the controller, the slider is slidably connected to the third slide rail, the probe card is placed on the slider, and card holes are symmetrically opened at the front of the probe card.

[0007] Further description, it also includes a card rod, a pull rod and an elastic part. The front part of the slider is symmetrically and slidingly connected to the card rod, the pull rod is fixedly connected between one side of the two card rods, the elastic part is connected between the two card rods and the slider, and the two card rods are engaged with the corresponding card holes.

[0008] Further description, it also includes a motor and a connecting frame. The motor is fixedly connected to the workbench, the motor is electrically connected to the controller, the connecting frame is fixedly connected to the output shaft of the motor, and the connecting frame is fixedly connected to the placement plate.

[0009] Further description, it also includes an electric push rod, a push plate, a connecting rod, a movable frame and a calibration plate, the top of the connecting frame is symmetrically provided with the sliding grooves, the front of the connecting frame is fixedly connected to the electric push rod, the electric push rod is electrically connected to the controller, the push plate is fixedly connected to the telescopic rod of the electric push rod, both sides of the push plate are rotatably connected to the connecting rod, one side of the connecting rod is rotatably connected to the movable frame, both of the two movable frames slide in the corresponding sliding grooves, and the calibration plate is placed on one side of both of the movable frames.

[0010] Further description, fixing screws are also included, and the two movable frames and the corresponding calibration plates are symmetrically threadedly connected with the fixing screws.

[0011] Further description is provided, and a protective pad is also included, and the protective pad is fixedly connected to one side of the two calibration plates.

[0012] The beneficial effects of the present invention are as follows: 1. The present invention monitors the relative position of the wafer and the probe card through a monitor, and then the controller starts the first slide rail, the second slide rail and the third slide rail, so that the probe card can move accurately up and down, left and right, and front and back, ensuring that the probe can accurately contact the test point of each bare chip, reducing the possibility of test failure, reducing damage to the wafer caused by inaccurate positioning, and reducing the cost of material loss.

[0013] 2. The utility model monitors the position of the wafer through a monitor, and then the controller starts the motor and electric push rod to achieve precise angle and axis calibration of the wafer, ensuring that the wafer can be accurately aligned with the probe card, reducing problems caused by position offset during the test process.

[0014] 3. The present invention effectively prevents the probe card from falling off during the transfer process through the cooperation of the clamping rod and the elastic member, reduces the risk of probe card displacement, and thus improves the accuracy and production efficiency of wafer testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural diagram of the present utility model.

[0016] Figure 2 This is a schematic diagram of the structure of the controller, display, placement tray and other components of the utility model.

[0017] Figure 3 It is a partial cross-sectional structural diagram of the clamping rod, pull rod, elastic member and other components of the utility model.

[0018] Figure 4 This is a partial cross-sectional structural diagram of the workbench, motor, connecting frame and other components of the utility model.

[0019] Figure 5 It is a partial cross-sectional structural diagram of the connecting frame, electric push rod, push plate and other components of the utility model.

[0020] Figure 6 This is a partial cross-sectional view of the connecting rod, movable frame, and calibration plate components of the present invention. Reference numerals in the figure are: 1: workbench, 2: controller, 3: display, 4: placement tray, 5: first slide rail, 6: second slide rail, 7: third slide rail, 8: monitor, 9: slider, 10: probe card, 11: clamping rod, 12: pull rod, 13: elastic member, 14: motor, 15: connecting frame, 16: slide slot, 17: electric push rod, 18: push plate, 19: connecting rod, 20: movable frame, 21: calibration plate, 22: fixing screw, 23: protective pad. DETAILED DESCRIPTION

[0021] The present invention will be further described below in conjunction with specific embodiments. The illustrative embodiments and descriptions of the present invention are used to explain the present invention, but are not intended to limit the present invention.

[0022] Embodiment: A probe card transfer auxiliary mechanism for integrated circuit testing, such as Figure 1-Figure 4 As shown, it includes a workbench 1, a controller 2, a display 3, a placement tray 4, a first slide rail 5, a second slide rail 6, a third slide rail 7, a monitor 8, a slider 9, a probe card 10, a card rod 11, a pull rod 12 and an elastic member 13. The controller 2 is installed on the left front side of the workbench 1 by screws, and the display 3 is installed on the right front side of the workbench 1 by screws. The display 3 is electrically connected to the controller 2. The placement tray 4 is rotatably connected to the middle of the top of the workbench 1. The first slide rail 5 is installed on the rear side of the top of the workbench 1 by screws. The first slide rail 5 is slidably connected to the second slide rail 6, and the second slide rail 6 is slidably connected to the second slide rail 6. The third slide rail 7, the monitor 8 is installed on the front side of the third slide rail 7 by screws, the monitor 8, the first slide rail 5, the second slide rail 6 and the third slide rail 7 are all electrically connected to the controller 2, the slider 9 is slidably connected to the third slide rail 7, the probe card 10 is placed at the bottom of the slider 9, the front side of the probe card 10 is symmetrically provided with card holes, the front side of the slider 9 is symmetrically provided with the card rod 11 in a sliding manner, the pull rod 12 is welded between the front sides of the two card rods 11, the elastic member 13 is connected between the two card rods 11 and the slider 9, and the two card rods 11 are engaged with the corresponding card holes.

[0023] When the probe card 10 needs to be transferred, the staff places the wafer on the placement plate 4, then monitors the position of the wafer through the monitor 8, and transmits the information to the controller 2 and the display screen. The staff slides the probe card 10 into the slider 9 and adjusts it according to the setting data on the display screen. The first slide rail 5, the second slide rail 6 and the third slide rail 7 are started by the controller 2, wherein: the first slide rail 5 can make the second slide rail 6 and the third slide rail 7 together with the slider 9 and the probe card 10 move up and down; the second slide rail 6 can make the third slide rail 7, the slider 9 and the probe card 10 move left and right; the third slide rail 7 can make the slider 9 and the probe card 10 perform forward and backward translational motion, and the probe card 10 can be accurately moved to the specified position to contact the wafer. When the probe card 10 is accurately aligned, the probe will gently touch the bare die test point on the wafer to start the test. In order to prevent the probe card 10 from detaching from the slider 9 during the transfer process, when placing the probe card 10, the staff can pull the pull rod 12 forward to move the card rod 11 forward. At this time, the elastic part 13 is squeezed and deformed. After sliding the probe card 10 into the slider 9, the staff releases the pull rod 12, and the card rod 11 will be reset through the elastic part 13 and stuck in the card hole in the slider 9, thereby fixing the probe card 10.

[0024] like Figure 4-Figure 6 As shown, it also includes a motor 14, a connecting frame 15, an electric push rod 17, a push plate 18, a connecting rod 19, a movable frame 20, a calibration plate 21, a fixing screw 22 and a protective pad 23. The motor 14 is installed inside the workbench 1 by screws. The motor 14 is electrically connected to the controller 2. The connecting frame 15 is welded to the output shaft of the motor 14. The top of the connecting frame 15 is welded to the bottom of the placement plate 4. The top of the connecting frame 15 is symmetrically provided with the slide groove 16. The front part of the connecting frame 15 is installed with the electric push rod 17 by screws. The electric push rod 17 is electrically connected to the controller 2. The push plate 18 is welded on the telescopic rod of the electric push rod 17, and the left and right sides of the push plate 18 are rotatably connected to the connecting rod 19, and the sides of the connecting rod 19 that are away from each other are rotatably connected to the moving frame 20, and the two moving frames 20 slide in the corresponding slide groove 16, and the calibration plate 21 is placed on one side of the two moving frames 20 passing through the placement tray 4, and the fixing screws 22 are symmetrically threaded between the two moving frames 20 and the corresponding calibration plates 21, and the protective pad 23 is fixedly connected to the side where the two calibration plates 21 are close to each other.

[0025] In order to prevent the position of the wafer from shifting during the test, the monitor 8 continuously detects the position of the wafer and transmits the data to the controller 2. The controller 2 can start the motor 14 to rotate the output shaft of the motor 14, drive the connecting frame 15 to rotate, and thus rotate the placement plate 4 to calibrate the angle of the wafer. In addition, the controller 2 can also start the electric push rod 17 to extend the telescopic rod of the electric push rod 17 and push the push plate 18 to move backward. At this time, the connecting rod 19 is pushed to move, and the connecting rod 19 drives the calibration plate 21 to move along the slide 16 toward the wafer to calibrate the wafer. The axis is calibrated and clamped. When clamping, the protective pad 23 can protect the wafer to prevent the wafer from being worn. After detection, the electric push rod 17 can be controlled by the controller 2 to retract the telescopic rod of the electric push rod 17, and the push plate 18 moves forward to make the connecting rod 19 active. The connecting rod 19 drives the calibration plate 21 to move along the slide groove 16 in the opposite direction of the wafer. At this time, the wafer can be taken out. If the diameter of the wafer changes, the appropriate calibration plate 21 can be replaced by turning the fixing screw 22 clockwise. Finally, the new calibration plate 21 can be fixed by turning the fixing screw 22 counterclockwise.

[0026] It should be understood that the above description is only for illustrative purposes and is not intended to limit the present invention. Those skilled in the art will understand that variations of the present invention will be within the scope of the claims herein.

Claims

1. A probe card transfer auxiliary mechanism for integrated circuit testing, characterized by: The invention comprises a workbench (1), a controller (2), a display (3), a placement plate (4), a first slide rail (5), a second slide rail (6), a third slide rail (7), a monitor (8), a slider (9) and a probe card (10), wherein the controller (2) is fixedly connected to one side of the front of the workbench (1), the display (3) is fixedly connected to the other side of the front of the workbench (1), the display (3) is electrically connected to the controller (2), the placement plate (4) is rotatably connected to the top of the workbench (1), the third slide rail (7) is fixedly connected to the first slide rail (5), the second slide rail (6), the ...) A slide rail (5), the first slide rail (5) is slidably connected to the second slide rail (6), the second slide rail (6) is slidably connected to the third slide rail (7), the front of the third slide rail (7) is fixedly connected to the monitor (8), the monitor (8), the first slide rail (5), the second slide rail (6) and the third slide rail (7) are all electrically connected to the controller (2), the third slide rail (7) is slidably connected to the slider (9), the probe card (10) is placed on the slider (9), and the front of the probe card (10) is symmetrically provided with card holes.

2. The probe card transfer auxiliary mechanism for integrated circuit testing according to claim 1, wherein: It also includes a clamping rod (11), a pull rod (12) and an elastic member (13); the front of the slider (9) is symmetrically and slidingly connected to the clamping rod (11); the pull rod (12) is fixedly connected between one side of the two clamping rods (11); the elastic member (13) is connected between the two clamping rods (11) and the slider (9); and the two clamping rods (11) are clamped and matched with the corresponding clamping holes.

3. The integrated circuit test probe card transfer auxiliary mechanism according to claim 2, wherein: The machine also includes a motor (14) and a connecting frame (15). The motor (14) is fixedly connected to the workbench (1), the motor (14) is electrically connected to the controller (2), the connecting frame (15) is fixedly connected to the output shaft of the motor (14), and the connecting frame (15) is fixedly connected to the placement plate (4).

4. The integrated circuit test probe card transfer auxiliary mechanism according to claim 3, wherein: The utility model also includes an electric push rod (17), a push plate (18), a connecting rod (19), a movable frame (20) and a calibration plate (21). The top of the connecting frame (15) is symmetrically provided with a slide groove (16). The front of the connecting frame (15) is fixedly connected with the electric push rod (17). The electric push rod (17) is electrically connected to the controller (2). The telescopic rod of the electric push rod (17) is fixedly connected with the push plate (18). Both sides of the push plate (18) are rotatably connected with the connecting rod (19). One side of the connecting rod (19) is rotatably connected with the movable frame (20). The two movable frames (20) slide in the corresponding slide groove (16). The calibration plate (21) is placed on one side of the two movable frames (20).

5. The integrated circuit test probe card transfer auxiliary mechanism according to claim 4, wherein: It also includes fixing screws (22), and the two movable frames (20) and the corresponding calibration plates (21) are symmetrically threadedly connected with the fixing screws (22).

6. The integrated circuit test probe card transfer auxiliary mechanism according to claim 5, wherein: It also includes a protective pad (23), and one side of the two calibration plates (21) is fixedly connected to the protective pad (23).