Flip type chip test fixture and test device

Abstract

The utility model belongs to the technical field of testing devices, and particularly relates to a flip type chip testing jig and a testing device. Comprising a base, a probe assembly is arranged on the base, and a test position for placing a chip to be tested is formed on the probe assembly; the overturning cover is rotatably installed on the base, an adjusting assembly is arranged on the overturning cover, the adjusting assembly comprises a pressing block arranged on the inner side of the overturning cover, and the pressing block is used for extruding the chip to be tested; clamping openings matched with each other are formed between the pressing block and the overturning cover, and when the pressing block is rotated to fall into the clamping openings, the relative distance between the extrusion face of the pressing block and the inner side face of the overturning cover is changed. According to the utility model, stable and reliable electric contact between the probe and the chip is ensured by flexibly adjusting the pressing depth of the flip cover on the chip, and the accuracy and efficiency of testing are improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of testing devices, and in particular relates to a flip-type chip testing fixture and a testing device. Background Art

[0002] In the semiconductor manufacturing industry, chips must undergo rigorous electrical performance testing before leaving the factory to ensure that their performance indicators meet design requirements. As a common test equipment, flip-top chip test fixtures are widely used in production lines due to their compact structure and convenient operation. This type of fixture usually includes a base with a precision probe assembly on the base. The probe assembly is designed with a test position for placing the chip to be tested. During testing, the chip is placed on the test position, and then the flip cover is closed. A certain amount of pressure is applied to the chip through the mechanism on the flip cover to ensure good electrical contact between the probe and the chip, thus completing the test.

[0003] However, in practical applications, this test fixture faces a significant problem: due to the extremely small size and frequent use of the probes, they are extremely susceptible to wear, resulting in the probe tips being unable to maintain stable contact with the chip surface. This unstable contact directly affects the accuracy and reliability of test results and may even mislead production decisions, resulting in unnecessary losses.

[0004] To address this challenge, traditional methods often involve replacing the entire probe assembly, but this approach is not only costly, but also time-consuming and labor-intensive, reducing production efficiency.

[0005] Therefore, there is an urgent need for a flip-top chip testing fixture and a testing device that can achieve stable contact connection between the chip and the probe. Utility Model Content

[0006] The purpose of the utility model is to address the deficiencies of the existing technology and provide a flip-top chip testing fixture and testing device, which ensures stable and reliable electrical contact between the probe and the chip by flexibly adjusting the pressing depth of the flip cover on the chip, thereby improving the accuracy and efficiency of the test.

[0007] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0008] A flip-top chip test fixture, comprising:

[0009] A base, wherein a probe assembly is provided on the base, and a test position for placing a chip to be tested is formed on the probe assembly;

[0010] A flip cover is rotatably mounted on the base, and an adjustment assembly is provided on the flip cover. The adjustment assembly includes a pressure block provided on the inner side of the flip cover, and the pressure block is used to squeeze the chip to be tested; a mutually cooperating bayonet is provided between the pressure block and the flip cover, and when the pressure block is rotated to fall into the bayonet, the relative distance between the extrusion surface of the pressure block and the inner side surface of the flip cover will change.

[0011] Furthermore, an adjustment groove is provided on the outer side of the flip cover, and a through hole is provided in the middle position of the adjustment groove and passes through the flip cover; the adjustment assembly includes an adjustment button installed in the adjustment groove, and a connecting piece connected between the adjustment button and the pressure block, the connecting piece is located in the through hole, and a return spring abutting the adjustment button is also installed in the adjustment groove.

[0012] Furthermore, a low-position bayonet and a high-position bayonet are provided on the inner side of the flip cover, and a limiting protrusion is provided on the pressure block. When the limiting protrusion switches from the low-position bayonet to the high-position bayonet, the relative distance between the extrusion surface of the pressure block and the inner side surface of the flip cover will be increased.

[0013] Furthermore, the flip cover includes a cover body and a flat pressing cover rotatably mounted at a middle position of the cover body, the cover body is hinged to the base, and the adjustment assembly is mounted on the flat pressing cover.

[0014] Furthermore, a torsion spring is provided at the hinged end of the cover.

[0015] Furthermore, a lock buckle is provided on the cover body away from the hinged end, and a locking rod that cooperates with the lock buckle is provided on the base.

[0016] Furthermore, the probe assembly includes a probe board and a floating board floatingly arranged on the probe board, the test position is arranged on the floating board, the floating board is provided with a plurality of probe holes corresponding to the test position, and the probes on the probe board are connected to the test position through the probe holes.

[0017] Furthermore, a positioning post is provided at the edge of the probe plate, a floating spring is sleeved on the positioning post, and a positioning hole is provided on the floating plate corresponding to the positioning post.

[0018] The utility model also provides a testing device, including a programmer and a flip-top chip testing fixture, wherein the base of the testing fixture is provided with a circuit board, the circuit board is electrically connected to the probe assembly, the programmer is provided with a connecting seat, and the circuit board is detachably mounted on the connecting seat.

[0019] Furthermore, a first strong magnet is provided on the connecting base, and a second strong magnet is provided on the circuit board. When the circuit board is mounted on the connecting base, the first strong magnet and the second strong magnet are attracted to each other.

[0020] Beneficial effects of the utility model:

[0021] The utility model provides an adjustable pressure block on the flip cover to achieve flexible adjustment of the pressing depth of the chip to be tested, thereby ensuring stable and reliable electrical contact between the probe and the chip; by providing an adjustment button, the user can conveniently adjust the pressure block by pressing; by providing a low-position bayonet and a high-position bayonet, accurate switching of the pressure block position is achieved; by providing a flat pressure cover, the force direction is vertically downward when the chip is flipped and pressed down, thereby avoiding damage to the chip; by providing a floating plate, the probe can be hidden in the floating plate when not in a test state, thereby avoiding damage to the probe; by providing a first strong magnet and a second strong magnet, a fast and stable connection between the circuit board and the connecting seat is achieved; the utility model ensures stable and reliable electrical contact between the probe and the chip by flexibly adjusting the pressing depth of the flip cover on the chip, thereby improving the accuracy and efficiency of the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Attachment Figure 1 It is a structural diagram of the test fixture of the utility model;

[0023] Attachment Figure 2 This is a schematic diagram of the exploded structure of the flip cover of the utility model;

[0024] Attachment Figure 3 This is a structural diagram of the flat gland and the pressing block of the utility model;

[0025] Attachment Figure 4 This is a schematic structural diagram of the utility model in which the limiting protrusion is located at a low-position bayonet;

[0026] Attachment Figure 5 This is a structural diagram of the utility model in which the limiting protrusion is located at a high-position bayonet;

[0027] Attachment Figure 6 This is a schematic diagram of the exploded structure of the base and probe assembly of the utility model;

[0028] Attachment Figure 7 It is a structural diagram of the programmer of the utility model;

[0029] Attachment Figure 8 It is a structural schematic diagram of the testing device of the utility model;

[0030] Markings in the figure: 1-base, 110-locking rod; 2-probe assembly, 210-probe plate, 211-probe, 212-positioning column, 213-floating spring, 220-floating plate, 221-test position, 222-probe hole, 223-positioning hole; 3-flip cover, 310-cover body, 320-flat pressure cover, 321-adjustment slot, 322-through hole, 323-bayonet, 3231-low bayonet, 3232-high bayonet, 330-torsion spring, 340-lock; 4-adjustment assembly, 410-pressure block, 411-extrusion surface, 412-limiting protrusion, 420-adjustment button, 430-connector, 440-reset spring; 5-programmer, 510-connecting seat, 520-first strong magnet; 6-circuit board, 610-second strong magnet. DETAILED DESCRIPTION

[0031] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention, and should not be construed as limiting the present invention.

[0032] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0034] In the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium; internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0035] See attached Figure 1 To the attached Figure 8 , the figure shows a specific embodiment of a flip-type chip testing fixture and testing device provided by the present invention.

[0036] See attached Figure 1 , flip-type chip test fixture includes:

[0037] A base 1 is provided with a probe assembly 2, and a test position 221 is formed on the probe assembly 2 for placing a chip to be tested;

[0038] The flip cover 3 is rotatably mounted on the base 1. The flip cover 3 is provided with an adjustment assembly 4. The adjustment assembly 4 includes a pressure block 410 disposed on the inner side of the flip cover 3. The pressure block 410 is used to squeeze the chip to be tested. A mutually cooperating bayonet 323 is provided between the pressure block 410 and the flip cover 3. When the pressure block 410 is rotated so that it falls into the bayonet 323, the relative distance between the squeezing surface 411 of the pressure block 410 and the inner side surface of the flip cover 3 will change.

[0039] See attached Figure 1 In the above embodiment, one end of the flip cover 3 is rotatably connected to one end of the base 1, allowing the flip cover 3 to be opened or closed relative to the base 1. When the flip cover 3 is in the open state, a chip to be tested can be placed on the test position 221 of the base 1. When the flip cover 3 is closed, the flip cover 3 covers the test position 221 while the pressing surface 411 of the pressure block 410 contacts and presses down on the chip to be tested, thereby ensuring stable contact between the chip and the probes 211 of the probe assembly 2. If the probes 211 are no longer in stable contact with the chip due to wear after a period of use, the pressure block 410 can be rotated so that the pressure block 410 cooperates with the latch 323 to increase the relative distance between the pressing surface 411 of the pressure block 410 and the inner side surface of the flip cover 3, thereby increasing the pressing depth of the chip during downward pressure, so that the chip can once again be in stable contact with the probes 211.

[0040] See attached Figure 2In the above embodiment, an adjustment slot 321 is provided on the outer side of the flip cover 3, and a through hole 322 is provided in the middle of the adjustment slot 321, which penetrates the flip cover 3. The adjustment assembly 4 includes an adjustment button 420 installed in the adjustment slot 321, and a connecting member 430 connected between the adjustment button 420 and the pressure block 410. The connecting member 430 is located in the through hole 322. A return spring 440 is also installed in the adjustment slot 321 to abut against the adjustment button 420. In this embodiment, the adjustment button 420 is lifted up by the elastic force of the return spring 440, and the pressure block 410 connected to the adjustment button 420 via the connecting member 430 tends to approach the inner side of the flip cover 3. When it is necessary to switch the pressure block 410, the adjustment button 420 can be pressed to compress the return spring 440, so that the pressure block 410 is released from the engagement state with the bayonet 323.

[0041] See attached Figure 3 In the above embodiment, a low-position bayonet 3231 and a high-position bayonet 3232 are provided on the inner side of the flip cover 3, and a limiting protrusion 412 is provided on the pressing block 410. When the limiting protrusion 412 switches from the low-position bayonet 3231 to the high-position bayonet 3232, the relative distance between the extrusion surface 411 of the pressing block 410 and the inner side surface of the flip cover 3 will increase. In the embodiment, the low-position bayonet 3231 and the high-position bayonet 3232 on the inner side of the flip cover 3 are arranged in a cross shape, and correspondingly, the limiting protrusion 412 of the pressing block 410 is also in a cross shape. The limiting protrusion 412 of the pressing block 410 is in the low-position bayonet 3231 by default. Under the elastic force of the reset spring 440, the extrusion surface 411 of the pressing block 410 is close to the inner side surface of the flip cover 3, as shown in the attached figure. Figure 4 As shown; when it is necessary to increase the pressing depth of the pressing block 410 on the chip to be tested, the pressing block 410 is pulled out from the inside or the adjusting button 420 is pressed on the outside to disengage the limiting protrusion 412 of the pressing block 410 from the low-position bayonet 3231, and then the pressing block 410 is rotated to align the limiting protrusion 412 of the pressing block 410 with the high-position bayonet 3232. Under the elastic force of the reset spring 440, the pressing block 410 is reset, and the limiting protrusion 412 of the pressing block 410 falls into the high-position bayonet 3232 and fixes the pressing block 410 relative to the flip cover 3. At this time, the pressing block 410 is more protruding than when it is aligned with the low-position bayonet 3231, as shown in the attached figure. Figure 5 Therefore, the pressing block 410 can press down the chip to be tested more deeply, so that the chip and the probe 211 can be in stable contact.

[0042] See attached Figure 2In the above embodiment, the flip cover 3 includes a cover body 310 and a flat pressing cover 320 rotatably mounted in the middle of the cover body 310. The cover body 310 is hinged to the base 1, and the adjustment assembly 4 is mounted on the flat pressing cover 320. In this embodiment, a rotating shaft is provided in the middle of the flat pressing cover 320 to enable the flat pressing cover 320 to swing back and forth within the cover body 310. This allows the pressing block 410 on the flat pressing cover 320 to apply a vertical downward force to the chip when the cover body 310 is flipped and pressed downward, thereby preventing uneven force on the chip during flipping and pressing, which could cause damage to the chip.

[0043] See attached Figure 1 In the above embodiment, a torsion spring 330 is provided at the hinged end of the cover 310. In the embodiment, the torsion spring 330 causes the cover 310 to tend to be in an open state between the base 1, so as to facilitate the placement of chips on the test position 221. A lock catch 340 is provided on the cover 310 away from the hinged end, and a locking rod 110 is provided on the base 1 to cooperate with the lock catch 340. In the embodiment, when a force is applied to overcome the elastic force of the torsion spring 330 to close the cover 310, the lock catch 340 on the cover 310 is engaged with the locking rod 110 to lock the cover 310.

[0044] See attached Figure 6 In the above embodiment, the probe assembly 2 includes a probe plate 210 and a floating plate 220 that is floatingly disposed on the probe plate 210. A test position 221 is disposed on the floating plate 220. The floating plate 220 is provided with a plurality of probe holes 222 corresponding to the test position 221. The probes 211 on the probe plate 210 pass through the probe holes 222 and are connected to the test position 221. In the embodiment, the probes 211 are accommodated in the probe holes 222 of the floating plate 220 when not in a testing state, thereby preventing damage to the probes 211 when no chip is placed. After the chip is placed, the flip cover 3 is flipped down to press the pressing block 410 onto the chip. The chip continues to apply downward force to move the floating plate 220 downward, and the probes 211 extend from the probe holes 222 to contact the chip.

[0045] See attached Figure 6 In the above embodiment, positioning posts 212 are provided at the edge of the probe card 210, and floating springs 213 are mounted on the positioning posts 212. Positioning holes 223 are provided on the floating plate 220 corresponding to the positioning posts 212. In this embodiment, the probe card 210 is rectangular, and the positioning posts 212 are disposed at the four corners of the probe card 210. The floating plate 220 floats above the probe card 210 via the floating springs 213.

[0046] See attached Figure 8This embodiment also provides a testing device, including a programmer 5 and the aforementioned flip-top chip test fixture. The test fixture's base 1 is provided with a circuit board 6, which is electrically connected to the probe assembly 2. The programmer 5 is provided with a connector 510, to which the circuit board 6 is detachably mounted. In this embodiment, the circuit board 6 and the programmer 5 are connected via a unified interface. The programmer 5 is used for online and offline chip data burning and programming, as well as online chip simulation and debugging.

[0047] See attached Figure 6 and attached Figure 7 In the above embodiment, a first strong magnet 520 is provided on the connecting base 510, and a second strong magnet 610 is provided on the circuit board 6. When the circuit board 6 is mounted on the connecting base 510, the first strong magnet 520 and the second strong magnet 610 attract each other. In the embodiment, four first strong magnets 520 are provided on the connecting base 510, and correspondingly, four second strong magnets 610 are also provided on the circuit board 6. The first strong magnet 520 and the second strong magnet 610 attract each other so that the test fixture and the circuit board 6 are firmly mounted on the connecting base 510, thereby preventing the torsion spring 330 from popping up the flip cover 3 and causing the circuit board 6 to separate from the connecting base 510 when the test fixture is opened, thereby improving the test stability and achieving a fast and stable connection between the circuit board 6 and the connecting base 510, as shown in the attached figure. Figure 8 shown.

[0048] In summary, this embodiment provides a flip-top chip test fixture and test device. By providing an adjustable pressure block 410 on the flip cover 3, the pressing depth of the chip to be tested can be flexibly adjusted, thereby ensuring stable and reliable electrical contact between the probe 211 and the chip. By providing an adjustment button 420, the user can conveniently adjust the pressure block 410 by pressing. By providing a low-position latch 3231 and a high-position latch 3232, the position of the pressure block 410 can be accurately switched. By providing a flat pressure cover 320, the force direction is vertically downward when the chip is flipped and pressed, thereby avoiding damage to the chip. By providing a floating plate 220, the probe 211 can be hidden in the floating plate 220 when not in the test state, thereby avoiding damage to the probe. By providing a first strong magnet 520 and a second strong magnet 610, a quick and stable connection is achieved between the circuit board 6 and the connecting seat 510. This embodiment ensures stable and reliable electrical contact between the probe 211 and the chip by flexibly adjusting the pressing depth of the flip cover 3 on the chip, thereby improving the accuracy and efficiency of the test.

[0049] The embodiment described above is only one of the more preferred specific embodiments of the present invention. Any common changes and substitutions made by technicians in this field within the scope of the technical solution of the present invention should be included in the protection scope of the present invention.

Claims

1. A flip-top chip test fixture, characterized in that: include: A base (1), wherein a probe assembly (2) is provided on the base (1), and a test position (221) for placing a chip to be tested is formed on the probe assembly (2); A flip cover (3) is rotatably mounted on the base (1), and an adjustment assembly (4) is provided on the flip cover (3). The adjustment assembly (4) includes a pressing block (410) arranged on the inner side of the flip cover (3), and the pressing block (410) is used to press the chip to be tested; a mutually matching bayonet (323) is provided between the pressing block (410) and the flip cover (3), and when the pressing block (410) is rotated to fall into the bayonet (323), the relative distance between the pressing surface (411) of the pressing block (410) and the inner side surface of the flip cover (3) will be changed.

2. The flip-top chip test fixture according to claim 1, characterized in that: The outer side surface of the flip cover (3) is provided with an adjustment groove (321), and a through hole (322) penetrating the flip cover (3) is provided in the middle of the adjustment groove (321); the adjustment assembly (4) comprises an adjustment button (420) installed in the adjustment groove (321), and a connecting member (430) connected between the adjustment button (420) and the pressure block (410), the connecting member (430) being located in the through hole (322), and a return spring (440) abutting against the adjustment button (420) is also installed in the adjustment groove (321).

3. The flip-top chip test fixture according to claim 2, characterized in that: The inner side of the flip cover (3) is provided with a low-position snap-in (3231) and a high-position snap-in (3232), and the pressing block (410) is provided with a limiting protrusion (412). When the limiting protrusion (412) switches from the low-position snap-in (3231) to the high-position snap-in (3232), the relative distance between the extrusion surface (411) of the pressing block (410) and the inner side surface of the flip cover (3) is increased.

4. A flip-top chip test fixture according to any one of claims 1 to 3, characterized in that: The flip cover (3) comprises a cover body (310) and a flat pressing cover (320) rotatably mounted in the middle of the cover body (310); the cover body (310) is hinged to the base (1); and the adjustment assembly (4) is mounted on the flat pressing cover (320).

5. The flip-top chip test fixture according to claim 4, characterized in that: A torsion spring (330) is provided at the hinged end of the cover body (310).

6. The flip-top chip test fixture according to claim 4, characterized in that: A lock buckle (340) is provided on the cover body (310) away from the hinged end, and a locking rod (110) that matches the lock buckle (340) is provided on the base (1).

7. A flip-top chip test fixture according to any one of claims 1 to 3, characterized in that: The probe assembly (2) includes a probe plate (210) and a floating plate (220) floatingly arranged on the probe plate (210); the test position (221) is arranged on the floating plate (220); the floating plate (220) is provided with a plurality of probe holes (222) corresponding to the test position (221); the probes (211) on the probe plate (210) pass through the probe holes (222) and are connected to the test position (221).

8. The flip-top chip test fixture according to claim 7, characterized in that: A positioning column (212) is provided at the edge of the probe plate (210), a floating spring (213) is sleeved on the positioning column (212), and a positioning hole (223) is provided on the floating plate (220) corresponding to the positioning column (212).

9. A testing device, characterized in that: The invention comprises a programmer (5) and a flip-top chip test fixture according to any one of claims 1 to 8, wherein the base (1) of the test fixture is provided with a circuit board (6), the circuit board (6) is electrically connected to the probe assembly (2), and the programmer (5) is provided with a connecting seat (510), and the circuit board (6) is detachably mounted on the connecting seat (510).

10. A testing device according to claim 9, characterized in that: A first strong magnet (520) is provided on the connecting base (510), and a second strong magnet (610) is provided on the circuit board (6). When the circuit board (6) is mounted on the connecting base (510), the first strong magnet (520) and the second strong magnet (610) attract each other.

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