Thermistor film for printer
By setting an insulating layer and a staggered structure of a heat-conducting frame on the outer surface of the thermistor film, the problem of uneven heat caused by dust shielding is solved, and accurate perception of the print head temperature under dust cover is achieved.
Patent Information
- Application Number
- CN202422503887.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-16
- Publication Date
- 2025-09-26
- Estimated Expiration
- 2034-10-16
AI Technical Summary
Dust on the surface of the printer's thermistor film obscures the resistance area, causing uneven heat distribution and affecting the accuracy of temperature readings.
An insulating layer is wrapped around the outer surface of the resistor layer, and a heat-conducting frame is arranged at equal intervals between the insulating layer and the outer layer to form a surface structure with alternating protrusions and depressions, thereby increasing the heated area and improving the heat conduction efficiency.
Ensure that the thermistor film can still accurately sense the temperature changes of the print head even when covered with dust, improving the accuracy and uniformity of temperature perception.
Smart Images

Figure CN223390326U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of resistor films, in particular to a thermistor film used for a printer. Background Art
[0002] Thermistor film is a sensitive component that uses the temperature-dependent resistance of a material to measure and control temperature. Thermistor film used in printers is primarily used to regulate printhead temperature. However, over time, the surface of the thermistor film can accumulate dust from the print cartridges. This dust can partially obscure the resistance area, causing uneven heat distribution and affecting the film's ability to accurately read the printhead temperature. Utility Model Content
[0003] The purpose of this section is to summarize some aspects of the embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and in the abstract and title of the utility model to avoid obscuring the purpose of this section, the abstract and the title of the utility model, and such simplifications or omissions shall not be used to limit the scope of the present invention.
[0004] To solve the above-mentioned problems, the present invention provides the following technical solution: A thermistor film for a printer includes an outer layer, the outer layer completely wrapping around a resistor layer and an electrode layer, the resistor layer being electrically connected to one end of the electrode layer, and the outer layer having a window located at the end of the electrode layer. The invention is characterized in that: the outer surface of the resistor layer is wrapped with an insulating layer, and the insulating layer and the outer layer are wrapped with heat-conducting frames arranged at equal intervals, which highlight a surface structure with interlaced protrusions and depressions under the wrapping of the outer layer.
[0005] On the basis of the above technical solution, the present invention can also be improved as follows.
[0006] As a preferred solution of the thermistor film for a printer of the utility model, the outer layer is a yttrium-doped zirconia ceramic substrate.
[0007] As a preferred embodiment of the thermistor film for a printer according to the present invention, the ratio of the distance between the edge of the resistor layer and the edge of the outer layer to the distance from the edge of the film to the edge of the same film on the other side is in the range of 0.1 to 0.2.
[0008] As a preferred solution of the thermistor film for a printer of the present invention, the heat-conducting frame is a metal layer, and the side of the heat-conducting frame in contact with the insulating layer is a flat surface, and the other side is a smooth arc surface.
[0009] As a preferred solution of the thermistor film for a printer of the present invention, the insulating layer is an organic silicone resin insulating layer, which covers the resistance layer.
[0010] As a preferred solution of the thermistor film for a printer of the utility model, the protrusions and depressions of the outer layer extend from the central axis to the edge of the film, and the height of their surface from the surface of the resistor layer gradually decreases.
[0011] The beneficial effect of this utility model is that by providing insulating thermal frames above the resistor layer, these thermal frames not only cover the resistor layer but also extend into a wider area of the outer layer, acting as an additional heat transfer medium. The thermal frames are evenly spaced and interact with the outer layer to form an undulating and staggered surface feature, i.e., protrusions and depressions. This design increases the heated surface area of the resistor film. Even if the surface is contaminated with powder or dust, the wide heated surface and efficient heat conduction of the thermal frames allow the thermistor film to accurately sense temperature changes in the print head. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without inventive work. Among them:
[0013] Figure 1 It is a three-dimensional diagram of the entire embodiment.
[0014] Figure 2 For this embodiment Figure 1 Partial stereogram.
[0015] Figure 3 For this embodiment Figure 2 Assembly drawing.
[0016] Figure 4 This is a three-dimensional diagram of the outer layers of this embodiment after bonding.
[0017] Figure 5 Schematic diagram of the structure of this embodiment.
[0018] In the figure; a resistor layer 100 and an electrode layer 101;
[0019] Outer layer 200, membrane edge 201, window 202, protrusion 203, recess 204;
[0020] Insulation layer 300;
[0021] Thermal Conductive Frame 400;
[0022] Central axis 500. DETAILED DESCRIPTION
[0023] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.
[0024] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.
[0025] Secondly, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.
[0026] Example
[0027] Reference Figures 1 to 5 , is an embodiment of the present utility model, which provides a thermistor film for a printer, including an outer layer 200, wherein the outer layer 200 is completely wrapped around a resistor layer 100 and an electrode layer 101, wherein the resistor layer 100 is electrically connected to one end of the electrode layer 101, and the outer layer 200 is provided with a window 202 located at the end of the electrode layer 101, and the outer surface of the resistor layer 100 is wrapped with an insulating layer 300, and between the insulating layer 300 and the outer layer 200 are wrapped thermal conductive frames 400 arranged at equal intervals, which highlight a surface structure of protrusions 203 and depressions 204 interlaced with each other under the wrapping of the outer layer 200.
[0028] Specifically, the existing thermistor film includes an internal thermistor coating, i.e., a resistance layer 100, and two electrode pins - an electrode layer 101, which are then sealed by a sealing film (outer layer 200), thereby forming a thermistor. The electrode layer 101 is exposed at a window 202 in the outer layer 200 for electrically connecting to the resistance layer 100. Generally, the thermistor coating, i.e., the resistance layer 100, is very flat, thereby improving the uniform heating of the thermistor. Thus, when in use, this thermistor film is more sensitive than a traditional thermistor. By using an insulating layer 30 on the resistance layer 100, the thermistor film is more sensitive than a traditional thermistor. 0. The heat-conducting frame 400 is set apart. The heat-conducting frame 400 covers the resistor layer 100 so that the heat is diffused to more areas of the outer layer 200. The heat-conducting frame 400 is equivalent to providing additional heat-conducting medium for the resistor layer 100. The heat-conducting frame 400 is arranged at equal intervals. Under the wrapping of the outer layer 200, the surface structure of the protrusions 203 and the depressions 204 interlaced with each other is highlighted, which increases the heating surface area of the entire resistor film. Even if a large amount of powder and dust accumulates on the surface of the resistor film, the large heating area and the good heat-conducting heat-conducting frame 400 can enable the thermistor film to well sense the temperature of the print head.
[0029] In this example, the outer layer 200 is a yttrium-doped zirconia ceramic substrate. Yttrium-doped zirconia ceramic has good mechanical properties and toughness, and can maintain good strength when relatively thin. Reducing the thickness of the thermistor film is conducive to better heating of the resistance layer 100, thereby accurately sensing the temperature of the print head.
[0030] In this example, the ratio of the distance between the edge of the resistor layer 100 and the membrane edge 201 of the outer layer 200 to the distance from the membrane edge 201 to the same membrane edge 201 on the other side is in the range of 0.1 to 0.2. The resistor layer 100 occupies a larger area of the resistor film at the same mass. Such a resistor layer 100 is flatter and has a larger area, and is heated more evenly.
[0031] In this example, the heat-conducting frame 400 is a metal layer, and the side of the heat-conducting frame 400 in contact with the insulating layer 300 is a flat surface, and the other side is a smooth curved surface. The heat-conducting frame 400 can be made of copper. Copper not only has good thermal conductivity but also has good flexibility and strength. It can not only conduct heat but also protect the resistance layer 100. This is why the side in contact with the insulating layer 300 is a flat surface and the other side is a smooth curved surface.
[0032] In this example, the insulating layer 300 is a silicone resin insulating layer, which covers the resistor layer 100. The silicone resin insulating layer not only has good toughness but also has high temperature resistance. The insulating layer 300 is located between the resistor layer 100 and the heat-conducting frame 400. Its stability maintains a flat surface at high temperatures, which has a stable effect on both thermal conductivity and heat dissipation.
[0033] In this example, the protrusions 203 and recesses 204 of the outer layer 200 extend to the edge 201 of the film with the center axis 500 as the center, and the height of the surface from the surface of the resistor layer 100 gradually decreases. This setting is conducive to the discharge of dust and powder from the surface of the outer layer 200. The powder on the surface of the film can be shaken off as the printer vibrates during operation, thereby keeping the thermistor film in good condition for a long time.
[0034] It is important to note that the configuration and arrangement of the present application, as shown in various exemplary embodiments, are illustrative only. Although only a few embodiments are described in detail in this disclosure, those reading this disclosure will readily appreciate that numerous modifications are possible (e.g., variations in the size, dimensions, structure, shape, and proportions of various components, as well as parameter values (e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without materially departing from the novel teachings and advantages of the subject matter described herein. For example, components shown as integrally formed may be constructed from multiple parts or components, the positions of components may be inverted or otherwise altered, and the nature, number, or position of discrete components may be modified or changed. Therefore, all such modifications are intended to be encompassed within the scope of this invention. The order or sequence of any process or method steps may be altered or reordered according to alternative embodiments. In the claims, any "means-plus-function" clause is intended to cover structures described herein that perform the function described, and not only structural equivalence but also equivalent structures. Without departing from the scope of the present invention, other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement of the exemplary embodiments. Therefore, the present invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.
[0035] Additionally, in order to provide a concise description of example embodiments, all features of an actual embodiment (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.
[0036] It will be appreciated that in the development of any actual embodiment, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will, for those of ordinary skill having the benefit of this disclosure, be a routine undertaking of design, fabrication, and production without undue experimentation.
[0037] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, and all of these should be included in the scope of the claims of the present invention.
Claims
1. A thermistor film for a printer, comprising an outer layer (200), wherein the outer layer (200) is completely wrapped around a resistor layer (100) and an electrode layer (101), wherein the resistor layer (100) is electrically connected to one end of the electrode layer (101), and wherein the outer layer (200) is provided with a window (202) at the end of the electrode layer (101), characterized in that: The outer surface of the resistance layer (100) is wrapped with an insulating layer (300), and heat-conducting frames (400) arranged at equal intervals are wrapped between the insulating layer (300) and the outer layer (200), and a surface structure in which protrusions (203) and depressions (204) are interlaced with each other is highlighted under the wrapping of the outer layer (200).
2. The thermistor film for a printer according to claim 1, wherein: The outer layer (200) is a yttrium-doped zirconia ceramic substrate.
3. The thermistor film for a printer according to claim 1 or 2, wherein: The ratio of the distance between the edge of the resistor layer (100) and the film edge (201) of the outer layer (200) to the distance from the film edge (201) to the other side of the same film edge (201) is in the range of 0.1 to 0.
2.
4. The thermistor film for a printer according to claim 1, wherein: The heat-conducting frame (400) is a metal layer, and one side of the heat-conducting frame (400) in contact with the insulating layer (300) is a flat surface, and the other side is a smooth arc surface.
5. The thermistor film for a printer according to claim 1, wherein: The insulating layer (300) is a silicone resin insulating layer, which covers the resistance layer (100).
6. The thermistor film for a printer according to claim 1 or 4, wherein: The protrusions (203) and recesses (204) of the outer layer (200) extend from the central axis (500) to the edge (201) of the film, and the height of their surfaces from the surface of the resistance layer (100) gradually decreases.