Ceramic chopper device for IC packaging and bonding

Abstract

The utility model discloses a ceramic chopper device for IC packaging and bonding, which relates to the technical field of IC packaging equipment and comprises a machine head, a mounting seat is arranged on one side of the machine head, a mounting plate is arranged on one side of the mounting seat, a supporting seat with an annular structure is fixedly arranged at the bottom end of the outer side of the mounting plate, and the supporting seat is arranged on the outer side of the machine head. And a supporting sleeve is fixedly arranged at the top end of the supporting seat. The mounting seat and the mounting plate are arranged on one side of the machine head, the supporting seat is arranged on the outer side of the mounting plate, the positioning sleeve is arranged in the supporting sleeve above the supporting seat and can support and position the chopper body, the outer side of the supporting sleeve is of an inclined structure, and the locking sleeve is further arranged on the outer side of the supporting sleeve in a threaded mode. The locking sleeve is rotated to enable the supporting sleeve to shrink and deform, so that clamping and positioning of the positioning sleeve and the chopper body can be achieved, disassembly, assembly and replacement of the chopper body are facilitated, and the working efficiency of equipment is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of IC packaging equipment, in particular to a ceramic splitting knife device for IC packaging bonding. Background Art

[0002] Wire bonding is a process that uses heat, pressure, ultrasound, and other energies to tightly weld metal wires to substrate pads, achieving electrical interconnection between the chip and substrate and information exchange between chips. In the semiconductor packaging industry, the wedge is a crucial tool in the wire bonding process. Its structure and performance determine the flexibility, reliability, and cost-effectiveness of the bonding process.

[0003] For example, a semiconductor chip wire bonding device, disclosed as CN214753650U, includes a base plate, a housing fixedly mounted on the upper end of the base plate, a dust removal mechanism mounted on the inner wall of the housing, and a bonding mechanism connected to the bottom of the dust removal mechanism. The bonding mechanism includes a first motor, a first threaded rod, a first connecting frame, a second motor, a second threaded rod, a second connecting frame, a hydraulic telescopic rod, a splitting knife, and a clamping plate. The dust removal mechanism includes a third motor, a first gear, a rotating shaft, a second gear, a third gear, a second thrust ball bearing, a connecting rod, and an electrode rod. This utility model solves the problem of bonding and dust removal not being able to be performed simultaneously. The first and second threaded rods adjust the front, back, left, and right positions of the hydraulic telescopic rod, which adjusts the up and down position of the splitting knife. The second gear causes the first and third gears to rotate in opposite directions, and the electrode rod and the bonding frame to rotate in opposite directions, resulting in higher dust removal efficiency.

[0004] The above technical solution has some problems in practical application. Since the splitting knife needs to be replaced regularly during use, the above technical solution is more troublesome when replacing the splitting knife, which is not conducive to improving the working efficiency of the equipment.

[0005] Therefore, it is necessary to invent a ceramic splitting knife device for IC packaging bonding to solve the above problems. Summary of the Invention

[0006] The purpose of the utility model is to provide a ceramic cleaver device for IC packaging bonding to solve the problems raised in the above background technology.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a ceramic splitting knife device for IC package bonding, comprising a machine head, a mounting seat is provided on one side of the machine head, a mounting plate is provided on one side of the mounting seat, a support seat with an annular structure is fixedly provided on the outer bottom end of the mounting plate, a support sleeve is fixedly provided on the top of the support seat, a positioning sleeve is provided inside the support sleeve, a splitting knife body is provided inside the positioning sleeve, a positioning block is fixedly provided on the outer top end of the splitting knife body, a positioning groove corresponding to the positioning block is provided on the top of the inner side wall of the positioning sleeve, an inclined surface is provided on the bottom end of the inner side wall of the support sleeve, a supporting surface corresponding to the inclined surface is provided on the outer side wall of the support sleeve, a tilted structure is provided, and a plurality of deformation grooves are provided around the outer side wall of the support sleeve, and a locking sleeve is provided on the outer thread of the support sleeve.

[0008] Preferably, a guide wheel is provided on the top of the side where the mounting seat and the mounting plate are away from each other, an inclined structure is provided on the side where the mounting seat and the mounting plate are close to each other, and a plurality of support studs are fixed between the mounting seat and the mounting plate.

[0009] Preferably, a fixing seat is provided at the top end of the side where the mounting seat and the mounting plate are close to each other, and the fixing seat is fixedly provided between the two supporting studs. A plug rod is provided on the middle thread of the fixing seat, and a spring is provided around the outer side of the plug rod. A movable seat is provided at the bottom end of the plug rod through a bearing, and a locking wheel is provided at the bottom end of the movable seat.

[0010] Preferably, a wire passing groove is provided at the middle of the top end of the mounting seat and the mounting plate, and the wire passing groove corresponds to the guide wheel.

[0011] Preferably, a connecting ear is fixedly provided at the bottom end of the outer side wall of the mounting seat, and a connecting seat corresponding to the connecting ear is fixedly provided at the bottom end of the outer side wall of the machine head.

[0012] Preferably, a cutting head with a conical structure is fixedly provided at the bottom end of the riving knife body, and a notch is provided at the bottom end of the cutting head.

[0013] The technical effects and advantages of this utility model are:

[0014] 1. The utility model provides a mounting seat and a mounting plate on one side of the machine head, a support seat is provided on the outside of the mounting plate, a positioning sleeve is provided in the support sleeve above the support seat, and the positioning sleeve can realize the support and positioning of the riving knife body, and the outer side of the support sleeve is provided with an inclined structure, and the outer side of the support sleeve is also provided with a locking sleeve threadedly. By rotating the locking sleeve to shrink and deform the support sleeve, the positioning sleeve and the riving knife body can be clamped and positioned, thereby facilitating the disassembly and replacement of the riving knife body, thereby improving the working efficiency of the equipment;

[0015] 2. The utility model provides a movable seat between the mounting seat and the mounting plate, and a locking wheel is provided below the movable seat. During the process of replacing the chopper body, the position between the insertion rod and the fixed seat is adjusted so that the insertion rod drives the locking wheel to move downward until the locking wheel clamps the lead between the mounting seat and the mounting plate to achieve locking of the lead, thereby facilitating threading of the chopper body after replacement. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0017] Figure 2 This is a schematic structural diagram of the chopper body of the utility model.

[0018] Figure 3 This is a schematic diagram of the mounting plate structure of the present utility model.

[0019] In the figure: 1. Machine head; 2. Mounting seat; 3. Mounting plate; 4. Support seat; 5. Support sleeve; 6. Positioning sleeve; 7. Chopper body; 8. Positioning block; 9. Positioning groove; 10. Inclined surface; 11. Deformation groove; 12. Locking sleeve; 13. Guide wheel; 14. Support stud; 15. Fixed seat; 16. Insert rod; 17. Movable seat; 18. Locking wheel; 19. Wire groove; 20. Connecting ear; 21. Connecting seat; 22. Cutter head; 23. Notch. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] The utility model provides Figure 1-3 The present invention shows a ceramic splitting knife device for IC package bonding, comprising a head 1, a mounting seat 2 being provided on one side of the head 1, a mounting plate 3 being provided on one side of the mounting seat 2, a support seat 4 having an annular structure being fixedly provided on the outer bottom end of the mounting plate 3, a support sleeve 5 being fixedly provided on the top end of the support seat 4, a positioning sleeve 6 being inserted into the interior of the support sleeve 5, and a splitting knife body 7 being inserted into the interior of the positioning sleeve 6;

[0022] Specifically, a positioning block 8 is fixedly provided on the top outer side of the cleaver body 7, a positioning groove 9 corresponding to the positioning block 8 is provided on the top inner side wall of the positioning sleeve 6, an inclined surface 10 is provided on the bottom end of the positioning sleeve 6, and a supporting surface corresponding to the inclined surface 10 is provided on the bottom inner side wall of the support sleeve 5. The outer side wall of the support sleeve 5 is provided with an inclined structure, and a plurality of deformation grooves 11 are provided around the outer side wall of the support sleeve 5. A locking sleeve 12 is provided on the outer thread of the support sleeve 5. The locking sleeve 12 can squeeze the support sleeve 5 to deform it inwardly and clamp the positioning sleeve 6. The positioning sleeve 6 is provided with a rubber sleeve, which can achieve the clamping of the cleaver body 7 while avoiding damage to the cleaver body 7 by excessive clamping.

[0023] More specifically, a guide wheel 13 is provided on the top of the side where the mounting seat 2 and the mounting plate 3 are away from each other, and an inclined structure is provided on the side where the mounting seat 2 and the mounting plate 3 are close to each other, and a plurality of support studs 14 are fixedly provided between the mounting seat 2 and the mounting plate 3, and a fixing seat 15 is provided on the top of the side where the mounting seat 2 and the mounting plate 3 are close to each other, and the fixing seat 15 is fixedly provided between the two support studs 14, and a plug rod 16 is provided on the middle thread of the fixing seat 15, and a spring is provided around the outer side of the plug rod 16, and a movable seat 17 is provided on the bottom end of the plug rod 16 through a bearing. A locking wheel 18 is provided on the bottom end of the movable seat 17, and the locking wheel 18 can press the lead wire against the inner wall of the mounting seat 2 and the mounting plate 3 after downward movement to fix the lead wire;

[0024] In addition, a wire groove 19 is provided at the middle of the top of the mounting seat 2 and the mounting plate 3, and the wire groove 19 corresponds to the guide wheel 13. The arrangement of the wire groove 19 facilitates the passage of the lead wire.

[0025] Moreover, a connecting ear 20 is fixedly provided at the bottom end of the outer wall of the mounting base 2, and a connecting base 21 corresponding to the connecting ear 20 is fixedly provided at the bottom end of the outer wall of the head 1. The connecting base 21 and the connecting ear 20 can realize the installation of the device;

[0026] At the same time, a cone-shaped cutter head 22 is fixedly provided at the bottom end of the riving knife body 7 , and a notch 23 is provided at the bottom end of the cutter head 22 . The notch 23 facilitates the guiding of the lead wire by the riving knife body 7 .

[0027] Working principle of this utility model:

[0028] When the present device is in use, the head 1 can drive the splitting knife body 7 to move under the action of the driving mechanism to complete the wire bonding during the packaging operation. When the splitting knife body 7 needs to be replaced, the nut at the top of the insertion rod 16 is first rotated, so that the insertion rod 16 drives the movable seat 17 to move downward, thereby causing the locking wheel 18 to move downward. Since the side where the mounting seat 2 and the mounting plate 3 are close to each other is set to an inclined structure, the locking wheel 18 gradually approaches the inner wall of the mounting seat 2 and the mounting plate 3 during the downward movement, so that the locking wheel 18 can press the lead against the inner wall of the mounting seat 2 and the mounting plate 3 to achieve the fixation of the lead. Then the locking sleeve 12 is rotated to separate the locking sleeve 12 from the support sleeve 5. At this time, the support sleeve 5 is deformed outward under the action of its own elastic potential energy, so that the limit of the positioning sleeve 6 is released, and the positioning sleeve 6 is taken out upward. After the positioning sleeve 6 is no longer squeezed by the support sleeve 5, its squeezing effect on the splitting knife body 7 disappears. At this time, the splitting knife body 7 can be taken out from the positioning sleeve 6 to achieve the replacement of the splitting knife body 7.

[0029] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A ceramic splitter device for IC packaging bonding, comprising a head (1), characterized in that: A mounting seat (2) is provided on one side of the machine head (1), a mounting plate (3) is provided on one side of the mounting seat (2), a support seat (4) of an annular structure is fixedly provided on the outer bottom end of the mounting plate (3), a support sleeve (5) is fixedly provided on the top end of the support seat (4), a positioning sleeve (6) is provided inside the support sleeve (5), a chopper body (7) is provided inside the positioning sleeve (6), a positioning block (8) is fixedly provided on the outer top end of the chopper body (7), a positioning groove (9) corresponding to the positioning block (8) is provided on the top end of the inner side wall of the positioning sleeve (6), an inclined surface (10) is provided on the bottom end of the inner side wall of the support sleeve (5), a supporting surface corresponding to the inclined surface (10) is provided on the bottom end of the inner side wall of the support sleeve (5), the outer side wall of the support sleeve (5) is provided with an inclined structure, and a plurality of deformation grooves (11) are provided around the outer side wall of the support sleeve (5), and a locking sleeve (12) is provided on the outer thread of the support sleeve (5).

2. The ceramic wedge device for IC packaging bonding according to claim 1, characterized in that: A guide wheel (13) is provided at the top end of the side where the mounting seat (2) and the mounting plate (3) are away from each other, and a tilted structure is provided at the side where the mounting seat (2) and the mounting plate (3) are close to each other, and a plurality of support studs (14) are fixedly provided between the mounting seat (2) and the mounting plate (3).

3. The IC packaging bonding ceramic wedge device according to claim 2, characterized in that: A fixing seat (15) is provided at the top end of the side where the mounting seat (2) and the mounting plate (3) are close to each other, and the fixing seat (15) is fixedly provided between the two supporting studs (14). A plug rod (16) is provided on the middle thread of the fixing seat (15), and a spring is provided around the outer side of the plug rod (16). A movable seat (17) is provided at the bottom end of the plug rod (16) through a bearing, and a locking wheel (18) is provided at the bottom end of the movable seat (17).

4. The ceramic wedge device for IC packaging bonding according to claim 3, characterized in that: A wire groove (19) is provided at the middle of the top of each of the mounting seat (2) and the mounting plate (3), and the wire groove (19) corresponds to the guide wheel (13).

5. The ceramic wedge device for IC packaging bonding according to claim 4, characterized in that: A connecting ear (20) is fixedly provided at the bottom end of the outer wall of the mounting seat (2), and a connecting seat (21) corresponding to the connecting ear (20) is fixedly provided at the bottom end of the outer wall of the machine head (1).

6. The ceramic cleaver device for IC packaging bonding according to claim 5, characterized in that: A cone-shaped cutter head (22) is fixedly provided at the bottom end of the splitting knife body (7), and a notch (23) is provided at the bottom end of the cutter head (22).

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