Chip double-sided liquid cooling heat dissipation system

Abstract

The utility model relates to the technical field of chip heat dissipation, and discloses a chip double-sided liquid cooling heat dissipation system. Comprising an upper-layer cover plate arranged on a substrate and a lower-layer cover plate arranged on a PCB, the top surface of the upper-layer cover plate is provided with a first water inlet and a first water outlet, the bottom surface of the upper-layer cover plate is provided with a first avoiding cavity, a chip is arranged in the first avoiding cavity, and an upper-layer liquid cooling flow channel is formed among the first water inlet, the first avoiding cavity and the first water outlet; a second water inlet, a second water outlet and a clearance opening are formed in the top surface of the lower-layer cover plate, a second clearance cavity is formed in the bottom surface of the lower-layer cover plate, and a lower-layer liquid cooling flow channel is formed among the second water inlet, the second clearance cavity and the second water outlet; according to the structure, the upper surface and the lower surface of the chip can be cooled simultaneously, and the problem that the chip performance is reduced or even damaged due to the fact that the junction temperature of the chip is too high is effectively solved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip heat dissipation, in particular to a chip double-sided liquid cooling system. Background Art

[0002] Chip cooling is crucial for maintaining chip performance at a stable operating temperature, preventing performance degradation, damage, or other issues caused by overheating. Effective heat dissipation ensures chip stability and reliability, extends chip life, and improves overall system performance and safety. Existing cooling technologies typically utilize single-sided cooling methods, such as air cooling, liquid cooling, and immersion cooling.

[0003] With the rapid development of semiconductor technology, chips are showing a development trend of high integration, complexity and high frequency. In particular, for the structure of multi-DIE chips and multi-module chips, when the power is high, the heat generated by the chips also increases, becoming a key factor hindering the improvement of chip performance and reliability. Therefore, single-sided heat dissipation technology is difficult to solve the heat dissipation problem of the above chip structure.

[0004] According to the prior art, a Chinese utility model patent with the announcement number CN113594112B describes a stacked liquid cooling heat dissipation module structure for a double-sided chip. The structure is sequentially provided with three-layer plate structures, each of which is provided with a liquid cooling channel, and the chip is installed between the three layers to achieve double-sided heat dissipation of the chip. Although this structure can achieve double-sided heat dissipation of the chip, the excessive number of plate layers increases the thermal resistance layer, resulting in unsatisfactory heat dissipation effect; more importantly, the heat dissipation structure cannot achieve direct contact heat dissipation of the chip, which will cause the junction temperature of the chip to be too high, thereby causing the chip performance to decline or even damage. Utility Model Content

[0005] Based on the above, the purpose of the present invention is to provide a double-sided liquid cooling system for chips, which is used to solve the problems in the existing double-sided chip cooling technology, such as excessive thermal resistance layers affecting its heat dissipation effect, and poor chip heat dissipation effect causing the chip junction temperature to be too high, resulting in chip performance degradation or even damage.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0007] The utility model provides a chip double-sided liquid cooling system comprising a chip, a substrate and a PCB, wherein the pins of the chip are passed through the substrate and electrically connected to the PCB via a plurality of solder balls; and further comprising: an upper cover plate mounted on the substrate, wherein the top surface of the upper cover plate is provided with a first water inlet and a first water outlet, and the bottom surface of the upper cover plate is provided with a first air-avoiding cavity, wherein the chip is placed in the first air-avoiding cavity;

[0008] A lower cover plate is mounted on the PCB, wherein the top surface of the lower cover plate is provided with a second water inlet, a second water outlet, and an air avoidance opening, and the bottom surface thereof is provided with a second air avoidance cavity; the upper cover plate is placed in the second air avoidance cavity, and the first water inlet and the first water outlet pass through the air avoidance opening and extend to the top of the lower cover plate;

[0009] Among them, a cooling liquid flow channel is formed between the plurality of solder balls; when the cooling liquid flows from the first water inlet into the first air-avoiding cavity and flows out from the first water outlet after undergoing convection heat exchange through the chip surface, an upper liquid cooling flow channel is formed; when the cooling liquid flows from the second water inlet into the second air-avoiding cavity and flows out from the second water outlet after undergoing convection heat exchange through the plurality of solder balls, a lower liquid cooling flow channel is formed.

[0010] As an optional technical solution for a double-sided liquid cooling system for a chip, a jet plate is provided between the upper cover plate and the chip, and a plurality of jet holes are opened on the jet plate.

[0011] As an optional technical solution for a double-sided liquid cooling system for a chip, confluence grooves conductively connected to the first water outlet are respectively provided on both sides of the first air-avoiding cavity.

[0012] As an optional technical solution for a double-sided liquid cooling system for a chip, the jet plate is provided with drainage grooves on both sides near its edge, and the drainage grooves are conductively connected to the confluence grooves.

[0013] As an optional technical solution for a double-sided liquid cooling system for a chip, a plurality of diffusion sheets are connected to the surface of the chip, and each of the diffusion sheets is provided with a number of capillaries.

[0014] As an optional technical solution for a double-sided liquid cooling system for a chip, a plurality of the diffusion sheets are arranged in an array, and cooling liquid flow channels are formed between the plurality of the diffusion sheets.

[0015] As an optional technical solution for a double-sided liquid cooling system for a chip, sealing grooves are respectively opened around the first air-avoiding cavity, the air-avoiding opening and the second air-avoiding cavity, and sealing strips are installed in the sealing grooves. A plurality of screws are interspersed at intervals in the circumferential position of the lower cover plate, and the plurality of screws are used to lock the lower cover plate and the PCB together.

[0016] As an optional technical solution for a double-sided liquid cooling system for a chip, an adhesive layer is applied at the joint between the upper cover plate and the substrate, and an adhesive layer is applied at the joint between the lower cover plate and the PCB.

[0017] The beneficial effects of the utility model are:

[0018] The utility model provides a chip double-sided liquid cooling heat dissipation system, which includes an upper cover plate installed on a substrate and a lower cover plate installed on a PCB, the top surface of the upper cover plate is provided with a first water inlet and a first water outlet, the bottom surface is provided with a first air-avoidance cavity, the chip is placed in the first air-avoidance cavity, the cooling liquid flows into the first air-avoidance cavity from the first water inlet and passes through the surface of the chip for convection heat exchange before flowing out from the first water outlet, forming an upper liquid cooling flow channel; the top surface of the lower cover plate is provided with a second water inlet, a second water outlet and an air-avoidance cavity, the bottom surface is provided with a second air-avoidance cavity, the circumferential position of the upper cover plate is in contact with the top surface of the second air-avoidance cavity and is located in the second air-avoidance cavity, the first water inlet and the first water outlet pass through the air-avoidance cavity and extend to the top of the lower cover plate, when the cooling liquid flows into the second air-avoidance cavity from the second water inlet and passes through a plurality of solder balls for convection heat exchange before flowing out from the second water outlet, a lower liquid cooling flow channel is formed.

[0019] Under the above structure, the coolant in the upper liquid-cooling channel can carry out contact convection heat exchange with the surface of the chip, and no thermal resistance layer is formed between the coolant and the chip, which makes the heat dissipation effect of the structure better; the structure of the lower liquid-cooling channel enables the junction temperature inside the chip to be transferred to the solder ball through the pins of the chip and directly convectively exchange heat through the coolant. In other words, the setting of the lower liquid-cooling channel can effectively solve the problem of high junction temperature of the chip, which leads to chip performance degradation or even damage; in addition, the setting of the upper liquid-cooling channel and the lower liquid-cooling channel can dissipate heat on the upper and lower sides of the chip at the same time, effectively solving the heat dissipation problem of high-power, multi-module chips.

[0020] On the other hand, sealing strips and adhesive layers are arranged between the upper cover plate and the substrate, and between the lower cover plate and the PCB, and the upper cover plate and the lower cover plate are pressed and sealed together by multiple screws, so that the overall sealing and stability of the chip double-sided liquid cooling system are further improved; welding sealing is performed between the top of the upper cover plate and the top of the second air-avoiding cavity, and welding sealing is performed between the upper cover plate and the jet plate. The sealing method of combining elastic crimping of the sealing strip, welding or adhesive layer connection makes the overall sealing and later service life and stability of the chip double-sided liquid cooling system more stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the overall structure of the chip double-sided liquid cooling system in an embodiment of the present invention;

[0022] Figure 2 This is an exploded view of the chip double-sided liquid cooling system in an embodiment of the present invention;

[0023] Figure 3 This is a cross-sectional schematic diagram of a double-sided liquid cooling system for a chip in an embodiment of the present invention;

[0024] Figure 4 This is an isometric diagram of the upper cover plate in an embodiment of the present utility model;

[0025] Figure 5 This is an isometric diagram of the lower cover plate in an embodiment of the present utility model;

[0026] Figure 6 A top view of a jet plate in an embodiment of the present utility model;

[0027] Figure 7 It is a bottom view of the jet plate in the embodiment of the present utility model.

[0028] In the figure: 1. Upper cover plate; 11. First water inlet; 12. First water outlet; 13. Confluence trough; 14. First air-avoiding cavity; 2. Lower cover plate; 21. Second water inlet; 22. Second water outlet; 23. Second air-avoiding cavity; 24. Air-avoiding port; 3. Jet plate; 31. Jet hole; 32. Drain trough; 33. Third air-avoiding cavity; 4. Diffuser; 5. Substrate; 6. Solder ball; 7. PCB. DETAILED DESCRIPTION

[0029] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.

[0030] In the description of this utility model, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0031] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0032] In the description of this embodiment, the terms "up", "down", "left", "right" and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0033] In the description of the present invention, unless otherwise specified, the meaning of "plurality" is two or more. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0034] like Figures 1 to 7 As shown, the utility model provides a chip double-sided liquid cooling heat dissipation system, which includes a chip, a substrate 5 and a PCB7. The pins of the chip are arranged on the substrate 5 and are electrically connected to the PCB7 through a plurality of solder balls 6; it also includes an upper cover plate 1, which is mounted on the substrate 5, and the top surface of the upper cover plate 1 is provided with a first water inlet 11 and a first water outlet 12, and the bottom surface is provided with a first air-avoiding cavity 14, and the chip is placed in the first air-avoiding cavity 14; a lower cover plate 2, which is mounted on the PCB7, and the top surface of the lower cover plate 2 is provided with a second water inlet 21, a second water outlet 22 and an air-avoiding cavity 24, which A second air-avoidance cavity 23 is provided on the bottom surface; the upper cover plate 1 is placed in the second air-avoidance cavity 23, and the first water inlet 11 and the first water outlet 12 are penetrated by an air-avoidance cavity 24 and extend to the top of the lower cover plate 2; wherein, a cooling liquid flow channel is formed between the plurality of solder balls 6; when the cooling liquid flows into the first air-avoidance cavity 14 from the first water inlet 11 and flows out from the first water outlet 12 after undergoing convection heat exchange on the chip surface, an upper liquid-cooling flow channel is formed; when the cooling liquid flows into the second air-avoidance cavity 23 from the second water inlet 21 and flows out from the second water outlet 22 after undergoing convection heat exchange through the plurality of solder balls 6, a lower liquid-cooling flow channel is formed.

[0035] The utility model provides a chip double-sided liquid cooling heat dissipation system, which can achieve contact convection heat exchange with the surface of the chip through the cooling liquid in the upper liquid cooling channel. No thermal resistance layer is formed between the cooling liquid and the chip, so that the heat dissipation effect of the structure is better; the structure of the lower liquid cooling channel enables the junction temperature inside the chip to be transferred to the solder ball 6 through the pins of the chip and directly convectively exchange heat through the coolant, that is, the setting of the lower liquid cooling channel can effectively solve the problem of high junction temperature of the chip, which leads to chip performance degradation or even damage; in addition, the setting of the upper liquid cooling channel and the lower liquid cooling channel can simultaneously dissipate heat on the upper and lower sides of the chip, effectively solving the heat dissipation problem of high-power, multi-module chips.

[0036] Specifically, such as Figure 3-4As shown, there is one first water inlet 11, which is located in the middle of the upper end of the upper cover plate 1. Preferably, there are two first water outlets 12 and are arranged on the same axis on both sides of the first water inlet 11; two first water inlets 11 can also be set according to the heat dissipation requirements. The coolant is injected into the first air-avoiding cavity 14 from the first water inlet 11 through the positive pressure of the outside world, and is then output from the first water outlet 12 through the negative pressure of the outside world, so that a water circulation with the best heat dissipation effect is formed inside the entire heat dissipation device, and the heat dissipation speed of the chip can also be changed by adjusting the positive and negative pressures.

[0037] In this embodiment, if Figure 3 、 Figure 4 and Figure 6 As shown, the bottom surface of the upper cover plate 1 is located on both sides of the first air-avoiding cavity 14, and a long confluence groove 13 is respectively provided. The confluence groove 13 is conductively connected to the first water outlet 12, and a barrier is formed between the confluence groove 13 and the first air-avoiding cavity 14. A jet plate 3 is also installed between the upper cover plate 1 and the chip. A plurality of jet holes 31 are arranged in an array on the jet plate 3, and the jet plate 3 is respectively provided with a long strip of drainage grooves 32 on both sides near its edge and is conductively connected with the confluence groove 13. After the upper cover plate 1 and the jet plate 3 are welded or glued and sealed, the jet hole 31 is located below the first air-avoiding cavity 14, and the barrier and the jet plate 3 fit tightly to isolate the first air-avoiding cavity 14 and the drainage groove 32, thereby separating the water inlet route and the water outlet route into two separate waterways, and the heat dissipation effect will not be affected by the long-term mixing of the water inlet and the water outlet.

[0038] Further, such as Figure 3 and Figure 7 As shown, a third air-avoiding cavity 33 is provided on the bottom surface of the jet plate 3, and a plurality of diffusers 4 are connected to the surface of the chip. When the jet plate 3 is mounted on the substrate 5, the diffusers 4 and the chip are both placed in the third air-avoiding cavity 33; and the plurality of diffusers 4 are arranged in an array on the upper surface of the chip, and a plurality of flow channels for the circulation of the working coolant are formed between the plurality of diffusers 4. Each diffuser 4 is provided with a number of capillaries, so that the coolant can penetrate into the capillaries to increase the convective heat transfer area of ​​the diffuser 4, and the flow channels between the diffusers 4 can accelerate the flow rate of the coolant between the diffusers 4, thereby increasing the speed of convective heat transfer and accelerating the heat dissipation speed and heat dissipation effect of the chip surface; the spacing between the diffuser 4 and the jet plate 3 is preferably 0.5MM, so that when the coolant is ejected from the jet hole 31 to the diffuser 4 and then flows out from the drainage grooves 32 on both sides of the diffuser 4, the heat exchange distance therebetween is short, so that the heat dissipation effect is better; the diffuser 4 can be made of a material with strong thermal conductivity such as a copper layer or an indium layer.

[0039] In this embodiment, if Figures 1 to 3As shown, the circumferential area of ​​the second air-avoidance cavity 23 is larger than the circumferential area of ​​the upper cover plate 1, and the circumferential size of the air-avoidance opening 24 is smaller than the circumferential size of the upper cover plate 1. After the lower cover plate 2 and the PCB 7 are fixedly installed, the first water inlet 11 and the first water outlet 12 can pass through the air-avoidance opening 24 and extend to the top of the lower cover plate 2, so as to facilitate the connection of external pipelines; the circumferential edge position of the upper cover plate 1 is abutted and sealed with the top of the second air-avoidance cavity 23, thereby forming a circumferential flow channel at the circumferential position of the chip, which can perform convective heat exchange on the circumferential side of the chip, further enhancing the heat dissipation effect of the chip.

[0040] It should be noted that the lower liquid cooling channel of the present invention can not only dissipate heat to the circumferential side surfaces and the bottom surface of the chip, but more importantly, the junction temperature inside the chip can be transferred to the solder ball 6 through the pins, and then the solder ball 6 is subjected to convection heat exchange by the coolant to reduce the junction temperature inside the chip, thereby solving the problem that the internal junction temperature of multi-module and high-power chips is too high, which leads to chip performance degradation or even damage.

[0041] In this embodiment, the cooling liquid used may be ultrapure water or fluorinated liquid.

[0042] Furthermore, a sealing groove is opened around the first air avoidance cavity 14, and a sealing strip is installed in the sealing groove, and the upper cover plate 1 is attached to the substrate 5. At this time, the chip is placed in the first air avoidance cavity 14; the lower cover plate 2 is assembled, and sealing grooves are respectively opened on the bottom surface of the lower cover plate 2 around the air avoidance opening 24 and the second air avoidance cavity 23, and a sealing strip is installed in the sealing groove, and the lower cover plate 2 is attached to the PCB7. A plurality of screws are arranged at intervals in the circumferential position of the lower cover plate 2, and the lower cover plate 2 is tightly attached to the PCB7 by locking the screws; at this time, the upper cover plate 1 is tightly attached to the substrate 5 as the lower cover plate 2 is pressed down while the screws are locked.

[0043] Under the above structure, sealing strips and adhesive layers are arranged between the upper cover plate 1 and the substrate 5 and between the lower cover plate 2 and the PCB 7, and finally the upper cover plate 1 and the lower cover plate 2 are pressed and sealed together by multiple screws. When the screws are tightened, the sealing strips on the upper cover plate 1 and the lower cover plate 2 are elastically pressed against the jet plate 3 and the PCB 7 respectively, forming a sealed liquid cooling circulation channel with the upper liquid cooling channel and the lower liquid cooling channel, so that the overall sealing of the double-sided liquid cooling heat dissipation system of the chip is more stable.

[0044] Specifically, an adhesive layer is applied at the joint between the upper cover plate 1 and the substrate 5; an adhesive layer is applied at the joint between the lower cover plate 2 and the PCB7; by applying an adhesive layer on the sealing surfaces of the upper cover plate 1 and the lower cover plate 2 and the jet plate 3 and the PCB7, the overall sealing and stability of the chip double-sided liquid cooling system are further improved. Of course, its sealing can also be increased by welding; in addition, after assembling the lower cover plate 2, use a torque wrench to tighten the screws. Keeping the torque of each screw consistent can improve the overall stability of the liquid cooling system.

[0045] Furthermore, welding seals are performed between the top of the upper cover plate 1 and the top of the second air-avoiding cavity 23, and welding seals are performed between the upper cover plate 1 and the jet plate 3. The overall sealing and later service life and stability of the chip double-sided liquid cooling system are made more stable by a sealing method combining elastic crimping of sealing strips, welding or adhesive connection.

[0046] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention is disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technician familiar with the profession can make some changes or modifications to equivalent embodiments of the above-disclosed technical contents without departing from the scope of the technical solution of the present invention. However, any simple modifications, equivalent changes and modifications made to the above embodiments according to the technology of the present invention, which do not depart from the content of the technical solution of the present invention, are within the scope of the technical solution of the present invention.

Claims

1. A chip double-sided liquid cooling system, comprising a chip, a substrate, and a PCB, wherein the pins of the chip are inserted through the substrate and electrically connected to the PCB via a plurality of solder balls; characterized in that: Also includes: An upper cover plate is mounted on the base plate, wherein a first water inlet and a first water outlet are provided on the top surface of the upper cover plate, and a first air-avoiding cavity is provided on the bottom surface thereof, and the chip is placed in the first air-avoiding cavity; A lower cover plate is mounted on the PCB, wherein the top surface of the lower cover plate is provided with a second water inlet, a second water outlet, and an air avoidance opening, and the bottom surface thereof is provided with a second air avoidance cavity; the upper cover plate is placed in the second air avoidance cavity, and the first water inlet and the first water outlet pass through the air avoidance opening and extend to the top of the lower cover plate; Among them, a cooling liquid flow channel is formed between the plurality of solder balls; when the cooling liquid flows from the first water inlet into the first air-avoiding cavity and flows out from the first water outlet after undergoing convection heat exchange through the chip surface, an upper liquid cooling flow channel is formed; when the cooling liquid flows from the second water inlet into the second air-avoiding cavity and flows out from the second water outlet after undergoing convection heat exchange through the plurality of solder balls, a lower liquid cooling flow channel is formed.

2. A chip double-sided liquid cooling system according to claim 1, characterized in that: A jet plate is provided between the upper cover plate and the chip, and a plurality of jet holes are provided on the jet plate.

3. A chip double-sided liquid cooling system according to claim 2, characterized in that: Both sides of the first air-avoiding cavity are respectively provided with a confluence groove conductively connected to the first water outlet.

4. A chip double-sided liquid cooling system according to claim 3, characterized in that: The jet plate is provided with drainage grooves on both sides close to the edge thereof, and the drainage grooves are conductively connected to the confluence grooves.

5. The chip double-sided liquid cooling system according to claim 1, characterized in that: The surface of the chip is connected with a plurality of diffusion sheets, and each of the diffusion sheets is provided with a number of capillaries.

6. The chip double-sided liquid cooling system according to claim 5, characterized in that: The plurality of diffusion sheets are arranged in an array, and cooling liquid flow channels are formed between the plurality of diffusion sheets.

7. The chip double-sided liquid cooling system according to claim 5, characterized in that: Sealing grooves are respectively opened around the first air avoidance cavity, the air avoidance opening and the second air avoidance cavity, and sealing strips are installed in the sealing grooves. A plurality of screws are spaced apart at circumferential positions of the lower cover plate, and the plurality of screws are used to lock the lower cover plate and the PCB together.

8. The chip double-sided liquid cooling system according to claim 7, characterized in that: An adhesive layer is applied at the joining portion between the upper cover plate and the substrate, and an adhesive layer is applied at the joining portion between the lower cover plate and the PCB.

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