Chip turbulence radiator

Abstract

The utility model discloses a chip turbulence radiator, which comprises a base, at least two radiating units and a fan, the bottom surface of the base is tightly attached to a chip, the radiating units are arranged above the base, the fan is clamped between two adjacent radiating units, and each radiating unit comprises a plurality of radiating fins parallel to each other and a heat conduction pipe fixedly connected with the base. The radiating fins are fixedly connected with the heat conduction pipe in a penetrating mode, turbulent flow pieces are fixedly arranged on the radiating fins, a gap between every two adjacent radiating fins on the same radiating unit is an air channel, and the directions of the air channels of every two adjacent radiating units are consistent. When the fan runs, air flows between the cooling fins along the horizontal direction, and heat on the cooling fins is taken away, so that cooling and heat dissipation of the chip are realized. After the chip works for a period of time, the fan rotates reversely to enable air in the air channel to flow reversely, so that flocculent deposits gathered on one side of the radiating fin previously are blown away, and the deposits are prevented from influencing normal flow of the air.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic component heat dissipation, in particular to a chip turbulence radiator. Background Art

[0002] A heat sink is a commonly used heat dissipation component on chips. It typically consists of a base and several parallel fins vertically fixed to the base. A fan is attached to one end of the fins. Heat generated by the chip during operation is transferred through the base to the fins, where it is then carried away by air from the fan, cooling the chip and preventing overheating and damage.

[0003] After a fan has been running for a long time, dust will accumulate on the side of the heat sink closest to the fan. Over time, the dust will accumulate, mixed with other debris in the air, and will form a cotton-like accumulation between the fan and the heat sink. This cotton-like accumulation will seriously affect the heat dissipation of the chip, so it is necessary to stop the machine and clean it.

[0004] The usual practice is to use a brush to clean dust after shutting down the machine, but this accumulation is located between the fan and the heat sink, so a brush cannot remove it. The fan must be removed for thorough cleaning. Some people also use a high-pressure air gun to blow the radiator. Due to the high pressure of the high-pressure air gun, the fan will rotate at high speed when it is blown, which can seriously damage the fan.

[0005] Patent Publication No. CN207833446U discloses a pluggable heat sink for use inside a computer case. The heat sink consists of a heat sink, multiple heat sinks, four fan struts, and a fan mounting plate. The heat sink is equipped with four heat sink mounting holes and four fan strut mounting holes. Each fan strut has a spring in the middle. The fan mounting plate houses a fan mounting bracket, a fan, and a motor. Because the fan is mounted on one side of the heat sink, dust accumulates between the fan and the heat sink after prolonged operation, affecting proper heat dissipation. Patent Publication No. CN1547257A discloses an axial heat sink with an offset fan for electronic chips, primarily comprising a fan, a motor, a heat sink, and a mounting clip. The heat sink consists of a square horizontal base and right-angled trapezoidal vertical fins. The vertical fins are evenly arranged perpendicularly on the horizontal base, and the vertical fins and the horizontal base are integrally cast. The fan is fixed to the heat sink. The fan is also fixed to the side of the heat sink, which similarly causes dust to accumulate between the heat sink and fan. Over time, this can form a cotton-like buildup, affecting heat dissipation. Utility Model Content

[0006] The technical problem to be solved by the utility model is to provide a chip turbulence radiator, which is used to solve the problem that the radiator needs to be shut down when cleaning dust and deposits on the radiator.

[0007] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0008] A chip turbulent heat sink comprises a base whose bottom surface is in close contact with the chip, at least two heat dissipation units arranged above the base, and a fan sandwiched between two adjacent heat dissipation units. Each heat dissipation unit comprises a plurality of mutually parallel heat dissipation fins and a heat conduction pipe fixedly connected to the base. The heat dissipation fins and the heat conduction pipes are fixedly connected through them. A spoiler is fixedly provided on each of the heat dissipation fins. The gap between two adjacent heat dissipation fins on the same heat dissipation unit serves as an air duct, and the air duct directions of the two adjacent heat dissipation units are consistent.

[0009] Furthermore, the spoiler is a hemispherical protrusion, and the heat sink has a hemispherical pit on a side opposite to the protrusion.

[0010] Furthermore, the spoiler is a fish-scale-shaped protrusion, one side of the protrusion is open and faces the direction of the wind in the air duct, and the heat sink is provided with a through hole at a position corresponding to the protrusion.

[0011] Furthermore, the heat sink is rectangular, and the spoilers on two adjacent heat sinks are staggered in the transverse and longitudinal directions of the heat sink.

[0012] Furthermore, baffles are provided on both sides of each heat dissipation unit, the heat sink is located between the two baffles, and the baffles are parallel to the wind direction of the wind blown out by the fan.

[0013] Furthermore, the same heat dissipation unit has two groups of heat dissipation fins, and the opposing parts of the two groups of heat dissipation fins are staggered.

[0014] Furthermore, the heat sinks are parallel to the surface of the chip, and the fan is axial flow.

[0015] The positive effects of this utility model are:

[0016] The utility model comprises a base, a heat pipe, a heat dissipation unit, and a fan. Heat generated by the chip during operation is sequentially transferred to each heat sink through the base and heat pipe. When the fan is in operation, air flows horizontally between the heat sinks, removing heat from the heat sinks and thus cooling and dissipating heat from the chip. After the chip has operated for a period of time, the fan rotates in the opposite direction, causing the air in the air duct to flow in the opposite direction, thereby blowing away any cotton-like deposits that had previously accumulated on one side of the heat sink, preventing these deposits from affecting the normal flow of air and ensuring proper heat dissipation from the heat sink. Because the fan is located between the two heat dissipation units, dust does not accumulate between the fan and the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a front view of Example 1;

[0018] Figure 2 yes Figure 1 Right view;

[0019] Figure 3 This is a front view of Example 3 after removing the baffle;

[0020] Figure 4 is a schematic structural diagram of the spoiler in Example 1;

[0021] Figure 5 is a schematic structural diagram of the spoiler in Example 2;

[0022] In the picture:

[0023] 1. Chip; 2. Base; 3. Heat pipe; 4. Baffle; 5. Heat sink; 6. Spoiler; 7. Spring; 8. Fan; 9. First screw; 10. Second screw; 11. Through hole; 12. Air duct. DETAILED DESCRIPTION

[0024] For the sake of convenience, in the following description, the direction consistent with the wind direction blown by the fan 8 (i.e. the axial direction of the fan 8) is referred to as "longitudinal", and the direction perpendicular to the axial direction of the fan 8 in the horizontal plane is referred to as "transverse". Figure 4 and Figure 5 In the figure, the arrow points to the direction of wind flow.

[0025] Example 1

[0026] like Figure 1 、 Figure 2 and Figure 4 As shown, a chip turbulent heat sink includes a rectangular base 2 whose bottom surface is in close contact with the chip 1, two heat dissipation units arranged above the base 2, and a fan 8 sandwiched between the two adjacent heat dissipation units, wherein the fan 8 is an axial flow type. Both sides of the base 2 are protruding lugs, and a second screw 10 is provided through the lugs. The second screw 10 is screwed on the circuit board under the chip 1, thereby pressing the base 2 against the upper surface of the chip 1. Thermal grease is applied between the upper surface of the chip 1 and the bottom surface of the base 2 to improve the heat conduction effect and facilitate the timely transfer of the heat emitted by the chip 1 to the base 2. The two heat dissipation units are symmetrically arranged on both sides of the fan 8, one on the left and one on the right. Each heat dissipation unit includes a number of rectangular heat sinks 5 evenly distributed vertically and four heat pipes 3 fixedly connected to the bottom of the base 2.

[0027] Bosses are provided on the heat sink 5 at each corner of the fan 8, each of which is penetrated by a first screw 9. The first screw 9 extends through the corresponding mounting hole in the fan 8 and is tightened by a nut on the right end of the first screw 9, thereby clamping the fan between the two heat sinks. A spring 7 is also mounted on the left end of the first screw 9 to prevent the first screw 9 from loosening and keep the fan 8 clamped.

[0028] Heat pipe 3 is a hollow cylindrical tube containing a coolant and a capillary wick structure. When one end of the heat pipe 3 is heated, creating a temperature difference between the two ends, the liquid in the wick evaporates and vaporizes. The pressure differential causes the vapor to rush to the other end, releasing heat and condensing into liquid. The liquid then flows back to the evaporation section along the porous tube wall due to capillary forces. This cycle repeats, transferring a large amount of heat from one end of the heat pipe to the other. The heat conductivity of heat pipe 3 exceeds that of any known metal.

[0029] Each heat sink 5 is parallel to each other and welded perpendicularly to the four heat pipes 3. A spoiler 6 is fixedly installed on both the top and bottom surfaces of each heat sink 5. The gap between two adjacent heat sinks 5 on the same heat sink unit forms an air duct 12. The air ducts 12 of the left and right heat sink units are aligned in the same longitudinal direction. The spoilers 6 on the opposite sides of two adjacent heat sinks 5 are staggered along the horizontal and vertical directions of the heat sink 5. External cold air exchanges heat with the heat sink 5 and is blown out of the air duct 12 as hot air. The hot air is horizontal and spaced away from the base 2, so it does not affect the base 2 and the chip 1.

[0030] The spoiler 6 is a hemispherical protrusion, and the heat sink 5 has a hemispherical pit on a side opposite to the protrusion. In actual production, the protrusion can be formed by a stamping process using a mold to improve production efficiency.

[0031] The heat generated by the chip 1 during operation is transferred to each heat sink 5 through the base 2 and the heat pipe 3 in turn. When the fan 8 is running, the wind flows horizontally in the air duct 12, taking away the heat from the heat sink 5, thereby achieving cooling and heat dissipation of the chip 1.

[0032] After a period of operation, the fan 8 rotates in the reverse direction, causing the air in the air duct 12 to flow in the reverse direction, thereby blowing away the cotton-like accumulation that had previously accumulated on one side of the heat sink 5, preventing the accumulation from affecting the normal flow of air. Since the fan 8 is located between the two heat dissipation units 8, dust will not accumulate between the fan 8 and the heat sink 8.

[0033] Each heat dissipation unit is provided with baffles 4 on both sides. Each heat dissipation fin 5 of the same heat dissipation unit is located between two baffles 4. The baffles 4 are parallel to the wind direction of the air blown by the fan 8. The two baffles 4 act as a guide, allowing the air to flow between the baffles 4, thereby increasing the flow rate of the air in the air duct 12 and preventing dust from settling in the air duct 12.

[0034] When the wind flows in the air duct 12, it is blocked by the spoiler 6. Under the action of the spoiler 6, the wind forms turbulence when flowing in the air duct 12, which can increase the probability of contact between the wind and the heat sink 5, thereby increasing the heat dissipation efficiency (when the spoiler 6 is not set, the wind flows in the air duct 12 in laminar flow, and only the wind close to the surface of the heat sink 5 exchanges heat with the heat sink 5, while the wind close to the center of the air duct 12 will blow directly through the air duct 12, so the heat dissipation efficiency is low).

[0035] Example 2

[0036] Combine Figure 5 As shown, the difference between this embodiment and embodiment 1 is that:

[0037] The structure of the spoiler 6 is different. The spoiler 6 is a fish-scale shaped protrusion, one side of the protrusion is open and faces the direction of the wind in the air duct 12, and the heat sink 5 is provided with a through hole 11 at a position corresponding to the protrusion.

[0038] In actual production, stamping can also be used to form fish-scale-like protrusions, which are the same as the protrusion structure on the grating board used for grating potatoes or carrots in life.

[0039] When wind flows in the air ducts 12 , the protrusions cause the wind to cross-flow between adjacent air ducts 12 , thereby increasing the turbulence effect.

[0040] Example 3

[0041] like Figure 3 As shown, each heat dissipation unit has two groups of heat sinks 5 distributed on the left and right, with the two groups of heat sinks 5 facing each other staggered, and the staggered parts are no longer provided with spoilers 6. Each heat dissipation unit has two groups of heat pipes 5 distributed and welded to the two groups of heat sinks 5.

[0042] Taking the heat dissipation unit on the left as an example, the direction of the wind in the air duct 12 is from right to left. When the wind in the middle of the air duct 12 of the right group of heat sinks 5 enters the air duct 12 of the left group of heat sinks 5, it is separated into two paths by the left heat sink 5. Therefore, the wind in the center of the right air duct 12 will approach the surface of the left heat sink 5, thereby improving the turbulence effect and making the heat dissipation better.

[0043] The above-mentioned embodiments are described in a relatively detailed and specific manner, expressing preferred embodiments of the present invention. They are only used to illustrate the technical ideas and features of the present invention. Their purpose is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly. However, they are not limited to the present invention alone, and the patent scope of the present invention cannot be limited solely by these embodiments. That is, any equivalent changes or modifications made to the spirit disclosed by the present invention, for researchers or technicians in this field, without departing from the structure of the present invention, local improvements within the system and changes and conversions between subsystems, etc., are still within the patent scope of the present invention.

Claims

1. A chip turbulent heat sink, characterized in that: The invention comprises a base (2) whose bottom surface is in close contact with a chip (1), at least two heat dissipation units arranged above the base (2), and a fan (8) sandwiched between two adjacent heat dissipation units. Each heat dissipation unit comprises a plurality of mutually parallel heat dissipation fins (5) and a heat conduction pipe (3) fixedly connected to the base (2). The heat dissipation fins (5) and the heat conduction pipe (3) are fixedly connected through the heat dissipation fins (5). A spoiler (6) is fixedly provided on each of the heat dissipation fins (5). The gap between two adjacent heat dissipation fins (5) on the same heat dissipation unit is an air duct (12). The air ducts (12) of the two adjacent heat dissipation units are in the same direction.

2. A chip turbulent heat sink according to claim 1, characterized in that: The spoiler (6) is a hemispherical protrusion, and the heat sink (5) is a hemispherical pit on a side opposite to the protrusion.

3. The chip turbulent heat sink according to claim 1, characterized in that: The spoiler (6) is a fish-scale-shaped protrusion, one side of the protrusion is open and faces the direction of the wind in the air duct (12), and the heat sink (5) is provided with a through hole (11) at a position corresponding to the protrusion.

4. The chip turbulent heat sink according to claim 1, characterized in that: The heat sink (5) is rectangular, and the spoilers (6) on two adjacent heat sinks (5) are staggered in the transverse and longitudinal directions of the heat sink (5).

5. The chip turbulent heat sink according to claim 1, characterized in that: Baffles (4) are provided on both sides of each heat dissipation unit, the heat dissipation fins (5) are located between the two baffles (4), and the baffles (4) are parallel to the wind direction of the wind blown out by the fan (8).

6. The chip turbulent heat sink according to claim 1, characterized in that: The same heat dissipation unit has two groups of heat dissipation fins (5), and the opposite parts of the two groups of heat dissipation fins (5) are staggered.

7. The chip turbulent heat sink according to claim 1, characterized in that: The heat sinks (5) are all parallel to the surface of the chip (1), and the fan (8) is of axial flow type.

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