Embedded packaging circuit board integrated with driving device

Abstract

An embedded packaging circuit board integrated with a driving device comprises an FR4 insulating layer, a power device is embedded in the FR4 insulating layer, and a second insulating layer is arranged on the bottom surface of the FR4 insulating layer; the circuit layer is arranged on the FR4 insulating layer, and the circuit layer is electrically connected with the power device; the driving device is arranged above the circuit layer, the driving device is electrically connected with the circuit layer, and a first insulating layer is arranged between the driving device and the circuit layer; the first insulating layer is lower than the second insulating layer in heat conductivity coefficient. According to the utility model, the heat conductivity coefficient of the first insulating layer is lower than that of the second insulating layer, so that heat can be dissipated from the lower part, the influence on the driving device is avoided, the packaging structure enables the distance between the driving device and the power device to be shorter, the signal transmission to be more stable and rapid, the shortest power path, the lowest stray inductance and the smoother waveform are realized, and the reliability of the packaging structure is improved. The switching loss is minimum, and meanwhile, the system size can be minimum.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging, in particular to an embedded packaging circuit board with integrated driving devices. Background Art

[0002] With the development and widespread adoption of new energy vehicles and high-power industrial electronics, motor controllers, as core components of electric drives, are becoming increasingly important. Traditional motor controller design approaches are no longer able to meet the growing demand, and performance is gradually reaching bottlenecks. With the continued development of third-generation semiconductors such as SiC and GaN, the requirements for motor controller power density, integration, and reliability are becoming increasingly stringent.

[0003] To solve the above problems, power device embedded circuit boards are a potential solution. However, the common power device embedded circuit board solutions on the market simply embed the power devices into the circuit board. Since the thermal conductivity of FR4 is concentrated between 0.3-0.5W / m*K, it is still relatively high. This causes the top temperature of the embedded circuit board solution to be still high, making it impossible to integrate the driver chip on the circuit board. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art.

[0005] To this end, the present invention provides an embedded packaged circuit board with an integrated driver device, comprising: an FR4 insulating layer, wherein a power device is embedded in the FR4 insulating layer, and a second insulating layer is provided on the bottom surface of the FR4 insulating layer; a circuit layer, wherein the circuit layer is provided on the FR4 insulating layer and is electrically connected to the power device; a driver device, wherein the driver device is provided above the circuit layer and is electrically connected to the circuit layer, and a first insulating layer is provided between the driver device and the circuit layer; the thermal conductivity of the first insulating layer is lower than that of the second insulating layer.

[0006] According to the embedded package circuit board of the integrated driver device in the embodiment of the present invention, the material of the first insulating layer is ABF material or BT material, and the material of the second insulating layer is FR4 material.

[0007] According to the embedded package circuit board with integrated driver device in the embodiment of the present invention, a first conductive layer is provided on the upper surface of the first insulating layer, and the driver device is connected to the first conductive layer.

[0008] According to the embedded packaged circuit board of the integrated driver device of the embodiment of the present invention, a second conductive layer is provided on the lower surface of the first insulating layer, a through hole is provided on the first insulating layer, and the through hole is filled with copper metal, and the copper metal is used to connect the first conductive layer and the second conductive layer.

[0009] According to the embedded package circuit board of the integrated driver device in the embodiment of the present invention, the pin ends of the power device face toward the circuit layer.

[0010] According to the embedded package circuit board of the integrated driver device of the embodiment of the present invention, there is an FR4 layer between the circuit layer and the second conductive layer, and connecting copper pillars are provided in the FR4 layer. The circuit layer and the second conductive layer are connected through the connecting copper pillars.

[0011] According to the embedded package circuit board of the integrated driver device in the embodiment of the present invention, metal circuits are provided on both the upper and lower surfaces of the second insulating layer.

[0012] The beneficial effects of the utility model are:

[0013] The utility model has a simple and compact structure. The power device is embedded in the FR4 insulating layer, thereby effectively protecting the power device on all sides, improving safety and reliability. The upper and lower surfaces of the power device are protected by the first insulating layer and the second insulating layer. In addition, the thermal conductivity of the first insulating layer is lower than that of the second insulating layer, which is conducive to heat dissipation from the bottom, avoiding affecting the driving device on the first insulating layer. In addition, this packaging structure shortens the distance between the driving device and the power device, makes signal transmission more stable and rapid, realizes the shortest power path, minimizes stray inductance, makes the waveform smoother, minimizes switching loss, and can minimize the system volume.

[0014] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or understood by practicing the present invention. The objectives and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0015] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0017] Figure 1 It is a structural diagram of the present utility model.

[0018] In the figure: FR4 insulation layer 1, power device 2, driver device 3, circuit layer 4, connecting copper pillar 5, first insulation layer 6, second insulation layer 7. DETAILED DESCRIPTION

[0019] The present invention will now be described in further detail with reference to the accompanying drawings, which are simplified schematic diagrams that illustrate the basic structure of the present invention in a schematic manner.

[0020] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, features defined as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0021] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0022] An embedded packaged circuit board with an integrated driver device includes: an FR4 insulating layer 1, a power device 2, a driver device 3, a circuit layer 4, a first insulating layer 6, and a second insulating layer 7. The power device 2 is embedded in the FR4 insulating layer 1, and the second insulating layer 7 is provided on the bottom surface of the FR4 insulating layer 1; the circuit layer 4 is provided on the FR4 insulating layer 1, and the circuit layer 4 is electrically connected to the power device 2; the driver device 3 is provided above the circuit layer 4, and the driver device 3 is electrically connected to the circuit layer 4, and the first insulating layer 6 is provided between the driver device 3 and the circuit layer 4; the thermal conductivity of the first insulating layer 6 is lower than that of the second insulating layer 7.

[0023] In other words, the power device 2 is surrounded by the FR4 insulating layer 1, thereby effectively protecting the power device 2. At the same time, a circuit layer 4 is formed on the FR4 insulating layer 1, and the circuit layer 4 can electrically connect the power device 2 with other components. At the same time, the first insulating layer 6 and the second insulating layer 7 protect the upper and lower surfaces of the power device 2, and the thermal conductivity of the first insulating layer 6 is set to be lower than that of the second insulating layer 7. In this way, the heat of the power device 2 is discharged from the bottom, thereby protecting the driving device 3 and preventing the heat distributed upward from damaging the driving device 3.

[0024] In this embodiment, the first insulating layer 6 is made of ABF or BT, and the second insulating layer 7 is made of FR4. Therefore, the thermal conductivity of the first insulating layer 6 is lower than that of the second insulating layer 7. As a result, when the power device 2 generates heat during operation, the heat is preferentially dissipated from the second insulating layer 7 below. Components such as the driver device 3 can be mounted above the first insulating layer 6, providing a more flexible configuration, preventing the effects of heat on the components, and extending their service life.

[0025] A first conductive layer is provided on the upper surface of the first insulating layer 6, and the driver device 3 is connected to the first conductive layer. Furthermore, a second conductive layer is provided on the lower surface of the first insulating layer 6. The first insulating layer 6 is provided with a through hole filled with copper metal, which is used to connect the first and second conductive layers. Furthermore, the pin ends of the power device 2 face the circuit layer 4.

[0026] That is, the first insulating layer 6 has a first conductive layer on its upper surface and a second conductive layer on its lower surface. The first and second conductive layers are connected via copper metal filled in the through-holes of the first insulating layer 6. Furthermore, the pin ends of the power device 2 face upward, while the pin ends of the driver device 3 face downward. This allows for a closer connection between the power device 2 and the driver device 3, achieving the shortest power path, the lowest stray inductance, smoother waveforms, minimal switching losses, and a smaller package size.

[0027] On this basis, an FR4 layer is provided between the circuit layer 4 and the second conductive layer. Connecting copper pillars 5 are provided in the FR4 layer. The circuit layer 4 and the second conductive layer are connected via the connecting copper pillars 5 .

[0028] In other words, to prevent direct contact between circuit layer 4 and the second conductive layer, an FR4 layer is added to circuit layer 4 for isolation. Copper pillars 5 are then placed within the through-holes of the FR4 layer to connect circuit layer 4 and the second conductive layer. This allows circuit layer 4 to extend horizontally to connect components in the same plane, while connecting copper pillars 5 also connect components vertically, simplifying the structure.

[0029] In this embodiment, metal circuits are provided on both the upper and lower surfaces of the second insulating layer 7. That is, the various devices in the package structure can also be electrically connected through the metal circuits on the upper and lower surfaces of the second insulating layer 7.

[0030] In summary, the utility model has a simple and compact structure, and the power device 2 is embedded in the FR4 insulating layer 1, thereby effectively protecting the power device 2 on all sides, improving safety and reliability, and protecting the upper and lower surfaces of the power device 2 by the first insulating layer 6 and the second insulating layer 7. In addition, the thermal conductivity of the first insulating layer 6 is lower than that of the second insulating layer 7, which is conducive to heat dissipation from the bottom, avoiding affecting the driving device 3 on the first insulating layer 6, and this packaging structure makes the distance between the driving device 3 and the power device 2 shorter, the signal transmission is more stable and rapid, and the shortest power path is achieved, the stray inductance is lowest, the waveform is smoother, the switching loss is minimized, and the system volume can be minimized.

[0031] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the illustrative use of the above terms does not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0032] Based on the above-described preferred embodiments of the present invention, and in accordance with the above description, relevant personnel are fully capable of making various changes and modifications without departing from the technical scope of the present invention. The technical scope of the present invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. An embedded package circuit board with integrated driver components, characterized in that: include: An FR4 insulating layer (1), wherein the power device (2) is embedded in the FR4 insulating layer (1), and a second insulating layer (7) is provided on the bottom surface of the FR4 insulating layer (1); A circuit layer (4), the circuit layer (4) being provided on the FR4 insulating layer (1), the circuit layer (4) being electrically connected to the power device (2); A driving device (3), the driving device (3) being arranged above the circuit layer (4), the driving device (3) being electrically connected to the circuit layer (4), and a first insulating layer (6) being arranged between the driving device (3) and the circuit layer (4); The thermal conductivity of the first insulating layer (6) is lower than that of the second insulating layer (7).

2. The embedded package circuit board of the integrated driver device according to claim 1, wherein: The material of the first insulating layer (6) is ABF material or BT material, and the material of the second insulating layer (7) is FR4 material.

3. The embedded package circuit board of the integrated driver device according to claim 1, wherein: A first conductive layer is provided on the upper surface of the first insulating layer (6), and the driving device (3) is connected to the first conductive layer.

4. The embedded package circuit board with integrated driver device according to claim 3, wherein: A second conductive layer is provided on the lower surface of the first insulating layer (6), and a through hole is provided on the first insulating layer (6). The through hole is filled with copper metal, and the copper metal is used to connect the first conductive layer and the second conductive layer.

5. The embedded package circuit board with integrated driver device according to claim 4, characterized in that: The pin end of the power device (2) faces the circuit layer (4).

6. The embedded package circuit board with integrated driver device according to claim 5, characterized in that: An FR4 layer is provided between the circuit layer (4) and the second conductive layer. A connecting copper column (5) is provided in the FR4 layer. The circuit layer (4) and the second conductive layer are connected via the connecting copper column (5).

7. The embedded package circuit board with integrated driver device according to claim 1, wherein: Metal circuits are provided on the upper and lower surfaces of the second insulating layer (7).

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