Clamp for mounting and bonding flexible circuit board

By designing a fixture including a carrier plate, a cover plate and positioning pins, the problems of bending and collision of flexible circuit boards during the bonding process are solved, stable transfer positioning and precise processing are achieved, and the bonding quality of flexible circuit boards is improved.

CN223391502UActive Publication Date: 2025-09-26SUZHOU GOODARK ELECTRONICS CO LTD
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Patent Information

Application Number
CN202422589680.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-25
Publication Date
2025-09-26
Estimated Expiration
2034-10-25

AI Technical Summary

Technical Problem

The traditional lead frame die bonding method cannot meet the transfer positioning and die bonding accuracy requirements of flexible circuit boards, which can easily cause the flexible circuit boards to bend and collide with the tracks, affecting the processing quality.

Method used

A fixture including a carrier plate, a cover plate and positioning pins is used to fix the flexible circuit board through the thin plate and pin hole structure on the carrier plate, and the cover plate is pressed and the positioning pins are used to accurately position it, avoiding the processing area, and cooperating with the track clamp of the loader or bonding machine for transmission.

Benefits of technology

It realizes the stable transmission and positioning of the flexible circuit board on the track of the mounting machine and the bonding machine, prevents bending and collision, ensures processing accuracy and stability, and improves the mounting and bonding quality of the flexible circuit board.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a flexible circuit board mounting and bonding clamp which comprises a carrier plate, a cover plate and positioning pins, a thin plate is fixedly arranged on the carrier plate, the thin plate is recessed in the front face of the carrier plate, a first pin hole is formed in the carrier plate, a second pin hole and a receding hole are formed in the cover plate, during working, a flexible circuit board is placed on the carrier plate, and the positioning pins are arranged on the first pin hole and the second pin hole. The cover plate is pressed on the flexible circuit board, the first pin hole is aligned with the second pin hole, the positioning pin is inserted into the first pin hole and the second pin hole so as to position the flexible circuit board, and a to-be-processed area on the flexible circuit board is exposed through the abdicating hole for processing. And the thin plate is used for avoiding a track clamp of a chip loader or a bonding machine. According to the fixture, the flexible circuit board is fixed on the carrier plate, so that the flexible circuit board can be conveyed and positioned on the tracks of a chip loader and a bonding machine, and the phenomena of bending, collision and the like of the flexible circuit board are prevented.
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Description

Technical Field

[0001] The present application relates to circuit board processing technology, and in particular to a fixture for bonding flexible circuit boards. Background Art

[0002] Die bonding is a crucial process in QFN integrated circuit (QFN) production. Die bonding involves attaching the semiconductor chip to a substrate or lead frame, while bonding involves electrically connecting the electrodes on the semiconductor chip to the leads on the lead frame using gold or copper wire. Most semiconductor integrated circuits utilize lead frames, a key component of the electrical circuit. Their high strength and hardness allow them to be directly positioned and transported on the track of the die bonder.

[0003] Flexible circuit boards (FPCBs) are printed circuit boards (PCBs) made of a flexible insulating substrate. They can bend and fold freely, and can withstand millions of dynamic flexes without damaging the conductors. However, this flexibility can lead to issues during the bonding process, such as bending, inability to be supported by the equipment tracks, and uneven board surfaces. This can affect the FPCB's positioning and bonding accuracy, and can even cause damage from collisions between the FPCB and the track pads. Therefore, traditional lead frame bonding methods cannot meet the bonding requirements of FPCBs. Utility Model Content

[0004] In order to overcome the above-mentioned defects, the present application provides a fixture for loading and bonding a flexible circuit board, which fixes the flexible circuit board on a carrier board, thereby realizing the transmission and positioning of the flexible circuit board on the track of the loading machine and the bonding machine, and preventing the flexible circuit board from bending, colliding, etc.

[0005] The technical solution adopted by this application to solve its technical problems is:

[0006] A fixture for loading and bonding a flexible circuit board comprises a carrier plate, a cover plate and a positioning pin, wherein a thin plate is fixedly provided on the carrier plate, the thin plate is recessed in the front face of the carrier plate, a first pin hole is provided on the carrier plate, and a second pin hole and a clearance hole are provided on the cover plate. During operation, the flexible circuit board is placed on the carrier plate, the cover plate is pressed onto the flexible circuit board, the first pin hole and the second pin hole are aligned, the positioning pin is inserted into the first pin hole and the second pin hole to position the flexible circuit board, and the area to be processed on the flexible circuit board is exposed for processing through the clearance hole, and the thin plate is used to avoid the track clamp of the loading machine or bonding machine.

[0007] Optionally, the thickness of the thin plate is smaller than the thickness of the carrier plate.

[0008] Optionally, the carrier plate is made of ferromagnetic material, the cover plate is made of ferromagnetic material, and a magnet is fixed on the back of the carrier plate, and the magnet is used to adsorb and fix the cover plate.

[0009] Optionally, a mounting hole is provided on the back side of the carrier plate, and the magnet is embedded in the mounting hole.

[0010] Optionally, the ferromagnetic material includes one of iron-nickel alloy, iron-cobalt alloy, ferrite, neodymium-iron-boron, samarium-cobalt, iron-chromium, and iron-silicon.

[0011] Optionally, a groove is provided on the carrier plate, and the groove is used to facilitate taking and placing the cover plate and the flexible circuit board.

[0012] Optionally, a plurality of thermal stress relief holes are provided on the carrier plate.

[0013] Optionally, the carrier plate includes a first side wall, a second side wall, a third side wall and a fourth side wall, the first side wall is arranged parallel to the third side wall, the second side wall and the fourth side wall are arranged parallel to each other, the thin plate is provided on the second side wall and the fourth side wall, and a groove is provided on the third side wall.

[0014] Optionally, three first pin holes are provided on the carrier plate, and correspondingly, three second pin holes are provided on the cover plate.

[0015] The beneficial effects of the present application are as follows: the flexible circuit board is fixed on the carrier board, and the cover board is used to press the flexible circuit board, thereby realizing the transmission and positioning of the flexible circuit board on the track of the chip loader and the bonding machine, preventing the flexible circuit board from bending or even colliding with the track pads, etc.; because the thin plate is recessed on the front of the carrier board, and the depth of the thin plate's depression matches the track clamp of the chip loader or the bonding machine, it is convenient for the carrier board to be smoothly conveyed in the chip loader and the bonding machine through the track clamp; the present application uses a positioning pin to pass through the first pin hole, the flexible circuit board, and the second pin hole to accurately position the flexible circuit board, effectively preventing the flexible circuit board from being offset during movement. The cover board is provided with an avoidance hole according to the position of the area to be processed on the flexible circuit board, so that the area to be processed on the flexible circuit board is exposed through the avoidance hole, so that the chip loader or the bonding machine can process the area to be processed on the flexible circuit board, and the area to be processed is the chip loading and bonding area of ​​the flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is one of the structural diagrams of the clamp in this application;

[0017] Figure 2 This is the second structural diagram of the clamp in this application;

[0018] Figure 3This is the third structural diagram of the clamp in this application;

[0019] Figure 4 This is the fourth structural diagram of the clamp in this application;

[0020] Figure 5 This is one of the structural diagrams of the carrier board in this application;

[0021] Figure 6 This is the second structural diagram of the carrier board in this application;

[0022] Figure 7 This is the main view of the carrier board in this application;

[0023] Figure 8 This is a rear view of the carrier board in this application;

[0024] Figure 9 A side view of the carrier board in this application;

[0025] Figure 10 for Figure 9 Enlarged view of point A in the middle;

[0026] Figure 11 This is one of the structural diagrams of the cover plate in this application;

[0027] Figure 12 This is the second structural diagram of the cover plate in this application;

[0028] Figure 13 This is the third structural diagram of the cover plate in this application;

[0029] Figure 14 Schematic diagram of the structure of the magnet in this application;

[0030] In the figure: 10-carrier plate, 11-thin plate, 12-first pin hole, 13-groove, 14-thermal stress hole, 15-first side wall, 16-second side wall, 17-third side wall, 18-fourth side wall, 19-mounting hole, 20-cover plate, 21-second pin hole, 22-clearance hole, 30-locating pin, 40-magnet, 50-area to be processed. DETAILED DESCRIPTION

[0031] The following will be combined with the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described in this application are only a part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0032] It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the following drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the objects used in this way can be interchanged where appropriate so that the embodiments of the application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0033] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0034] Example: Figure 1-14 As shown, a fixture for loading and bonding a flexible circuit board includes a carrier board 10, a cover board 20 and a positioning pin 30. A thin plate 11 is fixed on the carrier board 10, and the thin plate 11 is recessed in the front face of the carrier board 10. A first pin hole 12 is provided on the carrier board 10, and a second pin hole 21 and a clearance hole 22 are provided on the cover board 20. During operation, the flexible circuit board is placed on the carrier board 10, and the cover board 20 is pressed onto the flexible circuit board. The first pin hole 12 and the second pin hole 21 are aligned with each other, and the positioning pin 30 is inserted into the first pin hole 12 and the second pin hole 21 to position the flexible circuit board. The area to be processed 50 on the flexible circuit board is exposed for processing through the clearance hole 22. The thin plate 11 is used to avoid the track clamp of the loading machine or bonding machine.

[0035] In the present application, the flexible circuit board is fixed on the carrier 10, and the cover plate 20 is used to press the flexible circuit board, thereby realizing the transmission and positioning of the flexible circuit board on the track of the loader and bonding machine, preventing the flexible circuit board from bending or even colliding with the track pads, etc.; since the thin plate 11 is recessed in the front of the carrier 10, that is, the upper surface of the thin plate 11 is lower than the front of the carrier 10, and the depth of the depression of the thin plate 11 matches the track clamp of the loader or bonding machine, it is convenient for the carrier 10 to be smoothly conveyed in the loader and bonding machine through the track clamp; in the present application, the positioning pin 30 is used to pass through the first pin hole 12, the flexible circuit board and the second pin hole 21 to accurately position the flexible circuit board, effectively preventing the flexible circuit board from positional displacement during movement. The cover plate 20 is provided with an avoidance hole 22 according to the position of the area to be processed 50 on the flexible circuit board, so that the area to be processed 50 on the flexible circuit board is exposed through the avoidance hole, so as to facilitate the chip loading machine or the bonding machine to process the area to be processed 50 on the flexible circuit board. The area to be processed is the chip loading and bonding area of ​​the flexible circuit board.

[0036] Optionally, the thickness of the thin plate 11 is smaller than the thickness of the carrier plate 10. Figure 10 As shown, the thickness of the thin plate 11 is D1, the thickness of the carrier plate 10 is D2, and D1 is smaller than D2.

[0037] Optionally, the carrier plate 10 is made of ferromagnetic material, and the cover plate 20 is made of ferromagnetic material, such as Figure 4 As shown, a magnet 40 is fixedly provided on the back of the carrier plate 10 , and the magnet 40 is used to adsorb and fix the cover plate 20 .

[0038] like Figure 8 As shown, the back of the carrier 10 is provided with a mounting hole 19, and the magnet 40 is embedded in the mounting hole 19. Optionally, the magnet 40 is embedded in the aluminum alloy and then installed in the mounting hole 19. Multiple rows of magnets 40 are installed on the back of the carrier 10, and the magnets 40 are used to tightly adsorb the cover 20 on the carrier 10, thereby fixing the flexible circuit board between the cover 20 and the carrier 10. The cover 20 can press the flexible circuit board tightly to make the surface of the flexible circuit board flat, and reduce the instability of the dispensing and patch bonding caused by the flexible circuit board being suspended and not close to the carrier 10 during the chip bonding process. The clamp in this application can reduce the warping of the flexible circuit board after baking, maintain the consistency of the height of the chip bonding, and reduce the instability during the chip bonding process.

[0039] The ferromagnetic material includes one of iron-nickel alloy, iron-cobalt alloy, ferrite, neodymium-iron-boron, samarium-cobalt, iron-chromium, and iron-silicon. Optionally, the carrier plate 10 and the cover plate 20 are made of stainless steel.

[0040] like Figure 5-8As shown, a groove 13 is provided on the carrier plate 10 , and the groove 13 is used to facilitate the taking and placing of the cover plate 20 and the flexible circuit board.

[0041] The carrier board 10 is provided with a plurality of rows of thermal stress holes 14. The thermal stress holes 14 can reduce warping of the carrier board after baking along with the flexible circuit board, maintain a consistent height of the die bonding, and reduce unstable dispensing and bonding caused by height differences between the various die bonding areas of the flexible circuit board during the die bonding process.

[0042] like Figure 5 As shown, the carrier plate 10 includes a first side wall 15, a second side wall 16, a third side wall 17, and a fourth side wall 18. The first side wall 15 is arranged parallel to the third side wall 17, and the second side wall 16 and the fourth side wall 18 are arranged parallel to each other. The thin plate 11 is provided on the second side wall 16 and the fourth side wall 18, and the groove 13 is defined in the third side wall 17. The carrier plate 10 has an overall rectangular parallelepiped structure, with the first side wall 15, the second side wall 16, the third side wall 17, and the fourth side wall 18 fixedly connected in sequence.

[0043] Alternatively, as Figure 7 As shown, the carrier plate 10 is provided with three first pin holes 12, correspondingly, as shown in FIG. Figure 11-13 As shown, the cover plate 20 is provided with three second pin holes 21. That is, the three positioning pins 30 are used to fix the flexible circuit board, effectively preventing displacement during transportation.

[0044] It should be noted that those skilled in the art may make a number of modifications and improvements without departing from the concept of this application, and these modifications and improvements are all within the scope of protection of this application. Therefore, the scope of protection of this patent application shall be based on the appended claims.

Claims

1. A fixture for bonding a flexible circuit board, characterized by: The invention comprises a carrier plate (10), a cover plate (20) and a positioning pin (30), wherein a thin plate (11) is fixedly provided on the carrier plate (10), the thin plate (11) is recessed in the front surface of the carrier plate (10), a first pin hole (12) is provided on the carrier plate (10), and a second pin hole (21) and a clearance hole (22) are provided on the cover plate (20). During operation, a flexible circuit board is placed on the carrier plate (10), the cover plate (20) is pressed onto the flexible circuit board, the first pin hole (12) and the second pin hole (21) are aligned, the positioning pin (30) is inserted into the first pin hole (12) and the second pin hole (21) to position the flexible circuit board, and the area to be processed (50) on the flexible circuit board is exposed through the clearance hole (22) for processing, and the thin plate (11) is used to avoid the track clamp of the chip loader or bonding machine.

2. The flexible circuit board bonding fixture according to claim 1, characterized in that: The thickness of the thin plate (11) is smaller than the thickness of the carrier plate (10).

3. The flexible circuit board bonding fixture according to claim 1, characterized in that: The carrier plate (10) is made of ferromagnetic material, the cover plate (20) is made of ferromagnetic material, and a magnet (40) is fixedly provided on the back of the carrier plate (10), and the magnet (40) is used to adsorb and fix the cover plate (20).

4. The flexible circuit board bonding fixture according to claim 3, characterized in that: A mounting hole (19) is provided on the back side of the carrier plate (10), and the magnet (40) is embedded in the mounting hole (19).

5. The flexible circuit board bonding fixture according to claim 3, characterized in that: The ferromagnetic material includes one of iron-nickel alloy, iron-cobalt alloy, ferrite, neodymium-iron-boron, samarium-cobalt, iron-chromium, and iron-silicon.

6. The flexible circuit board bonding fixture according to claim 1, characterized in that: A groove (13) is provided on the carrier plate (10), and the groove (13) is used to facilitate the taking and placing of the cover plate (20) and the flexible circuit board.

7. The flexible circuit board bonding fixture according to claim 1, characterized in that: A plurality of thermal stress relief holes (14) are provided on the carrier plate (10).

8. The flexible circuit board bonding fixture according to claim 1, characterized in that: The carrier plate (10) comprises a first side wall (15), a second side wall (16), a third side wall (17) and a fourth side wall (18); the first side wall (15) and the third side wall (17) are arranged in parallel; the second side wall (16) and the fourth side wall (18) are arranged in parallel; the thin plate (11) is provided on the second side wall (16) and the fourth side wall (18); and a groove (13) is provided on the third side wall (17).

9. The flexible circuit board bonding fixture according to claim 1, characterized in that: The carrier plate (10) is provided with three first pin holes (12), and correspondingly, the cover plate (20) is provided with three second pin holes (21).