SMD-LED lamp bead packaging mold

Abstract

The utility model provides an SMD-LED lamp bead packaging mold. The SMD-LED lamp bead packaging mold comprises an upper mold, a lower mold and a bracket semi-finished product module, the lower die comprises a lower die main body, a die condition and a first positioning piece; a plurality of lens forming grooves are formed in the surface of the die condition; the bracket semi-finished product module comprises a plurality of semi-finished product brackets; a first positioning hole is formed in the bracket bearing plate; the first positioning piece penetrates through the first positioning hole and positions the support bearing plate, and the surfaces of the semi-finished supports stretch into the lens forming grooves in a one-to-one correspondence mode. Through the arrangement of the lens forming groove, the lens in the corresponding shape can be formed on the semi-finished support, compared with traditional glue injection, the lens forming device has the advantage of being low in cost, mold strips can be flexibly selected according to requirements to form the lens in the corresponding shape, the productivity is not limited, and meanwhile through the arrangement of the first positioning piece and the second positioning piece, the production efficiency is improved. The support bearing plate and the mold strip can be positioned, and it is ensured that the positions of a plurality of semi-finished supports and a plurality of lens forming grooves can accurately form a one-to-one correspondence relation.

Description

Technical Field

[0001] The utility model relates to the technical field of LED production, and in particular to an SMD-LED lamp bead packaging mold. Background Art

[0002] LED chip is a semiconductor light-emitting device made based on the principle of PN junction electroluminescence. It has the advantages of high electro-optical conversion efficiency, long service life, environmental protection and energy saving, and small size.

[0003] The packaging of SMD LED lamp beads refers to first mounting the LED chip in the accommodating cavity of the LED bracket, and then injecting the packaging glue into the accommodating cavity to encapsulate the LED chip. At present, there are three main ways to encapsulate SMD LED lamp beads: dispensing, injection, and molding. Among them, the traditional dispensing method is to directly inject the packaging glue into the accommodating cavity of the LED bracket, but this method can only form a flat surface on the surface of the LED bracket and cannot form a lens structure, not to mention wanting to form a lens structure of a specific shape. The application scenarios are relatively narrow. Although the injection method can form lenses of different shapes, high-precision injection equipment and injection molds are required for injection, and the equipment and mold costs are high. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the present application provides an SMD-LED lamp bead packaging mold.

[0005] An SMD-LED lamp bead packaging mold disclosed in the present application includes: an upper mold, a lower mold and a bracket semi-finished product module; the lower mold includes a lower mold body, a mold condition and a first positioning piece, a lower mold groove is provided on the side of the lower mold body facing the upper mold, the mold condition and the first positioning piece are respectively arranged in the lower mold groove, and a plurality of lens forming grooves are provided on the surface of the mold condition; the bracket semi-finished product module includes a bracket supporting plate and a plurality of semi-finished brackets, the plurality of semi-finished brackets are respectively arranged on the bracket supporting plate, the bracket supporting plate is provided with a first positioning hole at a position corresponding to the first positioning piece, and each semi-finished bracket surface is provided with at least one accommodating cavity; when the bracket supporting plate is placed on the surface of the mold condition, the first positioning piece passes through the first positioning hole and positions the bracket supporting plate, and the surfaces of the plurality of semi-finished brackets extend into the plurality of lens forming grooves one by one.

[0006] Preferably, the number of the first positioning members and the number of the first positioning holes are both multiple, the multiple first positioning members are spaced apart in the lower mold groove, the multiple first positioning holes are spaced apart in the bracket supporting plate, and the multiple first positioning holes are arranged in a one-to-one correspondence with the multiple first positioning members.

[0007] Preferably, the mold condition includes a plurality of mold strips, each mold strip surface is provided with a plurality of lens forming grooves, the plurality of mold strips are arranged side by side in the lower mold groove, and the plurality of lens forming grooves are distributed in a matrix in the lower mold groove.

[0008] Preferably, the plurality of mold strips are detachably installed in the lower mold groove.

[0009] Preferably, each mold strip is provided with at least one second positioning hole, and the lower mold further includes a plurality of second positioning members, which are respectively arranged in the lower mold groove at intervals, and the plurality of second positioning members are respectively arranged in a one-to-one correspondence with the plurality of second positioning holes; when the mold strip is installed in the lower mold groove, one of the second positioning members passes through the second positioning hole and positions the mold strip.

[0010] Preferably, each mold strip has at least two second positioning holes, and the two second positioning holes are respectively close to the two ends of the mold strip. The multiple second positioning members are divided into two rows, and the two rows of second positioning members are relatively arranged and respectively close to the two side walls of the lower mold groove. The multiple second positioning members in the same row are arranged in sequence at intervals; when the mold strip is installed in the lower mold groove, the mold strip is positioned at both ends by the cooperation of at least two relatively arranged second positioning members and at least two second positioning holes.

[0011] Preferably, the mold strip includes a mold strip body and a plurality of molding parts, the plurality of molding parts are respectively arranged on the surface of the mold strip body, a lens molding groove is provided on the surface of each molding part, and the plurality of mold strip bodies are arranged side by side in the lower mold groove.

[0012] Preferably, the mold condition further includes a pressing plate, which is provided with a through hole and multiple through holes. When the pressing plate covers the surfaces of the multiple mold strip bodies, the first positioning piece passes through the through hole, and the multiple forming parts are respectively located in the multiple through holes.

[0013] Preferably, the bracket supporting plate is further provided with a position identification hole.

[0014] Preferably, the lower mold also includes at least two locating pins, at least two locating pins are respectively arranged on the surface of the lower mold body, the upper mold is provided with at least two locating pin holes, at least two locating pins and at least two locating pin holes are respectively arranged in one-to-one correspondence; when the upper mold and the lower mold are closed, the locating pins extend into the locating pin holes and position the upper mold.

[0015] The beneficial effects of the present application are as follows: glue is dispensed in multiple lens molding grooves and all accommodating cavities of each semi-finished product bracket, the bracket carrier plate is inverted so that the accommodating cavity of the semi-finished product bracket faces the lens molding groove, the bracket carrier plate is placed on the mold condition surface, and multiple semi-finished product brackets are extended into multiple lens molding grooves one by one. After the glue in the accommodating cavity is cured, the LED chip is encapsulated in the accommodating cavity. Through the setting of the lens molding groove, the glue in the lens molding groove can be cured to form a lens of a corresponding shape on the surface of the semi-finished product bracket. Compared with the traditional glue injection method, this has the advantage of lower cost, and the mold strip can be flexibly selected according to demand to form a lens of a corresponding shape. The production capacity is not limited, and there is no need to spend a lot of time and cost to create a high-precision glue injection mold.

[0016] At the same time, by setting the first positioning piece and the first positioning hole, it is ensured that when the bracket supporting plate is placed on the mold condition surface, multiple semi-finished brackets can correspond one by one and accurately extend into the lens molding groove, ensuring that lenses of corresponding shapes can be accurately formed on the surface of each semi-finished bracket, thereby improving packaging efficiency and product quality.

[0017] In addition, through the provision of the second positioning member and the second positioning hole, each mold strip can be accurately positioned and installed at the preset position of the lower mold groove. By positioning the mold strip and the bracket supporting plate respectively, it is ensured that the positions of multiple semi-finished product brackets and multiple lens molding grooves can accurately form a one-to-one correspondence. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0019] Figure 1 This is a structural diagram of the SMD-LED lamp bead packaging mold in the embodiment;

[0020] Figure 2 This is a schematic structural diagram of the finished product module of the bracket in the embodiment;

[0021] Figure 3 Schematic diagram of the structure of the lower mold in the embodiment;

[0022] Figure 4 Schematic diagram of the structure of the lower mold body in the embodiment;

[0023] Figure 5 A schematic structural diagram of a mold strip in an embodiment;

[0024] Figure 6 This is a structural schematic diagram of a lower mold with a pressing plate installed in an embodiment;

[0025] Figure 7 Schematic diagram of the structure of the pressing plate in the embodiment;

[0026] Figure 8 Schematic diagram of the structure of the upper mold in the embodiment.

[0027] Reference numerals:

[0028] 1. Upper mold; 11. Positioning pin hole; 12. Bracket avoidance groove; 2. Lower mold; 21. Lower mold body; 211. Lower mold groove; 2111. Avoidance hole; 22. Mold condition; 221. Lens molding groove; 222. Mold strip; 2221. Second positioning hole; 2222. Mold strip body; 2223. Molding part; 223. Press plate; 2231. Through hole; 2232. Through hole; 23. First positioning member; 24. Second positioning member; 25. Positioning pin; 3. Bracket finished product module; 31. Bracket bearing plate; 311. First positioning hole; 312. Position identification hole; 32. Semi-finished product bracket. DETAILED DESCRIPTION

[0029] The following diagrams illustrate various embodiments of the present application. For clarity, many practical details will be included in the following description. However, it should be understood that these practical details are not intended to limit the present application. In other words, in some embodiments of the present application, these practical details are not essential. Furthermore, to simplify the drawings, some conventional structures and components are depicted in a simplified schematic manner.

[0030] It should be noted that all directional indications such as up, down, left, right, front, back, etc. in the embodiments of the present application are only used to explain the relative position relationship, movement status, etc. between the various components in a certain specific posture as shown in the accompanying drawings. If the specific posture changes, the directional indication will also change accordingly.

[0031] In addition, in this application, descriptions such as "first" and "second" are only used for descriptive purposes and do not specifically refer to the order or ranking, nor are they used to limit this application. They are only used to distinguish components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0032] In order to further understand the application content, features and effects of this application, the following embodiments are given as examples and described in detail with reference to the accompanying drawings.

[0033] Reference Figure 1-Figure 3 , Figure 1 This is a structural diagram of the SMD-LED lamp bead packaging mold in the embodiment. Figure 2 This is a structural diagram of the finished product module of the bracket in the embodiment. Figure 3This is a schematic diagram of the structure of the lower mold in the embodiment. The SMD-LED lamp bead packaging mold in this embodiment includes an upper mold 1, a lower mold 2, and a bracket semi-finished product module 3. The lower mold 2 includes a lower mold body 21, a mold base 22, and a first positioning member 23. The lower mold body 21 has a lower mold groove 211 on the side facing the upper mold 1. The mold base 22 and the first positioning member 23 are respectively arranged in the lower mold groove 211. The surface of the mold base 22 has multiple lens molding grooves 221. The bracket semi-finished product module 3 includes a bracket support plate 31 and multiple semi-finished brackets 32. The multiple semi-finished brackets 32 are respectively arranged on the bracket support plate 31. The bracket support plate 31 has first positioning holes 311 at positions corresponding to the first positioning members 23. Each semi-finished bracket 32 ​​has at least one accommodating cavity on its surface. When the bracket support plate 31 is placed on the surface of the mold base 22, the first positioning member 23 passes through the first positioning hole 311 and positions the bracket support plate 31. The surfaces of the multiple semi-finished brackets 32 extend into the multiple lens molding grooves 221 in a one-to-one correspondence.

[0034] The SMD-LED lamp bead packaging mold in this embodiment is used to package the semi-finished bracket 32 ​​and form a lens on its surface. The semi-finished bracket 32 ​​in this embodiment refers to a semi-finished product on which the LED chip and pins have been installed but the chip packaging has not been completed. Multiple semi-finished brackets 32 are arranged in a matrix on the bracket carrier plate 31, and each semi-finished bracket 32 ​​has at least one accommodating cavity on its surface. In this embodiment, each semi-finished bracket 32 ​​has three accommodating cavities on its surface, and each accommodating cavity is loaded with an LED chip. In specific application, glue dispensing operation is first performed, and glue is dispensed in multiple lens molding grooves 221 and all accommodating cavities of each semi-finished product bracket 32, and the bracket supporting plate 31 is inverted so that the accommodating cavity of the semi-finished product bracket 32 ​​faces the lens molding groove 221, and the bracket supporting plate 31 is placed on the surface of the mold condition 22. Through the setting of the first positioning member 23 and the first positioning hole 311, the bracket supporting plate 31 can be accurately positioned at the preset position of the lower mold body 21, so that multiple semi-finished product brackets 32 can be extended into multiple lens molding grooves 221 one by one, that is, the bottom wall of the accommodating cavity is opposite to the bottom of the lens molding groove 221. At this time, the glue in the accommodating cavity and the lens molding groove 221 contacts each other, and the upper mold 1 is pressed on the surface of the lower mold 2 to close the mold and simultaneously press the bracket supporting plate 31 to the surface of the mold condition 22, further positioning and fixing the positions of the bracket supporting plate 31 and the semi-finished product bracket 32, and finally baking is performed to solidify the glue to complete the packaging, and then demolding and stripping are performed to obtain multiple LED lamp beads. It can be understood that after the glue in the accommodating cavity is cured, the LED chip is encapsulated in the accommodating cavity. Through the setting of the lens molding groove 221, the glue in the lens molding groove 221 can be cured to form a lens of corresponding shape on the surface of the semi-finished bracket 32. Compared with the traditional glue injection method, this has the advantage of lower cost. At the same time, through the setting of the first positioning member 23 and the first positioning hole 311, it is ensured that when the bracket supporting plate 31 is placed on the surface of the mold condition 22, multiple semi-finished brackets 32 can be accurately extended into the lens molding groove 221 one by one, ensuring that a lens of corresponding shape can be accurately formed on the surface of each semi-finished bracket 32, thereby improving packaging efficiency and product quality.

[0035] Refer to Figure 4 , Figure 4This is a structural diagram of the lower mold body in the embodiment. Preferably, the number of the first positioning members 23 and the first positioning holes 311 are both multiple, and the multiple first positioning members 23 are spaced apart in the lower mold groove 211, and the multiple first positioning holes 311 are spaced apart in the bracket carrier plate 31, and the multiple first positioning holes 311 are arranged in a one-to-one correspondence with the multiple first positioning members 23. In specific applications, by providing multiple first positioning members 23 and multiple first positioning holes 311, on the one hand, it is only necessary to align the first positioning holes 311 with the first positioning members 23 to position the bracket carrier plate 31 on the surface of the lower mold body 21, thereby improving the installation speed of the bracket carrier plate 31 while ensuring that the multiple semi-finished brackets 32 can be accurately and one-to-one extended into the lens molding groove 221. On the other hand, by positioning the bracket carrier plate 31 together with the multiple first positioning members 23, it can be ensured that the position of the bracket carrier plate 31 will not shake after the upper mold 1 and the lower mold 2 are closed, thereby ensuring that the glue in the lens molding groove 221 can be accurately solidified and formed on the surface of the semi-finished bracket 32 ​​to form a lens, thereby improving product quality. Specifically, the first positioning member 23 is a pin, and multiple first positioning members 23 are spaced apart within the lower die groove 211 and arranged linearly close to a side wall of the lower die groove 211. In this embodiment, there are three first positioning members 23, and the three first positioning members 23 are linearly spaced apart and close to a side wall of the lower die groove 211. Of course, in other embodiments, the number of first positioning members 23 can also be four, five, or more, and the multiple first positioning members 23 can also be arranged in two opposite rows and close to the opposite side walls of the lower die groove 211, which is not limited here. Furthermore, multiple first positioning holes 311 are respectively provided on opposite sides of the bracket support plate 31, and one side of the bracket support plate 31 is also provided with a position identification hole 312. The provision of the position identification hole 312 allows the direction of the bracket support plate 31 to be quickly distinguished. Of course, position identification holes 312 of different shapes or sizes can also be provided on both sides for differentiation, such as large and small holes, square holes, or triangular holes.

[0036] Refer to Figure 5 , Figure 5This is a schematic diagram of the structure of the mold strip in an embodiment. Preferably, the mold base 22 includes multiple mold strips 222, each of which has multiple lens molding grooves 221 formed on its surface. The multiple mold strips 222 are arranged side by side within the lower mold groove 211, and the multiple lens molding grooves 221 are distributed in a matrix within the lower mold groove 211. In a specific application, the mold strip 222 includes a mold strip body 2222 and multiple molding portions 2223. The multiple molding portions 2223 are respectively arranged on the surface of the mold strip body 2222, and each molding portion 2223 has a lens molding groove 221 formed on its surface. The multiple mold strip bodies 2222 are arranged side by side within the lower mold groove 211. Specifically, the mold strip body 2222 in this embodiment is in the shape of a long strip, and the length of the mold strip body 2222 is equivalent to the width of the lower mold groove 211. Multiple mold strip bodies 2222 are arranged side by side in the lower mold groove 211 along the length direction of the lower mold groove 211. The multiple molding parts 2223 on the surface of each mold strip body 2222 are divided into two rows spaced apart and arranged in parallel, so that the multiple lens molding grooves 221 in the lower mold groove 211 are distributed in a matrix manner, that is, corresponding to the position distribution of the multiple semi-finished brackets 32 on the bracket supporting plate 31. The molding part 2223 is a lens molding mold. It can be understood that the shape of the bottom of the lens molding groove 221 is the shape of the lens formed by curing the glue.

[0037] Re-reference Figure 5Preferably, each mold strip 222 is provided with at least one second positioning hole 2221, and the lower mold 2 further includes a plurality of second positioning members 24, and the plurality of second positioning members 24 are respectively arranged in the lower mold groove 211 at intervals, and the plurality of second positioning members 24 are respectively arranged in a one-to-one correspondence with the plurality of second positioning holes 2221. When the mold strip 222 is installed in the lower mold groove 211, one of the second positioning members 24 passes through the second positioning hole 2221 and positions the mold strip 222. Through the provision of the second positioning member 24 and the second positioning hole 2221, each mold strip 222 can be accurately positioned and installed at the preset position of the lower mold groove 211, that is, the plurality of lens forming grooves 221 can be accurately located at the preset position. It can be understood that the first positioning member 23 and the first positioning hole 311 cooperate to position the position of the bracket supporting plate 31 to ensure the accuracy of the position of the plurality of semi-finished product brackets 32. The second positioning member 24 and the second positioning hole 2221 cooperate to position the mold strip 222, ensuring the accuracy of the positions of the multiple lens molding grooves 221. That is, by positioning the bracket carrier plate 31 and the mold strip 222 respectively, the positions of the multiple semi-finished brackets 32 and the multiple lens molding grooves 221 form a one-to-one correspondence. When the bracket carrier plate 31 is positioned and placed on the surface of the mold condition 22, it is ensured that the surfaces of the multiple semi-finished brackets 32 can respectively extend into the multiple lens molding grooves 221 in a one-to-one correspondence, thereby ensuring that the glue in the lens molding grooves 221 can accurately form lenses on the surfaces of the semi-finished brackets 32 after curing. Specifically, the second positioning member 24 is a positioning pin. The second positioning hole 2221 is opened near the two ends of the mold strip body 2222.

[0038] Re-reference Figure 5Preferably, each mold strip 222 is provided with at least two second positioning holes 2221, and the two second positioning holes 2221 are respectively close to the two ends of the mold strip 222. The multiple second positioning members 24 are evenly divided into two rows, and the two rows of second positioning members 24 are arranged opposite to each other and respectively close to the two side walls of the lower mold groove 211. The multiple second positioning members 24 in the same row are arranged in sequence and spaced apart. When the mold strip 222 is installed in the lower mold groove 211, the mold strip 222 is positioned at both ends by the cooperation of at least two oppositely arranged second positioning members 24 and at least two second positioning holes 2221. In specific applications, the second positioning holes 2221 are provided at both ends of each mold strip 222. By positioning the two ends of the mold strip 222, it is possible to ensure that the position of the mold strip 222 does not shake, further improving the accuracy and stability of the position of the mold strip 222. Specifically, the multiple mold strips 222 are detachably installed in the lower mold groove 211. In this embodiment, the bottom of the lower mold groove 211 is provided with a plurality of elongated avoidance holes 2111 corresponding to the positions of the plurality of mold strips 222. These holes are used to accommodate the portion of the molding portion 2223 extending through the mold strip body 2222 toward the bottom of the mold strip body 2222, and to assist in positioning the mold strip body 2222. The mold strip 222 can be installed within the lower mold groove 211 by placing the mold strip 222 at the bottom of the lower mold groove 211 and passing the second positioning member 24 through the second positioning hole 2221. Furthermore, since the shape of the bottom of the lens molding groove 221 is the shape of the lens formed by the cured glue, when it is necessary to mold lenses of different shapes (e.g., arc, ellipse, irregular ellipse, etc.) on the surface of the semi-finished bracket 32, or to mold a corresponding number of lenses based on the number of cavities on the surface of the semi-finished bracket 32, the mold strip 222 can be removed and replaced with a mold strip 222 having a correspondingly shaped lens molding groove 221, thereby expanding the application scenarios. Furthermore, since the mold strip 222 is a consumable part and will be damaged after long-term use, the detachable setting allows the mold strip 222 to be disassembled and replaced after it is damaged, saving the material cost of remanufacturing the upper mold 1 and the lower mold 2.

[0039] Refer to Figure 6 and Figure 7 , Figure 6 This is a structural diagram of a lower die with a pressing plate installed in the embodiment. Figure 7The structure of the pressing plate in the embodiment is schematically shown. Preferably, the mold condition 22 further includes a pressing plate 223, which is provided with a through hole 2231 and a plurality of through holes 2232. When the pressing plate 223 covers the surfaces of the plurality of mold strip bodies 2222, the first positioning member 23 passes through the through hole 2231, and the plurality of forming parts 2223 are respectively located in the plurality of through holes 2232. In a specific application, the through holes 2232 are long strips, and the plurality of through holes 2232 are sequentially spaced and arranged side by side along the length direction of the lower mold groove 211. The plurality of forming parts 2223 in the same row are all accommodated in the same through hole 2232. In this way, the pressing plate 223 also plays a role in assisting in positioning the positions of the forming parts 2223. At the same time, when the pressure plate 223 covers the surface of multiple mold strip bodies 2222, the pressure plate 223 supports the bracket supporting plate 31, and the surface of the semi-finished bracket 32 ​​enters the through hole 2232 and extends into the lens molding groove 221 accordingly. It should be noted that the surface of the semi-finished bracket 32 ​​does not extend into the bottom of the lens molding groove 221. In this way, the depth of the semi-finished bracket 32 ​​extending into the lens molding groove 221 can be adjusted by changing the thickness of the pressure plate 223, thereby adjusting the thickness of the molded lens.

[0040] Refer to Figure 8 , Figure 8 This is a schematic diagram of the structure of the upper mold in the embodiment. Preferably, the lower mold 2 also includes at least two locating pins 25, at least two locating pins 25 are respectively provided on the surface of the lower mold body 21, and the upper mold 1 is provided with at least two locating pin holes 11, and the at least two locating pins 25 are respectively provided in a one-to-one correspondence with the at least two locating pin holes 11. When the upper mold 1 and the lower mold 2 are closed, the locating pins 25 extend into the locating pin holes 11 and position the upper mold 1. Through the provision of the locating pins 25 and the locating pin holes 11, the upper mold 1 and the lower mold 2 can be accurately closed, allowing the upper mold 1 to press the bracket bearing plate 31 against the surface of the pressure plate 223, and allowing the surface of the semi-finished product bracket 32 ​​to extend into the lens molding groove 221. Specifically, the two locating pins 25 are respectively provided at the diagonal positions of the lower mold body 21, and the two locating pin holes 11 are respectively provided at the diagonal positions of the upper mold 1. Furthermore, a pin avoidance hole is provided on the side of the upper mold 1 facing the lower mold 2 to avoid the first positioning member 23. A support avoidance groove 12 is further provided on one side of the upper mold 1 facing the lower mold 2 , and the shape of the support avoidance groove 12 is adapted to the shape of the support semi-finished product module 3 .

[0041] In summary, glue is dispensed in the multiple lens molding grooves 221 and in all the accommodating cavities of each semi-finished product bracket 32, the bracket carrier plate 31 is inverted so that the accommodating cavity of the semi-finished product bracket 32 ​​faces the lens molding groove 221, the bracket carrier plate 31 is placed on the surface of the mold condition 22, and the multiple semi-finished product brackets 32 are extended into the multiple lens molding grooves 221 one by one. After the glue in the accommodating cavity is cured, the LED chip is encapsulated in the accommodating cavity. Through the setting of the lens molding groove 221, the glue in the lens molding groove 221 can be cured to form a lens of a corresponding shape on the surface of the semi-finished product bracket 32. Compared with the traditional glue injection method, this method has the advantage of lower cost, and the mold strip 222 can be flexibly selected according to demand to form a lens of the corresponding shape. The production capacity is not limited, and there is no need to spend a lot of time and cost to create a high-precision glue injection mold. At the same time, through the setting of the first positioning member 23 and the first positioning hole 311, it is ensured that when the bracket carrier plate 31 is placed on the surface of the mold condition 22, the multiple semi-finished brackets 32 can correspond one by one and accurately extend into the lens molding groove 221, ensuring that the corresponding shape of the lens can be accurately formed on the surface of each semi-finished bracket 32, thereby improving packaging efficiency and product quality. In addition, through the setting of the second positioning member 24 and the second positioning hole 2221, each mold strip 222 can be accurately positioned and installed at the preset position of the lower mold groove 211. By positioning the mold strip 222 and the bracket carrier plate 31 respectively, it is ensured that the positions of the multiple semi-finished brackets 32 and the multiple lens molding grooves 221 can accurately form a one-to-one correspondence.

[0042] The above is merely an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included within the scope of the claims of the present application.

Claims

1. An SMD-LED lamp bead packaging mold, characterized in that: include: Upper mold(1); A lower mold (2), comprising a lower mold body (21), a mold base (22) and a first positioning member (23); a lower mold groove (211) is provided on a side of the lower mold body (21) facing the upper mold (1); the mold base (22) and the first positioning member (23) are respectively arranged in the lower mold groove (211); and a plurality of lens molding grooves (221) are provided on a surface of the mold base (22); and A bracket semi-finished product module (3), comprising a bracket carrier plate (31) and a plurality of semi-finished product brackets (32), wherein the plurality of semi-finished product brackets (32) are respectively arranged on the bracket carrier plate (31), a first positioning hole (311) is provided on the bracket carrier plate (31) at a position corresponding to the first positioning member (23), and at least one accommodating cavity is provided on the surface of each of the semi-finished product brackets (32); When the bracket supporting plate (31) is placed on the surface of the mold condition (22), the first positioning member (23) passes through the first positioning hole (311) and positions the bracket supporting plate (31), and the surfaces of the plurality of semi-finished brackets (32) extend into the plurality of lens molding grooves (221) in a one-to-one correspondence.

2. The SMD-LED lamp bead packaging mold according to claim 1, characterized in that: The number of the first positioning members (23) and the first positioning holes (311) are both multiple, and the multiple first positioning members (23) are respectively arranged at intervals in the lower mold groove (211), and the multiple first positioning holes (311) are respectively arranged at intervals in the bracket supporting plate (31), and the multiple first positioning holes (311) are arranged in a one-to-one correspondence with the multiple first positioning members (23).

3. The SMD-LED lamp bead packaging mold according to claim 1, characterized in that: The mold condition (22) includes a plurality of mold strips (222), each of the mold strips (222) having a plurality of lens forming grooves (221) formed on its surface. The plurality of mold strips (222) are arranged side by side in the lower mold groove (211), and the plurality of lens forming grooves (221) are distributed in a matrix manner in the lower mold groove (211).

4. The SMD-LED lamp bead packaging mold according to claim 3, characterized in that: The plurality of mold strips (222) are respectively detachably mounted in the lower mold groove (211).

5. The SMD-LED lamp bead packaging mold according to claim 4, characterized in that: Each of the mold strips (222) is provided with at least one second positioning hole (2221), and the lower mold (2) further comprises a plurality of second positioning members (24), the plurality of second positioning members (24) are respectively arranged in the lower mold groove (211) at intervals, and the plurality of second positioning members (24) and the plurality of second positioning holes (2221) are respectively arranged in a one-to-one correspondence; when the mold strip (222) is installed in the lower mold groove (211), one of the second positioning members (24) passes through the second positioning hole (2221) and positions the mold strip (222).

6. The SMD-LED lamp bead packaging mold according to claim 5, characterized in that: Each mold bar (222) is provided with at least two second positioning holes (2221), the two second positioning holes (2221) are respectively close to the two ends of the mold bar (222), and the plurality of second positioning members (24) are divided into two rows. The two rows of second positioning members (24) are arranged opposite to each other and are respectively close to the two side walls of the lower mold groove (211). The plurality of second positioning members (24) in the same row are arranged in sequence and spaced apart. When the mold bar (222) is installed in the lower mold groove (211), the mold bar (222) is positioned at both ends by the cooperation of at least two oppositely arranged second positioning members (24) and at least two second positioning holes (2221).

7. The SMD-LED lamp bead packaging mold according to claim 3, characterized in that: The mold strip (222) includes a mold strip body (2222) and a plurality of molding parts (2223), wherein the plurality of molding parts (2223) are respectively arranged on the surface of the mold strip body (2222), and each molding part (2223) is provided with a lens molding groove (221) on its surface, and the plurality of mold strip bodies (2222) are arranged side by side in the lower mold groove (211).

8. The SMD-LED lamp bead packaging mold according to claim 7, characterized in that: The mold condition (22) also includes a pressing plate (223), which is provided with a through hole (2231) and multiple through holes (2232). When the pressing plate (223) covers the surfaces of the multiple mold strip bodies (2222), the first positioning member (23) passes through the through hole (2231), and the multiple forming parts (2223) are respectively located in the multiple through holes (2232).

9. The SMD-LED lamp bead packaging mold according to claim 1, characterized in that: The bracket supporting plate (31) is also provided with a position identification hole (312).

10. The SMD-LED lamp bead packaging mold according to claim 1, characterized in that: The lower mold (2) further comprises at least two positioning pins (25), at least two of the positioning pins (25) are respectively arranged on the surface of the lower mold body (21), the upper mold (1) is provided with at least two positioning pin holes (11), and the at least two positioning pins (25) are respectively arranged in a one-to-one correspondence with the at least two positioning pin holes (11); when the upper mold (1) and the lower mold (2) are closed, the positioning pins (25) extend into the positioning pin holes (11) and position the upper mold (1).

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