Punching and blanking die for aluminum alloy SIM card support

Abstract

The utility model discloses an aluminum alloy SIM card support stamping blanking die which comprises a stamping table, an installation table is installed on the top of the stamping table, a plurality of sliding rods are installed in the installation table in a sliding mode, a buffering table is installed on the rod walls of the sliding rods together, and a plurality of buffering springs are arranged between the installation table and the buffering table. The two ends of the multiple buffer springs are fixed to the opposite side surfaces of the mounting table and the buffer table correspondingly. Through the arrangement of the multiple sets of sliding rods, the buffer springs, the limiting rods and the buffer tables, the punching head is vertically buffered in the punching process, so that the problem that burrs are generated after materials are punched is greatly reduced, meanwhile, the materials are blocked on one side through the hollow sliding blocks on the two sides in the punching process, and the punching quality is improved. And meanwhile, a control valve is matched to convey high-pressure gas into the hollow sliding block through a gas inlet pipe, and the high-pressure gas is sprayed to the surfaces of the materials through a plurality of spraying openings, so that the materials are rapidly flushed down, and the problem that the materials are clamped in the discharging opening to affect discharging is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of blanking dies, in particular to an aluminum alloy SIM card tray stamping blanking die. Background Art

[0002] In the field of electronic equipment manufacturing, aluminum alloy SIM card trays are a critical component, and their demand continues to increase with the popularity of electronic devices. SIM card trays typically require high precision, high strength, and good dimensional stability to ensure their proper function in electronic devices. Stamping and blanking are common processes used to manufacture aluminum alloy SIM card trays. Using a stamping die, aluminum alloy sheets can be formed into the desired SIM card tray shape.

[0003] The current technology of SIM card tray stamping and blanking dies still has some shortcomings in actual processing. For example, during the punching process of the punch head, the stability of the traditional punching table is poor, burrs remain on the surface of the material after punching, and blanking is difficult. At the same time, the material after punching is easy to get stuck in the blanking port of the die table, making it easy for the material to deform during the next punching, thereby affecting the production quality of the product.

[0004] Therefore, an aluminum alloy SIM card tray stamping die is proposed. Utility Model Content

[0005] The purpose of the utility model is to provide an aluminum alloy SIM card tray stamping and blanking die to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an aluminum alloy SIM card tray stamping and blanking die, including a stamping table, characterized in that: a mounting table is installed on the top of the stamping table, a plurality of sliding rods are slidably installed inside the mounting table, and a buffer table is commonly installed on the rod walls of the plurality of sliding rods, a plurality of buffer springs are arranged between the mounting table and the buffer table, the two ends of the plurality of buffer springs are respectively fixed to the mounting table and the opposite side surface of the buffer table, a plurality of limit rods are installed on the bottom of the plurality of buffer tables, the lower ends of the plurality of limit rods all pass through the mounting table and extend to the bottom, a mold table is installed inside the mounting table, a mold groove is provided on the top of the mold table, a blanking port is provided inside the mold groove, two sliding ports are provided inside the blanking port, and jet assemblies are slidably installed inside the two sliding ports.

[0007] Preferably, the jet assembly includes two hollow sliders, and the two hollow sliders are respectively slidably installed inside the corresponding sliding openings. The interiors of the two hollow sliders are hollow, and multiple jet ports are opened on one side of the inner wall of the two hollow sliders. One side of the two hollow sliders is provided with an air intake pipe, and the outer walls of the two air intake pipes are installed with a control valve, and one side of the two hollow sliders is provided with a rebound assembly.

[0008] Preferably, the rebound assembly includes two connecting tubes, both of which are installed on corresponding hollow sliders, and the other ends of the two connecting tubes are installed with connecting plates, one side of the two connecting plates is installed with limiting springs, the other ends of the two limiting springs are installed on the mold table, and one end of the two air intake pipes is installed on the corresponding connecting plate.

[0009] Preferably, the two injection ports are symmetrically arranged, and the opposite sides of the two hollow sliders are inclined.

[0010] Preferably, a blanking plate is provided below the mold table, and the blanking plate is mounted on the stamping table.

[0011] Preferably, a buffer pad is installed on the upper end of each of the sliding rods, and each of the buffer pads is made of rubber material.

[0012] Preferably, two openings are provided on the left side of the upper surface of the buffer table, and recessed blocks are installed inside the two openings. A plurality of telescopic springs are installed below the inner walls of the two recessed blocks, and a guide plate is commonly installed at the upper ends of a corresponding group of telescopic springs. The two guide plates are respectively slidably installed inside the corresponding recessed blocks, and one side of the two recessed blocks is threadedly connected to the buffer table by bolts.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] 1. The utility model vertically buffers the punch head during the punching process by setting up multiple sets of sliding rods, buffer springs, limit rods, and buffer tables, thereby greatly reducing the problem of burrs generated after the material is punched. At the same time, the material is blocked on one side by the hollow sliders on both sides during the punching process, and the control valve is used to transport high-pressure gas to the inside of the hollow slider through the air intake pipe and spray it onto the surface of the material through multiple injection ports, so that the material is quickly flushed down, preventing the material from getting stuck inside the blanking port and affecting the blanking, thereby improving the production quality of the product.

[0015] 2. The utility model provides two openings on the buffer table, and guides the raw materials before stamping through the guide plates inside the openings to prevent the raw materials from shifting in position during the feeding process. During stamping, the punching head presses the guide plate to slide along the inside of the concave block and move into it, thereby not affecting the normal operation of the punching head. After the stamping is completed, the guide plate is pushed to its original position by the reaction force of the telescopic spring, which does not affect the normal operation of the material guide. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the main structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the overall cross-sectional structure of the present utility model;

[0018] Figure 3 for Figure 2 A magnified view of point A in the figure;

[0019] Figure 4 It is a partially enlarged structural schematic diagram of the utility model.

[0020] In the figure: 1. Stamping table; 2. Mounting table; 4. Sliding rod; 5. Buffer table; 6. Buffer spring; 7. Limit rod; 8. Mold table; 9. Mold slot; 10. Blanking port; 11. Sliding port; 12. Hollow slider; 13. Injection port; 14. Connecting pipe; 15. Connecting plate; 16. Limit spring; 17. Inlet pipe; 18. Control valve; 19. Blanking plate; 20. Buffer pad; 21. Opening; 22. Concave block; 23. Telescopic spring; 24. Guide plate; 25. Bolt. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] Example 1: Please refer to Figure 1-4The utility model provides a technical solution: an aluminum alloy SIM card tray stamping and blanking die, comprising a stamping table 1, a mounting table 2 is installed on the top of the stamping table 1, a plurality of sliding rods 4 are slidably installed inside the mounting table 2, a buffer table 5 is installed on the rod walls of the plurality of sliding rods 4, a plurality of buffer springs 6 are arranged between the mounting table 2 and the buffer table 5, the two ends of the plurality of buffer springs 6 are respectively fixed to the opposite side surfaces of the mounting table 2 and the buffer table 5, a plurality of limiting rods 7 are installed at the bottom of the plurality of buffer tables 5, the lower ends of the plurality of limiting rods 7 all pass through the mounting table 2 and extend to the bottom, a mold table 8 is installed inside the mounting table 2, a mold groove 9 is opened on the top of the mold table 8, and the inner part of the mold groove 9 A blanking port 10 is provided on the inside of the blanking port 10, and two sliding ports 11 are provided inside the two sliding ports 11. Jet components are slidably installed inside. Through the arrangement of multiple sets of sliding rods 4, buffer springs 6, limit rods 7, and buffer platforms 5, the punching head is vertically buffered during the punching process, thereby greatly reducing the problem of burrs generated after the material is punched. At the same time, during the punching, the material is blocked on one side by the hollow sliders 12 on both sides, and the control valve 18 is cooperated to transport the high-pressure gas to the inside of the hollow slider 12 through the air inlet pipe 17, and sprayed to the surface of the material through multiple injection ports 13, thereby quickly flushing the material down to prevent the material from getting stuck inside the blanking port 10 and affecting the blanking problem.

[0023] like Figure 2 and 3 As shown, the jet assembly includes two hollow sliders 12, which are slidably installed in the corresponding sliding ports 11 respectively. The interiors of the two hollow sliders 12 are hollow, and a plurality of jet ports 13 are opened on one side of the inner wall of the two hollow sliders 12. An air inlet pipe 17 is provided on one side of the two hollow sliders 12, and a control valve 18 is installed on the outer wall of the two air inlet pipes 17. When the material needs to be discharged, the control valve 18 is opened to transport the high-pressure gas to the interior of the hollow slider 12 through the air inlet pipe 17. A rebound component is provided on one side of the two hollow sliders 12, and the two jet ports 13 are symmetrically arranged. The opposite sides of the two hollow sliders 12 are inclined. Since the two jet ports 13 are symmetrically arranged and the opposite sides of the hollow sliders 12 are inclined, the jet force of the high-pressure gas can quickly flush the material down, which can prevent the material from getting stuck inside the blanking port 10, ensure smooth discharge, and thus improve the production quality of the product;

[0024] The rebound assembly includes two connecting pipes 14, both of which are mounted on the corresponding hollow sliders 12, and the other ends of the two connecting pipes 14 are mounted with connecting plates 15, and one side of the two connecting plates 15 is mounted with limit springs 16, and the other ends of the two limit springs 16 are mounted on the mold table 8. One end of the two air inlet pipes 17 is mounted on the corresponding connecting plates 15. When the punch head pushes the material downward along the blanking port 10, it squeezes the hollow sliders (12) on both sides to move to both sides. When it rebounds, the material after punching is separated from the punch head by the force of the limit springs 16 on both sides, which is convenient for blanking. In combination with the high-pressure gas ejected from the injection port 13, blanking is made smoother.

[0025] like Figure 2 As shown, a blanking plate 19 is provided under the mold table 8, and the blanking plate 19 is installed on the stamping table 1. The material after stamping and blanking falls onto the blanking plate 19 through the blanking port 10. The blanking plate 19 is installed on the stamping table 1, receives the material and guides it to the designated position, and the upper ends of the multiple sliding rods 4 are installed with buffer pads 20, and the multiple buffer pads 20 are made of rubber material. Through the setting of the buffer pads 20, the buffering effect of the equipment during stamping is further improved during the stamping process, making the stamping process more stable.

[0026] The working principle is as follows: when the punch head performs a punching operation on the die table 8, it first contacts the buffer table 5. The buffer table 5 slides in the mounting table 2 through multiple sliding rods 4, and at the same time compresses multiple buffer springs 6. The elastic action of the buffer spring 6 buffers the punching process and reduces the impact force of the punch head. The setting of the limit rod 7 limits the moving range of the buffer table 5 to ensure the stability of the buffering process. The synergistic effect of multiple sets of sliding rods 4, buffer springs 6 and limit rods 7 makes the punching process more stable and greatly reduces the problem of burrs generated after the material is punched. During the punching process, the material in the die slot 9 on the die table 8 is punched. , the hollow sliders 12 on both sides block the material on one side in the initial state to prevent the material from shifting during the stamping process. When the material needs to be unloaded, the control valve 18 is opened to deliver high-pressure gas to the inside of the hollow slider 12 through the air inlet pipe 17. The high-pressure gas is sprayed onto the surface of the material from multiple injection ports 13 on one side of the inner wall of the hollow slider 12. Since the two injection ports 13 are symmetrically arranged and the opposite sides of the hollow slider 12 are inclined, the injection force of the high-pressure gas can quickly flush the material down, which can prevent the material from getting stuck inside the blanking port 10, ensure smooth unloading, and thus improve the production quality of the product;

[0027] After stamping and blanking, the material falls onto the blanking plate 19 through the blanking port 10. The blanking plate 19 is installed on the stamping table 1 to receive the material and guide it to the designated position. The stamping and blanking die improves the production quality and efficiency of the aluminum alloy SIM card tray through the synergistic effects of stamping buffering, preventing material jamming, material guiding and blanking receiving functions.

[0028] Example 2: Figure 1 and 4 As shown, in order to further improve the material feeding stability when the mold table 8 is working, two openings 21 are opened on the left side of the upper surface of the buffer table 5, and recessed blocks 22 are installed inside the two openings 21. A plurality of telescopic springs 23 are installed under the inner walls of the two recessed blocks 22. A guide plate 24 is installed on the upper end of a corresponding group of telescopic springs 23. The two guide plates 24 are slidably installed in the corresponding recessed blocks 22 respectively, and one side of the two recessed blocks 22 is threadedly connected to the buffer table 5 by bolts 25. By providing two openings 21 on the buffer table 5 and guiding the raw material before stamping through the guide plates 24 inside the openings 21, the problem of position displacement of the raw material during the feeding process is prevented. During stamping, the punching head presses the guide plate 24 to slide along the inside of the recessed block 22 and move it into it, thereby not affecting the normal operation of the punching head. After the stamping is completed, the guide plate 24 is pushed to its original position by the reaction force of the telescopic spring 23, which also does not affect the normal operation of the material guiding.

[0029] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A stamping die for an aluminum alloy SIM card tray, comprising a stamping table (1), characterized in that: A mounting platform (2) is installed on the top of the punching platform (1), and a plurality of sliding rods (4) are slidably installed inside the mounting platform (2), and a buffer platform (5) is installed on the rod walls of the plurality of sliding rods (4). A plurality of buffer springs (6) are arranged between the mounting platform (2) and the buffer platform (5), and the two ends of the plurality of buffer springs (6) are respectively fixed to the surfaces of the opposite side of the mounting platform (2) and the buffer platform (5). A plurality of limiting rods (7) are installed on the bottom of the plurality of buffer platforms (5), and the lower ends of the plurality of limiting rods (7) all pass through the mounting platform (2) and extend downward. A mold platform (8) is installed inside the mounting platform (2), and a mold groove (9) is provided on the top of the mold platform (8), and a blanking port (10) is provided inside the mold groove (9), and two sliding ports (11) are provided inside the blanking port (10), and jet assemblies are slidably installed inside the two sliding ports (11).

2. The aluminum alloy SIM card tray stamping die according to claim 1, characterized in that: The jet assembly includes two hollow sliders (12), the two hollow sliders (12) are respectively slidably mounted inside corresponding sliding openings (11), the interiors of the two hollow sliders (12) are hollow, a plurality of jet ports (13) are provided on one side of the inner wall of the two hollow sliders (12), an air intake pipe (17) is provided on one side of the two hollow sliders (12), a control valve (18) is installed on the outer wall of the two air intake pipes (17), and a rebound assembly is provided on one side of the two hollow sliders (12).

3. The aluminum alloy SIM card tray stamping die according to claim 2, characterized in that: The rebound assembly includes two connecting tubes (14), both of which are mounted on corresponding hollow sliders (12), and the other ends of the two connecting tubes (14) are mounted with connecting plates (15), one side of the two connecting plates (15) is mounted with limiting springs (16), the other ends of the two limiting springs (16) are mounted on the mold table (8), and one end of the two air inlet pipes (17) is mounted on the corresponding connecting plates (15).

4. The aluminum alloy SIM card tray stamping die according to claim 2, characterized in that: The two injection ports (13) are symmetrically arranged, and the opposite sides of the two hollow sliders (12) are both inclined.

5. The aluminum alloy SIM card tray stamping die according to claim 3, characterized in that: A blanking plate (19) is provided below the die table (8), and the blanking plate (19) is mounted on the punching table (1).

6. The aluminum alloy SIM card tray stamping die according to claim 1, characterized in that: A buffer pad (20) is installed on the upper ends of the plurality of sliding rods (4), and the plurality of buffer pads (20) are made of rubber material.

7. The aluminum alloy SIM card tray stamping die according to claim 1, characterized in that: Two openings (21) are provided on the left side of the upper surface of the buffer platform (5), and recessed blocks (22) are installed inside the two openings (21). A plurality of telescopic springs (23) are installed below the inner walls of the two recessed blocks (22). A guide plate (24) is commonly installed at the upper ends of a corresponding group of telescopic springs (23). The two guide plates (24) are respectively slidably installed inside the corresponding recessed blocks (22), and one side of the two recessed blocks (22) is threadedly connected to the buffer platform (5) through a bolt (25).

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