Circuit board cache machine with good heat dissipation performance

By adopting multiple sets of cooling fans and air inlet and outlet hole structures in the circuit board cache machine, the problem of insufficient heat dissipation of the circuit board cache mechanism is solved, and efficient heat dissipation and production efficiency improvement are achieved.

CN223396930UActive Publication Date: 2025-09-30深圳市鑫晟智能自动化设备有限公司
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Patent Information

Application Number
CN202422974539.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-04
Publication Date
2025-09-30
Estimated Expiration
2034-12-04

AI Technical Summary

Technical Problem

During the production process of circuit boards, the side-by-side arrangement of cache mechanisms results in insufficient heat dissipation space, resulting in low heat dissipation efficiency and affecting production efficiency.

Method used

A circuit board buffer with good heat dissipation is designed. Multiple sets of cooling fans and air inlet and outlet vents are used to achieve multi-sided heat dissipation of the buffer mechanism. The Z-axis and Y-axis adjustment devices are used to optimize the conveying and cooling process of the circuit board.

Benefits of technology

The heat dissipation efficiency of the circuit board is improved, the cache time is reduced, and the production efficiency is improved.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223396930U_ABST
Patent Text Reader

Abstract

The utility model provides a circuit board caching machine with good heat dissipation performance, which comprises a rack, a caching mechanism, a board feeding conveying mechanism, a board discharging conveying mechanism, a defective product conveying mechanism and a heat dissipation mechanism, the caching mechanism is fixed in the middle of the rack, and the board feeding conveying mechanism and the board discharging conveying mechanism are fixed on the rack and correspond to the left side and the right side of the caching mechanism. The defective product conveying mechanisms are fixed to the rack and correspond to the position above the plate feeding conveying mechanisms, and the two sets of buffering mechanisms, the two sets of plate feeding conveying mechanisms, the two sets of plate discharging conveying mechanisms and the two sets of defective product conveying mechanisms are arranged on the rack side by side in the front-back direction. And the heat dissipation mechanism comprises a first vertical plate, a second vertical plate, an adjusting mounting plate, a mounting rod, a first heat dissipation fan, a second heat dissipation fan and a third heat dissipation fan. The design has the advantages that the heat dissipation airflow can be improved, the heat dissipation efficiency can be improved, the cache time of the circuit board can be shortened, and the production efficiency can be further improved.
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Description

Technical Field

[0001] The utility model relates to the field of circuit board cache equipment, in particular to a circuit board cache machine with good heat dissipation. Background Art

[0002] During the production process of circuit boards, electroplating and welding processes need to be frequently performed on the circuit boards, and the temperature on the circuit boards will be relatively high. After single-sided processing of the circuit boards, the circuit boards need to be cached and cooled simultaneously during the caching process, so that the circuit boards can be easily processed on the other side after cooling down. Therefore, the cache machines of the circuit boards are generally equipped with heat dissipation mechanisms. However, in order to improve the conveying capacity and cache capacity of the circuit boards, the cache mechanisms and conveying mechanisms are often arranged in double rows. Due to the side-by-side arrangement of the cache mechanisms, there is less heat dissipation space between the two groups of cache mechanisms, which leads to low heat dissipation efficiency and is not conducive to improving production efficiency. Therefore, it is necessary to produce a circuit board cache machine with good heat dissipation to solve the above problems. Utility Model Content

[0003] The purpose of the utility model is to provide a circuit board buffer with good heat dissipation to solve the problems mentioned in the background technology.

[0004] In order to achieve the above purpose, the present invention provides the following technical solutions:

[0005] A circuit board cache machine with good heat dissipation includes a frame, a cache mechanism, a board feed conveying mechanism, a board discharge conveying mechanism, a defective product conveying mechanism and a heat dissipation mechanism, the cache mechanism is fixed to the middle of the frame, the board feed conveying mechanism and the board discharge conveying mechanism are both fixed on the frame and correspond to the left and right sides of the cache mechanism, the defective product conveying mechanism is fixed on the frame and corresponds to the top of the board feed conveying mechanism, the cache mechanism, the board feed conveying mechanism, the board discharge conveying mechanism and the defective product conveying mechanism are arranged in two groups side by side along the front and back direction on the frame, the heat dissipation mechanism includes a first vertical plate, a second vertical plate, an adjustment mounting plate, a mounting rod, a first heat dissipation fan, a second heat dissipation fan and a third heat dissipation fan, the first vertical plate and the second vertical plate are both fixed on the frame and correspond to the left and right sides of the cache mechanism respectively. , multiple groups of air inlet holes are evenly arranged on the upper side of the second vertical plate, and the air inlet holes correspond to the top of the out-board conveying mechanism. The first vertical plate is provided with air outlet holes, and the air outlet holes correspond to the top of the defective product conveying mechanism. The adjustment mounting plate corresponds to the left side of the air outlet and the upper end is hinged to the first vertical plate. The mounting rod is fixed to the first vertical plate. Two groups of mounting rods are provided and correspond to the front and rear sides of the air outlet respectively. The front and rear sides of the lower end of the adjustment mounting plate are respectively fixed to the two groups of mounting rods by screws, and the position of the adjustment mounting plate on the mounting rod is adjustable. Multiple groups of first cooling fans are provided and fixed on the adjustment mounting plate, multiple groups of second cooling fans are provided and fixed on the top of the rack, the second cooling fan corresponds to the top of the cache mechanism, and multiple groups of third cooling fans are provided and fixed on the outsides of the two groups of cache mechanisms respectively.

[0006] Further description of the present invention: The cache mechanism includes a mounting bracket, a Z-axis drive assembly, a Z-axis guide rod, a lifting platform, a connecting frame and a cache frame body. The mounting bracket is fixed on the frame, the Z-column drive assembly is fixed on the mounting bracket, the Z-axis guide rod is vertically fixed on the mounting bracket and corresponds to the left and right sides of the Z-axis drive assembly, the outer side of the lifting platform is fixed to the power output end of the Z-axis drive assembly, the lifting platform is slidingly connected to the Z-axis guide rod through a guide sleeve, the cache frame body is fixed above the lifting platform, the connecting frame is fixed on the outside of the cache frame body, the connecting frame is slidingly connected to the Z-axis guide rod through a guide sleeve, and the third cooling fan is fixed on the connecting frame.

[0007] Further description of the present invention: The cache rack includes a first cache rack, a second cache rack and a Y-axis adjustment device. The first cache rack is vertically fixed on the upper inner side of the lifting platform, the Y-axis adjustment device is fixed on the lifting platform, the second cache rack is fixed at the power output end of the Y-axis adjustment device and corresponds to the space between the first cache rack and the mounting bracket, the connecting rack is fixed on the outside of the second cache rack, and multiple layers of conveyor belts are provided on the inside of the first cache rack and the inside of the second cache rack.

[0008] The beneficial effects of the present invention are as follows: the circuit board is conveyed to the right from the board inlet conveying mechanism to the buffer mechanism, and is stacked layer by layer in the buffer mechanism. After cooling for a certain period of time in the buffer mechanism, it is conveyed from the buffer mechanism to the board outlet conveying mechanism, and is further conveyed to the subsequent process by the board outlet conveying mechanism. If the circuit board is determined to be a defective product by the inspection station before entering the board inlet conveying mechanism, the cache mechanism directly conveys the defective circuit board to the defective product conveying mechanism without cooling. The defective product conveying mechanism conveys the defective circuit board to the defective product collection mechanism. For qualified products, during cooling, the first cooling fan, the second cooling fan and the third cooling fan operate simultaneously, which can dissipate heat on the front and back sides, left and right sides and the top of the cache mechanism, thereby improving the heat dissipation effect. Moreover, after the air flow enters from the air inlet, a part is discharged from the first cooling fan, and the other part is discharged from the air outlet, thereby increasing the gas discharge speed. The defective product conveying mechanism is arranged between the first cooling fan and the board inlet conveying mechanism, which can prevent dust discharged from the first cooling fan or the air outlet from falling onto the board inlet conveying mechanism. The advantage of this design is that it can increase the airflow for heat dissipation and improve the heat dissipation efficiency, reduce the circuit board buffering time, and thus improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is the overall structural diagram of the utility model;

[0010] Figure 2 It is a structural diagram of the cache mechanism in the utility model;

[0011] Figure 3 yes Figure 2 A partial enlarged view of position A in the middle;

[0012] Description of reference numerals:

[0013] 1. Frame; 2. Cache mechanism; 21. Mounting bracket; 22. Z-axis drive assembly; 23. Z-axis guide rod;

[0014] 24. Lifting platform; 25. Connecting frame; 26. Cache frame; 261. First cache rack; 262. Second cache rack; 263. Y-axis adjustment device; 3. Board infeed conveying mechanism; 4. Board outfeed conveying mechanism; 5. Defective product conveying mechanism; 6. Heat dissipation mechanism; 61. First vertical plate; 611. Air outlet; 62. Second vertical plate; 621. Air inlet; 63. Adjustment mounting plate; 64. Mounting rod; 65. First cooling fan; 66. Second cooling fan; 67. Third cooling fan. DETAILED DESCRIPTION

[0015] The present invention will be further described below with reference to the accompanying drawings:

[0016] like Figures 1 to 3As shown, a circuit board cache machine with good heat dissipation includes a rack 1, a cache mechanism 2, a board feed conveying mechanism 3, a board discharge conveying mechanism 4, a defective product conveying mechanism 5 and a heat dissipation mechanism 6. The cache mechanism 2 is fixed in the middle of the rack 1, the board feed conveying mechanism 3 and the board discharge conveying mechanism 4 are both fixed on the rack 1 and correspond to the left and right sides of the cache mechanism 2, the defective product conveying mechanism 5 is fixed on the rack 1 and corresponds to the top of the board feed conveying mechanism 3, the cache mechanism 2, the board feed conveying mechanism 3, the board discharge conveying mechanism 4 and the defective product conveying mechanism 5 are arranged in two groups side by side along the front and back direction on the rack 1, the heat dissipation mechanism 6 includes a first vertical plate 61, a second vertical plate 62, an adjustment mounting plate 63, a mounting rod 64, a first heat dissipation fan 65, a second heat dissipation fan 66 and a third heat dissipation fan 67, the first vertical plate 61 and the second vertical plate 62 are both fixed on the rack 1 and correspond to the left and right sides of the cache mechanism 2 respectively, the second vertical plate There are multiple groups of air inlet holes 621 evenly opened on the upper side of 62, and the air inlet holes 621 correspond to the top of the plate delivery conveying mechanism 4. The first vertical plate 61 is provided with air outlet holes 611, and the air outlet holes 611 correspond to the top of the defective product conveying mechanism 5. The adjustment mounting plate 63 corresponds to the left side of the air outlet hole 611 and the upper end is hinged to the first vertical plate 61. The mounting rod 64 is fixed on the first vertical plate 61. There are two groups of mounting rods 64 and they correspond to the front and rear sides of the air outlet hole 611 respectively. The front and rear sides of the lower end of the adjustment mounting plate 63 are respectively fixed to the two groups of mounting rods 64 by screws. The position of the adjustment mounting plate 63 on the mounting rod 64 is adjustable. The first cooling fan 65 is provided in multiple groups and fixed on the adjustment mounting plate 63. The second cooling fan 66 is provided in multiple groups and fixed on the top of the rack 1. The second cooling fan 66 corresponds to the top of the cache mechanism 2. The third cooling fan 67 is provided in multiple groups and is respectively fixed on the outside of the two groups of cache mechanisms 2.

[0017] The circuit board is conveyed from the board-in conveying mechanism 3 to the right into the buffer mechanism 2, and is stacked layer by layer in the buffer mechanism 2. After cooling for a certain period of time in the buffer mechanism 2, it is conveyed from the buffer mechanism 2 to the board-out conveying mechanism 4, and is further conveyed to the subsequent process by the board-out conveying mechanism 4. If the circuit board is judged as a defective product by the inspection station before entering the board-in conveying mechanism 3, the buffer mechanism 2 directly conveys the defective circuit board to the defective product conveying mechanism 5 without cooling. The defective product conveying mechanism 5 conveys the defective circuit board to the defective product collection mechanism. For qualified products, during cooling, the first The first, second, and third cooling fans 65, 66, and 67 operate simultaneously, dissipating heat from the front, back, left, and top sides of the buffer mechanism 2, improving the heat dissipation effect. Furthermore, after airflow enters through the air inlet 621, a portion is discharged from the first cooling fan 65 and another portion is discharged from the air outlet 611, increasing the air discharge speed. The defective product conveying mechanism 5 is disposed between the first cooling fan 65 and the board feed conveying mechanism 3, preventing dust discharged from the first cooling fan 65 or the air outlet 611 from falling onto the board feed conveying mechanism 3. The advantages of this design are that it increases the heat dissipation airflow and heat dissipation efficiency, reduces the time the circuit boards are buffered, and thus improves production efficiency.

[0018] The cache mechanism 2 includes a mounting bracket 21, a Z-axis drive assembly 22, a Z-axis guide rod 23, a lifting platform 24, a connecting frame 25 and a cache frame 26. The mounting bracket 21 is fixed on the frame 1, the Z-column drive assembly is fixed on the mounting bracket 21, the Z-axis guide rod 23 is vertically fixed on the mounting bracket 21 and corresponds to the left and right sides of the Z-axis drive assembly 22, the outer side of the lifting platform 24 is fixed to the power output end of the Z-axis drive assembly 22, the lifting platform 24 is slidingly connected to the Z-axis guide rod 23 through a guide sleeve, the cache frame 26 is fixed above the lifting platform 24, the connecting frame 25 is fixed on the outer side of the cache frame 26, the connecting frame 25 is slidingly connected to the Z-axis guide rod 23 through a guide sleeve, and the third cooling fan 67 is fixed on the connecting frame 25.

[0019] The Z-axis drive assembly 22 drives the lifting platform 24 to slide along the Z-axis guide rod 23, thereby driving the cache frame 26 to rise or fall so as to connect with the board input conveying mechanism 3 and the board output conveying mechanism 4, thereby realizing the collection and delivery of boards layer by layer. The lifting and lowering of the cache frame 26 simultaneously drives the connecting frame 25 and the third cooling fan 67 on the connecting frame 25 to rise and fall, so that the third cooling fan 67 can always dissipate heat to the cache frame 26, thereby improving the heat dissipation efficiency.

[0020] The cache rack 26 includes a first cache rack 261, a second cache rack 262 and a Y-axis adjustment device 263. The first cache rack 261 is vertically fixed on the upper inner side of the lifting platform 24, the Y-axis adjustment device 263 is fixed on the lifting platform 24, the second cache rack 262 is fixed at the power output end of the Y-axis adjustment device 263 and corresponds to between the first cache rack 261 and the mounting bracket 21, the connecting rack 25 is fixed on the outside of the second cache rack 262, and the inside of the first cache rack 261 and the inside of the second cache rack 262 are both provided with multiple layers of conveyor belts.

[0021] Multiple layers of conveyor belts are arranged on the first cache rack 261 and the second cache rack 262. The front and rear sides of each group of circuit boards are placed on different layers of conveyor belts. The conveyor belts can rotate forward and reverse so that the cache mechanism 2 can collect boards from the board input conveyor mechanism 3, or send boards to the board output conveyor mechanism 4 and the defective product conveyor mechanism 5. The distance between the second cache rack 262 and the first cache rack 261 can be adjusted by the Y-axis adjustment device 263 to adapt to the caching of circuit boards of different width specifications.

[0022] The above does not limit the technical scope of the present invention. Any modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A circuit board cache with good heat dissipation, characterized by: The loader is fixed to the rack, and the ... There are multiple groups of air inlet holes, which correspond to the top of the outlet conveying mechanism. The first vertical plate is provided with air outlet holes, which correspond to the top of the defective product conveying mechanism. The adjustment mounting plate corresponds to the left side of the air outlet and the upper end is hinged to the first vertical plate. The mounting rod is fixed on the first vertical plate. Two groups of mounting rods are provided and correspond to the front and rear sides of the air outlet respectively. The front and rear sides of the lower end of the adjustment mounting plate are respectively fixed to the two groups of mounting rods by screws. The position of the adjustment mounting plate on the mounting rod is adjustable. The first cooling fans are provided in multiple groups and are fixed on the adjustment mounting plate. The second cooling fans are provided in multiple groups and are fixed on the top of the rack. The second cooling fans correspond to the top of the cache mechanism. The third cooling fans are provided in multiple groups and are respectively fixed on the outsides of the two groups of cache mechanisms.

2. The circuit board cache with good heat dissipation according to claim 1, characterized in that: The cache mechanism includes a mounting bracket, a Z-axis drive assembly, a Z-axis guide rod, a lifting platform, a connecting frame and a cache frame body. The mounting bracket is fixed on the frame, the Z-axis drive assembly is fixed on the mounting bracket, the Z-axis guide rod is vertically fixed on the mounting bracket and corresponds to the left and right sides of the Z-axis drive assembly, the outer side of the lifting platform is fixed to the power output end of the Z-axis drive assembly, the lifting platform is slidably connected to the Z-axis guide rod through a guide sleeve, the cache frame body is fixed above the lifting platform, the connecting frame is fixed to the outer side of the cache frame body, the connecting frame is slidably connected to the Z-axis guide rod through a guide sleeve, and the third cooling fan is fixed on the connecting frame.

3. The circuit board cache with good heat dissipation according to claim 2, characterized in that: The cache rack body includes a first cache rack, a second cache rack and a Y-axis adjustment device. The first cache rack is vertically fixed on the upper inner side of the lifting platform. The Y-axis adjustment device is fixed on the lifting platform. The second cache rack is fixed at the power output end of the Y-axis adjustment device and corresponds to the space between the first cache rack and the mounting bracket. The connecting rack is fixed on the outer side of the second cache rack. The inner sides of the first cache rack and the second cache rack are both provided with multiple layers of conveyor belts.