Device for dissolving metal from waste printed board

Abstract

The utility model discloses a device for dissolving metal from a waste printed board, the device comprises a preparation cylinder, a dissolving cylinder and a recovery cylinder, the preparation cylinder is connected with the dissolving cylinder through a first pipeline, and the dissolving cylinder is connected with the recovery cylinder through a second pipeline. According to the recycling dissolving cylinder provided by the utility model, metals in waste printed boards and leftover materials can be dissolved by adding a CuCl2-HCl-H2O2 system solution for dissolving, so that the metals in the waste printed boards and the leftover materials are recycled.

Description

Technical Field

[0001] The utility model relates to the technical field of metal recovery from waste printed circuit boards, and more particularly to a device for dissolving metal from waste printed circuit boards. Background Art

[0002] Wasted printed circuit boards and scraps are primarily composed of glass fiber, resin, and various metals. They primarily contain common metals such as copper, nickel, lead, and tin, as well as precious metals such as gold and palladium. The average metal content in these waste printed circuit boards and scraps is greater than 10%, compared to 3%-5% in naturally occurring rich ores. Therefore, these waste printed circuit boards and scraps have a high metal recovery value, conserve resources, and are environmentally friendly. Recycling technologies for waste printed circuit boards and scraps primarily include mechanical treatment, pyrolysis, and chemical metallurgy, with the latter encompassing pyrometallurgy and hydrometallurgy. Metal dissolution can be achieved using either one method or a combination of several. Hydrometallurgy is a method of reacting waste printed circuit boards or scraps with a strong oxidizing medium such as hydrochloric acid, nitric acid, sulfuric acid, or other mixtures to dissolve the metals in the waste printed circuit boards or scraps into a liquid phase, separating the metals from non-metals, and then recovering the metals in the liquid phase through reduction, electrolysis, or extraction. Hydrometallurgy can be used to directly dissolve the metals in waste printed circuit boards or scraps, or it can be used as a method to dissolve metals from the metals enriched after mechanical separation of waste printed circuit boards or scraps.

[0003] Currently, the hydrometallurgical method used to dissolve metals from discarded printed circuit boards and waste scraps mainly uses nitric acid, hydrochloric acid, sulfuric acid and aqua regia solutions. This method can dissolve a wide variety of metals, but nitric acid and other solvents are prone to secondary pollution. H2SO4 and H2O2 can also dissolve metals, but the consumption of H2O2 is relatively high. Other dissolution methods have the main problems of limited number of dissolved metals, secondary pollution and large material input. None of the above dissolution methods can be recycled; Utility Model Content

[0004] In view of this, the utility model provides a device for dissolving metal from waste printed circuit boards using a CuCl2-HCl-H2O2 system solution, which can effectively solve the technical problems in the background technology.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A device for dissolving metal from waste printed circuit boards comprises a preparation tank, a dissolving tank and a recovery tank. The preparation tank and the dissolving tank are connected via a first pipeline, and the dissolving tank and the recovery tank are connected via a second pipeline.

[0007] Preferably, a first mechanical stirring device is provided in the preparation cylinder, and the first mechanical stirring device is vertically arranged in the center of the preparation cylinder.

[0008] Preferably, a second mechanical stirring device, an air stirring device and a heater are provided in the dissolution tank, wherein the second mechanical stirring device is vertically arranged at the center of the dissolution tank, the air stirring device is horizontally arranged at the bottom of the dissolution tank, and the heater is arranged on the side close to the inner wall of the dissolution tank.

[0009] Preferably, the first mechanical stirring device is 10 cm higher than the bottom of the preparation tank.

[0010] Preferably, the second mechanical stirring device is 10 cm higher than the bottom of the dissolution tank, the air stirring device is 10 cm higher than the bottom of the dissolution tank, and the second mechanical stirring device is not in contact with the air stirring device.

[0011] Preferably, the heater is 30 cm higher than the bottom of the dissolving tank and is more than 20 cm away from the inner wall of the dissolving tank.

[0012] Preferably, a filter is provided in the dissolving tank, and the filter is provided between the air stirring device and the bottom of the dissolving tank.

[0013] Preferably, a first circulation pump is provided on the first pipeline, and a carbon core is provided in the first circulation pump;

[0014] The second pipeline is provided with a second circulation pump, and the second circulation pump is provided with a carbon core.

[0015] Preferably, a metal ion concentration detector is provided at the bottom of the dissolution tank, and the metal ion concentration detector, the first circulation pump and the second circulation pump are all electrically connected to an external controller.

[0016] It can be seen from the above technical solution that compared with the prior art, the present invention has the following beneficial effects:

[0017] The recycling dissolving cylinder provided by the utility model can dissolve the metal in the waste printed circuit boards and scraps through the chemical liquid phase dissolution method, thereby realizing the metal recovery in the waste printed circuit boards and scraps;

[0018] The utility model realizes that there is no waste liquid or waste water discharge and no environmental pollution;

[0019] The utility model can dissolve metals in discarded printed circuit boards and discarded scraps. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0021] Figure 1 This is a structural diagram of the device of the utility model.

[0022] Among them, in the figure:

[0023] 1- preparation tank; 2- first mechanical stirring device; 3- first circulation pump; 4- first pipeline; 5- dissolution tank; 6- second mechanical stirring device; 7- air stirring device; 8- heater; 9- second circulation pump; 10- second pipeline; 11- recovery tank; 12- filter screen; 13- metal ion concentration detector. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] Example 1

[0026] like Figure 1 As shown, a device for dissolving metal from waste printed circuit boards includes a preparation tank 1, a dissolving tank 5 and a recovery tank 11. The preparation tank 1 is connected to the dissolving tank 5 through a first pipeline 4, and the dissolving tank 5 is connected to the recovery tank 11 through a second pipeline 10.

[0027] In this embodiment, a first mechanical stirring device 2 is installed inside the preparation tank 1. The first mechanical stirring device 2 is inserted deep into the preparation tank 1 and is 10 cm higher than the bottom of the preparation tank 1.

[0028] In this embodiment, a second mechanical stirring device 6 , an air stirring device 7 and a heating device 8 are installed inside the dissolution tank 5 . The second mechanical stirring device 6 penetrates deep into the dissolution tank 5 and is 20 cm higher than the bottom of the dissolution tank 5 .

[0029] The air stirring device 7 is 10 cm higher than the bottom of the dissolving tank 5, and the air stirring device can increase the uniformity of the liquid.

[0030] The heating device 8 is inserted into the dissolving tank 5 and is 30 cm above the bottom of the dissolving tank 5. The heating device 8 is 20 cm away from the edge of the dissolving tank 5. A filter screen 12 is installed inside the dissolving tank 5 to retain the dissolved solids in the filter screen 12.

[0031] In this embodiment, a first circulation pump 3 is provided at the center of the second pipeline 10. In this embodiment, a first circulation pump 3 is provided at the center of the first pipeline 4. A carbon core is installed in the first circulation pump 3. The first circulation pump 3 cooperates with the carbon core to play the role of circulating pump liquid and perform carbon adsorption filtration on the liquid.

[0032] There is a second circulation pump 9, which is also equipped with a carbon core. The second circulation pump 9 cooperates with the carbon core to play the role of circulating pump liquid and perform carbon adsorption and filtration on the liquid.

[0033] In this embodiment, a metal ion concentration detector 13 is installed inside the dissolution tank 5, and the metal ion concentration detector 13, the first circulation pump 3, and the second circulation pump 9 are all electrically connected to an external controller.

[0034] Example 2

[0035] This embodiment provides a method for using the device for dissolving metal from waste printed circuit boards in Example 1, comprising the following steps:

[0036] (1) Add tap water of half the volume of the CuCl2-HCl-H2O2 system solution to the preparation tank, dissolve CuCl2·2H2O with a concentration of 4g / L in water and inject it into the preparation tank, then dissolve HCl with a concentration of 100ml / L in water and inject it into the preparation tank, add tap water to the preparation tank to the required volume, start the first mechanical stirring device to stir, and completely dissolve the solution;

[0037] (2) Turn off the first mechanical stirring device, start the first circulation pump to pump the prepared solution in the preparation tank into the dissolution tank, start the second mechanical stirring device and the heater, when the solution temperature in the dissolution tank reaches 50 ° C, put the waste printed circuit boards and waste scraps into the dissolution tank, start the air stirring device, when the metal ion concentration detector detects that the various metal ions reach the specified concentration, start the second circulation pump to pump the solution into the recovery tank to recover the metal.

[0038] The reactions that occur in the dissolving tank are as follows:

[0039] (1) Reaction formula with copper:

[0040] Cu(s) 0 +Cu 2+ →2Cu + …………………………………………………………………(1)

[0041] Cu+ +nCl - →CuCln 1-n ……………………………………………………(2)

[0042] Cu 0 +Cu 2+ +2Cl - →2CuCl(s)(ΔG0(20℃)=-41kJ / mol)………(3)

[0043] Cu 0 +Cu 2+ +4Cl - →2CuCl 2- (ΔG0(20℃)=-25kJ / mol)…………(4)Cu 2+ and Cl - The generated ligand CuCln 2-n (2≤n≤4) has many forms.

[0044] (2) Reaction formula with lead:

[0045] Cu 2+ +Pb + (x+2)Cl - →CuCl2 - +PbCl x 2-x …………………………(5)X=1,2,3……

[0046] (3) Reaction formula with tin:

[0047] Cu 2+ +Sn + (x+2)Cl - →CuCl2 - +SnCl x 2-x …………………………(6)X=1,2,3……

[0048] (4) Reaction formula with nickel:

[0049] Cu 2+ +Ni + (x+2)Cl - →CuCl2 - +NiCl x 2-x …………………………(7)X=1,2,3……

[0050] (5) Reaction formula with palladium:

[0051] 2Cu 2++Pd 0 +8Cl - →2CuCl2 - +PdCl4 - …………………………………………(8)

[0052] (5) Reaction formula with H2O2:

[0053] 4CuCl2 - +H2O2+4H + →4Cu 2+ +8Cl - +3H2O……………………(9)

[0054] 4CuCl2 - +H2O2+4H + →4CuCl - +4Cl - +3H2O……………………(10)

[0055] 4CuCl2 - +H2O2+4H + →4CuCl 2(aq) +3H2O……………………(11)

[0056] (6) Reaction formula with O2:

[0057] 4CuCl2 - +O 2(aq) +4H + →4Cu 2+ +8Cl - +2H2O……………………(12)

[0058] 4CuCl2 - +O 2(aq) +4H + →4CuCl - +4Cl - +2H2O……………………(13)

[0059] 4CuCl2 - +O 2(aq) +4H + →4CuCl 2(aq) +2H2O……………………(14)

[0060] The metal dissolution conditions after dissolution using the method of Example 2 are shown in Table 1:

[0061] Table 1

[0062] Metal Type Metal dissolution copper Completely dissolved nickel Completely dissolved lead Completely dissolved tin Completely dissolved palladium Completely dissolved gold Undissolved

[0063] The CuCl2-HCl-H2O2 system solution can dissolve the copper layer under the gold layer from the side of the discarded printed circuit board, so that the gold layer forms flakes that float on the surface of the solution for filtration and recovery.

[0064] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Reference can be made to the common and similar parts between the various embodiments. For the devices disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple, and the relevant parts can be referred to the method description.

[0065] The above description of the disclosed embodiments will enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A device for dissolving metal from waste printed circuit boards, characterized in that: It includes a preparation tank, a dissolving tank and a recovery tank, wherein the preparation tank and the dissolving tank are connected via a first pipeline, and the dissolving tank and the recovery tank are connected via a second pipeline; A first mechanical stirring device is provided in the preparation cylinder, and the first mechanical stirring device is vertically arranged in the center of the preparation cylinder; A second mechanical stirring device, an air stirring device and a heater are provided in the dissolution tank, wherein the second mechanical stirring device is vertically arranged at the center of the dissolution tank, the air stirring device is horizontally arranged at the bottom of the dissolution tank, and the heater is arranged on one side close to the inner wall of the dissolution tank; The first mechanical stirring device is 10 cm higher than the bottom of the preparation tank; The second mechanical stirring device is 10 cm higher than the bottom of the dissolution tank, the air stirring device is 10 cm higher than the bottom of the dissolution tank, and the second mechanical stirring device is not in contact with the air stirring device; The heater is 30 cm higher than the bottom of the dissolving tank and is more than 20 cm away from the inner wall of the dissolving tank.

2. The device for dissolving metal from waste printed circuit boards according to claim 1, characterized in that: A filter is provided in the dissolving tank, and the filter is provided between the air stirring device and the bottom of the dissolving tank.

3. The device for dissolving metal from waste printed circuit boards according to claim 2, characterized in that: A first circulation pump is provided on the first pipeline, and a carbon core is provided in the first circulation pump; a second circulation pump is provided on the second pipeline, and a carbon core is provided in the second circulation pump.

4. The device for dissolving metal from waste printed circuit boards according to claim 3, characterized in that: A metal ion concentration detector is provided at the bottom of the dissolution tank, and the metal ion concentration detector, the first circulation pump and the second circulation pump are all electrically connected to an external controller.

Images