Heat pump SPA integrated control device and integrated equipment

Abstract

The utility model discloses a heat pump SPA integrated control device and integrated equipment. The device comprises a main control unit, an SPA control unit, a heat pump control unit, a power input interface unit and a switching power supply unit which are arranged in the same bearing body, and the main control unit is connected with the heat pump control unit and used for obtaining sensing data in a heat pump subsystem and controlling the heat pump subsystem to operate; the SPA subsystem is also connected with the SPA control unit and is used for controlling the SPA subsystem to operate; the input end of the switching power supply unit is connected with the first output end of the power supply input interface unit, high-voltage alternating current is converted into low-voltage direct current, and the low-voltage direct current is output to the power supply ends of the main control unit, the SPA control unit and the heat pump control unit. The SPA control unit comprises at least one SPA assembly control circuit which is used for controlling operation of the corresponding SPA assemblies, and the heat pump control unit comprises at least one heat pump assembly control circuit which is used for controlling operation of the corresponding heat pump assemblies. And the sensing detection circuit is used for detecting and acquiring the sensing data.

Description

Technical Field

[0001] The utility model relates to the field of SPA equipment and heat pump equipment, and more specifically, to a heat pump SPA integrated control device and integrated equipment. Background Art

[0002] With rising living standards, spa (hydrotherapy) equipment and systems are becoming increasingly popular. Using water as a medium, they leverage temperature, pressure, scent, and light to help users relax, improve their skin, and achieve a relaxing and health-enhancing experience. As a key carrier in spa equipment and systems, water is typically used in large quantities, and heating and cooling are a major energy consumer for the entire spa. Heat pump systems, based on the principle of heat transfer, utilize ambient heat sources for heat transfer. Compared to traditional heating and cooling equipment, they offer higher energy efficiency and lower energy consumption. Using a heat pump system to provide heating and cooling for a spa system or heat pump can effectively reduce energy consumption. Utility Model Content

[0003] The present invention provides an integrated control device and apparatus for a SPA and heat pump, which realizes an integrated control device, reduces the complexity of the control device, simplifies the overall component layout of the heat pump and SPA integrated system, and significantly improves the installation convenience of the entire system, enabling the heat pump system to be applied in the field of SPA equipment in a more optimal manner.

[0004] The present invention provides a heat pump SPA integrated control device, which is applied to a heat pump SPA integrated system, including:

[0005] A main control unit, a hydrotherapy SPA control unit, a heat pump control unit, a power input interface unit, and a switching power supply unit are arranged in the same carrier. The main control unit is connected to the heat pump control unit to obtain sensor data in the heat pump subsystem and control the operation of the heat pump subsystem; the main control unit is also connected to the SPA control unit to control the operation of the SPA subsystem;

[0006] The input end of the switching power supply unit is connected to the first output end of the power input interface unit, converting the high-voltage alternating current into low-voltage direct current and outputting it to the power supply ends of the main control unit, the SPA control unit and the heat pump control unit respectively;

[0007] The SPA control unit includes: at least one SPA component control circuit, each for controlling the operation of the SPA component included in the corresponding SPA subsystem; the heat pump control unit includes: at least one heat pump component control circuit, each for controlling the operation of the heat pump component included in the corresponding heat pump subsystem; and also includes a sensor detection circuit for detecting and acquiring the sensor data;

[0008] Wherein, the heat pump SPA integrated system includes: the SPA subsystem and the heat pump subsystem;

[0009] The SPA component includes: a circulation pump; the heat pump component includes: a fan and a compressor;

[0010] The sensor data includes at least one of the following: water outlet temperature, water inlet temperature, ambient temperature, compressor exhaust temperature, compressor inlet temperature, evaporator temperature, high pressure switch status, low pressure switch status, and water flow switch status.

[0011] The present invention also provides a heat pump SPA integrated device, including:

[0012] The heat pump SPA integrated control device and heat pump subsystem as described in any embodiment of the present invention;

[0013] The heat pump subsystem includes the following first heat pump components: a fan and a compressor.

[0014] The present invention implements an integrated control device for a SPA and a heat pump, thereby avoiding the delay and instability of cross-device communication between separate control units, reducing the total area of ​​the control device, improving installation convenience, and effectively ensuring the operational reliability of the SPA heat pump integrated device.

[0015] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be achieved and obtained through the structures particularly pointed out in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are used to provide a further understanding of the technical solution of the present invention and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present invention and do not constitute a limitation on the technical solution of the present invention.

[0017] Figure 1 This is a structural diagram of a heat pump SPA integrated control device provided by the utility model;

[0018] Figure 2 This is a structural diagram of another heat pump SPA integrated control device provided by the present invention;

[0019] Figure 3 This is a structural diagram of another heat pump SPA integrated control device provided by the present invention;

[0020] Figure 4 This is a structural diagram of a heat pump SPA integrated device provided by the utility model;

[0021] Figure 5 This is a structural diagram of another heat pump SPA integrated device provided by the utility model. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the present invention more clear, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other in any way.

[0023] In the description of the present invention, it should be noted that the terms "upper", "lower", "one side", "the other side", "one end", "the other end", "side", "relative", "four corners", "periphery", "'mouth'-shaped structure", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing "this" utility model and simplifying the description, and do not indicate or imply that the structure referred to has a specific orientation, is constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0024] In the description of the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "connection," "direct connection," "indirect connection," "fixed connection," "installation," and "assembly" should be understood in a broad sense. For example, they may refer to a fixed connection, a detachable connection, or an integral connection. The terms "installation," "connection," and "fixed connection" may refer to a direct connection, an indirect connection through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0025] Spa equipment in a SPA system includes various bathtubs, showers, and water massagers, achieving muscle relaxation and stress relief through water flow, pressure, and temperature. These systems typically include a water pump, air pump, circulation pump, disinfection components, and lighting, providing functions such as massage and bubble baths. Different SPA systems have different functions, including corresponding components, and are not limited to the examples disclosed herein. In some implementations, the SPA system includes a control unit / module that controls the operation of various components in response to user function settings or by monitoring the system's actual operating status.

[0026] A heat pump system is an energy conversion solution that converts low-temperature heat sources into high-temperature heat sources, enabling cooling and / or heating. It primarily consists of four core components: a compressor, an evaporator, a condenser, and an expansion valve. Some solutions also include a four-way valve. In some implementations, heat pump systems also include a control unit / module to respond to user function settings or monitor the system's actual operating conditions, controlling the operation of each component.

[0027] To utilize a heat pump system to provide heating or cooling for a spa system, some available heat pump spa devices / systems simply incorporate a collaborative control module that connects separately to an existing spa control unit / module and a heat pump control unit / module. This results in a three-part control system for user installation and deployment. Data cables connect the three components for control information exchange. This also requires independent power supplies for the heat pump and spa system's electrical components, making installation and commissioning of heat pump spa systems cumbersome and inefficient. This non-integrated control device requires multiple power and / or data connections between circuit modules, and prolonged exposure to hot and humid environments can severely impact the reliability of these connections, leading to a high risk of operational failures.

[0028] The embodiment of the present application provides a heat pump SPA integrated control device 10, which integrates a control circuit for collaboratively controlling the operation of two subsystems in the same carrier, and is applied to a heat pump SPA integrated system, such as Figure 1 As shown, the device includes:

[0029] A main control unit 110, a hydrotherapy SPA control unit 120, a heat pump control unit 130, a power input interface unit 140, and a switching power supply unit 150 are disposed in the same carrier 100. The main control unit 110 is connected to the heat pump control unit 120 to obtain sensor data in the heat pump subsystem and control the operation of the heat pump subsystem; the main control unit 110 is also connected to the SPA control unit 130 to control the operation of the SPA subsystem.

[0030] The input end of the switching power supply unit 150 is connected to the first output end 1401 of the power input interface unit 140, converting the high-voltage AC power into low-voltage DC power and outputting it to the power supply ends of the main control unit 110, the SPA control unit 120 and the heat pump control unit 130 respectively;

[0031] The SPA control unit 120 includes: at least one SPA component control circuit 1201, respectively used to control the operation of the SPA components included in the corresponding SPA subsystem; the heat pump control unit 130 includes: at least one heat pump component control circuit 1301, respectively used to control the operation of the heat pump components included in the corresponding heat pump subsystem; and also includes a sensor detection circuit 1302 for detecting and obtaining the sensor data;

[0032] Wherein, the heat pump SPA integrated system includes: the SPA subsystem and the heat pump subsystem;

[0033] The SPA component includes: a circulation pump; the heat pump component includes: a fan and a compressor;

[0034] The sensor data includes at least one of the following: water outlet temperature, water inlet temperature, ambient temperature, compressor exhaust temperature, compressor inlet temperature, evaporator temperature, high pressure switch status, low pressure switch status, and water flow switch status.

[0035] In some exemplary embodiments, the SPA component further includes one or more of the following: a water pump, an air pump, and a disinfection component.

[0036] In some exemplary embodiments, the spa component further includes one or more of the following: a lighting component, an aromatherapy component, a spray component, a light wave component, etc. It will be appreciated that the spa components included in the spa subsystem operate independently, or multiple spa components work together to achieve a specific spa function, such as a massage function, a bubble bath function, an aromatherapy function, etc.

[0037] As you can see, electronic devices require different power supplies depending on their component types. Some components, such as water pumps and motors, require high-voltage AC power, while others, such as CPUs and sensors, require low-voltage DC power. Some components even require multiple power supplies. High voltage and low voltage are relative terms. For example, high-voltage AC refers to 220V AC, 380V AC, or other voltages; low-voltage DC refers to 12V DC, 48V DC, or 5V DC. The SPA components within a SPA subsystem and the heat pump components within a heat pump subsystem also require multiple power supply specifications.

[0038] In some exemplary embodiments, the heat pump SPA integrated control device provides at least two power supplies for all (electronic) components in the heat pump SPA integrated system. The second output terminal 1402 of the power input interface unit 140 provides high-voltage AC power to some SPA components, and the output terminal of the switching power supply unit 150 provides low-voltage DC power to the SPA components. The input terminal of the switching power supply 150 is connected to the first output terminal 1401 of the power input interface unit 140 to perform voltage / current conversion and output the low-voltage DC power required by some SPA components.

[0039] The input terminal 1400 of the power input interface unit 140 serves as the power supply interface for the entire heat pump / SPA integrated system, connecting to an external power supply system. In some exemplary embodiments, the power input interface unit 140 stabilizes and filters the input current from the power grid, providing a stable high-voltage AC power supply for the heat pump / SPA integrated system. The power input interface unit 140 and the switching power supply unit 150 are collectively referred to as a power module.

[0040] It should be noted that the SPA component control circuit corresponds to the SPA component, and the heat pump component control circuit and the specific circuit structure of each control circuit corresponding to the heat pump component include multiple implementation forms. According to the specific control method of the SPA / heat pump component, the corresponding implementation can be achieved. In the embodiment of the present application, the SPA control unit, heat pump control unit and main control unit including multiple component control circuits are integrated and arranged in the same carrier. At the same time, the internal components are powered by a shared power module, which can avoid the need for three separate control devices to communicate across devices and the complexity of installation and wiring caused by the need to provide multiple power supplies separately. The three control units included in the integrated control device are integrated and arranged in the same carrier. The data / signals between the three control units are transmitted through internal boards / lines, which can effectively maintain the reliability of data / signal transmission. The shared power module can effectively reduce the overall control circuit cost.

[0041] The main control unit 110 determines the operating status of the SPA subsystem based on the acquired sensor data, and further controls the operation of each SPA component in the SPA subsystem to maintain or adjust its operating parameters. The main control unit 110 also determines the operating status of the heat pump subsystem based on the acquired sensor data, and further controls the operation of each heat pump component in the heat pump subsystem to maintain or adjust its operating parameters. In some exemplary embodiments, the main control unit 110 compares the current acquired sensor data with a set reference value for the operating parameter to determine an adjustment target value for the operating parameter, and adjusts the operation of the component based on the adjustment target value via the corresponding component control circuit.

[0042] In some exemplary embodiments, Figure 2As shown, the main control unit 110 includes: a switch driving circuit 1110 and a processor 1120;

[0043] The at least one SPA component control circuit includes at least one first switch 1202 corresponding to the SPA component, wherein a control signal input terminal of the first switch is connected to a first output terminal of the switch driving circuit; the first switch is arranged in a power supply path between the second output terminal of the power input interface unit and the corresponding SPA component, and each first switch corresponds to a first output terminal of the switch driving circuit;

[0044] The at least one heat pump assembly control circuit includes at least one second switch 1303 corresponding to the heat pump assembly, wherein the control signal input terminal of the second switch is connected to the second output terminal of the switch drive circuit; the second switch is arranged on the power supply path between the second output terminal of the power input interface unit and the corresponding heat pump assembly, and each second switch corresponds to a second output terminal of the switch drive circuit;

[0045] The processor 1120 is connected to the switch driving circuit 1110 to control the on or off of the first switch and the second switch; and the second output end of the power input interface unit outputs high voltage alternating current.

[0046] It can be understood that these first / second switches can be considered a simple component control circuit, controlling the conduction and disconnection of the power supply path of the corresponding component. In some exemplary embodiments, a spa / heat pump component corresponds to a first switch. When the first switch is turned on, the component is powered on and operates according to the preset mode. When the first switch is turned off, the component stops operating. Optionally, a spa / heat pump component corresponds to multiple first switches, each corresponding to a different operating mode of the component, and only one of the multiple first switches is turned on at any one time. For example, the fan of the heat pump component corresponds to two first switches, one of which operates at a first set speed and the other operates at a second set speed. More forms of control circuits are not exemplified here.

[0047] The switch driver circuit 1110 has an input connected to the processor 1120 and includes at least one first output and at least one second output, which are respectively connected to the control signal inputs of the first and second switches provided on the power supply paths of each component. Based on control signals from the processor, the switch driver circuit generates a control signal for the target switch and inputs it to the corresponding switch, controlling the on / off state of the switch and, therefore, the power supply path of the corresponding SPA component or heat pump component. The control signal indicates the switch identifier (or SPA / heat pump component identifier) ​​and the on / off state.

[0048] In some exemplary embodiments, the heat pump component further includes: a four-way valve; accordingly, the at least one heat pump component control circuit further includes: a second switch 1303 corresponding to the four-way valve, the control signal input end of the second switch being connected to the second output end of the switch drive circuit; the conduction and disconnection of the second switch control the flow direction of the refrigerant in the heat pump subsystem.

[0049] In some exemplary embodiments, the first switch and the second switch may be the same type of switch devices or different types of switch devices. Depending on the specific type and model of the switch device, the switch driving circuit may output the corresponding required control signal without limitation to a specific aspect.

[0050] In some exemplary embodiments, the processor includes: an MCU.

[0051] In some exemplary embodiments, the first / second switches include relays, solid-state relays, bidirectional thyristors, electronic relays, and the like. As can be seen, the second output terminal of the power input interface unit outputs high-voltage AC power, and the power supply paths controlled by the first and second switches provide power to components that require high-voltage AC power.

[0052] In some exemplary embodiments, Figure 3 As shown, the device further includes: at least one fuse protection unit 160; the fuse protection unit is arranged on the power supply path between the second output end of the power input interface unit and the SPA component to provide overcurrent protection; and / or, is arranged on the power supply path between the second output end of the power input interface unit and the heat pump component to provide overcurrent protection.

[0053] As you can see, the fuse protection unit provides overcurrent protection for components in the system powered by high-voltage AC power, including circuit breakers, fuses, protective relays or fuses, etc. A fuse protection unit is connected in series to the power supply path of each SPA component / heat pump component protected by overcurrent.

[0054] It should be noted that the different types of SPA components included in the SPA subsystem require different power supply specifications. Some components require overcurrent protection, while others do not require overcurrent protection during low-voltage DC operation. These components are respectively referred to as the first SPA component and the second SPA component. Similarly, the different types of heat pump components included in the heat pump subsystem also include the first heat pump component that requires overcurrent protection and the second heat pump component that does not require overcurrent protection.

[0055] As can be seen, the water pump, air pump, circulation pump, and disinfection assembly are the first SPA components; the fan, four-way valve, and compressor are the first heat pump components; and the expansion valve is the second heat pump component. If more components are included, their type can be determined based on their power supply characteristics. A fuse protection unit is installed in the power supply path of the first SPA component and / or the first heat pump component that requires overcurrent protection.

[0056] As can be seen, the SPA control unit is used to control the operation of each adjustable component in the SPA subsystem, achieving the desired control target by controlling its operating parameters, typically through the control circuits corresponding to each component. The heat pump control unit is used to control the operation of each adjustable component in the heat pump subsystem, achieving the desired control target by controlling its operating parameters, typically through the control circuits corresponding to each component. The control circuits corresponding to each SPA component included in the SPA control unit, the heat pump components included in the heat pump control unit, and the main control unit are all housed within the same carrier. This allows data exchange between the three control units to be completed within the carrier, eliminating the need for cross-device data communication and improving communication reliability.

[0057] In some exemplary embodiments, the SPA / heat pump component control circuitry, in addition to on / off control, also adapts to component functionality, providing more control options. Such component control circuitry not only controls the power supply path but also connects to the component's control data inputs. Alternatively, the component control circuitry may not control the power supply path but only connects to the component's control data inputs to control operating parameters. Specifically, the processor connects to the control circuitry of each SPA component to control the operating parameters of the SPA component controlled by that control circuit. For example, the processor connects to the water pump control circuit to control the water pump's operating parameters, such as pressure and flow rate. The processor connects to the control circuitry of each heat pump component to control the operating parameters of the heat pump component controlled by that control circuit. For example, the processor connects to the control circuitry of each heat pump component to control the operating parameters of the heat pump component controlled by that control circuit. For example, the processor connects to the fan control circuit to control the fan's operating parameters, such as speed. Many more components and their operating parameters are not listed here.

[0058] The operating parameters of each SPA / heat pump component are determined by the processor based on the sensor data and the set operating parameter reference values. It will be appreciated that the controller within the main control unit can determine the current operating status of the relevant functions within the SPA subsystem based on the acquired sensor data, and then determine new operating parameter values ​​based on the set operating parameter reference values. For example, if the sensor data includes the outlet water temperature, and if it is lower than the set outlet water temperature reference value, then it is determined that the parameters of one or more heat pump components need to be adjusted, and the new parameter values ​​are determined.

[0059] In some exemplary embodiments, the heat pump assembly further comprises: an expansion valve; the heat pump control unit further comprises: an expansion valve control circuit;

[0060] The first output terminal of the switching power supply unit is connected to the power supply terminal of the expansion valve, and the processor is connected to the expansion valve control circuit to control the operating parameters of the expansion valve;

[0061] The operating parameters are determined by the processor according to the sensor data and a set operating parameter reference value.

[0062] For example, the expansion valve is an electronic expansion valve, and the operating parameters include: opening degree, etc.

[0063] It can be seen that the power supply end of the expansion valve is connected to the output end of the switching power supply unit and is powered by low-voltage DC.

[0064] In some exemplary embodiments, the first switch is a first relay, the second switch is a second relay; the switch driving circuit is a relay driving circuit;

[0065] The first output end of the relay drive circuit is connected to the control end of the coil of the first relay, and the second output end of the relay drive circuit is connected to the control end of the coil of the second relay;

[0066] The two contacts of the first relay are respectively connected to the second output end of the power input interface unit and the power supply end of the corresponding SPA component; the two contacts of the second relay are respectively connected to the second output end of the power input interface unit and the power supply end of the corresponding heat pump component.

[0067] The relay driver circuit generates a control signal to control the relay on the power supply path of the corresponding SPA / heat pump component based on the switching instructions from the processor, controlling the relay to turn on or off to achieve the purpose of powering on or off the SPA / heat pump component.

[0068] In some exemplary embodiments, the first relay and / or the second relay is a relay that complies with explosion-proof certification standards.

[0069] In some exemplary embodiments, the switching power supply unit is a 48W switching power supply, or a switching power supply with other set power.

[0070] It is understood that when other types of first / second switches are selected, a corresponding switch driving circuit is selected to generate a control signal capable of turning the switch on or off according to a control instruction from the processor. Examples of more types of switches and control signals are not discussed here.

[0071] In some exemplary embodiments, the same carrier is the same shell.

[0072] In some exemplary embodiments, the main control unit, hydrotherapy SPA control unit, heat pump control unit, power input interface unit, switching power supply unit and insurance protection unit are arranged on the same PCB board, or are arranged on multiple PCB boards according to the internal layout requirements of the carrier.

[0073] In some exemplary embodiments, the sensor data detection circuit is connected to at least one sensor in the heat pump subsystem, collects sensor signals, converts them into sensor data in a set format, and sends them to the processor of the main control unit.

[0074] It's understood that a typical heat pump system typically consists of two circulation systems: a refrigerant circulation system, including an evaporator, condenser, compressor, expansion valve, and, optionally, a four-way valve; and a distribution circulation system, which transfers heat or cold to the water circuit and includes a water pump, inlet pipe, and outlet pipe. For heating, for example, heat exchange occurs in a condenser with integrated water pipes (e.g., a titanium tube heat exchanger). Water entering through the inlet pipe is heated and then discharged through the outlet pipe. The heat pump system is equipped with multiple sensors, and collecting sensor data from these sensors can provide insights into the heat pump's operating status.

[0075] In the heat pump system included in the heat pump-SPA integrated system provided in the embodiments of the present application, the water pump in the heat pump subsystem's distribution circulation system serves as the circulation pump in the SPA subsystem. Its water inlet pipe is connected to the SPA subsystem's water outlet pipe, and its water outlet pipe is connected to the SPA subsystem's water inlet pipe. As can be seen, after the SPA subsystem and heat pump subsystem are integrated, sensor data from the heat pump subsystem is collected, which not only allows the operating status of the heat pump subsystem to be determined, but also allows the actual operating status of SPA-related functions to be further determined, allowing the user's experience to be inferred, so that adjustments can be made to meet the user's needs.

[0076] In some exemplary embodiments, the evaporator pipe of the heat pump subsystem is also referred to as the evaporator coil, or simply the coil. Accordingly, the evaporator temperature is also referred to as the coil temperature.

[0077] In some exemplary embodiments, one or more of the following sensors are provided in the heat pump subsystem to obtain the sensing data:

[0078] A temperature sensor is installed on the water inlet pipe of the heat pump to obtain the water inlet temperature;

[0079] A temperature sensor is installed on the outlet pipe of the heat pump to obtain the outlet water temperature;

[0080] A temperature sensor is installed at the air inlet of the fan to obtain the ambient temperature;

[0081] A temperature sensor is provided at the compressor air inlet to obtain the compressor air inlet temperature;

[0082] A temperature sensor is installed at the compressor exhaust port to obtain the compressor exhaust temperature;

[0083] A temperature sensor is set on the evaporator / coil to obtain the evaporator / coil temperature;

[0084] A high-pressure switch is installed on the compressor exhaust pipe to obtain the high-pressure switch status;

[0085] A low-pressure switch is installed on the compressor air inlet pipeline to obtain the low-pressure switch status;

[0086] A water flow switch is installed in the water inlet pipe to obtain the water flow switch status.

[0087] It will be appreciated that, depending on the sensor type, the data signal generated may include an analog signal or a digital signal. The sensor data detection circuit is connected to at least one sensor in the heat pump subsystem, collects the sensor signal, converts it into sensor data in a predetermined format, and transmits it to the processor of the main control unit. The processor determines the operating status of the spa and / or heat pump based on the acquired sensor data, and adjusts and controls the operating parameters of the relevant spa / heat pump components to meet the user's desired usage.

[0088] Corresponding to the sensor, the sensor data detection circuit is used to perform water outlet temperature detection, water inlet temperature detection, ambient temperature detection, compressor exhaust temperature detection, compressor inlet temperature detection, evaporator / coil temperature detection, high-pressure switch status detection, low-pressure switch status detection and water flow switch status detection.

[0089] In some exemplary embodiments, the switching power supply unit includes a lightning protection circuit, an EMI filter circuit, a rectifier circuit, an input filter circuit, a power conversion circuit, a power PWM control circuit, an output rectifier filter circuit, and a protection circuit.

[0090] In some exemplary embodiments, the main control unit further includes: a peripheral communication module, configured to receive operation instructions from an operation panel or an external device to instruct the processor to control the operation of the SPA subsystem and / or the heat pump subsystem.

[0091] Among them, the peripheral communication module is an RS485 communication circuit; the operation instructions include one or more of the following: water level setting instructions, hot and cold mode instructions, SPA component switch instructions, etc.

[0092] In some exemplary embodiments, the main control unit further includes: a voltage stabilizing circuit, the output end of the switching power supply unit is connected to the input end of the voltage stabilizing circuit, and the output end of the voltage stabilizing circuit supplies power to the main control unit.

[0093] The present application also provides a heat pump SPA integrated device, such as Figure 4 Shown, including:

[0094] The heat pump SPA integrated control device 10 and the heat pump subsystem 30 as described in any embodiment of the present application;

[0095] The heat pump subsystem 30 includes the following first heat pump components: a fan 301 and a compressor 302 .

[0096] In some exemplary embodiments, the heat pump subsystem 30 and the heat pump SPA integrated control device 10 are integrated and arranged in the same carrier. For example, they are integrated and arranged in the same housing, that is, the components, sensors, and related circuits included in the heat pump subsystem and the heat pump SPA integrated control device are all integrated and arranged in the same housing.

[0097] In some exemplary embodiments, the heat pump SPA integrated device further includes: a control panel, which is provided on the handheld operator or embedded in the cylinder body of the SPA subsystem, and is used to receive user operation instructions.

[0098] The control panel exchanges data with the heat pump SPA integrated control device through the peripheral communication module.

[0099] In some exemplary embodiments, the heat pump subsystem 30 further includes sensors for acquiring the sensing data, which are disposed at required locations.

[0100] In some exemplary embodiments, the condenser is a condenser integrated with water pipes for heat / cold exchange.

[0101] In some exemplary embodiments, Figure 5 As shown, the integrated device further includes: a SPA subsystem 20, the SPA subsystem 20 includes the following SPA components: a circulation pump 203, or the SPA subsystem includes the following SPA components: a circulation pump 203, and at least one of the following SPA components: a water pump 201, an air pump 202, a disinfection component 304 and a lighting component 205.

[0102] In some exemplary embodiments, the SPA subsystem includes, in addition to the circulation pump, SPA components determined by the SPA functions provided by the integrated device. For example, a bubble bath function may also include an air pump, a hydrotherapy massage function may also include a water pump, and a water disinfection function may also include a disinfection component. In some exemplary embodiments, the SPA subsystem may also include other SPA components, not limited to those described in this embodiment.

[0103] It can be understood that the heat pump SPA integrated device including the SPA components can provide users with feature-rich SPA functions, and is also called a heat pump SPA integrated system.

[0104] In some exemplary embodiments, the first output end of the power input interface unit of the heat pump SPA integrated control device is connected to the input end of the switching power supply unit of the heat pump SPA integrated control device to output the converted low-voltage direct current; the second output end of the power input interface of the heat pump SPA integrated control device is connected to each SPA component and each first heat pump component for power supply;

[0105] The output end of the switching power supply unit is connected to the control circuit corresponding to each SPA component and the control circuit corresponding to each first heat pump component for power supply.

[0106] As can be seen, the SPA components and the first heat pump component are powered by the second output of the power input interface. The component control circuitry within the heat pump SPA integrated control device is powered by the input of the switching power supply unit. The power module within the heat pump SPA integrated control device, including the power input interface unit and the switching power supply unit, powers the entire heat pump SPA integrated device. After voltage stabilization and conversion, it provides at least two power supplies to the heat pump SPA integrated device. This integrated system control device, along with the shared power module it includes, significantly enhances the ease of installation and deployment of the heat pump SPA integrated device, ensuring stable and reliable operation.

[0107] In some exemplary embodiments, the heat pump subsystem 30 further includes the following second heat pump component: an expansion valve 303; accordingly, the first output terminal of the switching power supply unit of the heat pump SPA integrated control device is connected to the power supply terminal of the expansion valve.

[0108] In some exemplary embodiments, the heat pump subsystem 30 further includes the following first heat pump component: a four-way valve 304; accordingly, the second output end of the power input interface unit of the heat pump SPA integrated control device is connected to the power end of the four-way valve.

[0109] In some exemplary embodiments, the heat pump subsystem 30 further includes the following third heat pump components: an evaporator, a condenser;

[0110] In some exemplary embodiments, the heat pump subsystem 30 further includes the following third heat pump components: a water inlet pipe and a water outlet pipe.

[0111] The condenser is a condenser integrated with a water pipe, with a water inlet and a water outlet respectively provided at both ends, which are connected to the water inlet pipe and the water outlet pipe respectively.

[0112] In some exemplary embodiments, the heat pump subsystem is a fixed-frequency heat pump subsystem, that is, the heat pump control unit controls the components included in the heat pump subsystem to operate in coordination to achieve a fixed-frequency heat pump function.

[0113] The heat pump and spa integrated control device provided in this embodiment houses the heat pump and spa control units / modules within a single carrier, sharing a common power supply module. A unified master control unit implements the control logic for each component. The heat pump and spa centralized procurement equipment integrates the heat pump subsystem and the integrated control device, providing spa equipment manufacturers with an easy-to-install docking device to form a complete heat pump and spa system.

[0114] Although the embodiments disclosed in the present invention are as described above, the contents described are merely embodiments adopted to facilitate understanding of the present invention and are not intended to limit the present invention. Any person skilled in the art to which the present invention belongs may make any modifications and changes in the form and details of the implementation without departing from the spirit and scope disclosed in the present invention. However, the scope of patent protection of the present invention shall still be defined by the attached claims.

Claims

1. A heat pump SPA integrated control device, characterized in that: Applied to heat pump SPA integrated system, including: A main control unit, a hydrotherapy SPA control unit, a heat pump control unit, a power input interface unit, and a switching power supply unit are arranged in the same carrier. The main control unit is connected to the heat pump control unit to obtain sensor data in the heat pump subsystem and control the operation of the heat pump subsystem; the main control unit is also connected to the SPA control unit to control the operation of the SPA subsystem; The input end of the switching power supply unit is connected to the first output end of the power input interface unit, converting the high-voltage alternating current into low-voltage direct current and outputting it to the power supply ends of the main control unit, the SPA control unit and the heat pump control unit respectively; The SPA control unit includes: at least one SPA component control circuit, each for controlling the operation of the SPA component included in the corresponding SPA subsystem; the heat pump control unit includes: at least one heat pump component control circuit, each for controlling the operation of the heat pump component included in the corresponding heat pump subsystem; and also includes a sensor detection circuit for detecting and acquiring the sensor data; Wherein, the heat pump SPA integrated system includes: the SPA subsystem and the heat pump subsystem; The SPA component includes: a circulation pump; the heat pump component includes: a fan and a compressor; The sensor data includes at least one of the following: water outlet temperature, water inlet temperature, ambient temperature, compressor exhaust temperature, compressor inlet temperature, evaporator temperature, high pressure switch status, low pressure switch status, and water flow switch status.

2. The heat pump SPA integrated control device according to claim 1, characterized in that: The main control unit includes: a switch driving circuit and a processor; The at least one SPA component control circuit includes at least one first switch corresponding to the SPA component, wherein a control signal input terminal of the first switch is connected to a first output terminal of the switch driving circuit; the first switch is arranged in a power supply path between the second output terminal of the power input interface unit and the corresponding SPA component, and each first switch corresponds to a first output terminal of the switch driving circuit; The at least one heat pump assembly control circuit includes at least one second switch corresponding to the heat pump assembly, wherein a control signal input terminal of the second switch is connected to a second output terminal of the switch drive circuit; the second switch is arranged on a power supply path between the second output terminal of the power input interface unit and the corresponding heat pump assembly, and each second switch corresponds to a second output terminal of the switch drive circuit; The processor is connected to the switch driving circuit to control the on or off of the first switch and the second switch; and the second output end of the power input interface unit outputs high-voltage alternating current.

3. The heat pump SPA integrated control device according to claim 2, characterized in that: It also includes: at least one fuse protection unit; the fuse protection unit is arranged on the power supply path between the second output end of the power input interface unit and the SPA component to provide overcurrent protection; and / or is arranged on the power supply path between the second output end of the power input interface unit and the heat pump component to provide overcurrent protection.

4. The heat pump SPA integrated control device according to claim 3, characterized in that: The heat pump assembly further includes: an expansion valve; the heat pump control unit further includes: an expansion valve control circuit; The first output terminal of the switching power supply unit is connected to the power supply terminal of the expansion valve, and the processor is connected to the expansion valve control circuit to control the operating parameters of the expansion valve; The operating parameters are determined by the processor according to the sensor data and a set operating parameter reference value.

5. The heat pump SPA integrated control device according to claim 2, 3 or 4, characterized in that: The first switch is a first relay, the second switch is a second relay; the switch drive circuit is a relay drive circuit; The first output end of the relay drive circuit is connected to the control end of the coil of the first relay, and the second output end of the relay drive circuit is connected to the control end of the coil of the second relay; The two contacts of the first relay are respectively connected to the second output end of the power input interface unit and the power end of the corresponding SPA component; the two contacts of the second relay are respectively connected to the second output end of the power input interface unit and the power end of the corresponding heat pump component.

6. The heat pump SPA integrated control device according to claim 2, 3 or 4, characterized in that: The main control unit further includes: a peripheral communication module for receiving operation instructions from an operation panel or an external device to instruct the processor to control the operation of the SPA subsystem and / or the heat pump subsystem.

7. The heat pump SPA integrated control device according to claim 2, 3 or 4, characterized in that: The sensor data detection circuit is connected to at least one sensor in the heat pump subsystem, collects sensor signals, converts them into sensor data in a set format, and sends them to the processor of the main control unit.

8. A heat pump SPA integrated device, characterized in that: include: The heat pump SPA integrated control device and heat pump subsystem according to any one of claims 1 to 7; The heat pump subsystem includes the following first heat pump components: a fan and a compressor.

9. The heat pump SPA integrated device according to claim 8, characterized in that: Also includes: SPA subsystem, the SPA subsystem includes the following SPA components: a circulation pump; Alternatively, the SPA subsystem includes the following SPA components: a circulation pump, and at least one of the following SPA components: a water pump, an air pump, and a disinfection component; The first output end of the power input interface unit of the heat pump SPA integrated control device is connected to the input end of the switching power supply unit of the heat pump SPA integrated control device, and outputs the converted low-voltage direct current; the second output end of the power input interface of the heat pump SPA integrated control device is connected to each SPA component and each first heat pump component for power supply; The output end of the switching power supply unit is connected to the control circuit corresponding to each SPA component and the control circuit corresponding to each first heat pump component for power supply.

10. The heat pump SPA integrated device according to claim 7 or 8, characterized in that: The heat pump subsystem is a fixed-frequency heat pump subsystem.

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