Heat dissipation structure based on micro compressed solid-state storage hard disk module

Abstract

The utility model discloses a heat dissipation structure based on a miniature compressed solid state storage hard disk module, which relates to the technical field of memory chip modules, and comprises a flash memory module, an onboard heat dissipation sheet, a connector and an application end PCB (printed circuit board), one end of the flash memory module is fixedly connected with the top of the connector; the end part of the onboard radiating fin is fixedly arranged between the bottom of the connector and the application end PCB; a side curled edge and a tail curled edge are mounted at the edge of the onboard cooling fin, and the side curled edge is located at the long edge of the onboard cooling fin; the tail curled edge is positioned at a short edge of the onboard radiating fin, and two ends of the tail curled edge are fixedly connected with the end parts of the side curled edges; a plurality of ventilation holes are formed in the surfaces of the side curled edges and the tail curled edge; and the ventilation holes are used for quickly dissipating heat through air convection. The radiating device has the advantages of being suitable for mini PCs, light and thin laptops, tablet personal computers, all-in-one machines, game machines and other small devices, and capable of optimizing radiating efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of memory chip modules, and more particularly to a heat dissipation structure based on a micro-compressed solid-state storage hard disk module. Background Art

[0002] Three common module connection and assembly methods include embedded welding, connector slots, and board-to-board pin connections. Embedded welding refers to assembly onto a device via welding, such as eMMC and UFS. Its advantage is compactness and lightness, but its disadvantage is inconvenience in upgrading and replacing. Connector slots are connected via spring connectors and secured with screws and other structures, such as conventional memory modules and M.2 interface solid-state drives. The advantage is simple upgrading and replacement, but the spring pin structure and material limitations, such as defects in conductivity, equal length, impedance, and shielding protection, make them incapable of meeting higher frequency applications. Furthermore, the connector structure takes up space, limiting lightweight applications. With the development of small size and high density, the seismic stability of micro storage hard drive modules also tends to weaken, making them incapable of meeting the requirements of next-generation technology. Board-to-board pin connections were first used in CPUs, using high-precision, tiny board-to-board spring pins. Because the pins are extremely short and highly consistent, they are more suitable for high-frequency product applications. Among them, memory modules were the first to adopt board-to-board pin connection, giving birth to two types of compressed attached memory modules: LPCAMM2 (Low power DDRV CAMM2 module) and CAMM2 (Compression Attached Memory Module); however, board-to-board modules in the flash storage field are still in the exploratory stage, and standardized board-to-board pin connection modules and peripheral accessories such as onboard heat sinks have not yet been formed.

[0003] In this regard, the present invention provides a heat dissipation structure based on a micro-compressed solid-state storage hard disk module, which can be applied to miniaturized devices such as Mini PCs, thin and light notebooks, tablets, all-in-one computers, game consoles, etc., and can optimize heat dissipation efficiency. Utility Model Content

[0004] In order to overcome the shortcomings of the existing technology, the utility model provides a heat dissipation structure based on a micro-compressed solid-state storage hard disk module, which can be applied to miniaturized devices such as Mini PCs, thin and light notebooks, tablets, all-in-one computers, game consoles, etc., and can optimize heat dissipation efficiency.

[0005] The technical solution adopted by the present invention to solve the technical problem is: a heat dissipation structure based on a micro-compressed solid-state storage hard disk module, the improvement of which is that the heat dissipation structure based on the micro-compressed solid-state storage hard disk includes a flash memory module, an onboard heat sink, a connector, and an application-end PCB circuit board, one end of the flash memory module is fixedly connected to the top of the connector; the end of the onboard heat sink is fixedly installed between the bottom of the connector and the application-end PCB circuit board;

[0006] The edge of the onboard heat sink is installed with side curls and tail curls, the side curls are located at the long side of the onboard heat sink; the tail curls are located at a short side of the onboard heat sink, and the two ends of the tail curls are fixedly connected to the ends of the side curls; the surfaces of the side curls and the tail curls are provided with a number of ventilation holes, and the ventilation holes quickly dissipate heat through air convection.

[0007] In the above structure, screw holes are provided on the surface of the onboard heat sink, and the screw holes are close to the tail curling.

[0008] In the above structure, a screw column is fixedly installed on the top of the onboard heat sink, and the screw column is hollow and communicates with the screw hole.

[0009] In the above structure, the tail curl is provided with an avoidance gap, and the avoidance gap is located in the middle position of the tail curl and close to the screw column.

[0010] In the above structure, the heat dissipation structure based on the micro-compressed solid-state storage hard disk further includes a first fixing screw, which passes through the application-end PCB circuit board, the screw hole and the screw column in sequence.

[0011] In the above structure, a welding foot is fixedly mounted on the bottom of the heat sink, and the welding foot is close to the end of the side curling edge away from the tail curling edge.

[0012] In the above structure, the edge of the heat sink is also provided with a front curl and a positioning angle, and the positioning angle and the front curl are both located at the other short side of the board-mounted heat sink, and the positioning angle is located at both ends of the front curl; the positioning angle and the front curl are both snapped into the connector.

[0013] In the above structure, the heat dissipation structure based on the micro-compressed solid-state storage hard disk further includes a second fixing screw, which passes through the flash memory module and the connector in sequence and is inserted into the application-end PCB circuit board.

[0014] In the above structure, a gap is provided between the end of the front curl and the end of the side curl away from the tail curl, and the shape of the gap is adapted to the shape of the end of the connector.

[0015] In the above structure, the side curl is provided with a flash memory module avoidance groove, and the flash memory module avoidance groove is distributed on the side of the front curl away from the heat sink.

[0016] The beneficial effects of the present invention are as follows: the present solution realizes board-to-board pin connection through a connector and a flash memory chip, so as to be applicable to high-frequency equipment; by designing side curling edges at the long sides of the onboard heat sink and designing a tail curling edge at one short side of the onboard heat sink, and ventilation holes are distributed on the side curling edges and the tail curling edges, the ventilation holes can realize air convection between the two long sides and one short side of the onboard heat sink, so as to efficiently dissipate heat for the flash memory module; thus, the present solution can be applicable to miniaturized equipment such as Mini PCs, thin and light notebooks, tablet computers, all-in-one computers, game consoles, etc., and can optimize heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of a heat dissipation structure based on a micro-compressed solid-state storage hard disk module of the present invention;

[0018] Figure 2 This is a schematic diagram of the heat sink structure of a micro-compressed solid-state storage hard disk module in this utility model. Figure 1 ;

[0019] Figure 3 This is a schematic diagram of the heat sink structure of a micro-compressed solid-state storage hard disk module in this utility model. Figure 2

[0020] Figure 4 The utility model is a schematic structural diagram of the side curling of a heat dissipation structure based on a micro-compressed solid-state storage hard disk module. DETAILED DESCRIPTION

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0022] The following will clearly and completely describe the concept, specific structure and technical effects of the present invention in combination with the embodiments and drawings, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by technical personnel in this field without creative work are within the scope of protection of the present invention. In addition, all the connection / connection relationships involved in the patent do not refer to the direct connection of components, but refer to the fact that a better connection structure can be formed by adding or reducing connection accessories according to the specific implementation situation. The various technical features in the creation of the present invention can be combined interactively without conflicting with each other.

[0023] Reference Figure 1-4 As shown, the utility model discloses a heat dissipation structure based on a micro-compressed solid-state storage hard disk module, the heat dissipation structure based on the micro-compressed solid-state storage hard disk includes a flash memory module 1, an onboard heat sink 3, a connector 2 and an application-end PCB circuit board 4, one end of the flash memory module 1 is fixedly connected to the top of the connector 2; the end of the onboard heat sink 3 is fixedly installed between the bottom of the connector 2 and the application-end PCB circuit board 4; the edge position of the onboard heat sink 3 is installed with a side curl 7 and a tail curl 8, the side curl 7 is located at the long side of the onboard heat sink 3; the tail curl 8 is located at a short side of the onboard heat sink 3, and the two ends of the tail curl 8 are fixedly connected to the end of the side curl 7; the surfaces of the side curl 7 and the tail curl 8 are both provided with a plurality of ventilation holes 13, and the ventilation holes 13 quickly dissipate heat through air convection.

[0024] It should be noted that, in this embodiment, the flash memory module 1 is a micro-compressed solid-state storage hard disk module. Specifically, the micro-compressed solid-state storage hard disk module includes a PCB motherboard, a flash memory chip, a control chip and a circular pad matrix; wherein, the PCB motherboard is the structural basis of the entire micro-compressed solid-state storage hard disk module, and is used to provide circuit connection and mechanical support; the flash memory chip is used for data storage and reading, and this embodiment adopts the high-speed packaging specification BGA154Ba ll to increase the transmission frequency; the control chip is responsible for managing the data transmission and access operations of the flash memory chip, and can perform basic operations such as reading, writing and erasing data, and also undertakes functions such as error detection and correction, data encryption, etc.; the circular pad matrix is ​​used to provide connection points to realize the board-to-board pin connection between the PCB motherboard and the application-end PCB circuit board 4, which is suitable for high-frequency equipment; the connector 2 is used to connect the flash memory module 1 and the application-end PCB circuit board 4, and the connector 2 is designed with spring pins, which contact the circular pad matrix to realize the board-to-board pin connection between the flash memory module 1 and the application-end PCB circuit board 4, which is suitable for high-frequency products; the application-end PCB circuit board 4 is used to connect to a specific application device to complete data input and output; the on-board heat sink 3 is used to reduce the operating temperature of the flash memory module 1 to prevent performance degradation or damage caused by overheating; in the specific implementation of the present utility model, the connector 2 contacts the circular pad matrix of the flash memory module 1 through the spring pins to realize the board-to-board pin connection between the flash memory module 1 and the application-end PCB circuit board 4, which is more suitable for high-frequency products, thereby being applicable to Min Miniaturized devices such as iPCs, thin and light notebooks, tablets, all-in-one computers, and game consoles; the onboard heat sink 3 is designed with side curling edges 7 on a pair of long sides and a tail curling edge 8 on a short side to form a three-sided enclosure structure. Together with the connector 2, it forms an onboard shield, providing electromagnetic interference shielding and ESD protection on the application-end PCB circuit board 4. Ventilation holes 13 are provided on both the side curling edges 7 and the tail curling edge 8, enabling air convection for rapid heat dissipation and preventing heat accumulation, thereby improving heat dissipation efficiency. Furthermore, the onboard heat sink 3 is made of high-quality aluminum alloy and copper alloy, and their excellent thermal conductivity further enhances heat dissipation efficiency. Therefore, this embodiment is suitable for miniaturized devices such as mini PCs, thin and light notebooks, tablets, all-in-one computers, and game consoles, and can optimize heat dissipation efficiency.

[0025] Reference Figure 1-Figure 3As shown, the surface of the onboard heat sink 3 is provided with a screw hole, and the screw hole is close to the tail curl 8; a screw column 12 is fixedly installed on the top of the onboard heat sink 3, and the screw column 12 is hollow and communicates with the screw hole; the heat dissipation structure based on the micro-compressed solid-state storage hard disk also includes a first fixing screw 5, which passes through the application end PCB circuit board 4, the screw hole and the screw column 12 in sequence.

[0026] It should be noted that, in this embodiment, the design of the screw hole, screw column 12 and the first fixing screw 5 can fix the end of the onboard heat sink 3 close to the screw hole to the onboard heat sink 3 and the application end PCB circuit board 4 to ensure the stability of the entire heat dissipation structure.

[0027] Reference Figure 3 As shown, the tail curl 8 is provided with an escape gap 14 , and the escape gap 14 is located in the middle of the tail curl 8 and close to the screw column 12 .

[0028] It should be noted that, in this embodiment, the avoidance gap 14 is designed to facilitate the assembly of the screw column 12 to reduce the difficulty of installing the entire heat dissipation structure.

[0029] Reference Figure 2 As shown, a welding foot 11 is fixedly mounted on the bottom of the heat sink, and the welding foot 11 is close to the end of the side curling edge 7 away from the tail curling edge 8.

[0030] It should be noted that, in this embodiment, the soldering feet 11 are designed to further enhance the stability of the installation between the onboard heat sink 3 and the application-end PCB circuit board 4 .

[0031] Continue to refer to Figure 2 As shown, a front curl 9 and a positioning angle 10 are also provided at the edge of the heat sink. The positioning angle 10 and the front curl 9 are both located at the other short side of the onboard heat sink 3, and the positioning angle 10 is located at both ends of the front curl 9; the positioning angle 10 and the front curl 9 are both snap-connected with the connector 2.

[0032] It should be noted that, in this embodiment, the front curling edge 9 and the positioning angle 10 are designed to engage with the connector 2 to ensure the stability of the installation between the connector 2 and the onboard heat sink 3.

[0033] Reference Figure 1 As shown, the heat dissipation structure based on the micro-compressed solid-state storage hard disk further includes a second fixing screw 6, which passes through the flash memory module 1 and the connector 2 in sequence and is inserted into the application-end PCB circuit board 4.

[0034] It should be noted that, in this embodiment, the second fixing screw 6 is designed to fix the end of the onboard heat sink 3 close to the connector 2 to the flash memory chip, the connector 2 and the application-end PCB circuit board 4, further ensuring the stability of the entire heat dissipation structure.

[0035] A gap is provided between the end of the front curl 9 and the end of the side curl 7 away from the tail curl 8 , and the shape of the gap matches the shape of the end of the connector 2 .

[0036] It should be noted that, in this embodiment, the notch is designed to adapt to the assembly of the connector 2 to ensure the compatibility between the onboard heat sink 3 and the connector 2 .

[0037] Reference Figure 4 As shown, a flash memory module avoidance groove 15 is provided on the side curl 7, and the flash memory module avoidance groove 15 is distributed on the side of the front curl 9 away from the heat sink.

[0038] It should be noted that, in this embodiment, the flash memory module avoidance groove 15 is designed to facilitate the assembly between the flash memory module 1 and the onboard heat sink 3 .

[0039] The above is a specific description of the preferred implementation of the present invention, but the invention of the present invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A heat dissipation structure based on a micro-compressed solid-state storage hard disk module, characterized in that: The heat dissipation structure based on the micro-compressed solid-state storage hard disk includes a flash memory module, an onboard heat sink, a connector, and an application-end PCB circuit board. One end of the flash memory module is fixedly connected to the top of the connector; the end of the onboard heat sink is fixedly installed between the bottom of the connector and the application-end PCB circuit board; The edge of the onboard heat sink is installed with side curls and tail curls, the side curls are located at the long side of the onboard heat sink; the tail curls are located at a short side of the onboard heat sink, and the two ends of the tail curls are fixedly connected to the ends of the side curls; the surfaces of the side curls and the tail curls are provided with a number of ventilation holes, and the ventilation holes quickly dissipate heat through air convection.

2. The heat dissipation structure based on a micro-compressed solid-state storage hard disk module according to claim 1, characterized in that: The surface of the onboard heat sink is provided with screw holes, and the screw holes are close to the tail curling.

3. The heat dissipation structure based on a micro-compressed solid-state storage hard disk module according to claim 2, characterized in that: A screw column is fixedly installed on the top of the onboard heat sink. The screw column is hollow and communicates with the screw hole.

4. The heat dissipation structure based on a micro-compressed solid-state storage hard disk module according to claim 3, characterized in that: The tail curl is provided with an avoidance gap, and the avoidance gap is located in the middle position of the tail curl and close to the screw column.

5. The heat dissipation structure based on a micro-compressed solid-state storage hard disk module according to claim 3, characterized in that: The heat dissipation structure based on the micro-compressed solid-state storage hard disk also includes a first fixing screw, which passes through the application-end PCB circuit board, the screw hole and the screw column in sequence.

6. The heat dissipation structure based on a micro-compressed solid-state storage hard disk module according to claim 1, characterized in that: A welding foot is also fixedly mounted on the bottom of the heat sink, and the welding foot is close to the end of the side curling edge away from the tail curling edge.

7. The heat dissipation structure based on a micro-compressed solid-state storage hard disk module according to claim 1, characterized in that: The edge of the heat sink is also provided with a front curl and a positioning angle. The positioning angle and the front curl are both located at the other short side of the onboard heat sink, and the positioning angle is located at both ends of the front curl; the positioning angle and the front curl are both snapped into contact with the connector.

8. The heat dissipation structure based on a micro-compressed solid-state storage hard disk module according to claim 1, characterized in that: The heat dissipation structure based on the micro-compressed solid-state storage hard disk also includes a second fixing screw, which passes through the flash memory module and the connector in sequence and is inserted into the application-end PCB circuit board.

9. The heat dissipation structure based on a micro-compressed solid-state storage hard disk module according to claim 7, characterized in that: A gap is provided between the end of the front curl and the end of the side curl away from the tail curl, and the shape of the gap is adapted to the shape of the connector end.

10. The heat dissipation structure based on a micro-compression solid-state storage hard disk module according to claim 1, characterized in that: The side curl is provided with a flash memory module avoidance groove, and the flash memory module avoidance groove is distributed on a side of the front curl away from the heat sink.

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