Miniature compressed solid-state storage hard disk module

Abstract

The utility model discloses a miniature compressed solid-state storage hard disk module, which relates to the technical field of memory chip modules, and comprises a PCB (printed circuit board) main board comprising a surface A and a surface B; the flash memory chips are welded on the A surface and the B surface of the PCB mainboard, and only one flash memory chip is welded on each of the A surface and the B surface; the control chip is welded on the A surface of the PCB mainboard; and the circular bonding pad matrix is distributed at the edge position of the B surface of the PCB mainboard. The beneficial effects of the utility model are that: can be applicable to Mini PC, light and thin notebook computer, tablet personal computer, all-in-one machine, game machine and other miniaturized application scenarios, compared with traditional small size module, occupation space is small, heat dissipation efficiency is high.

Description

Technical Field

[0001] The utility model relates to the technical field of memory chip modules, and more particularly to a micro-compressed solid-state storage hard disk module. Background Art

[0002] There are three common connection and assembly methods for modules: embedded welding, connector slots, and board-to-board pin connections. Embedded soldering involves soldering devices together, such as eMMC and UFS. Its advantages are compactness and lightness, but its disadvantage is inconvenient upgrades and replacements. Connector slots, such as conventional memory modules and M.2 solid-state drives, are connected via spring-loaded connectors secured with screws and other structures. This approach offers the advantage of easy upgrades and replacements, but limitations in the spring-loaded pin structure and material, such as conductivity, length consistency, impedance, and shielding, prevent them from meeting the requirements of higher-frequency applications. Furthermore, the space occupied by the connector structure limits lightweight applications. The trend toward smaller, higher-density storage also weakens the seismic stability of micro-storage drive modules, making them unable to meet the demands of next-generation technologies. Board-to-board pin connections were first used in CPUs, utilizing high-precision, tiny spring-loaded pins. Due to their short, highly consistent pins, they are more suitable for high-frequency applications. Memory modules pioneered the use of board-to-board pin connections, resulting in the LPCAMM2 (Low Power DDRV CAMM2 module) and CAMM2 (Compression Attached Memory Module). However, standardized board-to-board pin connections have yet to be established in the flash memory storage sector.

[0003] To this end, the present invention provides a micro-compressed solid-state storage hard disk module, which can be applied to miniaturized application scenarios such as MiniPC, thin and light notebooks, tablet computers, all-in-one computers, game consoles, etc. Compared with traditional small-sized modules, it occupies less space and has higher heat dissipation efficiency. Utility Model Content

[0004] In order to overcome the shortcomings of the existing technology, the utility model provides a micro-compressed solid-state storage hard disk module, which can be used in miniaturized application scenarios such as Mini PCs, thin and light notebooks, tablets, all-in-one computers, game consoles, etc. Compared with traditional small-sized modules, it occupies less space and has higher heat dissipation efficiency.

[0005] The technical solution adopted by the present invention to solve the technical problem is: a micro-compressed solid-state storage hard disk module, the improvement of which is that the micro-compressed solid-state storage hard disk module includes:

[0006] PCB main board, including side A and side B;

[0007] The flash memory chip is soldered to the A and B sides of the PCB mainboard, and only one flash memory chip is soldered on each side.

[0008] The control chip is soldered to the A side of the PCB motherboard;

[0009] The circular pad matrix is ​​distributed at the edge of the B side of the PCB motherboard.

[0010] In the above structure, the PCB mainboard is 28mm-30mm long and 20mm-22mm wide, occupying an area of ​​560mm. 2 -660mm 2 between.

[0011] In the above structure, a first mounting hole, a second mounting hole and a third mounting hole are provided on the PCB main board. The first mounting hole and the second mounting hole are respectively located at the two ends of the circular pad matrix and are both close to the corners of the PCB main board; the third mounting hole is located in the middle position of the side of the PCB main board away from the circular pad matrix.

[0012] In the above structure, a first positioning groove and a second positioning groove are further provided on the PCB main board; the first positioning groove and the second positioning groove are respectively located on both sides of the PCB main board, and the first positioning groove is close to the first mounting hole, and the second positioning groove is close to the second mounting hole.

[0013] In the above structure, the size of the first positioning groove is larger than that of the second positioning groove / the size of the first positioning groove is smaller than that of the second positioning groove.

[0014] In the above structure, a third positioning groove and a fourth positioning groove are further provided on the PCB main board; the third positioning groove and the fourth positioning groove are respectively located on both sides of the third mounting hole.

[0015] In the above structure, the size of the third positioning groove is larger than that of the fourth positioning groove.

[0016] In the above structure, the welding position of the flash memory chip on the A side is symmetrical to the welding position on the B side.

[0017] In the above structure, the micro-compressed solid-state storage hard disk module further includes exposed copper foil, and the exposed copper foil is arranged around the edge of the PCB mainboard.

[0018] The beneficial effects of the present invention are as follows: this solution realizes board-to-board pin connection with the application-end PCB circuit board through a circular pad matrix, which occupies a smaller area than the traditional small-size storage hard disk that uses a connector slot for connection; it also realizes dispersed heat generation by designing flash memory chips on both the A and B sides of the PCB mainboard, which has higher heat dissipation efficiency than the traditional single-sided installation of flash memory chips that generates concentrated heat; it can be applied to miniaturized application scenarios such as Mini PCs, thin and light notebooks, tablet computers, all-in-one computers, game consoles, etc., and compared with traditional small-size modules, it has a small size and high heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the overall structure of a micro-compressed solid-state storage hard disk module of the utility model. Figure 1 ;

[0020] Figure 2 This is a schematic diagram of the overall structure of a micro-compressed solid-state storage hard disk module of the utility model. Figure 2 ;

[0021] Figure 3 This is a schematic diagram of the overall structure of a micro-compressed solid-state storage hard disk module of the utility model. Figure 3 ;

[0022] Figure 4 This is a schematic diagram of the overall structure of a micro-compressed solid-state storage hard disk module of the utility model. Figure 4 ;

[0023] Figure 5 This is a schematic diagram of the overall structure of a micro-compressed solid-state storage hard disk module of the utility model. Figure 5 . DETAILED DESCRIPTION

[0024] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0025] The following will clearly and completely describe the concept, specific structure and technical effects of the present invention in combination with the embodiments and drawings, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by technical personnel in this field without creative work are within the scope of protection of the present invention. In addition, all the connection / connection relationships involved in the patent do not refer to the direct connection of components, but refer to the fact that a better connection structure can be formed by adding or reducing connection accessories according to the specific implementation situation. The various technical features in the creation of the present invention can be combined interactively without conflicting with each other.

[0026] Reference Figure 1-5 As shown, the present invention discloses a micro-compressed solid-state storage hard disk module, which includes:

[0027] PCB main board 1, including side A and side B, and the PCB main board is 28mm-30mm long, 20mm-22mm wide, and occupies an area of ​​560mm 2 -660mm 2 between;

[0028] Flash memory chip 2 is soldered to both side A and side B of PCB mainboard 1. Only one flash memory chip 2 is soldered to each side A and B. The soldering position of flash memory chip 2 on side A is symmetrical to that on side B.

[0029] The control chip 3 is soldered to the A side of the PCB mainboard 1;

[0030] The circular pad matrix 4 is distributed at the edge of the B surface of the PCB main board 1 .

[0031] It should be noted that, in this embodiment, the PCB motherboard 1 is the basic structure of the entire micro-compressed solid-state storage hard disk module, which is used to provide circuit connection and mechanical support; the flash memory chip 2 is used for data storage and reading, and this embodiment adopts the high-speed packaging specification BGA152 Ball to improve the efficiency of data storage and reading; the control chip 3 is responsible for managing the data transmission and access operations of the flash memory chip 2, and can perform basic operations such as data reading, writing and erasing, and also undertakes functions such as error detection and correction, and data encryption; the circular pad matrix 4 is used to provide connection points to realize the board-to-board pin connection between the PCB motherboard 1 and the application end PCB circuit board; when the utility model is specifically implemented, since the PCB motherboard 1 used is 28mm-30mm long and 20mm-22mm wide, it is a micro-sized memory hard disk module, so it can be applied to Mini The present embodiment is applicable to miniaturized application scenarios such as PCs, thin and light notebooks, tablet computers, all-in-one computers, and game consoles. The board-to-board pin connection between the PCB motherboard 1 and the application-end PCB circuit board is achieved through circular pads, eliminating the need to reserve space for connectors. The occupied space is between 560 square millimeters and 660 square millimeters. Traditional small-sized storage hard drives are connected using connector slots. In actual applications, including connectors, the area occupied by the present embodiment exceeds 750 square millimeters. It is obvious that the present embodiment occupies less space. In addition, the present embodiment can disperse heat by installing flash memory chips 2 on both sides of the PCB motherboard 1. Compared with the traditional solution where heat is concentrated on a single flash memory chip 2, the present embodiment has a better heat dissipation effect. Therefore, the present embodiment is applicable to miniaturized application scenarios such as Mini PCs, thin and light notebooks, tablet computers, all-in-one computers, and game consoles. Compared with traditional small-sized modules, the present embodiment is small in size and has high heat dissipation efficiency.

[0032] Reference Figure 2-5 As shown, the PCB main board 1 is provided with a first mounting hole 6, a second mounting hole 7 and a third mounting hole 8. The first mounting hole 6 and the second mounting hole 7 are respectively located at the two ends of the circular pad matrix 4, and are both close to the corners of the PCB main board 1; the third mounting hole 8 is located in the middle position of the side of the PCB main board 1 away from the circular pad matrix 4.

[0033] It should be noted that, in this embodiment, the first mounting hole 6, the second mounting hole 7 and the third mounting hole 8 are designed to fix the PCB mainboard 1 to the application-end PCB circuit board; and the first mounting hole 6, the second mounting hole 7 and the third mounting hole 8 are distributed in a triangular shape. The design here applies the stability characteristics of the triangle to ensure that the PCB mainboard 1 can be firmly fixed on the application-end PCB circuit board.

[0034] Continue to refer to Figure 2-5 As shown, the PCB main board 1 is further provided with a first positioning groove 9 and a second positioning groove 10; the first positioning groove 9 and the second positioning groove 10 are respectively located on both sides of the PCB main board 1, and the first positioning groove 9 is close to the first mounting hole 6, and the second positioning groove 10 is close to the second mounting hole 7; the size of the first positioning groove 9 is larger than the size of the second positioning groove 10 / the size of the first positioning groove 9 is smaller than the size of the second positioning groove 10.

[0035] It should be noted that, in this embodiment, the first positioning groove 9 and the second positioning groove 10 are designed to be able to identify the interface type adapted by the circular solder pad matrix 4. Specifically, taking PC I e x4 and SATA as examples, if the size of the first positioning groove 9 is larger than the size of the second positioning groove 10, the interface adapted by the circular solder pad matrix 4 is SATA; if the size of the first positioning groove 9 is smaller than the size of the second positioning groove 10, the interface adapted by the circular solder pad matrix 4 is PC I e x4.

[0036] Continue to refer to Figure 2-5 As shown, a third positioning groove 11 and a fourth positioning groove 12 are also provided on the PCB main board 1; the third positioning groove 11 and the fourth positioning groove 12 are respectively located on both sides of the third mounting hole 8; the size of the third positioning groove 11 is larger than that of the fourth positioning groove 12.

[0037] It should be noted that, in this embodiment, the design of the third positioning groove 11 and the fourth positioning groove 12 can accurately position the micro compression solid-state storage hard disk module during the installation process, ensuring the accuracy of the installation of the micro compression solid-state storage hard disk module.

[0038] Continue to refer to Figure 2-5As shown, the micro-compressed solid-state storage hard disk module further includes a bare copper foil 5 , which is arranged around the edge of the PCB mainboard 1 .

[0039] It should be noted that, in this embodiment, the exposed copper foil 5 is subjected to anti-oxidation treatment such as gold plating to maintain good electrical conductivity and thermal conduction. The exposed copper foil 5 is grounded and connected to the bottom metal heat sink and the application end PCB circuit board through screws, which can achieve the functions of shielding electromagnetic interference, protecting static electricity and dissipating heat.

[0040] The above is a specific description of the preferred implementation of the present invention, but the invention of the present invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A micro-compressed solid-state storage hard disk module, characterized in that: The micro-compressed solid-state storage hard disk module includes: PCB main board, including side A and side B; The flash memory chip is soldered to the A and B sides of the PCB mainboard, and only one flash memory chip is soldered on each side. The control chip is soldered to the A side of the PCB motherboard; The circular pad matrix is ​​distributed at the edge of the B side of the PCB motherboard.

2. The micro-compressed solid-state storage hard disk module according to claim 1, characterized in that: The PCB mainboard is 28mm-30mm long and 20mm-22mm wide, occupying an area of ​​560mm 2 -660mm 2 between.

3. The micro-compressed solid-state storage hard disk module according to claim 2, characterized in that: The PCB main board is provided with a first mounting hole, a second mounting hole and a third mounting hole. The first mounting hole and the second mounting hole are respectively located at the two ends of the circular pad matrix and are both close to the corners of the PCB main board; the third mounting hole is located in the middle position of the side of the PCB main board away from the circular pad matrix.

4. The micro-compressed solid-state storage hard disk module according to claim 3, characterized in that: The PCB main board is also provided with a first positioning groove and a second positioning groove; the first positioning groove and the second positioning groove are respectively located on two sides of the PCB main board, and the first positioning groove is close to the first mounting hole, and the second positioning groove is close to the second mounting hole.

5. The micro-compressed solid-state storage hard disk module according to claim 4, characterized in that: The size of the first positioning groove is larger than that of the second positioning groove / the size of the first positioning groove is smaller than that of the second positioning groove.

6. The micro-compressed solid-state storage hard disk module according to claim 3, characterized in that: The PCB main board is further provided with a third positioning groove and a fourth positioning groove; the third positioning groove and the fourth positioning groove are respectively located on both sides of the third mounting hole.

7. The micro-compressed solid-state storage hard disk module according to claim 6, characterized in that: The size of the third positioning groove is larger than that of the fourth positioning groove.

8. The micro-compressed solid-state storage hard disk module according to claim 1, characterized in that: The welding position of the flash memory chip on the A side is symmetrical to the welding position on the B side.

9. The micro-compressed solid-state storage hard disk module according to claim 1, characterized in that: The micro-compressed solid-state storage hard disk module further includes exposed copper foil, which is arranged around the edge of the PCB mainboard.

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