Cable, wire structure and communication system

Abstract

The embodiment of the utility model provides a cable, a wire structure and a communication system, and relates to the field of optical devices. The problem that an existing cable is large in occupied space is solved. According to the specific scheme, the cable comprises an insulation sleeve and a wire structure. The wire structure includes a core, a cladding, and a conductive layer. The cladding layer surrounds the peripheral surface of the fiber core, and the conductive layer is arranged on the peripheral surface of the cladding layer; and the insulating sleeve surrounds the outer peripheral surface of the conductive layer. And a coating layer is also arranged between the cladding and the conductive layer. The cable can transmit both optical signals and electric signals. And compared with respective arrangement of an electric signal line and an optical signal line, the cable is high in integration level and small in occupied space. In addition, the wire structure can be seen as a conductive layer and a cable are sequentially arranged on the outer peripheral surface of the optical fiber. And the cable cost is low. In the embodiment that the conducting layer and the insulating sleeve are both made of transparent materials, the transparent cable has the performance close to invisibility, and the disorder degree is reduced.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of optical devices, and in particular to a cable, a line structure, and a communication system. Background Art

[0002] Cables are crucial components in communications networks. Typically, one end of a cable connects to one device and the other to another. Cables transmit signals and energy between the two devices. However, when the wiring between devices is complex, cables can take up a lot of space. Utility Model Content

[0003] The present application provides a cable, a wire structure and a communication system, aiming to improve the problem that existing cables occupy a large space.

[0004] In order to achieve the above objectives, this application adopts the following technical solutions.

[0005] In a first aspect, embodiments of the present application provide a cable. The cable includes an insulating sheath and a wire structure. The wire structure includes a fiber core, a cladding, and a conductive layer. The cladding surrounds the outer circumference of the fiber core, the conductive layer is disposed on the outer circumference of the cladding, and the insulating sheath surrounds the outer circumference of the conductive layer.

[0006] As a result, optical signals can be transmitted within the fiber core. The conductive layer with conductive properties can transmit electrical signals, and the insulating sleeve surrounding the outer peripheral surface of the conductive layer can prevent the outer peripheral surface of the conductive layer from contacting other conductive structures, causing short circuits or unstable electrical signal transmission. The cable has the function of transmitting both electrical and optical signals. Compared with components in which electrical signal lines and optical signal lines are separately provided, the cable provided in the embodiment of the present application has the advantages of high integration and small space occupation, and reduces the number of lines, effectively improving the problem of cluttered lines.

[0007] In conjunction with the first aspect, in some achievable embodiments, the conductive layer surrounds the outer circumference of the cladding. This increases the area of ​​the conductive layer and allows the conductive layer to uniformly cover the entire outer circumference of the cladding. This simplifies the manufacturing process of the conductive layer and reduces the cost of cable manufacturing.

[0008] In conjunction with the first aspect, in some achievable embodiments, the conductive layer includes a conductive coating and a chemically plated film. The conductive coating is disposed on the outer circumference of the cladding, and the chemically plated film is disposed on the outer circumference of the conductive coating. The conductive coating is a conductive coating; and the chemically plated film is a chemically plated film.

[0009] This improves the adhesion between the conductive coating and the cladding, enhancing the adhesion between the conductive layer and the cladding. Furthermore, the rough surface of the conductive coating provides a fulcrum for the chemical plating process. The low roughness of the chemical plating results in a smoother conductive layer. Furthermore, the chemical plating process is simple and cost-effective. Furthermore, chemical plating improves the conductivity of the conductive layer, reducing signal loss during signal transmission.

[0010] In conjunction with the first aspect, in some possible implementations, the conductive layer further includes an electroplated conductive film, which is disposed on the outer circumference of the chemically plated film. In this manner, the electroplated conductive film is disposed on the outer circumference of the chemically plated film. The electroplated conductive film is more uniform and continuous, further improving the conductivity and smoothness of the conductive layer.

[0011] In conjunction with the first aspect, in some possible implementations, the conductive layer comprises a transparent conductive material, and the insulating sleeve comprises a transparent material. In this manner, the transparent conductive material has good light transmittance, forming a transparent conductive layer. The cable also exhibits transparency, reducing cable visibility. This can further reduce the problem of cluttered wiring in cables with low visibility. Highly transparent cables have a minimal impact on the aesthetics of the environment.

[0012] In combination with the first aspect, in some feasible embodiments, the wire structure further includes a coating layer, and the coating layer is located between the cladding and the conductive layer. In this way, the coating layer can reduce the influence of the conductive layer on the cladding, and similarly, the coating layer can reduce the influence of the cladding on the conductive layer. In addition, the core, cladding and coating layer can be regarded as an optical fiber structure. In the process of preparing the cable, an optical fiber structure including a core, a cladding and a coating layer can be used as a raw material. The cable can be prepared by forming a conductive layer and an insulating sleeve outside the optical fiber structure. The preparation process of the cable is simple, and a low-cost optical fiber structure can be used as a raw material, thereby reducing the preparation cost. There is no need to remove the coating layer from the optical fiber structure including the core, the cladding and the coating layer, which saves process flow.

[0013] In conjunction with the first aspect, in some achievable embodiments, the cable includes multiple wire structures, the insulating sheath surrounds the outer circumference of the conductive layer of each wire structure, and the conductive layers of any two wire structures are electrically isolated. In this way, a single cable can integrate multiple wire structures, further improving cable integration and effectively alleviating the problem of cable clutter caused by a large number of cables.

[0014] In conjunction with the first aspect, in some possible implementations, the cable further includes an optical fiber, and the insulating sheath further surrounds the outer circumference of the optical fiber. In this manner, the cable comprises a wire structure capable of transmitting both electrical and optical signals, and the cable further includes an optical fiber for transmitting optical signals, making the cable adaptable to a wider range of scenarios and expanding its scope of use.

[0015] In combination with the first aspect, in some feasible embodiments, the cable includes a plurality of optical fibers, and the insulating sheath surrounds outer circumferences of the plurality of optical fibers.

[0016] In a second aspect, embodiments of the present application provide a communication system. The communication system includes a first communication device, a second communication device, and any one of the cables provided in the first aspect above, wherein the first communication device and the second communication device are connected via the cable. Due to the high integration of the cable, the number of cables between the first communication device and the second communication device is reduced, which facilitates aesthetically pleasing wiring.

[0017] In a third aspect, embodiments of the present application provide a fiber structure. The fiber structure includes a fiber core, a cladding, a conductive coating, and a chemically plated film. The cladding surrounds the outer circumference of the fiber core; the conductive coating is disposed on the outer circumference of the cladding; and the chemically plated film is disposed on the outer circumference of the conductive coating.

[0018] In combination with the third aspect, in some feasible embodiments, the wire structure further includes an electroplated conductive film, and the electroplated conductive film is provided on an outer peripheral surface of the chemically plated film.

[0019] In combination with the third aspect, in some achievable embodiments, the wire structure further includes a coating layer, wherein the coating layer is located between the cladding layer and the conductive layer.

[0020] Regarding the beneficial effects of the second and third aspects, reference may be made to the description of any optional implementation in the first aspect, which will not be repeated here. Based on the implementation provided in the above aspects, this application can also be further combined to provide more implementations. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A structural diagram of a communication system.

[0022] Figure 2 A schematic diagram of the structure of a cable provided in an embodiment of the present application.

[0023] Figure 3 A schematic diagram of the structure of another cable provided in an embodiment of the present application.

[0024] Figure 4 A schematic cross-sectional view of a conductive layer and a cladding provided in an embodiment of the present application.

[0025] Figure 5 A schematic diagram of the structure of another cable provided in an embodiment of the present application.

[0026] Figure 6 A schematic structural diagram of another cable provided in an embodiment of the present application.

[0027] Figure 7 A structural diagram of another cable provided in an embodiment of the present application.

[0028] Figure 8 A schematic structural diagram of a multi-fiber cable provided in an embodiment of the present application.

[0029] Figure 9 A schematic structural diagram of another multi-fiber cable provided in an embodiment of the present application.

[0030] In the figure: 10-communication system; 20-first communication device; 30-second communication device; 100-cable; 110-insulating sleeve; 121-fiber core; 122-cladding; 123-conductive layer; 101-conductive coating; 102-chemical plating; 103-electroplated conductive film; 124-coating layer; 120-line structure; 130-optical fiber. DETAILED DESCRIPTION

[0031] The present application provides a cable, which includes an insulating sleeve and a wire structure arranged in the insulating sleeve, and the wire structure includes a fiber core, a cladding and a conductive layer from the inside out. The fiber core is used to transmit optical signals, and the conductive layer is used to transmit electrical signals. The cable has the function of transmitting both optical and electrical signals. Optical signals and electrical signals can be transmitted between two devices through a single cable, effectively improving the problems of cluttered cables and large space occupied. Furthermore, a coating layer can be included between the cladding and the conductive layer. In this way, the cable can be prepared by arranging a conductor layer and an insulating sleeve outside the optical fiber. Optical fiber can be used as raw material, and the preparation process is simple, which is conducive to reducing costs.

[0032] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0033] In the following, the terms "first," "second," etc. are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the quantity of the technical features indicated. Therefore, a feature specified as "first," "second," etc. may explicitly or implicitly include one or more of the features.

[0034] In addition, in the embodiments of the present application, directional terms such as "up", "down", "left", "right", "horizontal" and "vertical" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to changes in the orientation of the components in the drawings.

[0035] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, an electrical connection, a detachable connection, or an integrated connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0036] Figure 1 FIG1 is a schematic diagram of the structure of a communication system 10. Figure 1 The communication system 10 includes a first communication device 20, a second communication device 30, and a cable 100. One end of the cable 100 is connected to the first communication device 20, and the other end of the cable 100 is connected to the second communication device 30. The first communication device 20 and the second communication device 30 communicate through the cable 100.

[0037] Exemplarily, the communication system 10 may be various types of long-distance optical communication systems using the cable 100 as a communication carrier, such as a common metropolitan area optical network system.

[0038] The embodiments of the present application do not limit the types of the first communication device 20 and the second communication device 30. For example, the first communication device 20 may be an optical line terminal (OLT), an optical terminal, an optical switch, etc. The second communication device 30 may be an optical modem, a router, a camera, etc.

[0039] In addition, in some embodiments, the cable 100 can also be used in devices that have high requirements for optical signal transmission and conductive performance, such as the cable 100 can be used in sensors, etc.

[0040] In an embodiment of the present application, the cable 100 can transmit optical signals and electrical signals. The cable 100 has a high degree of integration, which reduces the space occupied by the line between the first communication device 20 and the second communication device 30, and effectively improves the problem of cluttered lines between the first communication device 20 and the second communication device 30.

[0041] The embodiment of the present application does not limit the number of cables 100 connecting the first communication device 20 and the second communication device 30. For example, the number of cables 100 connecting the first communication device 20 and the second communication device 30 can be one, two, three or more.

[0042] Figure 2 This is a schematic diagram of the structure of a cable 100 provided in an embodiment of the present application. Figure 2The cable 100 includes an insulating sleeve 110 and a wire structure 120. The insulating sleeve 110 surrounds the outer circumference of the wire structure 120. The wire structure 120 includes a core 121, a cladding 122, and a conductive layer 123. The cladding 122 surrounds the outer circumference of the core 121, and the conductive layer 123 is disposed on the outer circumference of the cladding 122. The insulating sleeve 110 surrounds the outer circumference of the conductive layer 123.

[0043] In this way, optical signals can be transmitted within the fiber core 121. The conductive layer 123, which has conductive properties, can transmit electrical signals. The insulating sleeve 110 surrounding the outer circumference of the conductive layer 123 can prevent the outer circumference of the conductive layer 123 from contacting other conductive structures, causing short circuits or unstable electrical signal transmission. The cable 100 has the function of transmitting both electrical and optical signals. Compared with components in which electrical signal lines and optical signal lines are provided separately, the cable 100 provided in the embodiment of the present application has the advantages of high integration and small space occupation, and reduces the number of lines, effectively improving the problem of cluttered lines.

[0044] In addition, the fiber core 121 and the cladding 122 both have good bendability, and the conductive layer 123 disposed outside the cladding 122 also has good ductility, so that the cable 100 has excellent bending performance.

[0045] The outer peripheral surface of the core 121 mentioned above refers to the surface along the circumference of the core 121. Taking the cylindrical shape of the core 121 as an example, the outer peripheral surface of the core 121 is a cylindrical surface. The description of the other outer peripheral surfaces in the text is similar.

[0046] For example, the minimum bend radius of cable 100 is greater than or equal to 20 mm. This small bend radius means that the cable 100 can be safely bent within a certain range at any given point. The cable 100 exhibits an excess loss of less than or equal to 0.5 dB at 1550 nm and less than or equal to 1.0 dB at 1625 nm. When the cable 100 is loosely wound with a radius of 20 mm, the electrical conductivity remains above 70%.

[0047] Compared to conductive wires such as copper wires, the cable 100 provided in the embodiment of the present application has good bending performance and can transmit optical signals. The cable 100 provided in the embodiment of the present application can also improve the problem of shape memory effect caused by bending of copper wires.

[0048] The present embodiment does not limit the material of the insulating sleeve 110. For example, the insulating sleeve 110 can be made of polyvinyl chloride (PVC), polyethylene (PE), low-smoke halogen-free flame retardant material, polyurethane, polyamide, fluoroplastic, or silicone rubber.

[0049] The present embodiment of the present application does not limit the formation method of the insulating sleeve 110. For example, the insulating sleeve 110 can be formed by extrusion molding. The present embodiment of the present application does not limit the shape of the outer peripheral surface of the insulating sleeve 110. For example, the outer peripheral surface of the insulating sleeve 110 can be cylindrical, prismatic, or irregular in shape.

[0050] The embodiment of the present application does not limit the size of the insulating sleeve 110 , as long as it can wrap the entire wire structure 120 . Figure 2 In the figure, the length of the insulating sleeve 110 is shorter only to facilitate the visibility of the conductive layer 123 in the figure, and does not limit the length of the insulating sleeve 110 to be less than the length of the fiber core 121. The same applies to the other figures.

[0051] Illustratively, the core 121 and the cladding 122 are coaxial columnar structures. The present embodiment of the application does not limit the materials of the core 121 and the cladding 122. Illustratively, the refractive index of the core 121 is greater than the refractive index of the cladding 122. The cladding 122 confines the optical signal within the core 121 for transmission and protects the core. In some embodiments, the core 121 is made of silicon dioxide (SiO2), and the cladding 122 is doped silicon dioxide (SiO2), where the doping element may be, for example, a pentavalent element such as nitrogen or phosphorus.

[0052] In some embodiments, the material of the core 121 may be silica, doped silica, polycarbonate, polymethyl methacrylate, polyacrylate copolymer, fluorinated olefin polymer, or fluorinated methyl methacrylate. The material of the cladding 122 may be silica, doped silica, fluorinated olefin polymer, fluorinated methyl methacrylate, polycarbonate, polymethyl methacrylate, or polyacrylate copolymer.

[0053] The embodiments of the present application do not limit the sizes of the core 121 and the cladding 122. For example, the diameter of the core 121 can be 6 μm (micrometers) to 20 μm. For example, the diameter of the core 121 is 6 μm, 7 μm, 9 μm, 10 μm, 12 μm, 15 μm, 16 μm, 18 μm, or 20 μm. The diameter of the cladding 122 can be 100 μm to 140 μm. For example, the diameter of the cladding 122 is 100 μm, 105 μm, 110 μm, 120 μm, 125 μm, 130 μm, 135 μm, 138 μm, or 140 μm.

[0054] The conductive layer 123 includes a conductive material, for example, the conductive material may be metal, graphene, carbon nanorods, carbon powder, etc.

[0055] In the embodiment of the present application, the conductive layer 123 extends along the extension direction of the fiber core 121. The conductive layer 123 extends from one end of the fiber core 121 to the other end of the fiber core 121.

[0056] Figure 2 In the example shown, conductive layer 123 surrounds the outer circumference of cladding 122. In other words, conductive layer 123 is disposed around the outer circumference of cladding 122, covering the entire outer circumference of cladding 122. This increases the area of ​​conductive layer 123 and allows it to transmit higher-power electrical signals. Furthermore, since conductive layer 123 uniformly covers the entire outer circumference of cladding 122, the manufacturing process is simpler and the production cost is lower.

[0057] It is understood that, in some embodiments of the present application, the conductive layer 123 may cover a portion of the outer circumference of the cladding layer 122. Figure 3 An exemplary description is given.

[0058] Figure 3 This is a schematic structural diagram of another cable 100 provided in an embodiment of the present application. Figure 3 and Figure 2 The differences include: the shape of the conductive layer 123 and the shape of the cladding layer 122 are different.

[0059] Figure 3 In the example shown, the cladding 122 has a prismatic structure. The conductive layer 123 covers a portion of the outer circumference of the cladding 122. The conductive layer 123 does not cover the entire outer circumference of the cladding 122, but has a continuous layer structure. Thus, the conductive layer 123 can transmit electrical signals.

[0060] For example, along the circumference of the cladding 122 , the length of the conductive layer 123 may be one-quarter, one-eighth, one-half, or two-thirds of the circumference of the cladding 122 , etc., and this embodiment of the present application does not impose any limitation on this.

[0061] In addition, in the embodiment of the present application, the cladding 122 may have an irregular shape. For example, the edge of the cladding 122 may be serrated. Alternatively, the edge of the cladding 122 may be a smooth curve.

[0062] It is understandable that in the embodiment where the cladding 122 is a cylindrical structure, the conductive layer 123 may also cover a portion of the outer circumference of the cladding 122 .

[0063] The embodiment of the present application does not limit the thickness of the conductive layer 123. Exemplarily, the thickness of the conductive layer 123 is 2μm-50μm; for example, the thickness of the conductive layer 123 is 2μm, 5μm, 8μm, 10μm, 11μm, 12μm, 18μm, 20μm, 25μm, 30μm, 34μm, 38μm, 40μm, 45μm or 50μm, etc.

[0064] In some embodiments of the present application, the conductive layer 123 may include a multi-layer structure.

[0065] Figure 4 This is a cross-sectional diagram of a conductive layer 123 and a cladding layer 122 provided in an embodiment of the present application. Figure 4 The conductive layer 123 includes a conductive coating 101 and an electroless plating film 102. The conductive coating 101 is disposed on the outer peripheral surface of the cladding 122, and the electroless plating film 102 is disposed on the outer peripheral surface of the conductive coating 101.

[0066] This improves the adhesion between the conductive coating 101 and the cladding 122, thereby increasing the adhesion between the conductive layer 123 and the cladding 122. Furthermore, the relatively rough surface of the conductive coating 101 provides a fulcrum and a conductive seed carrier for the installation of the chemical plating film 102, facilitating the smooth progress of the chemical plating. The low roughness of the chemical plating film 102 makes the conductive layer 123 smoother. Furthermore, the chemical plating process 102 is simple and has low process costs. Furthermore, the chemical plating can improve the conductivity of the conductive layer 123, thereby reducing signal loss during transmission of electrical signals by the conductive layer 123.

[0067] For example, in some embodiments, the conductive coating 101 may be formed by curing a conductive paste. The conductive paste may be, for example, a palladium ion solution. The material of the chemically plated film may include, for example, nickel, silver, or copper. Alternatively, in other embodiments, the conductive coating 101 and the chemically plated film 102 may be other conductive materials.

[0068] In the conductive layer 123, Figure 2 In the embodiment shown as surrounding the outer peripheral surface of the cladding 122 , the conductive coating 101 surrounds the outer peripheral surface of the cladding 122 , and the chemical plating film 102 surrounds the outer peripheral surface of the conductive coating 101 .

[0069] In the conductive layer 123, Figure 3 In the embodiment shown as covering a portion of the outer circumference of the cladding 122, the conductive coating 101 covers a portion of the outer circumference of the cladding 122, and the chemical plating film 102 is disposed on the outer circumference of the conductive coating 101. The chemical plating film 102 may cover the entire outer circumference of the conductive coating 101 or may cover a portion of the outer circumference of the conductive coating 101.

[0070] In some embodiments of the present application, the conductive layer 123 may further include an electroplated conductive film 103, which is disposed on the outer peripheral surface of the chemically plated film 102. The electroplated conductive film 103 is more uniform and continuous, which can further improve the conductivity and smoothness of the conductive layer 123.

[0071] For example, the material of the electroplated conductive film 103 may be nickel, silver, copper or the like.

[0072] Similar to the above conductive coating 101 and chemical plating 102, the conductive layer 123 is Figure 2 In the embodiment shown as surrounding the outer periphery of the cladding layer 122, the electroplated conductive film 103 can surround the outer periphery of the chemically plated film 102. Figure 3 In the embodiment shown in which a portion of the outer circumference of the cladding layer 122 is covered, the electroplated conductive film 103 may cover the entire outer circumference of the chemically plated film 102 or may cover a portion of the outer circumference of the chemically plated film 102 .

[0073] In some embodiments of the present application, the conductive layer 123 may be formed using only one process. For example, the conductive layer 123 may be entirely a conductive coating. Alternatively, the conductive layer 123 may be entirely an electroplated conductive layer. Alternatively, the conductive layer 123 may be entirely a chemically plated conductive layer.

[0074] The formation process of the conductive layer 123 is not limited to the aforementioned coating, electroplating or chemical plating. For example, the formation process of the conductive layer 123 can be sputtering, evaporation or dipping.

[0075] Alternatively, in some embodiments, the conductive layer 123 may be a transparent conductive film. For example, the conductive layer 123 may be made of a transparent conductive material. Examples of such materials include indium tin oxide (ITO), silver nanowires, copper mesh, titanium nitride (Ti4N3) two-dimensional MXene, and the like. Transparent conductive materials have good light transmittance and can form a transparent conductive layer 123.

[0076] Furthermore, in embodiments where the conductive layer 123 is a transparent conductive film, the insulating sleeve 110 can also be made of a transparent material. This allows the cable 100 to be transparent, reducing visibility. This can further reduce the clutter of cables with low visibility. Using a highly transparent cable 100 minimizes the aesthetic impact on the environment.

[0077] In the embodiment of the present application, other layer structures may be included between the conductive layer 123 and the cladding layer 122. Figure 5 An exemplary description is given.

[0078] Figure 5 A schematic structural diagram of another cable 100 provided in an embodiment of the present application. Figure 5 and Figure 2 The difference is that the cable 100 may further include a coating layer 124, which is located between the cladding layer 122 and the conductive layer 123. In other words, the coating layer 124 surrounds the outer circumference of the cladding layer 122, and the conductive layer 123 is arranged on the outer circumference of the coating layer 124. For the rest of the structure, please refer to Figure 2 Description in .

[0079] The coating layer 124 can protect the cladding 122 and prevent impurities such as moisture and dust from affecting the performance of the cladding 122. In addition, the coating layer 124 is disposed between the cladding 122 and the conductive layer 123. The coating layer 124 can reduce the impact of the conductive layer 123 on the cladding 122. Similarly, the coating layer 124 can reduce the impact of the cladding 122 on the conductive layer 123.

[0080] Furthermore, the fiber core 121, cladding 122, and coating 124 can be considered an optical fiber structure. During the production of cable 100, the optical fiber structure comprising the fiber core 121, cladding 122, and coating 124 can be used as raw material. Cable 100 can be produced by forming a conductive layer 123 and an insulating jacket 110 on the outer surface of the optical fiber structure. The production process for cable 100 is simple, and the use of relatively low-cost optical fiber structures as raw materials reduces production costs. There is no need to remove the coating 124 from the optical fiber structure comprising the fiber core 121, cladding 122, and coating 124, thus streamlining the process.

[0081] The embodiment of the present application does not limit the material of the coating layer 124. For example, the material of the coating layer 124 can be, for example, polyacrylate, polyurethane, polyamide, polyethylene, low-smoke halogen-free flame retardant material, fluoropolymer or silicone material.

[0082] The embodiment of the present application does not limit the preparation process of the coating layer 124. For example, the coating layer 124 can be formed by an extrusion molding process.

[0083] The embodiment of the present application does not limit the shape of the coating layer 124. For example, the coating layer 124 can be cylindrical, prismatic, or irregular in shape. The embodiment of the present application does not limit the thickness of the coating layer 124. In the embodiment where the coating layer 124 is cylindrical, the diameter of the coating layer can be, for example, 180 μm to 250 μm. For example, the diameter of the coating layer is 180 μm, 190 μm, 200 μm, 210 μm, 220 μm, 230 μm, 240 μm, or 250 μm.

[0084] It can be understood that in some embodiments of the present application, the sizes and processes of the aforementioned core 121, cladding 122, conductive layer 123 and coating layer 124 can be selected.

[0085] In some embodiments, the cable 100 provided in the embodiments of the present application has the following performance: the breaking force of the cable 100 is greater than 50N (Newton), the resistivity is ≤4.5×10^-5Ω·m (ohm-meter), and the cable impedance is ≤100Ω / m (ohm / meter).

[0086] Figure 2 In the example of FIG. 1 , the cable 100 includes one wire structure 120 . In some embodiments of the present application, the cable 100 may include a plurality of wire structures 120 .

[0087] Figure 6 This is a schematic structural diagram of another cable 100 provided in an embodiment of the present application. Figure 6 and Figure 2 The differences include: Figure 6 The cable 100 in FIG. 1 includes two wire structures 120 .

[0088] Figure 6 In this example, the insulating sheath 110 surrounds the outer circumference of each wire structure 120. Furthermore, the conductive layers 123 of the two wire structures 120 are electrically isolated. Thus, the cable 100 integrates two wire structures 120, enabling it to transmit two optical signals and two electrical signals. This further increases the integration of the cable 100 and effectively alleviates the problem of cluttered communication system lines.

[0089] The aforementioned "electrically isolated conductive layers 123 of the two wire structures 120" means that the conductive layers 123 of the two wire structures 120 are not directly electrically connected to each other, nor are they electrically connected through other conductive components disposed within the insulating sleeve 110. This prevents short circuits or signal crosstalk between the conductive layers 123 of the two wire structures 120. For example, a portion of the insulating sleeve 110 may be placed between the conductive layers 123 of the two wire structures 120 to prevent electrical connection between the conductive layers 123 of the two wire structures 120.

[0090] The present embodiment of the present application does not limit the distance between the conductive layers 123 of the two wire structures 120 and can be set according to actual needs. For example, the distance between the conductive layers 123 of the two wire structures 120 can be 100 μm-300 μm. For example, the distance between the conductive layers 123 of the two wire structures 120 can be 100 μm, 120 μm, 150 μm, 180 μm, 190 μm, 200 μm, 220 μm, 250 μm, or 300 μm.

[0091] In the embodiment of the present application, the structures of the two wire structures 120 may be the same. Alternatively, the structures of the two wire structures 120 may be different. Figure 2 、 Figure 3 and Figure 5 The description of the wire structure 120 is not repeated here.

[0092] It is understood that in some embodiments of the present application, the cable 100 may include three, four, five or more wire structures 120. In embodiments where the cable 100 includes three or more wire structures 120, the conductive layers 123 of any two wire structures 120 are electrically isolated.

[0093] In the embodiment where the cable 100 includes two or more wire structures 120, the embodiment of the present application does not limit each wire structure 120 in the cable 100 to be used for communication. In other words, when the cable 100 is connected to the first communication device 20 (such as Figure 1 As shown) and a second communication device 30 (as Figure 1 ), the first communication device 20 and the second communication device 30 can be communicatively connected via a portion of the plurality of wire structures 120 in the cable 100. The remaining number of wire structures 120 in the plurality of wire structures 120 are not communicatively connected. The aforementioned communicatively connected connection may include an electrical connection via the conductive layer 123 or an optical communication connection via the fiber core 121.

[0094] Alternatively, in an embodiment where the cable 100 includes multiple wire structures 120, some of the wire structures 120 may transmit only electrical signals, some of the wire structures 120 may transmit only optical signals, some of the wire structures 120 may transmit both optical and optical signals, and some of the wire structures 120 may transmit neither optical nor electrical signals. In other words, the wire structures 120 provided in the embodiments of the present application can transmit both optical and electrical signals. When the cable 100 transmits both electrical and optical signals, the embodiments of the present application do not limit all fiber cores 121 in the cable 100 to transmitting optical signals, nor do the embodiments of the present application limit all conductive layers 123 in the cable 100 to transmitting electrical signals.

[0095] In some embodiments of the present application, the cable 100 may further include optical fibers that are only used to transmit optical signals.

[0096] Figure 7 A schematic structural diagram of another cable 100 provided in an embodiment of the present application. Figure 7 and Figure 6 The differences include: Figure 7 The cable 100 may further include an optical fiber 130 .

[0097] Figure 7 In the example shown in FIG, the insulating sleeve 110 further surrounds the outer circumference of the optical fiber 130. Thus, the cable 100 includes the wire structure 120 capable of transmitting both electrical and optical signals, and the optical fiber 130 for transmitting optical signals, making the cable 100 adaptable to more scenarios and expanding the scope of use of the cable 100.

[0098] The present invention does not limit the structure of the optical fiber 130. In some embodiments, the optical fiber 130 includes a core and a cladding surrounding the outer periphery of the core. In some embodiments, the optical fiber 130 includes a core, a cladding surrounding the outer periphery of the core, and a coating surrounding the outer periphery of the cladding.

[0099] Figure 7In the embodiment, the cable 100 includes one optical fiber 130 and two wire structures 120. In some embodiments, the cable 100 may include two, three, four, or more optical fibers 130, which is not limited in this embodiment of the present application. Similarly, in some embodiments, the cable 100 may include one, three, four, or more wire structures 120.

[0100] Figure 7 In the embodiment, the optical fiber 130 is located between the two wire structures 120. In some embodiments, one wire structure 120 may be located between the optical fiber 130 and another wire structure 120, which is not limited in this embodiment of the present application.

[0101] Furthermore, the present embodiment does not limit the placement of the optical fiber 130 and the two wire structures 120. For example, the geometric center of the optical fiber 130 and the geometric centers of the two wire structures 120 may be located on the same straight line. Alternatively, the geometric center of the optical fiber 130 and the geometric centers of the two wire structures 120 may form a triangular relationship.

[0102] In some embodiments, the optical fiber 130 does not have conductive properties, and the optical fiber 130 may be in contact with the conductive layer 123 of the wire structure 120 . The optical fiber 130 has little effect on the electrical properties of the conductive layer 123 .

[0103] The embodiments of this application are Figure 7 The manufacturing process of the cable 100 is not limited. For example, the optical fiber 130 and the two wire structures 120 are extruded from the raw material of the insulating sleeve 110 to form Figure 7 Cable 100 is shown.

[0104] Figure 7 In the example, the number of optical fibers 130 is one. In some embodiments of the present application, the number of optical fibers 130 may be multiple. Figure 8 An exemplary description is given.

[0105] Figure 8 Schematic diagram of the structure of a cable 100 with multiple optical fibers 130 provided in an embodiment of the present application. Figure 8 and Figure 6 The differences include: Figure 8 The cable 100 in FIG. 1 includes two optical fibers 130 .

[0106] See also Figure 8 The cable 100 includes two optical fibers 130 and two wire structures 120. This allows for a higher level of integration. The two optical fibers 130 can transmit two optical signals, while the two wire structures 120 can transmit two optical signals and two electrical signals.

[0107] Figure 8In the example shown, two optical fibers 130 are located between two wire structures 120. The two optical fibers 130 and the two wire structures 120 are arranged in a row. It will be appreciated that in other embodiments, the two optical fibers 130 and the two wire structures 120 may be arranged in other arrangements. For example, the two optical fibers 130 and the two wire structures 120 may be arranged in two rows, or in three rows, etc.

[0108] Figure 9 This is a schematic structural diagram of another multi-fiber cable 100 provided in an embodiment of the present application. Figure 9 and Figure 6 The differences include: Figure 9 The cable 100 in FIG. 1 includes two optical fibers 130 .

[0109] in addition, Figure 9 In the example of FIG, two optical fibers 130 are arranged in a row, and two wire structures 120 are arranged in a row. Figure 9 The height and width of the cable 100 are shown to be closer. In other embodiments of the present application, one optical fiber 130 and one wire structure 120 may be arranged in a row.

[0110] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0111] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A cable, characterized in that: The cable comprises: Insulating sleeves; and A wire structure comprising a core, a cladding and a conductive layer, wherein the cladding surrounds the outer circumference of the core, and the conductive layer is arranged on the outer circumference of the cladding; and the insulating sleeve surrounds the outer circumference of the conductive layer.

2. The cable according to claim 1, wherein: The conductive layer surrounds the outer peripheral surface of the cladding.

3. The cable according to claim 1, wherein: The conductive layer includes a conductive coating and a chemical plating film; the conductive coating is arranged on the outer peripheral surface of the cladding, and the chemical plating film is arranged on the outer peripheral surface of the conductive coating.

4. The cable according to claim 3, characterized in that The conductive layer further includes an electroplated conductive film, and the electroplated conductive film is arranged on the outer peripheral surface of the chemically plated film.

5. The cable according to claim 1, wherein: The conductive layer is made of a transparent conductive material, and the insulating sleeve is made of a transparent material.

6. The cable according to any one of claims 1 to 5, characterized in that: The wire structure further includes a coating layer located between the cladding layer and the conductive layer.

7. The cable according to any one of claims 1 to 5, characterized in that: The cable includes a plurality of wire structures, the insulating sheath surrounds the outer circumference of the conductive layer of each wire structure, and the conductive layers of any two wire structures are electrically isolated.

8. The cable according to any one of claims 1 to 5, characterized in that: The cable further includes an optical fiber, and the insulating sleeve further surrounds the outer circumference of the optical fiber.

9. A communication system, characterized in that: The communication system includes a first communication device, a second communication device, and the cable according to any one of claims 1 to 8, wherein the first communication device and the second communication device are connected via the cable.

10. A wire structure, characterized in that The line structure comprises: fiber core; a cladding layer, the cladding layer surrounding the outer circumference of the core; a conductive coating disposed on an outer peripheral surface of the cladding; and Chemical plating film; the chemical plating film is arranged on the outer peripheral surface of the conductive coating.

11. The wire structure according to claim 10, characterized in that The wire structure further includes an electroplated conductive film, which is disposed on an outer peripheral surface of the chemically plated film.

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