Laser heating module and laser heating device

Abstract

The utility model relates to the technical field of laser heating, and discloses a laser heating module and a laser heating device.The laser heating module comprises a heat exchange part, a plurality of circuit drivers and a plurality of chip modules, the heat exchange part is provided with a first containing cavity and at least two openings, the first containing cavity extends in the first direction, and the two openings are communicated with the first containing cavity; the two openings are used for introducing and discharging cooling liquid respectively, the circuit drivers are arranged on one side of the heat exchange part and are sequentially arranged in the first direction, the chip modules are arranged on the side, away from the circuit drivers, of the heat exchange part and are sequentially arranged in the first direction, and each chip module comprises a flexible circuit board and multiple chips. The plurality of chips are arranged on the flexible circuit boards, and the plurality of flexible circuit boards are electrically connected to the plurality of circuit drivers respectively. According to the laser heating module and the laser heating device, the heat exchange piece can be used for heat dissipation, and the situation that normal operation of the laser heating module is affected by heat accumulation is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of laser heating, in particular to a laser heating module and a laser heating device. Background Art

[0002] Vertical-cavity surface-emitting lasers (VCSELs) are widely used in various fields, particularly in high-power lasers. High-power lasers typically consist of multiple chips connected in series to form an array. However, as the number of chips increases, the laser's operating current increases, generating significant heat.

[0003] Therefore, the heat dissipation problem of high-power lasers needs to be solved urgently to avoid the accumulation of heat due to the inability to dissipate heat in time, which affects the normal operation of high-power lasers. Utility Model Content

[0004] The embodiments of the utility model disclose a laser heating module and a laser heating device, which can utilize a heat exchange component to dissipate heat, thereby preventing heat accumulation from affecting the normal operation of the laser heating module.

[0005] In the first aspect, an embodiment of the present utility model discloses a laser heating module, comprising a heat exchange element, a plurality of circuit drivers and a plurality of chip modules, wherein the heat exchange element has a first accommodating cavity and at least two openings, the first accommodating cavity is extended along a first direction, the two openings are connected to the first accommodating cavity, one of the two openings is used to introduce cooling liquid into the first accommodating cavity, and the other is used to discharge the cooling liquid in the first accommodating cavity, the plurality of circuit drivers are arranged on one side of the heat exchange element, and the plurality of circuit drivers are arranged in sequence along the first direction, the plurality of chip modules are arranged on the side of the heat exchange element away from the circuit driver, and the plurality of chip modules are arranged in sequence along the first direction, each chip module comprises a flexible circuit board and a plurality of chips, the plurality of chips are arranged on the flexible circuit board, and the plurality of flexible circuit boards are electrically connected to the plurality of circuit drivers respectively.

[0006] The laser heating module of the first aspect is provided on one side of a heat exchange element via multiple circuit drivers, and multiple chip modules are provided on a side of the heat exchange element facing away from the circuit drivers. The multiple chips in the chip module are electrically connected to the circuit drivers via a flexible printed circuit board, thereby being driven by separate chip modules configured with separate circuit drivers. Furthermore, the multiple circuit drivers and the multiple chip modules are arranged along a first direction, and the first accommodating chamber of the heat exchange element is arranged along the first direction. Coolant is introduced into the first accommodating chamber via one opening, while the coolant is discharged from another opening. This allows the coolant to exchange heat with the chip modules and circuit drivers, dissipating heat generated by the chip modules and circuit drivers, thereby dissipating heat from the laser heating module and preventing heat accumulation from affecting the normal operation of the laser heating module.

[0007] As an optional embodiment, in an embodiment of the present invention, the two openings are located at the same end of the heat exchange element along the first direction. Thus, by providing two openings at the same end of the heat exchange element, external pipes or components (e.g., a pump or coolant collection tank) can be easily connected at the same end, resulting in a more compact overall structure.

[0008] As an optional embodiment, in an embodiment of the present invention, the laser heating module further includes a first power connector and a second power connector. The first power connector extends along the first direction and is electrically connected to the positive electrodes of the plurality of circuit drivers. The second power connector extends along the first direction and is electrically connected to the negative electrodes of the plurality of circuit drivers. Thus, by electrically connecting the first and second power connectors to the positive and negative electrodes of the external circuit, power is supplied to the plurality of circuit drivers, resulting in a relatively simple and reliable circuit.

[0009] As an optional embodiment, in an embodiment of the present invention, the laser heating module further comprises an insulating support seat, disposed at one end of the heat exchange element along the first direction, and supporting both the first and second electrical connectors. Thus, the insulating support seat disposed at one end of the heat exchange element along the first direction, and supporting the first and second electrical connectors by the insulating support seat, can prevent the first and second electrical connectors extending along the first direction from bending or even cracking due to gravity over time. Furthermore, the effects of gravity on the circuit driver when the first and second electrical connectors are in contact and conducting with the circuit driver can be reduced.

[0010] As an optional embodiment, in an embodiment of the present utility model, the laser heating module further includes a plurality of heat sinks, and the plurality of heat sinks are arranged on the side of the heat exchange member away from the circuit driver, and the plurality of heat sinks are arranged in sequence along the first direction, each heat sink has a second accommodating cavity, and the second accommodating cavity is connected to the first accommodating cavity, and the plurality of chip modules are respectively arranged on the side of the plurality of heat sinks away from the heat exchange member. In this way, the second accommodating cavities of the plurality of heat sinks are connected to the first accommodating cavity, and the second accommodating cavities of the plurality of heat sinks can receive the coolant in the first accommodating cavity and discharge the coolant to the first accommodating cavity, so that the heat sink can perform heat exchange with the chip module, thereby achieving cooling and heat dissipation of the chip module. In addition, a single chip module has a matching heat sink for cooling and heat dissipation, which can improve heat dissipation efficiency and avoid local overheating.

[0011] As an optional embodiment, in an embodiment of the present invention, the heat exchange element has two first accommodating chambers, and the two first accommodating chambers are separated. The heat exchange element is provided with a first through hole and a second through hole on the side facing the heat sink, and the first through hole and the second through hole are respectively connected to the two first accommodating chambers. Each heat sink is provided with a third through hole and a fourth through hole on the side facing the heat exchange element, and the third through hole and the fourth through hole are both connected to the second accommodating chamber, the third through hole is connected to the first through hole, and the fourth through hole is connected to the second through hole. In this way, through the first through hole and the third through hole being connected, and the second through hole and the fourth through hole being connected, the coolant enters one first accommodating chamber from one opening and can flow to the second accommodating chamber through the first through hole and the third through hole, while the coolant in the second accommodating chamber can flow to the other first accommodating chamber through the fourth through hole and the second through hole, and flow out from the other opening. When the heat sink and the chip module perform heat exchange, the coolant always fills the second accommodating chamber, thereby improving the efficiency of heat exchange and achieving better heat dissipation effect of the laser heating module.

[0012] As an optional embodiment, in an embodiment of the present invention, a first sealing ring is provided at the connection between the first and third through-holes, and a second sealing ring is provided at the connection between the second and fourth through-holes. Thus, the first sealing ring seals the connection between the first and third through-holes, while the second sealing ring seals the connection between the second and fourth through-holes, thereby preventing coolant from leaking when flowing between the first and second accommodating chambers.

[0013] As an optional embodiment, in an embodiment of the present invention, each heat sink is provided with a plurality of heat fins on a side facing away from the heat exchange element. The plurality of heat fins are evenly spaced and abut the chip module. Thus, by providing multiple heat fins, the heat dissipation area can be increased, the heat dissipation efficiency of the heat sink can be improved, and the heat dissipation effect of the laser heating module can be improved.

[0014] As an optional embodiment, in an embodiment of the present invention, each flexible printed circuit board includes a main body, a first extension, and a second extension. The main body is disposed on a side of the heat exchange element facing away from the circuit driver. The plurality of chips are disposed on the main body. The first extension and the second extension are spaced apart from each other on the main body. The first extension and the second extension extend from the main body toward the heat exchange element and are electrically connected to the circuit driver. In this way, the main body has a larger area for accommodating the plurality of chips, while the first and second extensions can extend to electrically connect to the circuit driver. This achieves electrical connection between the chips located on opposite sides of the heat exchange element and the circuit driver, resulting in a more compact structure.

[0015] In a second aspect, an embodiment of the present invention discloses a laser heating device, comprising a housing and the laser heating module of the first aspect, wherein the heat exchange component, the circuit driver and the chip module are arranged in the housing.

[0016] The laser heating device of the second aspect has the advantageous effects of the laser heating module of the first aspect.

[0017] Compared with the prior art, the embodiments of the present invention have at least the following beneficial effects:

[0018] In an embodiment of the present invention, multiple circuit drivers are disposed on one side of a heat exchange element, multiple chip modules are disposed on a side of the heat exchange element facing away from the circuit drivers, and multiple chips in the chip modules are electrically connected to the circuit drivers via a flexible circuit board, thereby enabling a separate chip module to be configured with a separate circuit driver for driving. Furthermore, the multiple circuit drivers and the multiple chip modules are arranged along a first direction, and the first accommodating chamber of the heat exchange element is arranged along the first direction. Coolant is introduced into the first accommodating chamber via one opening, while the coolant is discharged from another opening. This allows the coolant to exchange heat with the chip modules and circuit drivers, removing heat generated by the chip modules and circuit drivers, thereby achieving heat dissipation of the laser heating module and preventing heat accumulation from affecting the normal operation of the laser heating module. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this technical field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 This is a schematic structural diagram of a laser heating module disclosed in Example 1 of the present utility model;

[0021] Figure 2 This is a schematic diagram of the exploded structure of a laser heating module disclosed in Example 1 of the present utility model;

[0022] Figure 3 This is a schematic diagram of the exploded structure of a laser heating module disclosed in the first embodiment of the present utility model from another perspective;

[0023] Figure 4 This is a schematic cross-sectional view of the heat exchange element and the heat dissipation element disclosed in the first embodiment of the present utility model;

[0024] Figure 5 It is a structural schematic diagram of the laser heating device disclosed in the second embodiment of the present utility model.

[0025] Description of main reference numerals

[0026] 100. Laser heating module; 10. Heat exchange element; 10a. First accommodating cavity; 10c. First through hole; 10d. Second through hole; 101. Main body; 102. Raised portion; 11. Circuit driver; 12. Chip module; 121. Flexible circuit board; 121a. Main body; 121b. First extension portion; 121c. Second extension portion; 122. Chip; 131. First power connection member; 132. Second power connection member; 14. Insulating support seat; 15. Heat dissipation member; 15a. Second accommodating cavity; 15b. Third through hole; 15c. Fourth through hole; 151. Heat dissipation fin; 200. Laser heating device; 20. Housing; x. First direction. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] In this utility model, terms such as "upper," "lower," "left," "right," "front," "back," "top," "bottom," "inner," "outer," "center," "vertical," "horizontal," "transverse," and "longitudinal" indicate positions or locations based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe the utility model and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0029] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

[0030] Furthermore, the terms "installed," "disposed," "provided with," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

[0031] Furthermore, the terms "first," "second," and the like are primarily used to distinguish different devices, elements, or components (which may or may not be the same in type and configuration) and are not intended to indicate or imply the relative importance or quantity of the devices, elements, or components indicated. Unless otherwise specified, "plurality" means two or more.

[0032] The utility model discloses a laser heating module and a laser heating device, which can utilize a heat exchange component to dissipate heat, thereby preventing the occurrence of a situation in which heat accumulation affects the normal operation of the laser heating module. Example 1

[0033] Please also refer to Figures 1 to 4, is a structural schematic diagram of a laser heating module 100 provided in Example 1 of the present utility model, the laser heating module 100 includes a heat exchange element 10, multiple circuit drivers 11 and multiple chip modules 12, the heat exchange element 10 has a first accommodating chamber 10a and at least two openings (not marked), the first accommodating chamber 10a extends along a first direction x, the two openings are connected to the first accommodating chamber 10a, one of the two openings is used to pass coolant into the first accommodating chamber 10a, and the other is used to discharge the coolant in the first accommodating chamber 10a, the multiple circuit drivers 11 are provided on one side of the heat exchange element 10, and the multiple circuit drivers 11 are arranged in sequence along the first direction x, the multiple chip modules 12 are provided on a side of the heat exchange element 10 away from the circuit drivers 11, and the multiple chip modules 12 are arranged in sequence along the first direction x, each chip module 12 includes a flexible circuit board 121 and multiple chips 122, the multiple chips 122 are provided on the flexible circuit board 121, and the multiple flexible circuit boards 121 are respectively electrically connected to the multiple circuit drivers 11.

[0034] In this embodiment, multiple circuit drivers 11 are disposed on one side of a heat exchange element 10, and multiple chip modules 12 are disposed on a side of the heat exchange element 10 facing away from the circuit drivers 11. Multiple chips 122 of the chip modules 12 are electrically connected to the circuit drivers 11 via a flexible circuit board 121, thereby enabling individual chip modules 12 to be driven by individual circuit drivers 11. Furthermore, the multiple circuit drivers 11 and the multiple chip modules 12 are arranged along a first direction x, and the first accommodating chamber 10a of the heat exchange element 10 is arranged along the first direction x. Coolant is introduced into the first accommodating chamber 10a through one opening, while the coolant is discharged through another opening. This allows the coolant to exchange heat with the chip modules 12 and the circuit drivers 11, dissipating heat generated by the chip modules 12 and the circuit drivers 11, thereby dissipating heat from the laser heating module 100 and preventing heat accumulation from affecting the normal operation of the laser heating module 100.

[0035] The first direction x may be the length direction of the laser heating module 100 . In some other embodiments, the first direction x may also be the width direction of the laser heating module 100 .

[0036] In some embodiments, such as Figure 1 As shown, the two openings are located at the same end of the heat exchange element 10 along the first direction x. Thus, by providing two openings at the same end of the heat exchange element 10, it is convenient to connect external pipes or components (such as a pump or a coolant collection tank, etc.) at the same end, and the overall structure is more compact.

[0037] In some other embodiments, the two openings are respectively located at two opposite ends of the heat exchange element 10 along the first direction x, which can be selected according to actual conditions and is not specifically limited in this embodiment.

[0038] In some embodiments, the laser heating module 100 further includes a first power connector 131 and a second power connector 132. The first power connector 131 extends along the first direction x and is electrically connected to the positive electrodes of the multiple circuit drivers 11. The second power connector 132 extends along the first direction x and is electrically connected to the negative electrodes of the multiple circuit drivers 11. In this way, by electrically connecting the first power connector 21 and the second power connector 22 to the positive and negative electrodes of the external circuit, power is supplied to the multiple circuit drivers 11, resulting in a relatively simple and reliable circuit.

[0039] Exemplarily, the laser heating module 100 further includes an insulating support base 14, which is disposed at one end of the heat exchange element 10 along the first direction x. The first and second electrical connectors 131 and 132 are both supported by the insulating support base 14. Thus, by disposing the insulating support base 14 at one end of the heat exchange element 10 along the first direction x and utilizing the insulating support base 14 to support the first and second electrical connectors 21 and 22, the first and second electrical connectors 21 and 22 extending along the first direction x can be prevented from bending or even cracking due to prolonged gravity. Furthermore, the effects of gravity on the circuit driver 11 when the first and second electrical connectors 21 and 22 are in contact and conductive with the circuit driver 11 can be reduced.

[0040] Optionally, each insulating support seat is provided with a bearing portion, which abuts against the first electrical connector 131 and the second electrical connector 132, and the bearing portion includes a through hole or a groove. In this way, by providing a variety of bearing portions with different structures, a selection can be made according to actual conditions, and this embodiment does not specifically limit this.

[0041] In some embodiments, such as Figures 1 to 3 As shown, the laser heating module 100 further includes a plurality of heat sinks 15 , which are disposed on a side of the heat exchange element 10 facing away from the circuit driver 11. The plurality of heat sinks 15 are arranged sequentially along a first direction x. Each heat sink 15 has a second accommodating cavity 15a, which is in communication with the first accommodating cavity 10a. The plurality of chip modules 12 are disposed on the side of the plurality of heat sinks 15 facing away from the heat exchange element 10. Thus, through the communication between the second accommodating cavities 15a of the plurality of heat sinks 15 and the first accommodating cavity 10a, the second accommodating cavities 15a of the plurality of heat sinks 15 can receive coolant from the first accommodating cavity 10a and discharge the coolant to the first accommodating cavity 10a. This allows the heat sinks 15 to exchange heat with the chip modules 12, thereby cooling and dissipating the heat from the chip modules 12. Furthermore, each chip module 12 has a matching heat sink 15 for cooling and dissipating the heat, which improves heat dissipation efficiency and prevents local overheating.

[0042] For example, Figures 2 to 4As shown, the heat exchange element 10 has two first accommodating cavities 10a, and the two first accommodating cavities 10a are separated. The heat exchange element 10 is provided with a first through hole 10c and a second through hole 10d on the side facing the heat dissipation element 15. The first through hole 10c and the second through hole 10d are respectively connected to the two first accommodating cavities 10a. Each heat dissipation element 15 is provided with a third through hole 15b and a fourth through hole 15c on the side facing the heat exchange element 10. The third through hole 15b and the fourth through hole 15c are both connected to the second accommodating cavity 15a. The third through hole 15b is connected to the first through hole 10c, and the fourth through hole 15c is connected to the second through hole 10d. In this way, the first through hole 10c is connected with the third through hole 15b, and the second through hole 10d is connected with the fourth through hole 15c. After the coolant enters a first accommodating cavity 10a from one opening, it can flow to the second accommodating cavity 15a through the first through hole 10c and the third through hole 15b, and the coolant in the second accommodating cavity 15a can flow to another first accommodating cavity 10a through the fourth through hole 15c and the second through hole 10d, and flow out from another opening, so that when the heat sink 15 and the chip module 12 perform heat exchange, the coolant always fills the second accommodating cavity 15a, thereby improving the efficiency of heat exchange and achieving better heat dissipation effect of the laser heating module 100.

[0043] Optionally, a first sealing ring (not shown) is provided at the connection between the first through hole 10c and the third through hole 15b, and a second sealing ring (not shown) is provided at the connection between the second through hole 10d and the fourth through hole 15c. Thus, the first sealing ring seals the connection between the first through hole 10c and the third through hole 15b, while the second sealing ring seals the connection between the second through hole 10d and the fourth through hole 15c, thereby preventing coolant from leaking when flowing between the first accommodating chamber 10a and the second accommodating chamber 15a.

[0044] For example, Figure 3 and Figure 4 As shown, each heat sink 15 is provided with a plurality of heat dissipation fins 151 on a side facing away from the heat exchange element 10. The plurality of heat dissipation fins 151 are evenly spaced and abut against the chip module 12. Thus, by providing a plurality of heat dissipation fins 151, the heat dissipation area can be increased, the heat dissipation efficiency of the heat sink 15 can be improved, and the heat dissipation effect of the laser heating module 100 is better.

[0045] In some embodiments, such as Figure 2 and Figure 3As shown, each flexible circuit board 121 includes a main body 121a, a first extension 121b, and a second extension 121c. The main body 121a is located on the side of the heat exchange element 10 facing away from the circuit driver 11. Multiple chips 122 are mounted on the main body 121a. The first and second extensions 121b, 121c are spaced apart from the main body 121a. The first and second extensions 121b, 121c extend from the main body 121a toward the heat exchange element 10 and are electrically connected to the circuit driver 11. Thus, the main body 121a provides a larger area for mounting multiple chips 122, while the first and second extensions 121b, 121c extend to electrically connect to the circuit driver 11. This achieves electrical connection between the chips 122 on opposite sides of the heat exchange element 10 and the circuit driver 11, resulting in a more compact structure.

[0046] The first embodiment of the present invention provides a laser heating module 100. Multiple circuit drivers 11 are disposed on one side of a heat exchange element 10, and multiple chip modules 12 are disposed on a side of the heat exchange element 10 facing away from the circuit drivers 11. Multiple chips 122 of the chip modules 12 are electrically connected to the circuit drivers 11 via a flexible circuit board 121, thereby enabling each chip module 12 to be driven by a separate circuit driver 11. Furthermore, the multiple circuit drivers 11 and the multiple chip modules 12 are arranged along a first direction x, and the first accommodating chamber 10a of the heat exchange element 10 is arranged along the first direction x. Coolant is introduced into the first accommodating chamber 10a through one opening, while the coolant is discharged through another opening. This allows the coolant to exchange heat with the chip modules 12 and the circuit drivers 11, dissipating heat generated by the chip modules 12 and the circuit drivers 11. This dissipates heat from the laser heating module 100 and prevents heat accumulation from affecting the normal operation of the laser heating module 100. Example 2

[0047] Please also refer to Figure 5 , which is a structural schematic diagram of a laser heating device 200 provided in Example 2 of the present utility model. The laser heating device 200 includes a shell 20 and the laser heating module 100 of Example 1. The heat exchange component 10, the circuit driver 11 and the chip module 12 are arranged in the shell 20.

[0048] The second embodiment of the present invention provides a laser heating device 200 , which has good heat dissipation efficiency.

[0049] The above is a detailed introduction to a laser heating module and a laser heating device disclosed in the embodiments of the present invention. This article uses individual examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the laser heating module and laser heating device of the present invention and its core ideas. At the same time, for general technical personnel in this field, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A laser heating module, characterized in that: include: a heat exchange element, the heat exchange element having a first accommodating cavity and at least two openings, the first accommodating cavity extending along a first direction, the two openings being connected to the first accommodating cavity, one of the two openings being used to introduce coolant into the first accommodating cavity, and the other being used to discharge the coolant in the first accommodating cavity; a plurality of circuit drivers, the plurality of circuit drivers being disposed on one side of the heat exchange element and being arranged in sequence along the first direction; as well as Multiple chip modules are provided on a side of the heat exchange component away from the circuit driver, and the multiple chip modules are arranged in sequence along the first direction, each chip module includes a flexible circuit board and multiple chips, the multiple chips are provided on the flexible circuit board, and the multiple flexible circuit boards are electrically connected to the multiple circuit drivers respectively.

2. The laser heating module according to claim 1, characterized in that: The two openings are located at the same end of the heat exchange element along the first direction.

3. The laser heating module according to claim 1, characterized in that: The laser heating module further includes a first electrical connector and a second electrical connector, wherein the first electrical connector extends along the first direction and is electrically connected to the positive electrodes of the plurality of circuit drivers, and the second electrical connector extends along the first direction and is electrically connected to the negative electrodes of the plurality of circuit drivers.

4. The laser heating module according to claim 3, characterized in that: The laser heating module further includes an insulating support seat, which is provided at one end of the heat exchange element along the first direction, and the first power connection element and the second power connection element are both supported by the insulating support seat.

5. The laser heating module according to any one of claims 1 to 4, characterized in that: The laser heating module also includes multiple heat sinks, which are arranged on the side of the heat exchange element away from the circuit driver, and are arranged in sequence along the first direction. Each heat sink has a second accommodating cavity, and the second accommodating cavity is connected to the first accommodating cavity. Multiple chip modules are respectively arranged on the side of the heat sinks away from the heat exchange element.

6. The laser heating module according to claim 5, characterized in that: The heat exchange element has two first accommodating cavities, and the two first accommodating cavities are separated. The heat exchange element is provided with a first through hole and a second through hole on the side facing the heat dissipation element. The first through hole and the second through hole are respectively connected to the two first accommodating cavities. Each heat dissipation element is provided with a third through hole and a fourth through hole on the side facing the heat exchange element. The third through hole and the fourth through hole are both connected to the second accommodating cavity. The third through hole is connected to the first through hole, and the fourth through hole is connected to the second through hole.

7. The laser heating module according to claim 6, characterized in that: A first sealing ring is provided at the connection between the first through hole and the third through hole, and a second sealing ring is provided at the connection between the second through hole and the fourth through hole.

8. The laser heating module according to claim 5, characterized in that: A plurality of heat dissipation fins are provided on a side of each heat dissipation element away from the heat exchange element. The plurality of heat dissipation fins are evenly spaced and arranged. The heat dissipation fins abut against the chip module.

9. The laser heating module according to any one of claims 1 to 4, characterized in that: Each of the flexible circuit boards includes a main body, a first extension, and a second extension. The main body is provided on a side of the heat exchange component facing away from the circuit driver. The plurality of chips are provided on the main body. The first extension and the second extension are provided at intervals on the main body. The first extension and the second extension extend from the main body along the direction of the main body toward the heat exchange component and are electrically connected to the circuit driver.

10. A laser heating device, characterized in that: It comprises a shell and the laser heating module according to any one of claims 1 to 8, wherein the heat exchange component, the circuit driver and the chip module are arranged in the shell.

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