Circuit board, circuit board assembly and power device

Abstract

The utility model provides a circuit board, a circuit board assembly and a power device. The circuit board comprises a substrate, wherein the substrate comprises a copper layer and a supporting layer which are attached to each other; the outer edge of the supporting layer protrudes out of the outer edge of the copper layer or is flush with the outer edge of the copper layer. A welding groove is formed in the substrate; at least part of the welding groove is located on the copper layer; the welding grooves are used for inserting pins; wherein the depth of the welding groove is d1, the thickness of the copper layer is d0, and 0.5 < = d1 / d0 < = 1.5. According to the technical scheme provided by the utility model, the technical problem of low welding precision of the circuit board and the contact pin in the prior art can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and in particular to a circuit board, a circuit board assembly and a power device. Background Art

[0002] Pin soldering is a common process in electronics manufacturing, primarily used to electrically connect pins to circuit boards or other components. The quality of pin soldering directly impacts the reliability and lifespan of electronic equipment.

[0003] However, traditional pin soldering technology primarily connects pins to circuit boards through heat fusion. This technology has limitations, such as difficulty maintaining precise soldering positions and the tendency to produce soldering defects during the soldering process. Due to differences in pin materials and circuit board design, soldering defects are prone to occur, affecting soldering quality. Furthermore, pin soldering position accuracy is difficult to maintain, which can easily lead to poor soldering and affect circuit function. Utility Model Content

[0004] The main purpose of the utility model is to provide a circuit board, a circuit board assembly and a power device to solve the technical problem of low welding precision between the circuit board and the pins in the prior art.

[0005] In order to achieve the above object, according to one aspect of the present invention, a circuit board is provided, comprising:

[0006] The substrate comprises a copper layer and a support layer attached to each other; the outer edge of the support layer protrudes from the outer edge of the copper layer or is flush with the outer edge of the copper layer; a welding groove is provided on the substrate; at least a portion of the welding groove is located on the copper layer; the welding groove is used to insert the pin;

[0007] The depth of the welding groove is d1, the thickness of the copper layer is d0, and 0.5≤d1 / d0≤1.5.

[0008] Furthermore, the welding groove is located on the copper layer; wherein 0.5≤d1 / d0≤1; or,

[0009] The welding groove includes a first groove section and a second groove section connected to each other, the first groove section forms at least a part of the welding groove, and the second groove section is located on the supporting layer; wherein 1<d1 / d0≤1.5.

[0010] Furthermore, along the extension direction of the welding groove, the cross-sectional shape of the welding groove remains unchanged; and / or,

[0011] Along the extending direction of the welding groove, the cross-sectional area of ​​the welding groove remains constant.

[0012] Furthermore, the notch of the welding groove is circular, triangular or square; and / or,

[0013] There are multiple welding grooves, and the multiple welding grooves are arranged at intervals.

[0014] Furthermore, a guide surface is provided at the notch of the welding groove;

[0015] The guide surface and the extending direction of the groove wall of the welding groove are arranged at a preset angle, and the preset angle is greater than 0 degrees and less than 90 degrees; and / or,

[0016] The guide surface is arranged around the notch; and / or,

[0017] The guide surface is an arc surface or a plane.

[0018] Furthermore, along the extension direction of the welding groove, the welding groove is in a gradually expanding shape; the groove wall of the welding groove is arranged inclined.

[0019] Furthermore, the circuit board further includes:

[0020] The storage groove is arranged on the substrate and is located at the edge of the welding groove. The storage groove is communicated with the welding groove. The storage groove is used to store solder.

[0021] According to another aspect of the present invention, a circuit board assembly is provided, comprising:

[0022] The circuit board provided above;

[0023] The connecting portion of the plug pin is used to be inserted into the soldering groove of the circuit board; solder is provided on one side of the connecting portion close to the bottom of the soldering groove.

[0024] Furthermore, one end of the welding groove is surrounded by a notch; the connecting portion is adaptively arranged with the welding groove; 1.0≤d2 / d3≤1.25, d3 is the maximum diameter of the connecting portion;

[0025] Wherein, the notch is circular and d2 is the diameter of the notch; or,

[0026] The notch is square, and d2 is the minimum side length of the notch; or,

[0027] The notch is triangular, and d2 is the diameter of the inscribed circle of the notch.

[0028] According to another aspect of the present invention, a power device is provided, including: the circuit board assembly provided above.

[0029] By controlling the ratio of the soldering groove depth to the copper layer thickness, the technical solution of the present invention ensures that the pins penetrate deeply into the copper layer during soldering, forming a stronger mechanical and electrical connection, thereby improving the reliability and durability of the circuit board. This prevents the connection between the pins and the copper layer from easily falling off when the circuit board is subjected to high current surges, ensuring the continuity and stability of power transmission. This is a key technology for achieving efficient and safe operation in equipment such as electric vehicles and high-power power converters. Furthermore, this design can improve the efficiency and quality of soldering in extremely difficult situations. The presence of the soldering groove increases the soldering area, lowers the soldering temperature, and reduces thermal stress, thereby improving soldering reliability and stability. It also reduces the occurrence of tin deficiency defects during soldering, thereby reducing the tin deficiency defect rate within the soldering groove and improving soldering quality. The presence of the soldering groove increases soldering stability and reduces spattering and oxidation of the molten metal during soldering, thereby reducing the probability of tin deficiency defects. Therefore, the technical solution of the present invention can address the low soldering precision problem of circuit boards and pins in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The drawings constituting part of this application are provided to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are provided to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0031] Figure 1 A schematic structural diagram of a circuit board provided according to the first embodiment of the present utility model is shown;

[0032] Figure 2 A schematic cross-sectional view of a partial structure of a circuit board provided according to the first embodiment of the present utility model is shown;

[0033] Figure 3 A schematic side structural diagram of the pins of the circuit board assembly provided in accordance with the second embodiment of the present utility model is shown.

[0034] The above drawings include the following reference numerals:

[0035] 10. Substrate;

[0036] 11. Copper layer;

[0037] 12. Support layer;

[0038] 13. Welding groove;

[0039] 20. Pin;

[0040] 21. Connecting part;

[0041] 22. Solder. DETAILED DESCRIPTION

[0042] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0043] like Figure 1 and Figure 2 As shown, embodiment 1 of the present invention provides a circuit board, which includes a substrate 10, and the substrate 10 includes a copper layer 11 and a support layer 12 attached to each other. The outer edge of the support layer 12 protrudes from the outer edge of the copper layer 11 or is flush with the outer edge of the copper layer 11. A welding groove 13 is provided on the substrate 10, and at least a portion of the welding groove 13 is located on the copper layer 11. The welding groove 13 is used to insert a pin 20. The depth of the welding groove 13 is d1, the thickness of the copper layer 11 is d0, and 0.5≤d1 / d0≤1.5.

[0044] By controlling the ratio of the depth of the soldering groove 13 to the thickness of the copper layer 11, the circuit board provided by Example 1 of the present invention can ensure that the pins 20 penetrate deeply into the copper layer 11 during soldering, forming a more secure mechanical and electrical connection, thereby improving the reliability and durability of the circuit board. This prevents the connection between the pins 20 and the copper layer from easily falling off when the circuit board is subjected to high current surges, ensuring the continuity and stability of power transmission. This is a key technology for achieving efficient and safe operation in equipment such as electric vehicles and high-power power converters. Furthermore, this arrangement can also improve the efficiency and quality of soldering when the pins 20 are extremely difficult to solder. The presence of the soldering groove 13 increases the soldering area, lowers the soldering temperature, and reduces thermal stress, thereby improving soldering reliability and stability. It can also reduce the occurrence of low-tin defects during soldering, thereby reducing the low-tin defect rate within the soldering groove 13 and improving soldering quality. The presence of the soldering groove 13 increases soldering stability and reduces the spattering and oxidation of the molten metal during soldering, thereby reducing the probability of low-tin defects. Therefore, the circuit board provided in this embodiment can solve the technical problem of low welding precision between the circuit board and the pins in the prior art.

[0045] Specifically, the support layer 12 is ceramic.

[0046] Specifically, the soldering groove 13 is located on the copper layer 11, wherein 0.5≤d1 / d0≤1. With such a configuration, the soldering accuracy of the pin 20 can be further enhanced by the provision of the soldering groove 13, thereby improving the soldering quality and reliability of the circuit board.

[0047] Specifically, the soldering groove 13 includes a first groove section and a second groove section that are interconnected. The first groove section forms at least a portion of the soldering groove 13, and the second groove section is located on the support layer 12. Wherein, 1 < d1 / d0 ≤ 1.5. With this arrangement, when the soldering groove 13 extends to the support layer 12, the ratio of the depth d1 to the copper layer thickness d0 is between 1 and 1.5. This increases the depth of the soldering groove 13, accommodating more solder 22 and improving soldering stability, ensuring a secure connection between the pin 20 and the circuit board in various environments (such as high temperature and high current environments).

[0048] Specifically, the ratio of the depth of the soldering groove 13 to the thickness of the copper layer 11 can be 1, 1.25, or 1.5. This can further improve the soldering position accuracy, making the soldering of the pins 20 to the circuit board more precise, effectively solving the problem of difficult soldering position accuracy in traditional technologies, thereby improving soldering quality and reliability.

[0049] Specifically, the cross-sectional shape of the soldering groove 13 remains constant along its extension. This configuration maintains stable contact between the pin 20 and the soldering groove 13 by ensuring a constant cross-sectional shape along its extension, preventing misalignment or poor contact of the pin 20 due to shape changes during soldering. This consistency promotes uniform heating during soldering, reduces soldering defects such as voids or cracks in the solder joint, and thus improves soldering quality and enhances the stability of the electrical connection between the pin 20 and the circuit board.

[0050] Specifically, the cross-sectional area of ​​the soldering groove 13 remains constant along its extension direction. This structural arrangement maintains the cross-sectional area of ​​the soldering groove 13, ensuring uniform solder filling 22 during the soldering process and avoiding insufficient or excessive solder 22 due to variations in the groove area. This not only helps optimize soldering parameters such as soldering temperature, time, and pressure, but also ensures uniform distribution of solder 22, enhancing the mechanical strength of the solder joint and improving the reliability and durability of the circuit board.

[0051] Specifically, the notch of the soldering groove 13 is circular, triangular, or square. This structural arrangement allows the notch of the soldering groove 13 to be designed in a circular, triangular, or square shape, accommodating pins 20 of varying shapes and sizes, thereby increasing the flexibility of circuit board design. The different notch shapes can meet the pin geometry requirements of specific electronic devices. For example, when the notch is square, the presence of the four corners of the square notch can increase the tin content of the solder.

[0052] Specifically, multiple soldering grooves 13 are provided, each spaced apart. This structural arrangement, by providing multiple, spaced apart soldering grooves 13 on the circuit board, effectively isolates the various electrical components on the circuit board, preventing short circuits or electrical interference, and improving the safety and reliability of the circuit board. This spacing also helps optimize the circuit board's layout, ensuring sufficient space between each pin 20 and soldering groove 13, even in high-density designs, to avoid mutual interference and enhance the circuit board's integration and performance.

[0053] In this embodiment, a guide surface is provided at the notch of the soldering groove 13. The guide surface is arranged at a preset angle with respect to the extension direction of the soldering groove 13's groove wall, with the preset angle being greater than 0 degrees and less than 90 degrees. This structural arrangement, by providing the guide surface at the notch of the soldering groove 13 and forming a preset angle with respect to the extension direction of the soldering groove 13's groove wall, with the preset angle being greater than 0 degrees and less than 90 degrees, effectively guides the pins 20 for precise alignment during assembly. This design helps reduce assembly errors caused by misalignment of the pins 20 with the soldering groove 13, improves the first-pass success rate of assembly, shortens assembly time, and ensures the stable position of the pins 20 during the soldering process, thereby enhancing soldering quality and circuit board reliability.

[0054] In this embodiment, a guide surface is provided at the notch of the welding groove 13. The guide surface surrounds the notch. This provides comprehensive guidance for the pin 20, ensuring precise and stable insertion of the pin 20 into the welding groove 13. Even in high-vibration environments, the pin 20 is less likely to shift, enhancing the stability of the welding process and electrical connection. This design is particularly suitable for electronic equipment requiring high-precision assembly and stable electrical connections, such as automotive electronic control systems and precision measuring instruments, significantly improving the reliability and service life of the equipment.

[0055] In this embodiment, a guide surface is provided at the notch of the soldering groove 13. The guide surface can be either an arcuate or flat surface. This structural arrangement, with the guide surface designed as an arcuate or flat surface, improves the flow path of the solder 22 during the soldering process, ensuring that the solder 22 evenly covers the inner wall of the soldering groove 13 and the contact surface between the pin 20. This reduces the occurrence of solder voids and cracks in the solder joint, thereby improving soldering quality. Furthermore, this design reduces stress concentration at the edge of the soldering groove 13, preventing metal fatigue during the soldering process and enhancing the mechanical strength and electrical performance of the solder joint.

[0056] Specifically, the soldering groove 13 extends in a gradually expanding shape, with its walls inclined. This structural arrangement, with its gradually expanding shape and inclined walls, provides a larger space for solder 22 to fill. The inclined walls also facilitate the flow and distribution of solder 22, ensuring that it fully covers the contact surface between the pin 20 and the copper layer 11, improving soldering reliability and electrical conductivity. This design is particularly suitable for electronic devices requiring high electrical conductivity and heat dissipation, such as battery management systems for electric vehicles and high-performance servers, effectively improving device performance and operational stability.

[0057] It should be noted that the extending direction of the welding groove 13 refers to the direction from the groove opening to the groove bottom of the welding groove 13 .

[0058] Specifically, the circuit board also includes a storage slot, which is provided on the substrate 10 and located at the edge of the soldering groove 13. The storage slot is connected to the soldering groove 13 and is used to store solder 22. With this structural arrangement, the additional storage slot provided on the circuit board, located at the edge of the soldering groove 13 and connected thereto, can be used to collect excess solder 22, thereby increasing the tin content. It also helps prevent solder 22 from spilling and splashing during the soldering process, reducing contamination of other parts of the circuit board by the solder 22, and improving the cleanliness and reliability of the circuit board. Furthermore, the storage slot design can reduce solder 22 waste during the soldering process, lowering production costs. It is suitable for precision electronic equipment such as medical equipment and aerospace equipment, ensuring stable operation in extreme environments.

[0059] Specifically, the ratio of the diameter of the storage slot opening to the diameter of the soldering groove 13 is less than 0.1. This structural arrangement can reduce the space occupied by the storage slot, optimize the circuit board layout, and also avoid the situation where the storage slot arrangement causes tip discharge and failure when the distance between two adjacent soldering grooves 13 is relatively close.

[0060] like Figure 3 As shown, embodiment 2 of the present invention provides a circuit board assembly, which includes the circuit board and the pin 20 provided in embodiment 1. The connecting portion 21 of the pin 20 is used to be inserted into the welding groove 13 of the circuit board, and solder 22 is provided on one side of the connecting portion 21 close to the bottom of the welding groove 13.

[0061] The circuit board assembly provided by Example 2 of the present invention controls the ratio of the depth of the soldering groove 13 to the thickness of the copper layer 11, ensuring that the pins 20 penetrate deeply into the copper layer 11 during soldering, forming a stronger mechanical and electrical connection, thereby improving the reliability and durability of the circuit board. This prevents the connection between the pins 20 and the copper layer from easily falling off when the circuit board is subjected to high current surges, ensuring the continuity and stability of power transmission. This is a key technology for achieving efficient and safe operation in equipment such as electric vehicles and high-power power converters. Furthermore, this arrangement can improve the efficiency and quality of soldering when the pins 20 are extremely difficult to solder, thereby increasing soldering efficiency and quality. The presence of the soldering groove 13 increases the soldering area, lowers soldering temperature, and reduces thermal stress, thereby improving soldering reliability and stability. It also reduces the occurrence of low-tin defects during soldering, thereby reducing the low-tin defect rate within the soldering groove 13 and improving soldering quality. The presence of the soldering groove 13 increases soldering stability and reduces spattering and oxidation of the molten metal during soldering, thereby reducing the probability of low-tin defects. Therefore, the circuit board assembly provided in this embodiment can solve the technical problem of low welding precision between the circuit board and the pins in the prior art.

[0062] Specifically, the circuit board is a direct-bonded copper ceramic substrate (DBC board).

[0063] Specifically, one end of the welding groove 13 is surrounded by a notch, and the connecting portion 21 is configured to fit the welding groove 13. 1.0≤d2 / d3≤1.25, where d3 is the maximum diameter of the connecting portion 21. The notch is circular, and d2 is the diameter of the notch. This structural arrangement can improve the compatibility of the welding groove 13 with the pin 20. By designing one end of the welding groove 13 as a circular notch and ensuring that the dimensions of the connecting portion 21 and the welding groove 13 are precisely matched, that is, the ratio of the notch diameter d2 to the maximum diameter d3 of the connecting portion 21 is between 1.0 and 1.25, a tight fit between the pin 20 and the circuit board can be achieved, reducing the offset of the pin 20 during the welding process and improving the consistency and reliability of welding. The circular notch design can evenly distribute solder, reduce welding stress, and enhance the mechanical strength of the welding point. It is suitable for electronic devices that require high current transmission and low contact resistance, such as battery management systems for electric vehicles and high-power power converters, and can effectively improve the efficiency and stability of power transmission. In addition, the circular notch is easy to process, which can reduce processing costs.

[0064] Specifically, one end of the welding groove 13 is surrounded by a notch, and the connecting portion 21 is adapted to fit the welding groove 13. 1.0≤d2 / d3≤1.25, d3 is the maximum diameter of the connecting portion 21. The notch is square, and d2 is the minimum side length of the notch. With such a structural setting, by designing one end of the welding groove 13 as a square notch, the ratio of the minimum side length d2 to the maximum diameter d3 of the connecting portion 21 is also between 1.0 and 1.25, which can provide a more stable positioning for the pin 20 and reduce the difficulty of assembly caused by the irregular shape of the pin 20. The square notch design can improve space utilization, ensure the stable operation of the circuit board under high load, and reduce the size of the circuit board to meet the needs of miniaturization and thinness of equipment.

[0065] Specifically, one end of the welding groove 13 is surrounded by a notch, and the connecting portion 21 is adapted to fit the welding groove 13. 1.0≤d2 / d3≤1.25, d3 is the maximum diameter of the connecting portion 21. Among them, the notch is a triangle, and d2 is the diameter of the inscribed circle of the notch. With such a structural setting, one end of the welding groove 13 is designed as a triangular notch, and the ratio of the inscribed circle diameter d2 of the notch to the maximum diameter d3 of the connecting portion 21 is precisely matched between 1.0 and 1.25, which can provide a unique spatial positioning advantage and is suitable for electronic equipment designs that need to save space, such as portable electronic devices, wearable devices, etc. The triangular notch design combined with precise size matching can ensure the stable assembly of the pin 20 in a limited space. At the same time, the special shape of the triangle can enhance the structural strength of the edge of the welding groove, reduce stress concentration during welding, and improve the reliability and durability of the welding point.

[0066] A third embodiment of the present invention provides a power device, which includes the circuit board assembly provided in the second embodiment.

[0067] By controlling the ratio of the depth of the soldering groove 13 to the thickness of the copper layer 11, the power device provided by Example 3 of the present invention ensures that the pins 20 penetrate deeply into the copper layer 11 during soldering, forming a more secure mechanical and electrical connection, thereby improving the reliability and durability of the circuit board. This prevents the connection between the pins 20 and the copper layer from easily falling off when the circuit board is subjected to high current surges, ensuring the continuity and stability of power transmission. This is a key technology for achieving efficient and safe operation in equipment such as electric vehicles and high-power power converters. Furthermore, this configuration can improve the soldering efficiency and quality of devices such as electric vehicles and high-power power converters by improving the soldering process. The presence of the soldering groove 13 increases the soldering area, lowers the soldering temperature, and reduces thermal stress, thereby improving soldering reliability and stability. It also reduces the occurrence of low-tin defects during soldering, thereby reducing the low-tin defect rate within the soldering groove 13 and improving soldering quality. The presence of the soldering groove 13 increases soldering stability and reduces the spattering and oxidation of the molten metal during soldering, thereby reducing the probability of low-tin defects. Therefore, the power device provided in this embodiment can solve the technical problem of low welding precision between the circuit board and the pins in the prior art.

[0068] Specifically, the welding between the pin 20 and the circuit board includes the following steps.

[0069] Step 1: Create a soldering groove 13 at a location to be soldered on the circuit board.

[0070] The specific operation is as follows: First, use precision mechanical equipment to cut a groove at the location to be soldered on the circuit board. The groove depth is 0.5 to 1 times the thickness of the copper layer 11, and the groove diameter is 1 to 1.25 times the bottom diameter of the pin 20. This size combination can reduce equipment soldering errors and improve soldering stability. Therefore, during the groove cutting process, the shape and size of the groove must be strictly controlled to ensure the accuracy of the soldering position.

[0071] Step 2: Improve the extremely difficult soldering condition of pin 20.

[0072] The specific operation is as follows: A new alloy material with high conductivity and a low melting point is used for welding on a circuit board with welding grooves 13 formed. Laser welding technology is used, with a laser power of 1000-1200W (inclusive), a welding speed of 5-7mm / s (inclusive), and a welding temperature of 250°C. During the welding process, the laser head's movement speed and path must be precisely controlled to ensure consistent and reliable welding.

[0073] Step 3: Reduce the probability of insufficient tin defects in the welding groove 13.

[0074] The specific operation is as follows: During the welding process, strictly control the welding parameters to ensure that the tin content of the welding is 0.05-0.1mg (including 0.05mg and 0.1mg). During the welding process, it is necessary to monitor the welding process in real time and adjust the welding parameters in time to ensure the tin content to reduce the occurrence of tin deficiency defects during the welding process.

[0075] From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects:

[0076] 1. Improve welding position accuracy: This solution's pin welding technology creates a groove at the DBC pin welding position, making the welding between the pin and the circuit board more precise. This effectively solves the problem of difficult to ensure welding position accuracy in traditional technologies, thereby improving welding quality and reliability.

[0077] 2. Reduce the defect rate of insufficient tin: Due to the slot design of the pin welding position, the solder can flow into the groove more easily, reducing the occurrence of insufficient tin defects and improving the consistency and quality of welding. The presence of the groove can increase the stability of welding and reduce the splashing and oxidation of the molten metal during welding, thereby reducing the poor welding phenomenon caused by insufficient tin defects.

[0078] 3. Improve the extremely difficult soldering situation of the pins: Through the improvement of the grooving and welding process, the extremely difficult soldering situation of the pins has been significantly improved, the welding success rate has been increased, and the welding difficulty and cost have been reduced.

[0079] 4. Improve welding efficiency and consistency: Welding is performed through machine automation, which improves welding efficiency and consistency, reduces the uncertainty and error of manual operation, and makes large-scale production possible.

[0080] 5. Wide range of applications: Suitable for pins and circuit boards of various materials and designs, with broad application prospects.

[0081] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0082] Unless otherwise specified, the relative arrangement of the parts and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application. Meanwhile, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to actual proportional relationships. Technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments can have different values. It should be noted that similar numbers and letters represent similar items in the following drawings, and therefore, once an item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0083] In the description of this application, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of this application; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0084] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0085] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0086] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A circuit board, characterized in that: include: A substrate (10), the substrate (10) comprising a copper layer (11) and a support layer (12) attached to each other; the outer edge of the support layer (12) protrudes from the outer edge of the copper layer (11) or is arranged flush with the outer edge of the copper layer (11); a welding groove (13) is provided on the substrate (10); at least a portion of the welding groove (13) is located on the copper layer (11); the welding groove (13) is used for inserting a pin (20); The depth of the welding groove (13) is d1, the thickness of the copper layer (11) is d0, and 0.5≤d1 / d0≤1.

5.

2. The circuit board according to claim 1, wherein: The welding groove (13) is located on the copper layer (11); wherein 0.5≤d1 / d0≤1; or, The welding groove (13) comprises a first groove section and a second groove section connected to each other, the first groove section forming at least a portion of the welding groove (13), and the second groove section being located on the supporting layer (12); wherein 1<d1 / d0≤1.

5.

3. The circuit board according to claim 1, wherein: Along the extension direction of the welding groove (13), the shape of the cross section of the welding groove (13) remains unchanged; and / or, Along the extending direction of the welding groove (13), the area of ​​the cross section of the welding groove (13) remains unchanged.

4. The circuit board according to claim 1, wherein: The notch of the welding groove (13) is circular, triangular or square; and / or, There are a plurality of welding grooves (13), and the plurality of welding grooves (13) are arranged at intervals.

5. The circuit board according to claim 1, wherein: A guide surface is provided at the notch of the welding groove (13); Wherein, the guide surface and the extension direction of the groove wall of the welding groove (13) are arranged at a preset angle, and the preset angle is greater than 0 degrees and less than 90 degrees; and / or, The guide surface is arranged around the notch; and / or, The guide surface is an arc surface or a plane surface.

6. The circuit board according to claim 1, wherein: Along the extension direction of the welding groove (13), the welding groove (13) is in a gradually expanding shape; the groove wall of the welding groove (13) is arranged at an inclination.

7. The circuit board according to claim 1, wherein: The circuit board also includes: A storage groove is provided on the substrate (10) and is located at the edge of the welding groove (13), and the storage groove is communicated with the welding groove (13); the storage groove is used to store solder.

8. A circuit board assembly, characterized in that: include: The circuit board according to any one of claims 1 to 7; A plug pin (20), wherein the connecting portion (21) of the plug pin (20) is used for being inserted into the soldering groove (13) of the circuit board; solder (22) is provided on one side of the connecting portion (21) close to the bottom of the soldering groove (13).

9. The circuit board assembly according to claim 8, wherein: One end of the welding groove (13) is formed into a notch; the connecting portion (21) is adaptively arranged to the welding groove (13); 1.0≤d2 / d3≤1.25, d3 is the maximum diameter of the connecting portion (21); Wherein, the notch is circular, d2 is the diameter of the notch; or, The notch is square, and d2 is the minimum side length of the notch; or, The notch is triangular, and d2 is the diameter of the inscribed circle of the notch.

10. A power device, characterized in that: include: The circuit board assembly as claimed in claim 8 or 9.

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