Circuit board structure of same-layer mixed material

Abstract

The utility model provides a circuit board structure of a same-layer mixed material, the circuit board structure comprises a single-sided copper-clad plate, a mixed material layer and a double-sided copper-clad plate which are laminated in sequence, the mixed material layer comprises a high-frequency material pattern layer, and high-frequency lines and common lines which are distributed in a mutually staggered manner, and the double-sided copper-clad plate comprises a double-sided copper-clad plate and a double-sided copper-clad plate which are laminated in sequence. The high-frequency material pattern layer corresponds to the high-frequency circuit; the common circuit is distributed on the double-sided copper-clad plate; the high-frequency circuit and the single-sided copper-clad plate are laminated, the common circuit is arranged on the double-sided copper-clad plate, and then the two core plates are laminated mutually, so that the high-frequency circuit and the common circuit are positioned on the same layer, and the problems that the high-frequency circuit and the common circuit need to be designed in a layered manner in the prior art, and the cost is low are solved. And the circuit board is poor in design and application flexibility.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, in particular to a circuit board structure of same-layer mixed materials. Background Art

[0002] Multi-layer circuit boards are generally made up of layers of core boards pressed together. For designs that require high-frequency circuits and ordinary circuits to be mixed in the same circuit board, the high-frequency layer and the ordinary layer are generally designed to be separated into two layers, and then the two layers are pressed together to achieve mixed pressing characteristics.

[0003] However, the design of the entire high-frequency layer requires the back-end working module to design the corresponding circuit pattern distribution layer according to the high-frequency layer, which makes the circuit board design and application less flexible, resulting in greater limitations in the design.

[0004] Based on the above background and problems, it is necessary to provide a new circuit board structure with mixed materials on the same layer. Utility Model Content

[0005] The utility model aims to solve the problem that the current high-frequency circuit board designs high-frequency lines and ordinary lines in separate layers and then presses them together, resulting in poor flexibility in circuit board design and application, which leads to significant design limitations. The utility model provides a circuit board structure with mixed materials in the same layer:

[0006] The circuit board structure includes a single-sided copper clad laminate, a mixed material layer and a double-sided copper clad laminate stacked in sequence; the mixed material layer includes a high-frequency material graphic layer, and high-frequency circuits and ordinary circuits that are staggered with each other; the high-frequency material graphic layer corresponds to the high-frequency circuit; the ordinary circuit is distributed on the double-sided copper clad laminate.

[0007] Furthermore, the single-sided copper clad laminate includes a first insulating dielectric layer, and the high-frequency material pattern layer is stacked and distributed on the first insulating dielectric layer.

[0008] Furthermore, the material of the high-frequency material pattern layer is PTFE, epoxy resin composite ceramic powder or pure ceramic.

[0009] Furthermore, the thickness of the high-frequency material pattern layer is 10 microns to 50 microns.

[0010] Furthermore, the circuit board structure is provided with a via hole, and the via hole does not pass through the high-frequency material pattern layer.

[0011] Furthermore, the flatness of the hole wall of the via hole is 2 microns to 5 microns.

[0012] Furthermore, the first insulating medium layer is made of epoxy resin composite glass fiber.

[0013] Furthermore, the insulating dielectric layer of the double-sided copper clad laminate is an epoxy resin composite glass fiber material.

[0014] The circuit board structure of the same layer of mixed materials proposed by the utility model is designed by interlacing high-frequency circuits and ordinary circuits, and arranging them on two layers of single-sided copper clad laminate and double-sided copper clad laminate respectively and then pressing them together, so that the ordinary circuits and ordinary circuits are distributed in the same layer of mixed material. This solves the problem of the existing technology that requires the high-frequency circuits and ordinary circuits to be designed in layers, resulting in poor flexibility in circuit board design and application. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0016] Figure 1 This is a cross-sectional schematic diagram of a circuit board structure of a same-layer mixed material according to the present invention.

[0017] Description of Figure Numbers:

[0018]

[0019] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0021] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), such directional indications are only used to explain the relative position relationship, movement status, etc. between the various components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0022] In order to better understand the above technical solution, the above technical solution is described in detail below with reference to the accompanying drawings.

[0023] See also Figure 1 , Figure 1 This is a cross-sectional schematic diagram of a circuit board structure of a same-layer mixed material according to the present invention.

[0024] The circuit board structure 10 of the same-layer mixed material in this embodiment includes a single-sided copper clad laminate 100, a mixed material layer 200 and a double-sided copper clad laminate 300 stacked in sequence; the mixed material layer 200 includes a high-frequency material graphic layer 210, and high-frequency circuits 220 and ordinary circuits 230 that are staggered and distributed with each other; the high-frequency material graphic layer 210 corresponds to the high-frequency circuit 220.

[0025] In this embodiment, a single-sided copper clad laminate 100, a mixed material layer 200, and a double-sided copper clad laminate 300 are separately manufactured, and then the three-layer structure is pressed into a circuit board structure 10. That is, the circuit board structure 10 finally formed by pressing is a three-layer structure in which the single-sided copper clad laminate 100 and the double-sided copper clad laminate 300 sandwich the mixed material layer 200, and the high-frequency circuits 220 and the ordinary circuits 230 that are staggered in distribution are both located in the same layer of the mixed material layer 200 through pressing.

[0026] In this embodiment, the mixed material layer 200 is a single-sided copper-clad laminate, including a copper layer and a high-frequency material graphic layer 210. The high-frequency material graphic layer 210 is first patterned, and then a high-frequency circuit 220 is made on the copper layer of the mixed material layer 200 corresponding to the pattern of the high-frequency material graphic layer 210, so that the high-frequency material graphic layer 210 corresponds to the high-frequency circuit 220, providing a lamination basis for the subsequent lamination process.

[0027] Preferably, the thickness of the high-frequency material pattern layer 210 is 10 microns to 50 microns.

[0028] Optionally, the material of the high-frequency material pattern layer 210 is PTFE, epoxy resin composite ceramic powder or pure ceramic.

[0029] In this embodiment, the circuit board structure 10 is pressed in stages, because stacking and pressing the three-layer structure at one time can easily lead to inter-layer displacement, resulting in poor bonding between layers and low circuit board processing yield.

[0030] The single-sided copper clad laminate 100 includes a first insulating dielectric layer 110 , and a high-frequency material pattern layer 210 is laminated on the first insulating dielectric layer 110 . In this embodiment, the first lamination is to laminate the high-frequency material pattern layer 210 and the first insulating dielectric layer 110 .

[0031] The common circuit 230 is distributed on the double-sided copper clad laminate 300 . In this embodiment, the common circuit 230 is laminated on the second insulating medium layer 310 of the double-sided copper clad laminate 300 , that is, the common circuit 230 is formed on one side of the copper layer of the double-sided copper clad laminate 300 .

[0032] Finally, the layer where the high-frequency circuit 220 is located is pressed against the layer where the common circuit 230 is located, so that the common circuit 230 and the high-frequency circuit 220 are located together in the mixed material layer 200 .

[0033] Preferably, the first insulating medium layer 110 and the second insulating medium layer 310 are both made of epoxy resin composite glass fiber.

[0034] It is worth noting that since the first insulating dielectric layer 110 and the second insulating dielectric layer 310 are both made of epoxy resin composite glass fiber, they have a certain fluidity after hot pressing, which makes the glue filling between the high-frequency circuit 220 and the ordinary circuit 230 more sufficient, thereby improving the interlayer bonding strength.

[0035] The key to the present invention is to stagger the high-frequency circuit 220 and the ordinary circuit 230 and distribute them on different board layers to avoid squeezing of the high-frequency circuit 220 and the ordinary circuit 230 during pressing, which would cause the whole circuit board processing to fail.

[0036] In summary, the circuit board structure 10 is formed by pressing, and then a circuit pattern is formed on the surface copper layer to form a finished circuit board.

[0037] In one embodiment, the circuit board structure 10 is provided with a via 400. It is worth noting that the via 400 only passes through the area of ​​the ordinary material layer, and does not pass through the area of ​​the high-frequency material graphic layer 210. That is, the via 400 passes through the surface copper layer of the circuit board structure 10 and the ordinary line 230 in the middle.

[0038] The design of the above-mentioned via 400 is an additional technical feature of the technical solution of the present invention. Since the high-frequency circuit board in the prior art is designed with the high-frequency circuit 220 and the ordinary circuit 230 in a layered and partitioned manner, designing the via 400 on the circuit board structure 10 will cause the via 400 to pass through the high-frequency material pattern layer 210, resulting in two different materials on the hole wall 410. Since the copper plating speed of the high-frequency material pattern layer 210 is slower than that of the ordinary material area, the subsequent hole copper electroplating will cause the hole wall 410 to be uneven and gaps to appear in the high-frequency material pattern layer 210.

[0039] In response to the above-mentioned via design issues, in this embodiment, the high-frequency material pattern layer 210 is patterned so that the high-frequency material pattern layer 210 corresponds to the high-frequency circuit 220. After lamination, the high-frequency circuit 220 and the ordinary circuit 230 are located on the same layer and do not affect each other. Therefore, the via 400 made on the circuit board passes through the area of ​​the mixed material layer 200 without the high-frequency material pattern layer 210. The hole wall 410 of the ordinary circuit 230 and the via 400 are made of the same material, so that the copper plating speed of the hole wall 410 during the subsequent hole copper electroplating is the same, and the hole wall 410 is relatively smoother.

[0040] Preferably, the flatness of the hole wall 410 of the via hole 400 is 2 microns to 5 microns.

[0041] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the description and drawings of the present invention embodiment under the utility model concept of the present invention embodiment, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention embodiment.

Claims

1. A circuit board structure with mixed materials on the same layer, characterized in that: The circuit board structure includes a single-sided copper clad laminate, a mixed material layer and a double-sided copper clad laminate stacked in sequence; The mixed material layer includes a high-frequency material pattern layer and a common material layer that are staggered and distributed with each other, and a high-frequency circuit and a common circuit that are staggered and distributed with each other; The high-frequency material graphic layer corresponds to the high-frequency circuit; the ordinary circuit is distributed on the double-sided copper clad board.

2. A circuit board structure of mixed materials in the same layer as claimed in claim 1, characterized in that: The single-sided copper clad laminate includes a first insulating dielectric layer, and the high-frequency material pattern layers are stacked and distributed on the first insulating dielectric layer.

3. A circuit board structure of mixed materials in the same layer as claimed in claim 1 or 2, characterized in that: The material of the high-frequency material pattern layer is PTFE, epoxy resin composite ceramic powder or pure ceramic.

4. A circuit board structure of mixed materials in the same layer as claimed in claim 1, characterized in that: The thickness of the high-frequency material pattern layer is 10 microns to 50 microns.

5. A circuit board structure of mixed materials in the same layer as claimed in claim 1, characterized in that: The circuit board structure is provided with a via hole, and the via hole passes through the common material layer.

6. A circuit board structure of mixed materials in the same layer as claimed in claim 5, characterized in that: The flatness of the hole wall of the via hole is 2 microns to 5 microns.

7. A circuit board structure of mixed materials in the same layer as claimed in claim 2, characterized in that: The first insulating medium layer is made of epoxy resin composite glass fiber.

8. A circuit board structure of mixed materials in the same layer as claimed in claim 1, characterized in that: The insulating dielectric layer of the double-sided copper clad laminate is an epoxy resin composite glass fiber material.

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