Circuit board production line

Abstract

The utility model discloses a circuit board production line. The circuit board production line comprises a linear conveying line, an annular conveying line and a processing station, wherein the linear conveying line is used for conveying a substrate; the annular conveying line is used for conveying spraying pieces; the linear conveying line and the annular conveying line at least coincide at the processing station, so that the spraying piece sprays the substrate; the annular conveying line is further provided with a replacement mechanism, and the replacement mechanism can replace the spraying pieces running on the annular conveying line so as to be matched with different machining technologies. The circuit board production line is high in integration level, short in line body length and small in occupied area.

Description

Technical Field

[0001] The utility model relates to the field of printed circuit board production and manufacturing, in particular to a circuit board production line. Background Art

[0002] In the related art, the wet process of printed circuit boards includes development, etching, film stripping, browning, copper electroplating, tin electroplating, nickel-gold electroplating, etc. The equipment used in its production process is mainly horizontal continuous lines. For example, the DES production line (a printed circuit board production line) is designed according to the process flow to include the board entry section, first development, second development, new liquid washing, isolation section, three-level overflow water washing, four-level overflow water washing, inspection section, first vacuum etching, second vacuum etching, third vacuum etching, fourth vacuum etching, compensation etching, three-level overflow water washing, inspection section, first film stripping, second film stripping, new liquid washing, three-level overflow water washing, acid washing, four-level overflow water washing, isolation section, strong air drying, hot air drying, and board output section.

[0003] Each of the above processes requires a separate process equipment to perform the process steps. Each process equipment is arranged sequentially along the length of the line, and the line transports the substrates through the above process equipment in sequence. As a result, the existing circuit board production line has the problem of excessive line length and large floor space. Utility Model Content

[0004] The present invention aims to solve at least one of the technical problems in the prior art. To this end, the present invention proposes a circuit board production line with a high degree of integration, a short line length, and a small footprint.

[0005] A circuit board production line according to a first embodiment of the present invention includes:

[0006] Linear conveyor line, used to convey substrates;

[0007] Ring conveyor line, used to convey spray parts;

[0008] A processing station, wherein the linear conveying line and the ring conveying line overlap at least at the processing station, so that the spraying part sprays the substrate;

[0009] The ring conveyor line is also provided with a replacement mechanism, which can replace the spray parts running on the ring conveyor line to match different processing techniques.

[0010] The circuit board production line according to the embodiment of the utility model has at least the following beneficial effects:

[0011] The spray element can spray any functional liquid such as developer and etching liquid. Developer is used in the development process to dissolve the exposed photoresist, and etching liquid is used in the etching process to react with the substrate material to form a specific pattern on the substrate surface. Alternatively, the spray element can spray cleaning liquids such as sulfuric acid and plasma water to remove impurities or waste liquid remaining on the substrate. Alternatively, the spray element can spray air flow, hot air, etc. to dry the substrate. It is understandable that the ring conveyor line continuously transports different spray elements to the processing stations to match different processing processes. Taking the DES production line as an example, at least the process steps such as the first development, second development, first vacuum etching to fourth vacuum etching can be integrated into the processing station, thereby greatly reducing the number of process equipment on the line, shortening the length of the line, and reducing the floor space occupied by the line.

[0012] According to some embodiments of the present invention, the circuit board production line also includes a cleaning station, and the linear conveyor line passes through the cleaning station. At least the linear conveyor line between the cleaning station and the processing station can drive the substrate to move back and forth so that the substrate can be moved from the processing station to the cleaning station, or, the substrate can be moved from the cleaning station to the processing station.

[0013] According to some embodiments of the present invention, the linear conveying line and the ring-shaped conveying line are arranged alternately in the vertical direction, and the ring-shaped conveying line is arranged higher than the linear conveying line.

[0014] According to some embodiments of the present invention, the linear conveyor line includes a first guide rail and a first hanger slidably connected to the first guide rail, and the first hanger is used to be connected to the substrate so that the substrate is suspended on the first hanger.

[0015] According to some embodiments of the present invention, the ring-shaped conveyor line includes a second guide rail and a second hanger slidably connected to the second guide rail, and the second hanger is used to be connected to the spray element so that the spray element is suspended on the second hanger;

[0016] When the first hanger and the second hanger are both moved to the processing station, the spraying member and the substrate are at the same height and are arranged in parallel.

[0017] According to some embodiments of the present invention, the second hanger includes two connecting members and two spraying members arranged in parallel, and each of the connecting members is connected to one of the spraying members;

[0018] Wherein, when the first hanger and the second hanger are both moved to the processing station, the substrate is located between the two spraying parts.

[0019] According to some embodiments of the present invention, the spray element includes a main body and at least one spray head, and the spray head is rotatably connected to the main body. When the spray element is working, the spray head can rotate relative to the main body.

[0020] According to some embodiments of the present invention, the spray part is driven to move unidirectionally along the ring-shaped conveyor line, the replacement mechanism has a feed end and a discharge end, the spray part moves from the discharge end to the processing station, and moves from the processing station to the feed end.

[0021] According to some embodiments of the present invention, the ring-shaped conveyor line has at least one straight segment, and along the vertical projection, the straight segment and the linear conveyor line are arranged to overlap, and along the length direction of the linear conveyor line, the length of the straight segment is greater than the length of the processing station.

[0022] According to some embodiments of the present invention, the processing station is provided with a recovery mechanism, which is located below the linear conveyor line and the ring conveyor line and is used to receive the liquid sprayed by the spraying part.

[0023] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0025] Figure 1 This is a schematic structural diagram of a circuit board production line according to an embodiment of the present invention;

[0026] Figure 2 This is a side view of the substrate and the spraying part of the embodiment of the utility model when both are located at the processing station;

[0027] Figure 3 This is a front view of the substrate and the spraying part during transportation according to an embodiment of the utility model.

[0028] Reference numerals:

[0029] Linear conveyor line 100; first guide rail 110; first hanger 120; substrate 130;

[0030] Annular conveyor line 200; straight section 201; second guide rail 210; second hanger 220; connecting member 221; spraying member 230; main body 231; spray head 232; replacement mechanism 240; feeding end 241; discharging end 242;

[0031] Processing station 300; cleaning station 350; DETAILED DESCRIPTION

[0032] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0033] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0034] In the description of this utility model, "several" means more than one, "plurality" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of the terms "first" and "second" is solely for the purpose of distinguishing technical features and is not to be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0035] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0036] In the description of the present invention, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0037] In the related art, the wet process of printed circuit boards includes development, etching, film stripping, browning, copper electroplating, tin electroplating, nickel-gold electroplating, etc. The equipment used in its production process is mainly horizontal continuous lines. For example, the DES line (a printed circuit board production line) is designed according to the process flow to include the board entry section, first development, second development, new liquid washing, isolation section, three-level overflow water washing, four-level overflow water washing, inspection section, first vacuum etching, second vacuum etching, third vacuum etching, fourth vacuum etching, compensation etching, three-level overflow water washing, inspection section, first film stripping, second film stripping, new liquid washing, three-level overflow water washing, acid washing, four-level overflow water washing, isolation section, strong air drying, hot air drying, and board output section.

[0038] The line body transports the substrates through the above process sections in sequence, and the conveying direction of the line body is irreversible. Therefore, the circuit board production line in the prior art has the problems of excessive line length and high line energy consumption.

[0039] In order to solve the above problems, the embodiment of the present application proposes a circuit board production line, which includes a linear conveyor line 100, a ring conveyor line 200 and a processing station 300, such as Figures 1 to 3 As shown, the linear conveyor line 100 is a straight line. It is understood that the linear conveyor line 100 can also be curved, wavy, etc. The main function of the linear conveyor line 100 is to convey the substrate 130 to move the substrate 130 from the loading position through the processing station 300 and the cleaning station 350 to the unloading position. The ring conveyor line 200 is a closed ring, which can be a circular ring, a square ring or a ring. Figure 1 The irregular annular structure shown. The annular conveyor line 200 is used to convey the spray element 230, which can move unidirectionally on the annular conveyor line 200. The linear conveyor line 100 and the annular conveyor line 200 overlap at least at the processing station 300. The substrate 130 on the linear conveyor line 100 can be parked at the processing station 300, and the spray element 230 of the annular conveyor line 200 can also be parked at the processing station 300, so that the spray element 230 can be arranged corresponding to the substrate 130.

[0040] The spray element 230 can spray any functional liquid, such as a developer or an etchant. The developer is used in the development process to dissolve the exposed photoresist; the etchant is used in the etching process to react with the substrate 130 material to form a specific pattern on the substrate 130 surface. Alternatively, the spray element 230 can spray cleaning liquids such as sulfuric acid and plasma water to remove residual impurities or waste liquid from the substrate 130. Furthermore, the spray element 230 can spray airflow, hot air, or other liquids to dry the substrate 130.

[0041] It is understood that the ring conveyor line 200 is provided with a replacement mechanism 240, and the replacement mechanism 240 is provided with a storage of spraying parts 230, which contains a variety of spraying parts 230. Different spraying parts 230 can achieve different functions. The replacement mechanism 240 can replace the spraying parts 230 running on the ring conveyor line 200, so as to Figure 1 As shown, after the spray part 230 is removed from the replacement mechanism 240, it moves counterclockwise along the ring conveyor line 200, undergoes corresponding spraying treatment at the processing station 300, and then continues to return to the replacement mechanism 240 in the counterclockwise direction, thereby recycling the spray part 230 to replace the spray part 230 required for the next process step to the ring conveyor line 200.

[0042] It is understood that the ring conveyor line 200 continuously conveys different spraying components 230 to the processing stations 300 to match different processing techniques. For example, during development, the spraying component 230 storing developer solution is conveyed to the processing station 300, while during etching, the spraying component 230 storing etching solution is conveyed to the processing station 300.

[0043] Taking the DES production line as an example, at least the first development, the second development, the first vacuum etching to the fourth vacuum etching and other process steps can be integrated into the processing station 300. The replacement mechanism 240 is used to place the corresponding spray parts 230 on the ring conveyor line 200 in sequence, so that the processing station 300 can perform the above-mentioned processes in sequence, thereby eliminating the need to set up special equipment for a single process, thereby greatly reducing the number of process equipment on the line, shortening the length of the line, and reducing the area occupied by the line.

[0044] In some embodiments, the circuit board production line further includes a cleaning station 350, and the linear conveyor line 100 passes through the cleaning station 350. Figure 1 As shown, along the transmission direction of the linear conveyor line 100, the cleaning station 350 is located downstream of the processing station 300. The cleaning station 350 can be equipped with automated equipment to clean the substrates 130 entering the cleaning station 350, or alternatively, the cleaning station 350 can be arranged with an operator to manually clean the passing substrates 130. It should be noted that at least the linear conveyor line 100 between the cleaning station 350 and the processing station 300 can reciprocate so that the substrates 130 can be moved from the processing station 300 to the cleaning station 350, and can also be moved from the cleaning station 350 to the processing station 300.

[0045] It is understood that in some embodiments, when the substrate 130 needs to be cleaned before the next process is performed after the processing station 300 completes a process, the substrate 130 can be transferred from the processing station 300 to the cleaning station 350 for processing, and then transferred back to the processing station 300 to perform the next process. It should be noted that in some embodiments, the entire linear conveyor line 100 is configured as a structure capable of bidirectional conveyance. In other embodiments, the linear conveyor line 100 is formed by splicing multiple sections of conveyor belts. Therefore, it is only necessary to configure the conveyor belt between the processing station 300 and the cleaning station 350 as a bidirectional conveyance structure. When the conveyor belt between the processing station 300 and the cleaning station 350 is transported in reverse, it does not affect the normal operation of the remaining conveyor belts.

[0046] Since substrate 130 can be moved back and forth between cleaning station 350 and processing station 300, taking the DES production line as an example, cleaning steps such as fresh liquid washing, three-stage overflow water washing, four-stage overflow water washing, and acid washing can all be performed at cleaning station 350. After completing the processing steps at processing station 300, the substrate can be moved to cleaning station 350 for cleaning and then returned to processing station 300 for subsequent processing. This further improves the integration of the circuit board production line of the embodiment of the present application, making the entire production line shorter and occupying a smaller area.

[0047] In some embodiments, as Figure 2 As shown, the linear conveyor line 100 and the ring conveyor line 200 are staggered in the vertical direction, and the ring conveyor line 200 is arranged higher than the linear conveyor line 100. Therefore, the ring conveyor line 200 and the linear conveyor line 100 are staggered in height space to avoid track interference.

[0048] Furthermore, the linear conveyor line 100 includes a first guide rail 110 and a first hanger 120, and the first hanger 120 is slidably connected to the first guide rail 110. The first hanger 120 is used to connect the substrate 130 so that the substrate 130 is suspended on the first hanger 120. Figure 2 and Figure 3 As shown, the first hanger 120 is connected to the upper edge of the substrate 130, so that the substrate 130 is suspended below the first hanger 120. The first hanger 120 is driven to move along the first guide rail 110, thereby driving the substrate 130 to move.

[0049] The looped conveyor line 200 includes a second rail 210 and a second hanger 220, which is slidably connected to the second rail 210. The second hanger 220 is connected to a spray element 230, so that the spray element 230 is suspended from the second hanger 220. When the first hanger 120 and the second hanger 220 are both moved to the processing station 300, the spray element 230 and the substrate 130 are at the same height and arranged parallel to each other, so that the spray element 230 can spray liquid onto the surface of the substrate 130.

[0050] Furthermore, the second hanger 220 includes two parallel connecting members 221 and two spray members 230. Each connecting member 221 is connected to a spray member 230, thereby placing the two spray members 230 in parallel. When both the first hanger 120 and the second hanger 220 are moved to the processing station 300, the substrate 130 is positioned between the two spray members 230. The spray members 230 on both sides can spray the specific liquid on both the front and back sides of the substrate 130, allowing development, etching, and other processes to be performed simultaneously on the front and back sides of the substrate 130, thereby greatly improving processing efficiency.

[0051] In some embodiments, as Figure 2 As shown, the spray member 230 includes a main body 231 and at least one spray head 232. The spray head 232 is rotatably connected to the main body 231. When the spray member 230 is in operation, the spray head 232 can rotate relative to the main body 231. More specifically, the spray head 232 can move in a combination of up and down, left and right, and in a circular motion, thereby performing a swinging spraying on the substrate 130, so that the liquid is sprayed more evenly on the surface of the substrate 130, while effectively avoiding the pool effect.

[0052] In some embodiments, the spray component 230 is driven to move unidirectionally along the ring conveyor line 200, and the replacement mechanism 240 has a feed end 241 and a discharge end 242. The spray component 230 moves from the discharge end 242 to the processing station 300, and moves from the processing station 300 to the feed end 241. Thus, the spray component 230 moving toward the processing station 300 and the spray component 230 withdrawing from the processing station 300 do not interfere with each other. When the previous spray component 230 withdraws from the processing station 300, the next spray component 230 can be immediately replaced, which reduces waiting time and improves processing efficiency.

[0053] In some embodiments, the annular conveyor line 200 has at least one straight segment 201. In the vertical projection, the straight segment 201 and the linear conveyor line 100 are arranged to overlap. Along the length direction of the linear conveyor line 100, the length of the straight segment 201 is greater than the length of the processing station 300. Therefore, when the spray part 230 moves to the straight segment 201, there is sufficient distance to adjust the angle of the spray part 230 to avoid interference between the spray part 230 and the substrate 130 when the spray part 230 moves to the processing station 300.

[0054] In some embodiments, the processing station 300 is equipped with a recovery mechanism (not shown). The recovery mechanism is located below the linear conveyor line 100 and the circular conveyor line 200 and is used to receive liquid sprayed by the spray element 230. It is understood that the recovery mechanism can collect liquid and discharge it promptly. Furthermore, after the spray element 230 of the same type has finished spraying, the recovery mechanism discharges and recovers the liquid once, and stores each type of waste liquid separately, thereby achieving a classified recycling effect.

[0055] In summary, the circuit board production line of this application adopts a modular design, which enables free combination and rapid assembly of multiple modules, thereby enabling rapid customized production. The modular design helps reduce the complexity of the line, improves its maintainability and scalability, and increases product flexibility. It can be quickly assembled according to actual processing conditions and process requirements, simplifies parts, reduces production costs, and increases the speed of innovation. Ultimately, this achieves flexible product manufacturing and saves production costs.

[0056] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various modifications can be made within the scope of knowledge possessed by a person skilled in the art without departing from the spirit of the present invention. In addition, the embodiments of the present invention and the features of the embodiments can be combined with each other unless there is a conflict.

Claims

1. Circuit board production line, characterized in that, include: Linear conveyor line, used to convey substrates; Ring conveyor line, used to convey spray parts; A processing station, wherein the linear conveying line and the ring conveying line overlap at least at the processing station, so that the spraying part sprays the substrate; The ring-shaped conveyor line is further provided with a replacement mechanism, which can replace the spraying parts running on the ring-shaped conveyor line to match different processing techniques.

2. The circuit board production line according to claim 1, characterized in that: The circuit board production line also includes a cleaning station, and the linear conveyor line passes through the cleaning station. At least the linear conveyor line between the cleaning station and the processing station can drive the substrate to move back and forth so that the substrate can be moved from the processing station to the cleaning station, or the substrate can be moved from the cleaning station to the processing station.

3. The circuit board production line according to claim 1, characterized in that: The linear conveying line and the ring-shaped conveying line are arranged alternately in a vertical direction, and the ring-shaped conveying line is arranged higher than the linear conveying line.

4. The circuit board production line according to claim 3, characterized in that: The linear conveyor line includes a first guide rail and a first hanger slidably connected to the first guide rail. The first hanger is used to be connected to the substrate so that the substrate is suspended on the first hanger.

5. The circuit board production line according to claim 4, characterized in that: The ring-shaped conveyor line includes a second guide rail and a second hanger slidably connected to the second guide rail, wherein the second hanger is used to connect to the spraying element so that the spraying element is suspended on the second hanger; When the first hanger and the second hanger are both moved to the processing station, the spraying member and the substrate are at the same height and are arranged in parallel.

6. The circuit board production line according to claim 5, characterized in that: The second hanger includes two connecting pieces and two spraying pieces arranged in parallel, and each of the connecting pieces is connected to one of the spraying pieces; Wherein, when the first hanger and the second hanger are both moved to the processing station, the substrate is located between the two spraying parts.

7. The circuit board production line according to claim 1, characterized in that: The spraying member includes a main body and at least one spray head, and the spray head is rotatably connected to the main body. When the spraying member is working, the spray head can rotate relative to the main body.

8. The circuit board production line according to claim 1, characterized in that: The spraying member is driven to move unidirectionally along the ring-shaped conveyor line. The replacement mechanism has a feeding end and a discharging end. The spraying member moves from the discharging end to the processing station and from the processing station to the feeding end.

9. The circuit board production line according to claim 1, characterized in that: The annular conveyor line has at least one straight segment. In the vertical projection, the straight segment and the linear conveyor line are overlapped. Along the length direction of the linear conveyor line, the length of the straight segment is greater than the length of the processing station.

10. The circuit board production line according to claim 1, characterized in that: The processing station is provided with a recovery mechanism, which is located below the linear conveyor line and the ring conveyor line and is used to receive the liquid sprayed by the spraying part.

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