Multifunctional positioning device for special large-size flexible circuit board

Through the design of a multifunctional positioning device, problems such as dimensional instability and poor flatness of large-size flexible circuit boards have been solved, high-precision positioning has been achieved, and production efficiency and product quality have been improved.

CN223402646UActive Publication Date: 2025-09-30BOLO COUNTY JINGHUI ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202422826721.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-20
Publication Date
2025-09-30
Estimated Expiration
2034-11-20

AI Technical Summary

Technical Problem

In the existing technology, special large-size flexible circuit boards have problems such as unstable dimensions, poor flatness, straightness bending, misalignment of the bayonet, and offset positioning holes, which lead to unstable production and low pass rate.

Method used

A multifunctional positioning device is used, including an alignment template, a large film, a small film and positioning pins. Through the precise positioning hole and positioning point design, combined with laser processing, high-precision flexible circuit board positioning is achieved.

Benefits of technology

It improves production stability and product qualification rate, reduces production costs, improves production efficiency, and meets customer delivery needs.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model relates to the technical field of flexible circuit board production, in particular to a multifunctional positioning device for a special large-size flexible circuit board. The alignment device comprises an alignment template, a large film, a small film and a positioning pin, the alignment template is provided with a first template positioning hole and a second template positioning hole, the large film is provided with a large film positioning point, the small film is provided with a small film positioning point, when the flexible circuit board is processed by laser, the flexible circuit board, the large film and the alignment template are sequentially stacked from top to bottom, and the positioning pin is arranged on the alignment template. The positioning pin is inserted into a first circuit board positioning hole, a large film positioning point and a first template positioning hole of the flexible circuit board; when the flexible circuit board is subjected to laser shaping, the flexible circuit board, the small film and the alignment template are sequentially stacked from top to bottom, and the positioning pins are inserted into the second circuit board positioning holes, the small film positioning points and the second template positioning holes of the flexible circuit board. The device is easy to operate and stable in quality, the production cost is greatly reduced, the production difficulty is reduced, and the production efficiency is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of flexible circuit board production, in particular to a multifunctional positioning device for a special large-size flexible circuit board. Background Art

[0002] With the changes of the times and the continuous development and progress of science and technology, the types of special large-size flexible circuit boards are gradually increasing. The complex design poses great difficulties for the production process of flexible circuit boards. Many products are customized, and the production process is complex. It is very difficult to realize, make, and produce finished products. The requirements for each size of the product are very strict, and the flatness and straightness requirements are very high. The product is divided into inner and outer layers for multiple positioning processing. The product size reaches more than 1.5 meters. The expansion and contraction of the product after the previous production process is inconsistent and very unstable. In addition, the positioning points on the product expand and contract greatly in the X and Y directions. The laser positioning method currently used is to use the positioning points added to the product. Every time the laser shape comes out, the dimensions of many products are inconsistent. The dimensions of the produced products have always been very unstable, the flatness is poor, the straightness is bent, the bayonet does not match, and the positioning hole is offset, which seriously affects the quality of the product and the delivery time of the product. When used, the size bayonet does not match, the flatness is poor, the straightness is bent, the positioning hole is offset and cannot be installed, and the qualified rate is very low, which seriously affects the production progress and qualified rate. Utility Model Content

[0003] The utility model provides a multifunctional positioning device for a special large-size flexible circuit board, aiming to solve the problems of unstable dimensions, poor flatness, straightness bending, misalignment of bayonets, and offset positioning holes of existing products.

[0004] The utility model provides a special large-size flexible circuit board multifunctional positioning device, comprising an alignment template, a large film, a small film, and a positioning pin. The alignment template is provided with a first template positioning hole and a second template positioning hole, the large film is provided with a large film positioning point, and the small film is provided with a small film positioning point. When laser processing the flexible circuit board, the flexible circuit board, the large film, and the alignment template are stacked in sequence from top to bottom, and the positioning pins are inserted into the first circuit board positioning hole, the large film positioning point, and the first template positioning hole of the flexible circuit board; when laser shaping the flexible circuit board, the small film, and the alignment template are stacked in sequence from top to bottom, and the positioning pins are inserted into the second circuit board positioning hole, the small film positioning point, and the second template positioning hole of the flexible circuit board.

[0005] As a further improvement of the present invention, the first template positioning holes are arranged near the edge of the alignment template, and a plurality of the first template positioning holes are horizontally arranged in a long strip shape.

[0006] As a further improvement of the present invention, the second template positioning holes are arranged at a position away from the edge of the alignment template, and the four second template positioning holes are distributed at the four top corners of a square.

[0007] As a further improvement of the present invention, the large film sheet includes a large film outer frame and a large film effective area. The large film outer frame is connected to the outside of the large film effective area, and the large film positioning point is set on the large film outer frame.

[0008] As a further improvement of the present invention, a plurality of large film exhaust holes are provided in the large film effective area.

[0009] As a further improvement of the present invention, a small film positioning point is provided at the top corner of the small film sheet, and a plurality of small film exhaust holes are provided in the middle area of ​​the small film sheet.

[0010] As a further improvement of the present invention, the large film sheet is provided with a positioning hinge and a film marking line for the installation position of the reinforcement sheet on the flexible circuit board.

[0011] As a further improvement of the present invention, the small film sheet is provided with a size scale for shaping and aligning the flexible circuit board.

[0012] As a further improvement of the present invention, the first circuit board positioning hole is formed by laser processing the alignment position of the flexible circuit board with the large film positioning point.

[0013] As a further improvement of the present invention, the second circuit board positioning hole is formed by laser processing the alignment position of the small film positioning point on the flexible circuit board.

[0014] The beneficial effects of the utility model are as follows: through the high-precision multifunctional positioning device for processing and production, the problems of unstable product size, poor flatness, straightness bending, misalignment of the bayonet, and offset positioning holes can be effectively solved. The operation is simple and the quality is stable, which greatly reduces the production cost, reduces the production difficulty, improves the production efficiency, and also improves the production yield of the product, meeting the delivery needs of customers. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a connection structure diagram of the alignment template, large film, small film, and flexible circuit board in the utility model;

[0016] Figure 2 This is a planar structural diagram of the alignment template in the utility model;

[0017] Figure 3 This is a planar structural diagram of the large film in the utility model;

[0018] Figure 4This is a planar structural diagram of the small and medium-sized film of the utility model;

[0019] Figure 5 This is a schematic diagram of the overall plan of the flexible circuit board in the present utility model;

[0020] Figure 6 This is a structural diagram of a flexible circuit board in which a PI sheet and a PP sheet are pressed together in the present invention;

[0021] Figure 7 This is a structural diagram of the flexible circuit board after laser processing in the utility model. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.

[0023] like Figures 1 to 4 As shown, the utility model is a special large-size flexible circuit board multifunctional positioning device, including a positioning template 1, a large film 2, a small film 3, and a positioning pin 4. The positioning template 1 is provided with a first template positioning hole 11 and a second template positioning hole 12, the large film 2 is provided with a large film positioning point 21, and the small film 3 is provided with a small film positioning point 31. When laser processing the flexible circuit board 5, the flexible circuit board 5, the large film 2, and the positioning template 1 are stacked in sequence from top to bottom, and the positioning pin 4 is inserted into the first circuit board positioning hole, the large film positioning point 21, and the first template positioning hole 11 of the flexible circuit board 5; when laser shaping the flexible circuit board 5, the flexible circuit board 5, the small film 3, and the positioning template 1 are stacked in sequence from top to bottom, and the positioning pin 4 is inserted into the second circuit board positioning hole, the small film positioning point 31, and the second template positioning hole 12 of the flexible circuit board 5.

[0024] A multifunctional alignment template 1 is used to improve the alignment accuracy of each production and processing to achieve the final required processing accuracy. The alignment template 1 is approximately 1.9m×800mm in size and made of cast iron with a thickness of 5cm. The previously designed first template positioning holes 11 and second template positioning holes 12 are processed using a high-precision CNC machine tool in a machining center. Positioning holes of various diameters and various types of positioning holes with different diameters φ play different roles. The functions of various positioning holes are primary positioning, secondary positioning, and tertiary positioning. The processing of the entire plate is completed on the entire template to form the entire positioning system. The accuracy of the CNC machine tool can reach about 0.015~0.02mm.

[0025] First template positioning holes 11 are located near the edge of the alignment template 1, with multiple first template positioning holes 11 arranged horizontally in a long strip. Large-sized film 2 uses a standard alignment method. Two alignment lines, consisting of multiple first template positioning holes 11, are located at the upper and lower edges of the alignment template 1. Positioning of the film 2 and the alignment template 1 is completed by simply aligning the film positioning points 21 on the film 2 with the first template positioning holes 11 on the alignment lines.

[0026] Second template positioning holes 12 are located away from the edge of the alignment template 1. Four second template positioning holes 12 are distributed at the four corners of a square. The film 3 is positioned in four sections, with the four corners of the square film 3 aligned with the four second template positioning holes 12, achieving alignment between the film 3 and the alignment template 1.

[0027] like Figure 3 As shown, the film sheet 2 includes a film outer frame 22 and a film effective area 23. The film outer frame 22 is connected to the outside of the film effective area 23. The film positioning point 21 is set on the film outer frame 22. A plurality of film extraction holes 24 are provided within the film effective area 23. The outer contour of the film effective area 23 constitutes the effective edge 25 of the product. The actual product size cannot be smaller than the effective edge 25. The effective edge 25 mates with the inner circle of the film outer frame 22, and the outer circle of the film outer frame 22 constitutes the outer frame edge 26. The area enclosed by the effective edge and the outer frame edge 26 forms the structure of the film outer frame 22. The film positioning point 21 is set at this position so that it can precisely align with the edge area of ​​the flexible circuit board 5, thereby reducing contact with the center area of ​​the flexible circuit board 5. The film extraction holes 24 function to allow the film sheet 2 to absorb the product during processing to prevent movement or displacement.

[0028] Film positioning points 31 are located at the top corners of the film sheet 3, and multiple film extraction holes 32 are located in the center of the film sheet 3. The entire film sheet 3 is considered an effective area, and the outer contour of the film sheet 3 forms the film frame edge 26. The film positioning points 31 are located at the top corners of the film sheet 3, which can be aligned with the top corners of the flexible circuit board 5, minimizing contact with the center area of ​​the flexible circuit board 5. The film extraction holes 32 function to hold the film sheet 3 in place during processing to prevent movement.

[0029] The first circuit board positioning hole is formed by laser processing on the flexible circuit board 5 so as to align with the large film positioning point 21. The second circuit board positioning hole is formed by laser processing on the flexible circuit board 5 so as to align with the small film positioning point 31.

[0030] Before production, two types of films are made (film belongs to: silver halide photosensitive film), a large customized large film 2 and a small small film 3. The large film 2 is used to locate the groove of the laser inner layer PP sheet 6 (semi-cured sheet) and the first circuit board positioning hole, and the small film 3 is used for the final laser shape and the second circuit board positioning hole on the flexible circuit. Before use, the large and small films are lasered with air holes in the middle part area of ​​the film. The function of the air holes is to absorb the product during the processing to prevent movement and displacement. The size of the large film 2 is approximately 2.1m×700mm, and the size of the small film 3 is approximately: 650mm×500mm.

[0031] Film markings are provided on the large film sheet 2 to locate the hinge 51 and reinforcement sheet 52 on the flexible circuit board 5. The effective edge 25 of the large film active area 23 serves as the film markings. These markings allow the hinge 51 and reinforcement sheet 52 to be precisely installed in their desired locations on the flexible circuit board 5.

[0032] The small film 3 is provided with a size scale 33 for the shaping and alignment of the flexible circuit board 5. It is convenient to stick the required position of the flexible circuit board 5 with tape, and then use laser to remove other unnecessary external structures as a whole to achieve a special large-sized flexible circuit board 5 structure.

[0033] The operation and processing flow of the special large-size flexible circuit board 5 is carried out by this multifunctional positioning device:

[0034] (1) Cut the PP sheet 6 (prepreg) into the required size, place the PP sheet 6 on the large film sheet 2, and use the large film positioning point 21 to process the long groove and positioning holes on the PP sheet 6 by laser.

[0035] (2) Attach 3mil pure polyimide PI insulation layer 7 to the laser-processed PP sheet 6 (prepreg) on ​​the top and bottom, and use a high-temperature press to press the pure polyimide PI insulation layer 7 and the PP sheet 6 together to form a large-size flexible circuit board 5, as shown in FIG. Figure 6 shown.

[0036] (3) Place the laminated large-size flexible circuit board 5 on the large film 2, and laser process the first circuit board positioning hole on the flexible circuit board 5 corresponding to the position on the alignment template 1. After the laser processing of the first circuit board positioning hole is completed, place the large film 2 on the alignment template 1 according to the first template positioning hole 11, and use the positioning pin 4 to insert the flexible circuit board 5 and the large film 2 into the alignment template 1 at the same time. Use masking tape to stick the edge of the product flexible circuit board 5 and the edge of the large film 2. Use a stretcher to move the large film 2 and the flexible circuit board 5 horizontally onto the movable laser platform for production and processing.

[0037] (4) The flexible circuit board 5 with a good laser shape is attached with hinges 51 and reinforcement sheets 52 according to the film marking lines on the large film sheet 2. The function of the hinge 51 is to facilitate the two flexible circuit boards 5 to be put together and folded and bent. The function of the reinforcement sheet 52 is to increase the thickness of this position and reinforce it. Then, high-temperature pressing is performed again. During pressing, a 1.0 mm stainless steel wire 53 is inserted into the hole of the hinge 51 to prevent the hinge 51 from deforming. Figure 5 and Figure 7 shown. Figure 5 In the figure, the position marked 54 is the inner groove of the flexible circuit board 5, and the position marked 55 is the mounting hole lasered on the reinforcing sheet 52.

[0038] (5) Prepare the product with the hinge 51 and the reinforcing sheet 52 pressed together. Place the film 3 with the laser-cut air evacuation hole 32 on the alignment template 1 according to the second template positioning hole 12 through the four-stage positioning method. Place the flexible circuit board 5 with the hinge 51 and the reinforcing sheet 52 pressed on the film 3. At the same time, use the positioning pin 4 to insert the flexible circuit board 5 and the film 3 into the alignment template 1. The hole of the positioning pin 4 at one end of the product is designed to be an elliptical hole. There is a size scale 33 on the film 3. Use a magnifying glass and a flashlight to illuminate the scale size on the film 3. After alignment, use masking tape to cover the overall shape of the laser.

[0039] (6) Place the laser-finished flexible circuit board 5 on the alignment template 1 and insert the positioning pin 4 to check the bayonet position, straightness, curvature, flatness and matching.

[0040] The utility model uses the multifunctional positioning device to perform positioning processing on a special large-size flexible circuit board 5. The operation is simple and the problems of unstable product size, poor flatness, straightness bending, misalignment of the bayonet, and deviation of the positioning hole are effectively solved, thereby effectively improving the production yield and product delivery time.

[0041] The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and the specific implementation of the present invention cannot be considered to be limited to these descriptions. For those skilled in the art of the present invention, without departing from the concept of the present invention, several simple deductions or substitutions can be made, which should be considered to fall within the scope of protection of the present invention.

Claims

1. A special multifunctional positioning device for large-size flexible circuit boards, characterized in that: It includes an alignment template, a large film, a small film, and a positioning pin. The alignment template is provided with a first template positioning hole and a second template positioning hole. The large film is provided with a large film positioning point, and the small film is provided with a small film positioning point. When laser processing a flexible circuit board, the flexible circuit board, the large film, and the alignment template are stacked in sequence from top to bottom, and the positioning pins are inserted into the first circuit board positioning hole, the large film positioning point, and the first template positioning hole of the flexible circuit board; when laser shaping the flexible circuit board, the small film, and the alignment template are stacked in sequence from top to bottom, and the positioning pins are inserted into the second circuit board positioning hole, the small film positioning point, and the second template positioning hole of the flexible circuit board.

2. The multifunctional positioning device for special large-size flexible circuit boards according to claim 1, characterized in that: The first template positioning holes are arranged near the edge of the alignment template, and a plurality of the first template positioning holes are arranged horizontally in a long strip shape.

3. The multifunctional positioning device for a special large-size flexible circuit board according to claim 1, characterized in that: The second template positioning holes are arranged at the edges away from the alignment template, and the four second template positioning holes are distributed at the four top corners of a square.

4. The multifunctional positioning device for a special large-size flexible circuit board according to claim 1, characterized in that: The large film sheet includes a large film outer frame and a large film effective area. The large film outer frame is connected to the outside of the large film effective area, and the large film positioning point is set on the large film outer frame.

5. The multifunctional positioning device for a special large-size flexible circuit board according to claim 4, characterized in that: A plurality of large film exhaust holes are provided in the large film effective area.

6. The multifunctional positioning device for a special large-size flexible circuit board according to claim 1, characterized in that: A small film positioning point is provided at a top corner of the small film sheet, and a plurality of small film exhaust holes are provided in a middle area of ​​the small film sheet.

7. The multifunctional positioning device for a special large-size flexible circuit board according to claim 1, characterized in that: The large film sheet is provided with a positioning hinge and a film marking line for the installation position of the reinforcement sheet on the flexible circuit board.

8. The multifunctional positioning device for a special large-size flexible circuit board according to claim 1, characterized in that: The small film sheet is provided with size scales for shaping and aligning the flexible circuit board.

9. The multifunctional positioning device for a special large-size flexible circuit board according to claim 1, characterized in that: The first circuit board positioning hole is formed by laser processing the alignment position of the flexible circuit board with the large film positioning point.

10. The multifunctional positioning device for a special large-size flexible circuit board according to claim 1, characterized in that: The second circuit board positioning hole is formed by laser processing the alignment position of the flexible circuit board with the small film positioning point.