Cleaning device for wafer polishing

Abstract

The utility model discloses a cleaning device for wafer polishing, and relates to the technical field of wafer cleaning, the cleaning device for wafer polishing comprises a water tank, a protective sleeve is arranged in the center of the inside of the water tank, a placing assembly is arranged at the upper end of the shrunk protective sleeve, a cleaning assembly is arranged on one side of the water tank, and the cleaning assembly is arranged on the other side of the water tank. A water outlet is formed in the front surface, close to the bottom end, of the water tank, one side of the cleaning assembly is externally connected with a water feeding device through a water inlet pipe, the placing assembly comprises a placing plate, a plurality of placing grooves are formed in the upper surface of the placing plate, a taking notch is formed in one side of each placing groove, and the placing grooves are communicated with the water tank. The lower surface of the placing groove is provided with a water permeable hole, the water permeable hole penetrates through the placing plate, and the problems that in the prior art, wafers are mostly cleaned in a water pool after being polished, water pollution and waste are serious, and cleaning is not thorough are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, in particular to a cleaning device for wafer polishing. Background Art

[0002] The chip is one of the most important raw materials of LED. It is the light-emitting component of LED and the most core part of LED. During processing, the surface is polished and cleaned after polishing.

[0003] For example, Chinese patent publication number CN204107908U (A cleaning device for a wafer polishing machine) includes a mounting base with a water inlet pipe movably inserted therein. The water inlet pipe has an elbow joint at its top, and a spray pipe is provided at the other end of the elbow via a telescopic adjustment sealing mechanism, allowing the spray pipe to extend and retract within the elbow without leaking. The spray pipe is also provided with a plurality of spray heads. The mounting base includes a horizontally arranged mounting plate and at least one vertically arranged vertical plate disposed on the bottom surface of the mounting plate. A reduction motor is mounted on one of the vertical plates, and a driving gear is provided on the output shaft of the reduction motor. The water inlet pipe movably extends through the mounting plate, and a driven gear is provided on the water inlet pipe that cooperates with the driving gear. This cleaning device is particularly suitable for installation on wafer polishing machines.

[0004] However, most of the existing wafers are cleaned in a water pool after polishing, which causes serious water pollution and waste, and leads to incomplete cleaning; therefore, it does not meet the existing needs. In this regard, we propose a cleaning device for wafer polishing. Utility Model Content

[0005] The purpose of the utility model is to provide a cleaning device for wafer polishing, so as to solve the problem in the above background technology that most of the existing wafers are cleaned in a pool after polishing, which causes serious water pollution and waste and leads to incomplete cleaning.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a cleaning device for wafer polishing, comprising: a water tank, a protective cover is provided at the inner center of the water tank, a placement assembly is provided at the upper end of the shrinking protective cover, a cleaning assembly is provided on one side of the water tank, a water outlet is provided on the front surface of the water tank near the bottom, and one side of the cleaning assembly is connected to a water supply device through a water inlet pipe.

[0007] Preferably, the placement component includes a placement plate, the upper surface of the placement plate is provided with a placement groove, and there are multiple placement grooves, one side of the placement groove is provided with a taking notch, the lower surface of the placement groove is provided with a water permeable hole, and the water permeable hole passes through the placement plate.

[0008] Preferably, the placement component also includes a variable frequency motor, and the variable frequency motor is located inside the protective cover, both ends of the variable frequency motor are provided with motor mounting seats, and the two ends of the variable frequency motor are respectively fixed to the protective cover and the placement plate through the motor mounting seats.

[0009] Preferably, the cleaning assembly includes a mounting frame, a top seat plate is provided on one side of one end of the mounting frame, and the top seat plate is welded and fixed to the mounting frame, a water inlet channel is provided inside the mounting frame, and the water inlet channel extends to the inside of the top seat plate, and a drain outlet is provided on the lower surface of the top seat plate.

[0010] Preferably, the cleaning assembly further comprises a water seat, a surface of the water seat is provided with a water hole, and the water hole passes through the water seat.

[0011] Preferably, a threaded ring seat is provided on the upper surface of the water drain seat, a threaded groove is provided on the outside of the water drain port, and the threaded ring seat is threadedly connected to the threaded groove.

[0012] Preferably, both side surfaces of the mounting frame are provided with fixing plates, and the fixing plates and the mounting frame, one side of the fixing plates is provided with fixing screws, and one end of the fixing screws passes through the fixing plates and is threadedly connected to the water tank.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] (1) The utility model sets a placement component and a protective cover in the water tank, and the frequency conversion motor is located inside the protective cover, which protects the frequency conversion motor and prevents water from entering. The polished wafers are placed inside the placement groove of the placement plate, and the water is diverted through the drain hole of the drain seat, thereby cleaning the wafers located directly below. The cleaning water flows into the water tank and is discharged from the outlet. After cleaning, the placement plate is driven to rotate by the output end of the frequency conversion motor, and the position of the placement groove is adjusted to clean the next wafer. It is simple and convenient, and it is not a water bubble cleaning. It cleans thoroughly. The diversion form of water allows for rapid and wide-area cleaning of the wafer surface, reducing cleaning time and thus reducing water consumption, achieving a water-saving effect. It solves the problem that most of the existing wafers are washed in a pool after polishing, which causes serious water pollution and waste, and leads to unclean cleaning.

[0015] (2) By setting a taking notch on one side of the placement slot, it is convenient for people to take the wafers through the taking notch, thereby improving the convenience of taking. The water is easy to drain through the water hole to avoid water accumulation. The water drain seat is connected to the threaded groove through the threaded ring seat, which is convenient for installation and disassembly of the water drain seat and easy to disassemble for scale cleaning, thereby improving convenience. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the structure of the placement component of the utility model;

[0018] Figure 3 This is a bottom view of the cleaning assembly of the present invention;

[0019] Figure 4 This is a schematic diagram of the split structure of the top plate and the lower water seat of the utility model;

[0020] In the figure: 1. Water tank; 2. Cleaning component; 3. Placing component; 4. Water outlet; 5. Water inlet pipe; 6. Placing plate; 7. Placing slot; 8. Removal gap; 9. Water hole; 10. Frequency conversion motor; 11. Motor mounting seat; 12. Mounting frame; 13. Top seat plate; 14. Drain seat; 15. Drain hole; 16. Fixing plate; 17. Fixing screw; 18. Water inlet channel; 19. Threaded ring seat; 20. Threaded groove; 21. Protective cover; 22. Drain. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0022] See also Figure 1-4The utility model provides an embodiment: a cleaning device for wafer polishing, comprising: a water tank 1, a protective sleeve 21 is provided at the inner center of the water tank 1, a placement component 3 is provided on the upper end of the shrinkage protective sleeve 21, a cleaning component 2 is provided on one side of the water tank 1, a water outlet 4 is provided on the front surface of the water tank 1 near the bottom, a water supply device is connected to one side of the cleaning component 2 through a water inlet pipe 5, the placement component 3 includes a placement plate 6, a placement groove 7 is provided on the upper surface of the placement plate 6, and the placement groove 7 is provided with a plurality of placement grooves. A take-up notch 8 is provided on one side of the placement slot 7, a water-permeable hole 9 is provided on the lower surface of the placement slot 7, and the water-permeable hole 9 passes through the placement plate 6, the placement component 3 also includes a variable frequency motor 10, and the variable frequency motor 10 is located inside the protective cover 21, and both ends of the variable frequency motor 10 are provided with a motor mounting seat 11, and the two ends of the variable frequency motor 10 are respectively fixed to the protective cover 21 and the placement plate 6 through the motor mounting seat 11, the cleaning component 2 includes a mounting frame 12, and a top seat plate 13 is provided on one side of one end of the mounting frame 12, and the top seat plate 13 The mounting frame 12 is welded and fixed, and a water inlet channel 18 is provided inside the mounting frame 12, and the water inlet channel 18 extends to the inside of the top seat plate 13, and a drain port 22 is provided on the lower surface of the top seat plate 13. The cleaning assembly 2 also includes a drain seat 14, and a drain hole 15 is provided on the surface of the drain seat 14, and the drain hole 15 passes through the drain seat 14. The polished wafer is placed inside the placement groove 7 of the placement plate 6, and water is introduced from the water inlet pipe 5 into the water inlet channel 18 through the water supply device, and falls from the drain port 22, and passes through the lower The drain hole 15 of the water seat 14 is diverted to clean the chip located directly below. The cleaning water flows into the water tank 1 and is discharged from the water outlet 4. After cleaning, the placement plate 6 is driven to rotate by the output end of the frequency conversion motor 10, and the placement slot 7 is adjusted to the position for cleaning the next chip. It is simple and convenient, and it is not a bubble cleaning. It cleans thoroughly. The diversion form of drainage facilitates rapid range cleaning of the chip surface, reduces cleaning time, thereby reducing water consumption and achieving a water-saving effect.

[0023] See also Figure 2 A taking notch 8 is provided on one side of the placement groove 7, and a water-permeable hole 9 is provided on the lower surface of the placement groove 7, and the water-permeable hole 9 passes through the placement plate 6. The taking notch 8 is convenient for personnel to take the wafer, thereby improving the convenience of taking. The water-permeable hole 9 is convenient for draining into the water to avoid water accumulation.

[0024] See also Figure 4 The upper surface of the water seat 14 is provided with a threaded ring seat 19, and the outside of the water outlet 22 is provided with a threaded groove 20, and the threaded ring seat 19 is threadedly connected to the threaded groove 20, which facilitates the installation and disassembly of the water seat 14, facilitates disassembly for scale cleaning, and improves convenience.

[0025] See also Figure 1 、 3, fixing plates 16 are provided on both side surfaces of the mounting frame 12, and the fixing plates 16 and the mounting frame 12, one side of the fixing plate 16 is provided with fixing screws 17, and one end of the fixing screws 17 passes through the fixing plate 16 and is threadedly connected to the water tank 1, so as to fix the cleaning component 2 to the water tank 1, making it easy to disassemble and replace the cleaning component 2.

[0026] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A cleaning device for wafer polishing, comprising a water tank (1), characterized in that: A protective sleeve (21) is provided at the inner center of the water tank (1), a placement assembly (3) is provided at the upper end of the shrinkage protective sleeve (21), a cleaning assembly (2) is provided on one side of the water tank (1), a water outlet (4) is provided on the front surface of the water tank (1) near the bottom, and one side of the cleaning assembly (2) is connected to an external water supply device through a water inlet pipe (5).

2. A cleaning device for wafer polishing according to claim 1, characterized in that: The placing assembly (3) comprises a placing plate (6), the upper surface of the placing plate (6) is provided with a placing groove (7), and a plurality of placing grooves (7) are provided, one side of the placing groove (7) is provided with a taking notch (8), and the lower surface of the placing groove (7) is provided with a water-permeable hole (9), and the water-permeable hole (9) passes through the placing plate (6).

3. A cleaning device for wafer polishing according to claim 2, characterized in that: The placement assembly (3) further includes a variable frequency motor (10), and the variable frequency motor (10) is located inside the protective cover (21). Both ends of the variable frequency motor (10) are provided with motor mounting seats (11), and the two ends of the variable frequency motor (10) are fixed to the protective cover (21) and the placement plate (6) respectively through the motor mounting seats (11).

4. A cleaning device for wafer polishing according to claim 1, characterized in that: The cleaning assembly (2) comprises a mounting frame (12), a top seat plate (13) is provided on one side of one end of the mounting frame (12), and the top seat plate (13) is welded and fixed to the mounting frame (12), a water inlet channel (18) is provided inside the mounting frame (12), and the water inlet channel (18) extends into the inside of the top seat plate (13), and a water outlet (22) is provided on the lower surface of the top seat plate (13).

5. A cleaning device for wafer polishing according to claim 4, characterized in that: The cleaning assembly (2) further comprises a water drain seat (14), a water drain hole (15) being provided on the surface of the water drain seat (14), and the water drain hole (15) passing through the water drain seat (14).

6. A cleaning device for wafer polishing according to claim 5, characterized in that: A threaded ring seat (19) is provided on the upper surface of the water outlet seat (14), a threaded groove (20) is provided on the outside of the water outlet (22), and the threaded ring seat (19) is threadedly connected to the threaded groove (20).

7. A cleaning device for wafer polishing according to claim 4, characterized in that: Both side surfaces of the mounting frame (12) are provided with fixing plates (16), and the fixing plates (16) and the mounting frame (12) are connected. A fixing screw (17) is provided on one side of the fixing plate (16), and one end of the fixing screw (17) passes through the fixing plate (16) and is threadedly connected to the water tank (1).

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