Semiconductor correction jig and grinding equipment
By introducing semiconductor correction jigs into chemical mechanical polishing equipment and using correction cavities and position calibration parts to achieve fast and high-precision position correction, the problem of poor correction accuracy during wafer transportation is solved, and production efficiency and accuracy are improved.
Patent Information
- Application Number
- CN202422873617.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-10-03
- Estimated Expiration
- 2034-11-25
AI Technical Summary
Existing chemical mechanical polishing equipment has poor calibration accuracy during wafer transfer, which makes the wafers easy to break. In addition, the calibration process is time-consuming and inefficient.
A semiconductor calibration fixture is used, equipped with a calibration cavity and multiple position calibration parts, which can achieve fast and high-precision position calibration by accurately measuring the position of the component to be calibrated.
It improves calibration efficiency and accuracy, reduces calibration time, and lowers the experience threshold, allowing non-experienced engineers to perform standardized calibration and ensure that the machine can quickly return to production.
Smart Images
Figure CN223406722U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a semiconductor correction jig and grinding equipment. Background Art
[0002] The field of semiconductor manufacturing technology involves a variety of processing techniques, such as wafer oxidation, deposition, ion implantation, photolithography, etching, chemical mechanical polishing, etc.
[0003] Almost all processes involve the transportation of wafers. During the transportation of wafers, multiple transportation components are involved. The relative position relationship of each transportation component determines the transportation accuracy of the wafer. Therefore, it is often necessary to calibrate the position of each transportation component.
[0004] Taking chemical mechanical polishing (CMP) as an example, CMP is a global surface planarization technology that uses chemical oxidation and mechanical polishing to remove material from the device surface to achieve a high degree of device surface flatness.
[0005] Existing chemical mechanical polishing equipment generally consists of a polishing table, a polishing pad, a polishing head, a polishing pad conditioner, and a wafer load. The polishing pad is mounted on the polishing table, and the polishing head is mounted on the polishing frame. The polishing head is used to absorb the device being polished and move relative to the polishing pad to flatten the surface of the device being polished.
[0006] The wafer carrier is used to place wafers to be ground or after grinding. For example, the wafer to be ground is placed on the wafer carrier through a wafer exchanger. Then, after the grinding head absorbs the wafer to be ground, the grinding frame drives the grinding head to rotate above the grinding pad to grind the wafer. After grinding is completed, the grinding frame drives the grinding head to rotate above the wafer carrier, places the ground wafer on the wafer carrier, and then transfers the ground wafer to the next workstation through the wafer exchanger.
[0007] In the above-mentioned transfer process, the transfer components involved include the grinding head, the wafer carrier and the wafer transfer device. Since the wafer carrier is generally fixed on the machine and its position is relatively fixed, the position accuracy of the grinding head and the wafer transfer device relative to the wafer carrier is more important. For example, when the position of the wafer transfer device deviates from the wafer carrier, it is easy for the wafer transfer device to be misaligned when placing the wafer on the wafer carrier. When the grinding head adsorbs the wafer, it is easy for the wafer to be partially affected by the force of the wafer carrier, which may cause the wafer to break. Therefore, it is necessary to regularly calibrate the position of the grinding head and the wafer transfer device relative to the wafer carrier.
[0008] Existing calibration methods typically involve using a wafer transfer device to transport a dummy wafer to a rough location. The relative positions of the dummy wafer, the polishing head, and the wafer stage are visually observed, and the polishing head and wafer transfer device are then adjusted. This calibration process is time-consuming, and errors inherent in the transfer of the dummy wafer, combined with errors from visual inspection, result in poor calibration accuracy.
[0009] Therefore, it is necessary to provide a semiconductor correction jig and a grinding device to improve the correction efficiency and correction accuracy. Utility Model Content
[0010] The purpose of the utility model is to provide a semiconductor correction fixture and grinding equipment. The semiconductor correction fixture is equipped with a correction cavity and a plurality of position calibration parts to improve the correction efficiency and correction accuracy.
[0011] The utility model provides a semiconductor calibration fixture, comprising a fixture body and at least two position calibration pieces; the fixture body has a calibration cavity; the position calibration pieces are arranged along the circumference of the calibration cavity, and at least a portion of the position calibration pieces is located in the calibration cavity.
[0012] Optionally, the fixture body includes a first fixture body and a second fixture body;
[0013] The first fixture body is movably connected to the second fixture body;
[0014] When the first jig body moves relative to the second jig body, the first jig body and the second jig body form at least a closed state and an open state;
[0015] When the first fixture body and the second fixture body are in a closed state, they enclose and form the calibration cavity;
[0016] When the first jig body and the second jig body are in an open state, the first jig body and the second jig body are away from each other.
[0017] Optionally, the first fixture body is rotatably connected to the second fixture body.
[0018] Optionally, along the axial projection of the correction cavity, the first fixture body and the second fixture body are both in a semicircular ring shape.
[0019] Optionally, at least one end of the correction cavity along its axial direction is open.
[0020] Optionally, a positioning structure is provided in the correction cavity, and the positioning structure protrudes from the inner wall of the correction cavity.
[0021] Optionally, the fixture body is divided into a thin-walled portion and a thick-walled portion along the axial direction of the correction cavity, the wall thickness of the thick-walled portion is greater than the wall thickness of the thin-walled portion, and the step surface where the thin-walled portion and the thick-walled portion meet serves as the positioning structure.
[0022] Optionally, the position marking component is arranged on the thin-walled portion.
[0023] Optionally, the position marking member is arranged on the fixture body so as to move in a direction perpendicular to the axial direction of the correction cavity;
[0024] And / or, the position calibration member is provided with a scale;
[0025] And / or, the correction cavity is cylindrical.
[0026] The utility model also provides a grinding device, which includes the semiconductor correction fixture described above.
[0027] In summary, the semiconductor calibration fixture includes a fixture body and at least two position calibration parts; the fixture body has a calibration cavity; each of the position calibration parts is arranged along the circumference of the calibration cavity, and at least a portion of the position calibration parts is located in the calibration cavity.
[0028] The jig body mentioned above is fixed in relative position during use, and has a calibration cavity for accommodating the component to be calibrated. A plurality of position calibration parts are distributed along the circumference of the calibration cavity for respectively measuring the positions of different points on the circumference of the component to be calibrated, so as to accurately measure the actual position of the component to be calibrated, and conveniently perform position correction on the component to be calibrated based on the position of each point, which helps to improve its correction efficiency and accuracy. In addition, the calibration cavity also has the function of fixing the jig body. For example, a reference object is placed in the calibration cavity, and the shape of the calibration cavity is adapted to the shape of the reference object, so that the inner wall of the calibration cavity is conformally fitted to the outer wall of the reference object. At this time, the position of the jig body is naturally fixed, and the component to be calibrated can be corrected based on the position of the jig body as a reference, which is more convenient to use. This calibration jig can significantly reduce calibration time, help the machine return to production faster, and effectively reduce the experience threshold for calibration, so that the calibration process is standardized. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] Figure 1 A schematic diagram of the three-dimensional structure of a semiconductor calibration fixture according to an embodiment of the present invention Figure 1 ;
[0030] Figure 2 A schematic diagram of the three-dimensional structure of a semiconductor calibration fixture according to an embodiment of the present invention Figure 2 ;
[0031] Figure 3This is a schematic diagram of the three-dimensional structure of a semiconductor calibration fixture according to an embodiment of the present invention when involved in calibration.
[0032] Among them, in the accompanying drawings:
[0033] 10- fixture body; 101- thin-walled portion; 102- thick-walled portion; 11- first fixture body; 12- second fixture body; 13- positioning structure;
[0034] 20-position calibration piece;
[0035] 30-hinge;
[0036] 40-grinding head;
[0037] 50-Wafer carrier. DETAILED DESCRIPTION
[0038] The following is a detailed description of the semiconductor calibration jig proposed by the present invention, with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are highly simplified and not to exact scale, and are intended solely to facilitate and clarify the purpose of illustrating the embodiments of the present invention.
[0039] As used in the present invention, the singular forms "a", "an", and "the" include plural objects, the term "or" is generally used to include the meaning of "and / or", the term "several" is generally used to include the meaning of "at least one", and the terms "at least two" or "a plurality" are generally used to include the meaning of "two or more". In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features specified as "first", "second", and "third" may explicitly or implicitly include one or at least two of the features. In addition, as used in the present invention, "installed", "connected", "connected", and one element is "set" on another element should be understood in a broad sense, usually only indicating that there is a connection, coupling, cooperation or transmission relationship between the two elements, and the connection, coupling, cooperation or transmission between the two elements can be direct or indirect through an intermediate element, and cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, one element can be in any orientation such as inside, outside, above, below or on one side of another element, unless the content clearly indicates otherwise. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, directional terms such as above, below, up, down, upward, downward, left, right, etc. are used relative to the exemplary embodiments as they are shown in the figures, with the upward or upper direction toward the top of the corresponding figure, and the downward or lower direction toward the bottom of the corresponding figure.
[0040] Please refer to Figures 1 to 3 As shown, the present invention provides a semiconductor calibration fixture, comprising a fixture body 10 and four position calibration parts 20;
[0041] The fixture body 10 has a calibration cavity; the four position markers 20 are arranged circumferentially along the calibration cavity. In this embodiment, the circumferential and axial directions of the calibration cavity are interrelated. When the calibration cavity is cylindrical, its axial and circumferential directions are naturally determined. When the calibration cavity is a special-shaped cavity, a straight line can be used as the axial direction of the calibration cavity, and the circumferential direction surrounds the axial direction of the calibration cavity.
[0042] At least a portion of the position calibration member 20 is located within the calibration chamber to directly calibrate the position of the component to be calibrated within the calibration chamber. The four position calibration members 20 can be used to calibrate the position of different points on the component to be calibrated, thereby calibrating the overall position of the component to be calibrated, facilitating position measurement and calibration of the component to be calibrated.
[0043] In this embodiment, the fixture body 10 is configured as a split structure. Figures 1 to 3As shown, the jig body 10 includes a first jig body 11 and a second jig body 12 .
[0044] The first fixture body 11 is movably connected to the second fixture body 12;
[0045] When the first jig body 11 moves relative to the second jig body 12 , the first jig body 11 and the second jig body 12 form at least a closed state and an open state.
[0046] Combine Figures 1 to 3 As shown, in this embodiment, the fixture body 10 is a two-half structure consisting of a first fixture body 11 and a second fixture body 12 .
[0047] The first jig body 11 is rotatably connected to the second jig body 12 , and a rotation center axis of the first jig body 11 and the second jig body 12 is parallel to an axial direction of the calibration cavity.
[0048] Continue to refer Figures 1 to 3 As shown, the first fixture body 11 and the second fixture body 12 are in an open state. At this time, the first fixture body 11 rotates away from the second fixture body 12 to form an open state. At this time, the cavity enclosed by the two is opened to form an open cavity, which facilitates the coordination of the fixture body with other components.
[0049] exist Figures 1 to 3 Based on the state shown, when the first fixture body 11 rotates relative to the second fixture body 12 and approaches each other and engages with each other, the cavity enclosed by the two is closed to form a closed state. At this time, the first fixture body 11 and the second fixture body 12 enclose the calibration cavity.
[0050] During the use of the above-mentioned jig body 10, the relative position of the jig body 10 is fixed, and the jig body 10 has a calibration cavity, which is used to accommodate the part to be calibrated. A plurality of position calibration parts 20 are distributed along the circumference of the calibration cavity, which are used to measure the positions of different points on the circumference of the part to be calibrated, respectively, so as to accurately measure the actual position of the part to be calibrated, and conveniently perform position correction on the part to be calibrated based on the position of each point, which helps to improve its correction efficiency and correction accuracy. In addition, the calibration cavity also has the function of fixing the jig body 10. For example, a reference object is placed in the calibration cavity, and the shape of the calibration cavity is adapted to the shape of the reference object, so that the inner wall of the calibration cavity is conformally fitted to the outer wall of the reference object. At this time, the position of the jig body 10 is naturally fixed, and the part to be calibrated can be corrected based on the position of the jig body 10 as a reference, which is more convenient to use. This calibration jig can greatly reduce the calibration time, help to return the machine to production faster, and effectively reduce the experience threshold for calibration, standardize the calibration process, and perform position correction without relying on experienced engineers.
[0051] Combine Figure 3 Taking the grinding equipment as an example, the grinding head 40 and the wafer transfer device are the parts to be calibrated, and the wafer carrier 50 is fixed relative to the grinding machine table, so the wafer carrier 50 is used as a reference. First, the jig body 10 is opened, so that the wafer carrier 50 and the grinding head 40 are located between the first jig body 11 and the second jig body 12. Then the first jig body 11 and the second jig body 12 can be rotated relative to each other to form a closed state. At this time, the wafer carrier 50 is placed in the calibration cavity of the jig body 10, and the inner wall of the calibration cavity is conformally fitted with the outer peripheral surface of the wafer carrier 50. Therefore, the position of the jig body 10 is naturally limited by the wafer carrier 50. At this time, the grinding head 40 is also placed in the calibration cavity, and the position of the grinding head 40 relative to the jig body 10 is measured by the position calibration part 20 and the position correction is performed. The measurement and calibration process of the wafer transfer device is similar to the above-mentioned process of the grinding head 40, and will not be repeated here.
[0052] The jig body 10 is designed as a split structure, which allows for easy opening and closing of the jig body 10, facilitating its use in confined spaces and facilitating the insertion of reference objects or components to be calibrated into the calibration chamber. Furthermore, the jig body 10 can be selectively adjusted based on actual calibration requirements. For example, when the jig body 10 is in the open state, only one of the first jig body 11 or the second jig body 12 can be used as a reference for position calibration. This significantly improves the flexibility and applicability of the jig body 10.
[0053] Furthermore, along the axial projection of the calibration cavity, the first fixture body 11 and the second fixture body 12 are both semicircular. That is, the first fixture body 11 and the second fixture body 12 are integrally tile-shaped structures, and when engaged, they form a cylindrical sleeve structure, thus forming a cylindrical calibration cavity.
[0054] Furthermore, the position calibration member 20 is provided with a scale and is disposed within the fixture body 10 so as to move in a direction perpendicular to the axial direction of the calibration cavity. Preferably, the position calibration member 20 is disposed so as to move in the radial direction of the calibration cavity. This arrangement facilitates flexible measurement of the radial dimension of the component to be calibrated within the calibration cavity from the inner wall of the calibration cavity, thereby increasing flexibility during calibration and testing and accommodating the measurement and calibration of components of varying specifications.
[0055] The calibration fixture has a cylindrical calibration cavity that is suitable for use with a cylindrical reference object (e.g., a wafer carrier). When the wafer carrier conforms to the inner wall of the calibration cavity, the fixture body 10 is naturally coaxial with the reference object (e.g., the wafer carrier). In this case, if the component to be calibrated (e.g., a calibration grinding head or wafer transfer device) needs to be coaxial with the reference object (e.g., the wafer carrier), it is only necessary to control the radial distance of each point on the periphery of the component to be calibrated from the inner wall of the calibration cavity through the position calibration member 20, which is convenient for calibration and use.
[0056] In this embodiment, the position calibration member 20 is a vernier caliper. The first fixture body 11 and the second fixture body 12 are radially provided with through holes, and the position calibration member 20 can be inserted into the through holes for radial single-degree-of-freedom movement.
[0057] In other alternative embodiments, the position marking member 20 may adopt other known structures with a marking scale.
[0058] In other alternative embodiments, the position calibration member 20 may not be provided with a scale and may be fixed inside the calibration cavity. Each position calibration member 20 extends radially along the calibration cavity and has the same size. In this case, each position calibration member 20 may be suitable for calibrating a component to be calibrated of a specific size.
[0059] In this embodiment, the calibration cavity is configured as a cylindrical shape to accommodate cylindrical components to be calibrated and reference objects. In other alternative embodiments, the shape of the calibration cavity can be adjusted based on the specific shapes of the components to be calibrated and reference objects, and the distribution of the position calibration elements 20 can also be adaptively adjusted.
[0060] In this embodiment, the calibration cavity is cylindrical, and four position markers 20 are evenly spaced along the circumference of the calibration cavity, such that the center angles of adjacent position markers 20 are 90°. In other alternative embodiments, the number of position markers 20 may be two, three, or more, and their distribution may be adjusted based on calibration requirements.
[0061] In this embodiment, the fixture body 10 is a split structure consisting of a first fixture body 11 and a second fixture body 12. In other alternative embodiments, the fixture body 10 can also be configured as an integrated structure, for example, directly configured as a cylindrical sleeve structure.
[0062] In this embodiment, the first fixture body 11 and the second fixture body 12 are connected by a rotational fit. In alternative embodiments, other known connection methods may be used, such as a connection method using relative radial linear motion, where the first and second fixture bodies 11, 12 move relative to each other in the radial direction to open or close the calibration cavity. If space permits, relative axial linear motion or other more complex connection methods may also be used, which will not be detailed here.
[0063] In this embodiment, when the jig body 10 is in a closed state, the two ends of the correction cavity along its axial direction are open. The setting of the opening structure makes the jig body 10 in an open state as a whole an open structure, which is convenient for the parts to be corrected (such as a grinding head or a wafer transfer device) or a reference object (such as a wafer carrier) to enter between the first jig body 11 and the second jig body 12, making the entire correction jig more convenient and flexible to use. At the same time, the two ends of the correction cavity are open structures, which also provide a visual channel for observing the position calibration part 20 and an operating channel for the correction operation, facilitating correction observation and correction operation.
[0064] In other alternative embodiments, the correction chamber can also be configured to be open at one end, which allows the component to be corrected (such as a correction grinding head or a wafer transfer device) or a reference object (such as a wafer carrier) to enter the correction chamber, and provides a viewing channel and an operation channel.
[0065] In this embodiment, the fixture body 10 is made of a non-translucent aluminum alloy, and at least one axial end of the calibration cavity is open to provide a viewing channel. In alternative embodiments, the fixture body 10 may be made of a translucent material to facilitate external observation, and the calibration cavity may be fully enclosed at both axial ends.
[0066] In this embodiment, the outer contour of the fixture body 10 in its closed state is cylindrical. In other alternative embodiments, the outer contour of the fixture body 10 in its closed state can be adjusted based on actual use requirements, for example, set to a rectangular parallelepiped or other structure.
[0067] In this embodiment, the first fixture body 11 and the second fixture body 12 are rotatably connected via a hinge 30. In other alternative embodiments, the first fixture body 11 and the second fixture body 12 can be coupled using other known rotatable connection methods.
[0068] Furthermore, a positioning structure 13 is provided in the correction cavity, and the positioning structure 13 protrudes from the inner wall of the correction cavity.
[0069] The positioning structure is used to axially position the component to be corrected (such as a grinding head). For example, after the component to be corrected (such as a grinding head) enters the correction cavity, it axially rests against the positioning structure to form a positioning, so as to facilitate the measurement of the position calibration part 20.
[0070] For details, please refer to Figure 2 As shown, the first fixture body 11 and the second fixture body 12 are regarded as a whole, and the fixture body 10 is divided into a thin-walled portion 101 and a thick-walled portion 102 along the axial direction of the correction cavity. The thick-walled portion 102 is located at Figure 2 The lower area of the middle fixture body 10, the thin-walled portion 101 is located Figure 2 The upper area of the middle fixture body 10. Figure 2 The upper half of the first fixture body 11 is a part of the thin-walled portion 101, and the upper half of the second fixture body 12 is a part of the thin-walled portion 101. Therefore, the upper half of the first fixture body 11 and the upper half of the second fixture body 12 constitute the thin-walled portion 101; similarly, Figure 2 The lower half of the first jig body 11 is a part of the thick-walled portion 102, and the lower half of the second jig body 12 is a part of the thick-walled portion 102. Therefore, the lower half of the first jig body 11 and the lower half of the second jig body 12 constitute the thick-walled portion 102. The wall thickness of the thick-walled portion 102 is greater than the wall thickness of the thin-walled portion 101, wherein the outer diameter of the thick-walled portion 102 is the same as the outer diameter of the thin-walled portion 101, and the inner diameter of the thick-walled portion 102 is smaller than the inner diameter of the thin-walled portion 101, and the thin-walled portion 101 and the thick-walled portion 102 are coaxially arranged. Therefore, an annular step surface is formed at the junction of the inner wall of the thick-walled portion 102 and the inner wall of the thin-walled portion 101, and the step surface serves as the positioning structure 13. After the component to be corrected (such as a grinding head) enters the correction cavity, the positioning structure 13 can be evenly pressed against the bottom peripheral edge of the component to be corrected (such as a grinding head) to form a stable positioning support.
[0071] The inner cavity of thin-walled portion 101 serves as one portion of the calibration chamber, while the inner cavity of thick-walled portion 102 serves as the other portion. The inner cavity of thin-walled portion 101 accommodates the component to be calibrated, while the inner cavity of thick-walled portion 102 accommodates the reference component. The arrangement of thin-walled portion 101 and thick-walled portion 102 divides the calibration chamber into distinct zones, each performing its own function and further improving calibration efficiency.
[0072] In other alternative embodiments, the fixture body 10 can be configured as a structure with a uniform wall thickness, and the positioning structure 13 can be a convex ring provided on the inner wall of the correction cavity or a plurality of convex blocks distributed along the circumference. The specific structure of the positioning structure 13 can be adaptively adjusted based on actual use requirements.
[0073] In this embodiment, the position calibration member 20 is disposed in the thin-walled portion 101. Preferably, the position calibration member 20 is axially close to the positioning structure 13. After the component to be calibrated (e.g., a grinding head) enters the calibration chamber and is positioned by the positioning structure 13, the component to be calibrated corresponds to the thin-walled portion 101. Therefore, the position calibration member 20 is disposed in the thin-walled portion 101 to match the position of the component to be calibrated (e.g., a grinding head), thereby facilitating direct measurement and calibration of the position of the component to be calibrated.
[0074] This embodiment also provides a grinding device, which includes the semiconductor correction jig described above. The grinding device also includes components such as a grinding table, a grinding pad, a grinding head, a grinding pad adjuster, and a wafer carrier. The grinding device is consistent with the structure of the existing chemical mechanical grinding device, the difference being the addition of a semiconductor correction jig, wherein the semiconductor correction jig is detachably arranged at the wafer carrier of the grinding device and is arranged around the wafer carrier. When the grinding device is in normal grinding operation, the semiconductor correction jig is disassembled, and when the grinding device needs to perform position correction on the grinding head and the wafer transfer device, the semiconductor correction jig is installed.
[0075] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.
[0076] The above description is only a description of the preferred embodiment of the present invention and does not limit the scope of the present invention. Any changes and modifications made by ordinary technicians in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.
Claims
1. A semiconductor calibration jig, characterized in that: Includes: a fixture body and at least two position calibration parts; The fixture body has a calibration cavity; The position marking members are arranged along the circumference of the calibration cavity, and at least a portion of the position marking members is located in the calibration cavity.
2. The semiconductor calibration jig according to claim 1, wherein: The fixture body includes a first fixture body and a second fixture body; The first fixture body is movably connected to the second fixture body; When the first jig body moves relative to the second jig body, the first jig body and the second jig body form at least a closed state and an open state; When the first fixture body and the second fixture body are in a closed state, they enclose and form the calibration cavity; When the first jig body and the second jig body are in an open state, the first jig body and the second jig body are away from each other.
3. The semiconductor calibration jig according to claim 2, wherein: The first fixture body is rotatably connected to the second fixture body.
4. The semiconductor calibration jig according to claim 2, wherein: Projected along the axial direction of the correction cavity, the first fixture body and the second fixture body are both semicircular.
5. The semiconductor calibration jig according to claim 1, wherein: At least one end of the correction cavity along the axial direction thereof is open.
6. The semiconductor calibration jig according to claim 1, wherein: A positioning structure is provided in the correction cavity, and the positioning structure protrudes from the inner wall of the correction cavity.
7. The semiconductor calibration jig according to claim 6, wherein: The fixture body is divided into a thin-walled portion and a thick-walled portion along the axial direction of the correction cavity. The wall thickness of the thick-walled portion is greater than that of the thin-walled portion. The step surface where the thin-walled portion and the thick-walled portion meet serves as the positioning structure.
8. The semiconductor calibration jig according to claim 7, wherein: The position marking component is arranged on the thin-walled portion.
9. The semiconductor calibration jig according to claim 1, wherein: The position marking member is arranged on the fixture body so as to move in a direction perpendicular to the axial direction of the correction cavity; And / or, the position calibration member is provided with a scale; And / or, the correction cavity is cylindrical.
10. A grinding device, characterized in that: The polishing device includes the semiconductor correction jig according to any one of claims 1 to 9.