Movable polishing slurry supply device for polishing machine

Abstract

The utility model discloses a movable polishing slurry supply device for a polishing machine. The movable polishing slurry supply device comprises a slurry barrel, a circulating and supplying system and a supporting and moving mechanism. The circulating and supplying system comprises a circulating pipe, a supplying pipe, a circulating valve, a supplying valve and a conveying pump; the feeding end and the discharging end of the circulating pipe communicate with the lower portion and the upper portion of the slurry barrel correspondingly, and circulation of polishing slurry is achieved under the action of the conveying pump. The feeding end of the supply pipe communicates with the circulating pipe, and the discharging end is used for being connected with a polishing machine to achieve supply of polishing slurry. According to the movable polishing slurry supply device, the polishing slurry can be conveniently adjusted and tested, meanwhile, the overall shutdown risk of the polishing machine can be effectively avoided, and the purposes of improving the yield of wafers, improving the utilization rate of the polishing machine, reducing the cost and the like are achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor production, and in particular relates to a movable polishing slurry supply device for a polishing machine. Background Art

[0002] Semiconductor wafers are the most basic raw material in integrated circuit manufacturing. With the rapid development of semiconductor integrated circuit technology, chip manufacturers are placing increasingly stringent demands on wafer quality. Polishing is a crucial step in the manufacturing process, and its accuracy directly impacts the performance of the final product. Chemical mechanical polishing (CMP) is a commonly used method for polishing wafers. The process involves placing the wafer between a polishing head and a polishing cloth, which is then rotated and polished with a polishing slurry. Therefore, the choice of slurry type, ratio, and flow rate directly impacts the quality of the polished wafer.

[0003] In the actual wafer polishing process, the polishing slurry is generally supplied in a centralized manner, using a single polishing slurry supply system to supply multiple polishing machines. Since the polishing slurry supply system is equipped with a mixing tank and a supply tank, continuous supply can be achieved. However, during the polishing production process, the polishing slurry sometimes needs to be adjusted according to product requirements. This includes testing the introduction of new polishing slurries, adjusting the polishing slurry ratio, and confirming polishing slurry anomalies. These issues all require the supply system to be shut down. A shutdown of the supply system can cause all polishing machines to be unable to produce due to a lack of polishing slurry supply, resulting in a loss of production. Therefore, a device specifically designed for adjusting the polishing slurry is needed. The slurry can be adjusted in this device and then connected to a specific polishing machine for testing. This facilitates adjustment of the polishing slurry and avoids the risk of overall polishing machine shutdown.

[0004] Therefore, the polishing slurry supply system in the polishing production process is further improved, and a movable polishing slurry supply device for the polishing machine is provided, so that the polishing slurry can be adjusted and tested more conveniently, and the overall shutdown risk of the polishing machine can be effectively avoided. It has important technical value for subsequently increasing the output of chips, improving the utilization rate of polishing machines, and reducing costs. Utility Model Content

[0005] The purpose of the utility model is to provide a movable polishing slurry supply device for a polishing machine in order to solve the deficiencies of the prior art.

[0006] The purpose of this utility model is achieved by the following technical solutions:

[0007] A movable polishing slurry supply device for a polishing machine, comprising a slurry barrel, a circulation and supply system, and a supporting and moving mechanism;

[0008] The slurry barrel is used for preparing and storing polishing slurry;

[0009] The circulation and supply system includes a circulation pipe, a supply pipe, a circulation valve located on the circulation pipe, a supply valve located on the supply pipe, and a delivery pump located on the circulation pipe; the feed end and the discharge end of the circulation pipe are respectively connected to the lower part and the upper part of the slurry barrel, and the polishing slurry is circulated under the action of the delivery pump; the feed end of the supply pipe is connected to the circulation pipe, and the discharge end is used to connect to the polishing machine to realize the supply of polishing slurry;

[0010] The slurry barrel and the circulation and supply system are all located on the supporting and moving mechanism and can move under the drive of the supporting and moving mechanism.

[0011] Preferably, the slurry barrel is provided with a barrel cover.

[0012] Preferably, the barrel cover consists of two semicircles, which are connected by a hinge in the middle, one of the semicircles is fixedly connected to the wall of the slurry barrel, and the other semicircle can be opened and closed by the hinge.

[0013] Preferably, a leak-proof disc is provided between the slurry barrel and the supporting and moving mechanism.

[0014] Preferably, a drain pipe is provided at the bottom of the slurry barrel, and a drain valve is provided on the drain pipe.

[0015] Preferably, a liquid level indicator tube is provided on the outside of the slurry barrel for confirming the liquid level of the polishing slurry in the slurry barrel.

[0016] Preferably, a shock-absorbing base is provided at the bottom of the delivery pump.

[0017] Preferably, the supporting and moving mechanism includes a frame, a chassis located above the frame, and moving wheels located at the bottom of the frame;

[0018] The slurry barrel and the circulation and supply system are all located on the chassis.

[0019] Preferably, a handrail is provided on one side of the frame.

[0020] Preferably, the movable wheel is a universal wheel with a brake function.

[0021] Therefore, the movable polishing slurry supply device provided by this application improves the polishing slurry supply system during the polishing production process. It not only facilitates the adjustment and testing of the polishing slurry, but also effectively avoids the risk of overall polishing machine downtime, thereby achieving the goals of increasing wafer production, improving polishing machine utilization, and reducing costs. Therefore, the movable polishing slurry supply device provided by this application has great practical value and technical improvement significance in the semiconductor wafer processing and manufacturing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the right side of the polishing slurry supply device provided by the present application;

[0023] Figure 2 It is a left side schematic diagram of the polishing slurry supply device provided by the present application;

[0024] Figure 3 is a bottom schematic diagram of the polishing slurry supply device provided by the present application;

[0025] Figure 4 It is a left side view of the polishing slurry supply device provided by the present application;

[0026] Figure 5 It is a partial planed surface schematic diagram of the polishing slurry supply device provided in this application.

[0027] Description of reference numerals:

[0028] 1-Handrail; 2-Frame; 3-Chassis; 4-Slurry bucket; 5-Drain valve; 6-Drain pipe; 7-Hinge; 8-Barrel cover; 9-Liquid level indicator tube; 10-Circulation pipe; 11-Circulation valve; 12-Supply valve; 13-Supply pipe; 14-Leakage-proof disc; 15-Moving wheel; 16-Delivery pump; 17-Discharge pipe; 18-Shock-absorbing base. DETAILED DESCRIPTION

[0029] The present application provides a movable polishing slurry supply device for a polishing machine, such as Figures 1 to 5 As shown, it includes a slurry barrel 4, a circulation and supply system, and a support and movement mechanism. The slurry barrel 4, the circulation and supply system are all located on the support and movement mechanism and can be moved under the drive of the support and movement mechanism, so that it can be applied to multiple polishing machines.

[0030] The slurry barrel 4 is used to mix and store polishing slurry and is generally cylindrical, but other shapes may also be used.

[0031] The circulation and supply system includes a circulation pipe 10 , a supply pipe 13 , a circulation valve 11 located on the circulation pipe 10 , a supply valve 12 located on the supply pipe 13 , and a delivery pump 16 located on the circulation pipe 10 .

[0032] The feed end and discharge end of the circulation pipe 10 are respectively connected to the lower and upper parts of the slurry barrel 4, and the polishing slurry is circulated under the action of the delivery pump 16. Preferably, the liquid inlet end of the delivery pump 16 is connected to the slurry barrel 4 through the liquid outlet pipe 17, and the liquid outlet end is connected to the circulation pipe.

[0033] The feed end of the supply pipe 13 is communicated with the circulation pipe 10, and the discharge end is used to be connected to the polishing machine to realize the supply of polishing slurry.

[0034] The circulation valve 11 and the supply valve 12 are used to control the connection and interruption of the circulation pipe 10 and the supply pipe 13, respectively, and to adjust the flow rate of the polishing slurry in the pipes. The delivery pump 16 is used to deliver the polishing slurry.

[0035] Specifically, when preparing the polishing slurry, the supply valve 12 is closed, the delivery pump 16 and the circulation valve 11 are opened, and the material in the slurry barrel flows out from the bottom, circulates through the circulation pipe 10, and is added to the upper part of the slurry barrel 4. During the circulation process, the materials are fully mixed to obtain a polishing slurry that meets the requirements. When the polishing slurry is prepared and needs to be supplied to the polishing machine, the slurry barrel is first moved to the vicinity of the polishing machine using the support and movement mechanism. Then, the delivery pump 16, the circulation valve 11, and the supply valve 12 are simultaneously opened. During the circulation process, the polishing slurry is simultaneously supplied to the polishing machine through the supply pipe.

[0036] The polishing slurry of this application is supplied during the circulation process. Compared with directly connecting the supply pipe to the slurry barrel and supplying the polishing slurry directly to the polishing machine from the slurry barrel, one can use one less delivery pump (the delivery pump on the circulation pipe can be used for the circulation and supply of the slurry at the same time), and secondly, the uniformity of the supplied polishing slurry can be improved, thereby improving the quality of the polishing slurry.

[0037] Therefore, the movable polishing slurry supply device provided by this application improves the polishing slurry supply system during the polishing production process. It not only facilitates the adjustment and testing of the polishing slurry, but also effectively avoids the risk of overall polishing machine downtime, thereby achieving the goals of increasing wafer production, improving polishing machine utilization, and reducing costs. Therefore, the movable polishing slurry supply device provided by this application has great practical value and technical improvement significance in the semiconductor wafer processing and manufacturing process.

[0038] Preferably, the slurry barrel is provided with a lid 8. Furthermore, the lid 8 comprises two semicircles connected by a hinge 7. One of the semicircles is fixedly connected to the barrel wall of the slurry barrel 4 and cannot be opened, while the other semicircle can be opened and closed by the hinge 7. When preparing the polishing slurry, the lid 8 can be opened halfway to pour the ingredients in. After the slurry is prepared, the lid is closed again to prevent foreign matter from falling into the barrel or the polishing slurry from splashing out.

[0039] Preferably, a leak-proof disk 14 is provided between the slurry barrel 4 and the supporting movable mechanism to catch the leaked polishing slurry and prevent the polishing slurry from flowing to other locations and causing other abnormalities.

[0040] Preferably, a drain pipe 6 is provided at the bottom of the slurry barrel 4, and a drain valve 5 is provided on the drain pipe 6. During normal operation of the supply device, the drain valve 5 is closed. When the polishing slurry in the slurry barrel 4 needs to be drained, the drain valve 5 is opened and the polishing slurry is discharged through the drain pipe 6.

[0041] Preferably, a liquid level indicator tube 9 is provided on the outside of the slurry barrel, and the upper and lower ends of the liquid level indicator tube 9 are respectively connected to the upper and lower ends of the slurry barrel 4, so that its liquid level is consistent with the liquid level in the slurry barrel. In this way, the liquid level of the polishing slurry in the slurry barrel 4 can be conveniently confirmed through the liquid level indicator tube 9 located on the outside.

[0042] Since the delivery pump 16 may vibrate during operation, preferably, a shock-absorbing base 18 is provided at the bottom of the delivery pump 16 to fix and absorb vibrations of the delivery pump 16 .

[0043] Preferably, the supporting moving mechanism includes a frame 2, a chassis 3 located above the frame 2, and moving wheels 15 located at the bottom of the frame; the slurry barrel and the circulation and supply system are all located on the chassis 3 (specifically, the slurry barrel and the circulation and supply system are located on the upper surface of the leak-proof disk 14, and the leak-proof disk 14 is located on the upper surface of the chassis 3). When the moving wheels at the bottom move, the slurry barrel and the circulation and supply system can be driven to move.

[0044] Preferably, a handrail 1 is provided on one side of the frame 2, and the entire device can be easily moved by the handrail 1.

[0045] Preferably, the moving wheel 15 is a universal wheel with a brake function to facilitate the movement and positioning of the supply device.

[0046] The frame, chassis and armrests are preferably made of stainless steel, which is strong and corrosion-resistant.

[0047] Although preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they are aware of the basic inventive concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention. Clearly, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, to the extent such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to encompass such changes and modifications.

Claims

1. A movable polishing slurry supply device for a polishing machine, characterized in that: Including slurry barrel, circulation and supply system, and supporting movement mechanism; The slurry barrel is used for preparing and storing polishing slurry; The circulation and supply system includes a circulation pipe, a supply pipe, a circulation valve located on the circulation pipe, a supply valve located on the supply pipe, and a delivery pump located on the circulation pipe; the feed end and the discharge end of the circulation pipe are respectively connected to the lower part and the upper part of the slurry barrel, and the polishing slurry is circulated under the action of the delivery pump; the feed end of the supply pipe is connected to the circulation pipe, and the discharge end is used to connect to the polishing machine to realize the supply of polishing slurry; The slurry barrel and the circulation and supply system are all located on the supporting and moving mechanism and can move under the drive of the supporting and moving mechanism.

2. The movable polishing slurry supply device for a polishing machine according to claim 1, characterized in that: The slurry barrel is provided with a barrel cover.

3. The movable polishing slurry supply device for a polishing machine according to claim 2, characterized in that: The barrel cover consists of two semicircles, which are connected by a hinge in the middle. One of the semicircles is fixedly connected to the barrel wall of the slurry barrel, and the other semicircle can be opened and closed under the action of the hinge.

4. The movable polishing slurry supply device for a polishing machine according to claim 1, wherein: A leak-proof disc is provided between the slurry barrel and the supporting and moving mechanism.

5. The movable polishing slurry supply device for a polishing machine according to claim 1, wherein: A drain pipe is provided at the bottom of the slurry barrel, and a drain valve is provided on the drain pipe.

6. The movable polishing slurry supply device for a polishing machine according to claim 1, wherein: A liquid level indicator tube is provided on the outside of the slurry barrel for confirming the liquid level of the polishing slurry in the slurry barrel.

7. The movable polishing slurry supply device for a polishing machine according to claim 1, wherein: A shock-absorbing base is provided at the bottom of the delivery pump.

8. The movable polishing slurry supply device for a polishing machine according to claim 1, wherein: The supporting and moving mechanism includes a frame, a chassis located above the frame, and moving wheels located at the bottom of the frame; The slurry barrel and the circulation and supply system are all located on the chassis.

9. The movable polishing slurry supply device for a polishing machine according to claim 8, characterized in that: A handrail is provided on one side of the frame.

10. The movable polishing slurry supply device for a polishing machine according to claim 8, wherein: The movable wheel is a universal wheel with a brake function.

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