Lifting mechanism capable of being leveled and wafer carrying table
By designing an adjustable leveling and lifting mechanism and utilizing the swing and displacement of the first and second adjustment mechanisms, the problem that the traditional lifting structure cannot adjust the horizontality of the wafer carrier is solved, and the horizontality adjustment and vertical lifting of the wafer carrier are realized, which reduces manufacturing costs and improves movement accuracy.
Patent Information
- Application Number
- CN202422877438.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-10-03
- Estimated Expiration
- 2034-11-25
AI Technical Summary
The traditional lifting structure cannot meet the requirements for adjusting the horizontality of the wafer carrier, and relies on the processing accuracy of components to increase manufacturing costs and is difficult to meet actual needs.
A leveling lifting mechanism is designed, which includes a cavity connecting support, a first adjustment mechanism and a second adjustment mechanism. The inclination angle of the wafer carrier is adjusted by swinging and displacing in different horizontal directions to ensure its horizontal state, and is combined with the lifting function of the lifting mechanism.
The horizontal adjustment of the wafer carrier is achieved to ensure that it remains horizontal during the vertical lifting process, reducing manufacturing costs and improving movement accuracy, ensuring process effects.
Smart Images

Figure CN223409281U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a leveling and lifting mechanism and a wafer carrier. Background Art
[0002] In semiconductor manufacturing, wafers, as a critical building block, play a central role in the production of chips, integrated circuits, and various electronic devices. During this crucial step in wafer processing, a wafer carrier must be used to support the wafer. To more efficiently utilize space, the heating lamps in some vapor deposition systems are positioned at the center of the reaction chamber bottom. This design necessitates a cantilevered wafer carrier.
[0003] To ensure a high wafer manufacturing yield, the wafer stage must remain level. However, the deflection of the lifting mechanism is significantly amplified in a cantilevered structure. Relying solely on component machining accuracy to ensure levelness not only significantly increases manufacturing costs but also struggles to meet practical needs. Conventional lifting mechanisms primarily provide vertical lift and cannot adjust the wafer stage's levelness. Summary of the Invention
[0004] The utility model provides a leveling lifting mechanism and a wafer carrier, so as to provide a lifting mechanism and a wafer carrier capable of satisfying the requirements of adjusting the horizontality of the wafer carrier.
[0005] In order to achieve the above purpose, the technical solution of the utility model is:
[0006] A leveling lifting mechanism includes: a cavity connecting support, a first adjustment mechanism, a second adjustment mechanism and a lifting mechanism;
[0007] The lifting mechanism is arranged on the cavity connecting support, and the lifting mechanism includes a lifting part that can be displaced in the vertical direction. The first adjustment mechanism is arranged on the lifting part, and the first adjustment mechanism can swing around the first horizontal direction. The second adjustment mechanism is arranged on the first adjustment mechanism, and the second adjustment mechanism can swing around the second horizontal direction. The second adjustment mechanism can install the wafer carrier, and the first horizontal direction, the second horizontal direction and the vertical direction are perpendicular to each other.
[0008] Furthermore, the first adjustment mechanism can also be displaced along the second horizontal direction, and the second adjustment mechanism can also be displaced along the first horizontal direction.
[0009] Furthermore, the first adjustment mechanism includes a first support, a first pin shaft and a first transmission pin;
[0010] The first pin shaft is located between the two first transmission pins. The first pin shaft and the first transmission pin are arranged on the lifting portion in a vertical direction. The axes of the first pin shaft and the first transmission pin are parallel to the first horizontal direction.
[0011] The first support is provided with a first waist hole and a second waist hole, the length directions of the first waist hole and the second waist hole are both parallel to the second horizontal direction, the first pin shaft is placed in the first waist hole, the first transmission pin is placed in the second waist hole, the diameter of the first pin shaft matches the width of the first waist hole, and a first anti-interference gap is left between the first transmission pin and the second waist hole along the vertical direction;
[0012] The first support is further provided with a first threaded hole and a first accommodating cavity in communication with the second waist hole, the first threaded hole being used to install a first adjustment bolt, the first accommodating cavity being used to accommodate a first spring, the first adjustment bolt and the first spring being arranged opposite each other, the first adjustment bolt and the first spring being capable of abutting against the first transmission pin, and the length direction of the first adjustment bolt and the length direction of the first spring being parallel to the second horizontal direction;
[0013] A third waist hole is also provided on the first support, and the length direction of the third waist hole is parallel to the second horizontal direction. The first support is fixed to the lifting part by a bolt set in the third waist hole. Along the vertical direction, a first anti-interference gap is left between the bolt in the third waist hole and the third waist hole.
[0014] Furthermore, the second adjustment mechanism includes a second support, a second pin shaft and a second transmission pin;
[0015] The second pin shaft is located between the two second transmission pins, and the second pin shaft and the second transmission pin are arranged on the first support in a vertical direction, and the axes of the second pin shaft and the second transmission pin are parallel to the second horizontal direction;
[0016] The second support is provided with a fourth waist hole and a fifth waist hole, the length directions of the fourth waist hole and the fifth waist hole are both parallel to the first horizontal direction, the second pin shaft is placed in the fourth waist hole, and the second transmission pin is placed in the fifth waist hole, the diameter of the second pin shaft matches the width of the fourth waist hole, and a second anti-interference gap is left between the second transmission pin and the fifth waist hole along the vertical direction;
[0017] The second support is further provided with a second threaded hole and a second accommodating cavity connected to the fifth waist hole, the second threaded hole is used to install a second adjustment bolt, and the second accommodating cavity is used to accommodate a second spring, the second adjustment bolt and the second spring are arranged opposite to each other, the second adjustment bolt and the second spring can abut against the second transmission pin, and the length direction of the second adjustment bolt and the length direction of the second spring are both parallel to the first horizontal direction;
[0018] The second support is also provided with a sixth waist hole, the length direction of the sixth waist hole is parallel to the first horizontal direction, and the second support is fixed to the first adjustment mechanism by a bolt set in the sixth waist hole. Along the vertical direction, a second anti-interference gap is left between the bolt in the sixth waist hole and the sixth waist hole.
[0019] Furthermore, the second support is provided with a mounting hole and a locking threaded hole perpendicular to the mounting hole, the mounting hole is non-circular in shape, and the cross section of the fixed axis of the wafer carrier matches the shape of the mounting hole;
[0020] After the fixed shaft is inserted into the mounting hole, the bolt in the locking threaded hole is tightened so that the fixed shaft can be clamped in the mounting hole.
[0021] Furthermore, it also includes a lifting mechanism limiter, and the lifting mechanism limiter includes an adjusting screw and a locking nut:
[0022] The adjusting screw is located above the lifting part, the length direction of the adjusting screw is parallel to the vertical direction, the adjusting screw is threadedly connected to the cavity connecting support, and the locking nut is sleeved on the adjusting screw.
[0023] Furthermore, at least three seventh waist holes arranged in a circular array are provided on the top of the cavity connection support, and the center lines of the seventh waist holes are tangent to the circle.
[0024] Furthermore, the lifting mechanism further comprises a motor, a lead screw, a vertical slide rail and a vertical slider;
[0025] The screw rotation is arranged on the cavity connecting support, the motor is fixed on the cavity connecting support, the motor can drive the screw to rotate, the vertical slide rail is arranged on the cavity connecting support, the vertical slider is installed on the vertical slide rail, the lifting part is fixedly connected to the vertical slider, and the lifting part is provided with a screw nut, and the screw nut is installed on the screw.
[0026] The utility model also relates to a wafer carrier, comprising the aforementioned leveling and lifting mechanism.
[0027] Beneficial effect: The utility model provides a leveling lifting mechanism and a wafer carrier, which realize the displacement of the wafer carrier in the vertical direction through the lifting and lowering of the lifting mechanism. By setting a first adjustment mechanism that swings around a first horizontal direction and a second adjustment mechanism that swings around a second horizontal direction, the inclination angle of the wafer carrier is adjusted through the swing of the first adjustment mechanism and the second adjustment mechanism, thereby realizing the adjustment of the horizontality of the wafer carrier, and realizing the vertical lifting and lowering of the wafer carrier while ensuring the horizontal state of the wafer carrier. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.
[0029] Figure 1 This is a structural diagram of a leveling lifting mechanism disclosed in the utility model;
[0030] Figure 2 This is a right side view of a leveling lifting mechanism disclosed in the utility model;
[0031] Figure 3 for Figure 2 BB cross-sectional view;
[0032] Figure 4 for Figure 3 Enlarged view of point F;
[0033] Figure 5 This is a front view of a leveling lifting mechanism disclosed in the utility model;
[0034] Figure 6 for Figure 5 CC cross-sectional view;
[0035] Figure 7 for Figure 6 Enlarged view of point E;
[0036] Figure 8 This is a left side view of a leveling lifting mechanism disclosed in the utility model;
[0037] Figure 9 for Figure 8 DD cross-sectional view;
[0038] Figure 10 This is a top view of a leveling lifting mechanism disclosed in the utility model;
[0039] Figure 11This is a schematic structural diagram of a wafer carrier using a leveling and lifting mechanism disclosed in the present utility model;
[0040] Figure 12 This is a rear view of a wafer stage using a leveling and lifting mechanism disclosed in the present utility model;
[0041] Figure 13 This is a structural schematic diagram of a second support of a leveling lifting mechanism disclosed in the utility model;
[0042] Figure 14 This is a structural schematic diagram of a first support of a leveling lifting mechanism disclosed in the utility model.
[0043] In the picture:
[0044] 1. Cavity connection support; 11. Seventh waist hole;
[0045] 2. First adjustment mechanism; 21. First support; 211. First waist hole; 212. Second waist hole; 213. Third waist hole; 214. First baffle; 215. First anti-interference gap; 22. First pin; 23. First transmission pin; 24. First adjustment bolt; 25. First spring;
[0046] 3. Second adjustment mechanism; 31. Second support; 311. Fourth waist hole; 312. Fifth waist hole; 313. Sixth waist hole; 314. Second baffle; 315. Second anti-interference gap; 316. Locking threaded hole; 317. Mounting hole; 32. Second pin; 33. Second transmission pin; 34. Second adjustment bolt; 35. Second spring;
[0047] 4. Lifting mechanism; 41. Lifting unit; 42. Motor; 43. Lead screw; 44. Vertical slide rail; 45. Vertical slider; 46. Lead screw nut;
[0048] 5. Adjusting screw;
[0049] 6. Leveling the top screw;
[0050] A, wafer stage; A1, fixed axis;
[0051] X, first horizontal direction; Y, second horizontal direction; Z, vertical direction. DETAILED DESCRIPTION
[0052] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.
[0053] Example 1
[0054] This embodiment provides a leveling lifting mechanism, such as Figures 1 to 3 as well as Figure 5 、 Figure 6 and Figure 8 As shown, it includes: a cavity connecting support 1, a first adjustment mechanism 2, a second adjustment mechanism 3 and a lifting mechanism 4;
[0055] The lifting mechanism 4 is arranged on the cavity connecting support 1. Figure 9 As shown, the lifting mechanism 4 includes a lifting portion 41 capable of displacement along a vertical direction Z. The first adjustment mechanism 2 is provided on the lifting portion 41 and can swing about a first horizontal direction X. The second adjustment mechanism 3 is provided on the first adjustment mechanism 2 and can swing about a second horizontal direction Y. The second adjustment mechanism 3 can be mounted on the wafer stage A. The first horizontal direction X, the second horizontal direction Y, and the vertical direction Z are perpendicular to each other.
[0056] This embodiment provides a leveling lifting mechanism and wafer stage. The lifting mechanism 4 is raised and lowered to achieve displacement of the wafer stage in the vertical direction Z. A first adjustment mechanism 2 that swings about a first horizontal direction X and a second adjustment mechanism 3 that swings about a second horizontal direction Y are provided. The first adjustment mechanism 2 and the second adjustment mechanism 3 are swung to adjust the inclination angle of the wafer stage A, thereby adjusting the horizontality of the wafer stage. This ensures that the wafer stage remains horizontal while achieving vertical lifting of the wafer stage.
[0057] At the same time, since the adjustment of the first adjustment mechanism 2 and the second adjustment mechanism 3 does not affect the lifting mechanism 4, the travel direction of the lifting mechanism 4 will not be changed, so that the wafer carrier A can always maintain vertical lifting, ensuring the movement accuracy of the wafer carrier A.
[0058] In a specific embodiment, the first adjustment mechanism 2 can also be displaced along the second horizontal direction Y, and the second adjustment mechanism 3 can also be displaced along the first horizontal direction X, so as to facilitate the displacement adjustment of the wafer stage A in the horizontal direction;
[0059] By setting up the first adjustment mechanism 2 and the second adjustment mechanism 3, the wafer carrier A can be translated along the first horizontal direction and the second horizontal direction, thereby adjusting the position of the wafer carrier A relative to the process chamber cavity, ensuring that the wafer carrier A can be in the center of the cavity, and then achieving concentricity between the wafer carrier A and the shower head (shower head) set at the top of the cavity for introducing process gas into the cavity, thereby ensuring the process effect.
[0060] In a specific embodiment, Figure 4 As shown, the first adjustment mechanism 2 includes a first support 21, a first pin shaft 22 and a first transmission pin 23;
[0061] The first pin shaft 22 is located between the two first transmission pins 23. The first pin shaft 22 and the first transmission pin 23 are arranged on the lifting portion 41 along the vertical direction Z. The axes of the first pin shaft 22 and the first transmission pin 23 are parallel to the first horizontal direction X.
[0062] In this embodiment, the lifting portion 41 is provided with holes for mounting the first pin shaft 22 and the first transmission pin 23, respectively. The first pin shaft 22 and the first transmission pin 23 are interference fit with the corresponding holes.
[0063] like Figure 14 As shown, the first support 21 is provided with a first waist hole 211 and a second waist hole 212. The length directions of the first waist hole 211 and the second waist hole 212 are both parallel to the second horizontal direction Y. The first pin 22 is placed in the first waist hole 211, and the first transmission pin 23 is placed in the second waist hole 212. The diameter of the first pin 22 matches the width of the first waist hole 211. Along the vertical direction Z, a first anti-interference gap 215 is left between the first transmission pin 23 and the second waist hole 212.
[0064] The first support 21 is further provided with a first threaded hole and a first accommodating cavity in communication with the second waist hole 212. The first threaded hole is used to install a first adjusting bolt 24, and the first accommodating cavity is used to accommodate a first spring 25. The first adjusting bolt 24 and the first spring 25 are arranged opposite each other. The first adjusting bolt 24 and the first spring 25 can abut against the first transmission pin 23. The length direction of the first adjusting bolt 24 and the length direction of the first spring 25 are both parallel to the second horizontal direction Y.
[0065] In this embodiment, if Figure 4 As shown, a hole for accommodating the first spring 25 is formed on the first support 21. A first baffle 214 is fixed to the first support 21 by bolts. The first baffle 214 and the hole for accommodating the first spring 25 form a first accommodating cavity. One end of the first spring 25 abuts against the first baffle 214, and the other end of the first spring 25 abuts against the first transmission pin 23.
[0066] like Figure 14 As shown, the first support 21 is further provided with a third waist hole 213, the length direction of the third waist hole 213 being parallel to the second horizontal direction Y. The first support 21 is fixed to the lifting portion 41 by a bolt disposed in the third waist hole 213. Along the vertical direction, a first anti-interference gap 215 is left between the bolt in the third waist hole 213 and the third waist hole 213.
[0067] By setting the first anti-interference gap 215, the first support 21 can rotate within a certain range relative to the first pin 22, and the inclination angle can be adjusted by swinging;
[0068] When the first support 21 needs to be adjusted to a horizontal level by swinging, loosen the bolt in the third waist hole 213 and screw the bolt in the third waist hole 213 according to the current tilt angle. Figure 4 The first adjusting bolt 24 of the upper half or the screw Figure 4 The first adjusting bolt 24 at the lower half compresses the corresponding first spring 25, causing the first support 21 to rotate around the first pin 22 to adjust the tilt angle of the first support 21, thereby performing leveling.
[0069] When the first support 21 needs to be displaced horizontally, loosen the bolts in the third waist hole 213 and tighten the Figure 4 The two first adjusting bolts 24 in the first adjusting bolt 24 are loosened, the first spring 25 is extended, and the first support 21 is moved to the Figure 4 Left displacement, tighten the first adjusting bolt 24, the first spring 25 is compressed, and the first support 21 moves Figure 4 The right side is displaced, and the waist hole provided on the first support 21 allows the first support 21 to have a certain adjustment amount in the horizontal direction, so that the first support 21 can achieve horizontal displacement.
[0070] In a specific embodiment, Figure 7 As shown, the second adjustment mechanism 3 includes a second support 31, a second pin shaft 32 and a second transmission pin 33;
[0071] The second pin shaft 32 is located between the two second transmission pins 33. The second pin shaft 32 and the second transmission pin 33 are arranged on the first support 21 along the vertical direction Z. The axes of the second pin shaft 32 and the second transmission pin 33 are parallel to the second horizontal direction Y.
[0072] In this embodiment, the first support 21 is provided with holes for mounting the second pin 32 and the second transmission pin 33, respectively. The second pin 32 and the second transmission pin 33 are interference fit with the corresponding holes.
[0073] like Figure 13As shown, the second support 31 is provided with a fourth waist hole 311 and a fifth waist hole 312. The length directions of the fourth waist hole 311 and the fifth waist hole 312 are both parallel to the first horizontal direction X. The second pin 32 is placed in the fourth waist hole 311, and the second transmission pin 33 is placed in the fifth waist hole 312. The diameter of the second pin 32 matches the width of the fourth waist hole 311. Along the vertical direction Z, a second anti-interference gap 315 is left between the second transmission pin 33 and the fifth waist hole 312.
[0074] The second support 31 is further provided with a second threaded hole and a second accommodating cavity in communication with the fifth waist hole 312. The second threaded hole is used to mount a second adjusting bolt 34, and the second accommodating cavity is used to accommodate a second spring 35. The second adjusting bolt 34 and the second spring 35 are arranged opposite each other. The second adjusting bolt 34 and the second spring 35 can abut against the second transmission pin 33. The length direction of the second adjusting bolt 34 and the length direction of the second spring 35 are both parallel to the first horizontal direction X.
[0075] like Figure 7 As shown, in this embodiment, a hole for accommodating the second spring 35 is opened on the second support 31, and a second baffle 314 is fixed to the second support 31 by bolts. The second baffle 314 and the hole for accommodating the second spring 35 form a second accommodating cavity. One end of the second spring 35 abuts the second baffle 314, and the other end of the second spring 35 abuts the second transmission pin 33.
[0076] like Figure 13 As shown, the second support 31 is further provided with a sixth waist hole 313, the length direction of the sixth waist hole 313 being parallel to the first horizontal direction X. The second support 31 is fixed to the first support 21 of the first adjustment mechanism 2 by a bolt disposed in the sixth waist hole 313. Along the vertical direction, a second anti-interference gap 315 is left between the bolt in the sixth waist hole 313 and the sixth waist hole 313.
[0077] By setting the second anti-interference gap 315, the second support 31 can rotate within a certain range relative to the second pin 33, and the inclination angle can be adjusted by swinging;
[0078] When the second support 31 needs to be adjusted to a horizontal level by swinging, loosen the bolt in the sixth waist hole 313 and screw the bolt in the sixth waist hole 313 according to the current tilt angle. Figure 7 The second adjusting bolt 34 of the upper half or the screw Figure 7 The second adjusting bolt 34 at the lower half compresses the corresponding second spring 35, causing the second support 31 to rotate around the second pin 32 to adjust the tilt angle of the second support 31, thereby performing leveling.
[0079] When the second support 31 needs to be displaced horizontally, loosen the bolt in the sixth waist hole 313 and tighten the Figure 7 The two second adjusting bolts 34 in the middle are loosened, the second spring 35 is extended, and the second support 31 is moved to the Figure 7 Left displacement, tighten the second adjusting bolt 34, the second spring 35 is compressed, and the second support 31 moves to the left. Figure 7 The right side is displaced, and the waist hole provided on the second support 31 allows the second support 31 to have a certain adjustment amount in the horizontal direction, so that the second support 31 can achieve horizontal displacement.
[0080] In a specific embodiment, Figure 13 As shown, the second support 31 is provided with a mounting hole 317 and a locking threaded hole 316 perpendicular to the mounting hole 317. The mounting hole 317 is non-circular in shape. The cross section of the fixed axis A1 of the wafer stage A matches the shape of the mounting hole 317, so that the fixed axis A1 and the mounting hole 317 can be positioned and installed, while preventing the fixed axis A1 from rotating in the mounting hole 317.
[0081] After the fixing shaft A1 is inserted into the mounting hole 317 , the bolt in the locking threaded hole 316 is tightened to clamp the fixing shaft A1 in the mounting hole 317 .
[0082] In a specific embodiment, it also includes a lifting mechanism limit, such as Figure 5 As shown, the lifting mechanism limit includes an adjusting screw 5 and a locking nut 6:
[0083] The adjusting screw 5 is located above the lifting portion 41, and the length direction of the adjusting screw 5 is parallel to the vertical direction Z. The adjusting screw 5 is threadedly connected to the cavity connection support 1, and the locking nut 6 is sleeved on the adjusting screw 5. Tightening the locking nut 6 can lock the adjusting screw 5 to prevent it from loosening;
[0084] The adjusting screw 5 can stop the lifting portion 41 from continuing to rise, thereby preventing the wafer stage A from rising excessively and colliding with other components in the reaction chamber.
[0085] In a specific embodiment, Figure 10 As shown, at least three seventh waist holes 11 arranged in a circular array are provided on the top of the cavity connection support 1, and the center line of the seventh waist hole 11 is tangent to the circle. The cavity connection support 1 is fixed to the cavity of the reaction chamber by bolts in the seventh waist hole 11. The seventh waist holes 11 arranged in a circular array enable the cavity connection support 1 to adjust its position by rotation to avoid other components in the semiconductor equipment.
[0086] In a specific embodiment, Figure 9As shown, the lifting mechanism 4 further includes a motor 42, a lead screw 43, a vertical slide rail 44 and a vertical slider 45;
[0087] The screw 43 is rotatably arranged on the cavity connecting support 1, and the motor 42 is fixed on the cavity connecting support 1. The motor 42 can drive the screw 43 to rotate. In this embodiment, the motor 42 drives the screw 43 to rotate through a belt transmission. The vertical slide rail 44 is arranged on the cavity connecting support 1, and the vertical slider 45 is installed on the vertical slide rail 44. The lifting part 41 is fixedly connected to the vertical slider 45. A screw nut 46 is fixed on the lifting part 41, and the screw nut 46 is installed on the screw 43. Guidance is achieved through the vertical slide rail 44 and the vertical slider 45, and transmission is achieved through the screw nut 46 and the screw 43.
[0088] Example 2
[0089] This embodiment provides a wafer stage, such as Figure 11 and Figure 12 As shown, it includes a leveling lifting mechanism as described in Example 1, which ensures the horizontal state of the wafer carrier A while achieving the displacement of the wafer carrier A in the three directions of XYZ. Figure 11 and Figure 12 The wafer carrier A shown is the wafer carrier part. In actual application, a leveling lifting mechanism is also used to lift and lower the ejector mechanism of the wafer carrier. The ejector mechanism also has a fixed axis A1, and the ejector mechanism is set on the second adjustment mechanism 3 through the fixed axis A1.
[0090] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A leveling lifting mechanism, characterized in that: include: The cavity connects the support (1), the first adjustment mechanism (2), the second adjustment mechanism (3) and the lifting mechanism (4); The lifting mechanism (4) is arranged on the cavity connection support (1), and the lifting mechanism (4) includes a lifting part (41) that can be displaced in the vertical direction. The first adjustment mechanism (2) is arranged on the lifting part (41), and the first adjustment mechanism (2) can swing around a first horizontal direction. The second adjustment mechanism (3) is arranged on the first adjustment mechanism (2), and the second adjustment mechanism (3) can swing around a second horizontal direction. The second adjustment mechanism (3) can install a wafer carrier (A), and the first horizontal direction, the second horizontal direction and the vertical direction are perpendicular to each other.
2. The leveling lifting mechanism according to claim 1, characterized in that: The first adjustment mechanism (2) is also capable of displacement along a second horizontal direction, and the second adjustment mechanism (3) is also capable of displacement along the first horizontal direction.
3. The leveling lifting mechanism according to claim 2, characterized in that: The first adjustment mechanism (2) comprises a first support (21), a first pin shaft (22) and a first transmission pin (23); The first pin shaft (22) is located between the two first transmission pins (23), the first pin shaft (22) and the first transmission pin (23) are arranged on the lifting portion (41) in a vertical direction, and the axes of the first pin shaft (22) and the first transmission pin (23) are parallel to the first horizontal direction; The first support (21) is provided with a first waist hole (211) and a second waist hole (212), the length directions of the first waist hole (211) and the second waist hole (212) are parallel to the second horizontal direction, the first pin shaft (22) is placed in the first waist hole (211), the first transmission pin (23) is placed in the second waist hole (212), the diameter of the first pin shaft (22) matches the width of the first waist hole (211), and along the vertical direction, a first anti-interference gap (215) is left between the first transmission pin (23) and the second waist hole (212); The first support (21) is further provided with a first threaded hole and a first accommodating cavity connected to the second waist hole (212), the first threaded hole is used to install a first adjusting bolt (24), the first accommodating cavity is used to accommodate a first spring (25), the first adjusting bolt (24) and the first spring (25) are arranged opposite to each other, the first adjusting bolt (24) and the first spring (25) can abut against the first transmission pin (23), and the length direction of the first adjusting bolt (24) and the length direction of the first spring (25) are both parallel to the second horizontal direction; The first support (21) is further provided with a third waist hole (213), the length direction of the third waist hole (213) is parallel to the second horizontal direction, the first support (21) is fixed to the lifting portion (41) by a bolt arranged in the third waist hole (213), and along the vertical direction, a first anti-interference gap (215) is left between the bolt in the third waist hole (213) and the third waist hole (213).
4. The leveling lifting mechanism according to claim 2, characterized in that: The second adjustment mechanism (3) comprises a second support (31), a second pin shaft (32) and a second transmission pin (33); The second pin shaft (32) is located between the two second transmission pins (33), the second pin shaft (32) and the second transmission pin (33) are arranged on the first support (21) in a vertical direction, and the axes of the second pin shaft (32) and the second transmission pin (33) are parallel to the second horizontal direction; The second support (31) is provided with a fourth waist hole (311) and a fifth waist hole (312), the length directions of the fourth waist hole (311) and the fifth waist hole (312) are parallel to the first horizontal direction, the second pin shaft (32) is placed in the fourth waist hole (311), the second transmission pin (33) is placed in the fifth waist hole (312), the diameter of the second pin shaft (32) matches the width of the fourth waist hole (311), and along the vertical direction, a second anti-interference gap (315) is left between the second transmission pin (33) and the fifth waist hole (312); The second support (31) is further provided with a second threaded hole and a second accommodating cavity connected to the fifth waist hole (312), the second threaded hole is used to install a second adjusting bolt (34), the second accommodating cavity is used to accommodate a second spring (35), the second adjusting bolt (34) and the second spring (35) are arranged opposite to each other, the second adjusting bolt (34) and the second spring (35) can abut against the second transmission pin (33), and the length direction of the second adjusting bolt (34) and the length direction of the second spring (35) are both parallel to the first horizontal direction; The second support (31) is further provided with a sixth waist hole (313), the length direction of the sixth waist hole (313) being parallel to the first horizontal direction. The second support (31) is fixed to the first adjustment mechanism (2) by a bolt arranged in the sixth waist hole (313), and along the vertical direction, a second anti-interference gap (315) is left between the bolt in the sixth waist hole (313) and the sixth waist hole (313).
5. The leveling lifting mechanism according to claim 4, characterized in that: The second support (31) is provided with a mounting hole (317) and a locking threaded hole (316) perpendicular to the mounting hole (317); the mounting hole (317) is non-circular in shape, and the cross section of the fixed axis (A1) of the wafer carrier (A) matches the shape of the mounting hole (317); After the fixed shaft (A1) is inserted into the mounting hole (317), the bolt in the locking threaded hole (316) is tightened, so that the fixed shaft (A1) can be clamped in the mounting hole (317).
6. The leveling lifting mechanism according to claim 1, characterized in that: It also includes a lifting mechanism limiter, which includes an adjusting screw (5) and a locking nut (6): The adjusting screw (5) is located above the lifting portion (41), the length direction of the adjusting screw (5) is parallel to the vertical direction, the adjusting screw (5) is threadedly connected to the cavity connection support (1), and the locking nut (6) is sleeved on the adjusting screw (5).
7. The leveling lifting mechanism according to claim 1, characterized in that: The top of the cavity connection support (1) is provided with at least three seventh waist holes (11) arranged in a circular array, and the center lines of the seventh waist holes (11) are tangent to the circle.
8. The leveling lifting mechanism according to claim 1, characterized in that: The lifting mechanism (4) further comprises a motor (42), a lead screw (43), a vertical slide rail (44) and a vertical slider (45); The lead screw (43) is rotatably arranged on the cavity connection support (1), the motor (42) is fixed on the cavity connection support (1), and the motor (42) can drive the lead screw (43) to rotate. The vertical slide rail (44) is arranged on the cavity connection support (1), and the vertical slider (45) is installed on the vertical slide rail (44). The lifting part (41) is fixedly connected to the vertical slider (45), and the lifting part (41) is provided with a lead screw nut (46), and the lead screw nut (46) is installed on the lead screw (43).
9. A wafer stage, characterized in that: It comprises a leveling lifting mechanism as described in any one of claims 1-8.