Thin film sputtering device based on HIPIMS technology
By setting up forward and reverse flow guide pipes and serpentine structures in the heat conduction plate of the HiPIMS power supply, the problem of uneven heat dissipation of high-power components is solved, uniform heat dissipation is achieved, the life of components is extended, and the stability of the power supply is ensured.
Patent Information
- Application Number
- CN202422798117.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-18
- Publication Date
- 2025-10-03
- Estimated Expiration
- 2034-11-18
AI Technical Summary
In the prior art, the heat dissipation of high-power components in HiPIMS power supplies mainly relies on natural cooling, resulting in poor cooling effect and difficulty in meeting high-precision usage requirements.
By setting forward and reverse flow guide pipes in the heat conduction plate and combining them with cooling water flow channels, heat is transferred to the cooling water through the heat conduction plate. The serpentine structure and heat conduction strips are used to increase the contact area and achieve uniform heat dissipation.
It effectively prevents high-power components from overheating and burning, extends their service life, ensures the stability and reliability of the power supply, and improves heat dissipation uniformity.
Smart Images
Figure CN223409709U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of magnetron sputtering, in particular to a thin film sputtering device based on HIPIMS technology. Background Art
[0002] High-energy pulsed magnetron sputtering (HiPIMS) is a magnetron sputtering technology that produces high ionization rates, combining the advantages of both magnetron sputtering and multi-arc ion plating. Its high ionization rate enables high-energy deposition, producing high-density, high-quality thin films. It is commonly used in the development and production of high-performance composite films and coatings.
[0003] HiPIMS power supplies are often used to increase power in HiPIMS systems. In actual use, the output voltage of the HiPIMS power supply reaches more than 2000 volts, the output current exceeds 1000A, and the peak power reaches megawatts. Therefore, high-power components in the HiPIMS power supply, such as high-power diodes, generate a lot of heat under instantaneous large currents and continuous large currents, making it easy for high-power components to overheat and burn out, thereby affecting the stability and reliability of the HiPIMS power supply. Therefore, high-power components need to be heat-dissipated. Currently, the heat dissipation of high-power components mainly relies on natural cooling. Natural cooling is greatly affected by the environment, resulting in poor cooling effect and difficulty in meeting the use requirements of high-precision HiPIMS power supplies. Utility Model Content
[0004] The purpose of the utility model is to provide a thin film sputtering device based on HIPIMS technology to solve the problem in the prior art that the heat dissipation of high-power components in HiPIMS power supplies mainly relies on natural cooling, resulting in poor cooling effect and difficulty in meeting the use requirements of high-precision HiPIMS power supplies.
[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:
[0006] A thin film sputtering device based on HIPIMS technology includes a vacuum chamber and a high-power pulse magnetron sputtering system arranged in the vacuum chamber, the high-power pulse magnetron sputtering system includes a high-power pulse magnetron sputtering power supply, the high-power pulse magnetron sputtering power supply includes high-power components and a heat conduction plate, the heat conduction plate is provided with a bearing surface, the bearing surface is used to install the high-power components; a forward guide pipe and a reverse guide pipe are opened inside the heat conduction plate, the two ends of the forward guide pipe are respectively connected to a forward water inlet and a forward water outlet, the two ends of the reverse guide pipe are respectively connected to a reverse water inlet and a reverse water outlet, and the forward water inlet is arranged close to the reverse water outlet, and the forward water outlet is arranged close to the reverse water inlet.
[0007] A further technical solution is to provide a plurality of heat-conducting strips with one end facing the axis thereof on the inner walls of the forward flow guide pipe and the reverse flow guide pipe along their paths.
[0008] A further technical solution is to install a forward water inlet joint and a reverse water inlet joint at the forward water inlet and a forward water outlet joint and a reverse water outlet joint at the forward water outlet and a reverse water outlet joint at the reverse water outlet.
[0009] A further technical solution is that the overall structures of the forward flow guide pipe and the reverse flow guide pipe are both arranged in a serpentine structure.
[0010] A further technical solution is to fill the space between the bearing surface and the high-power components with thermal conductive adhesive.
[0011] Compared with the prior art, the beneficial effects of the present invention are:
[0012] 1. By arranging forward flow guide pipes, reverse flow guide pipes, forward water inlet, forward water outlet, reverse water inlet and reverse water outlet, cooling water flows through the forward flow guide pipes and the reverse flow guide pipes. The heat generated by the high-power components is conducted to the cooling water through the heat conduction plate, so that the heat is absorbed and taken away by the cooling water, and the high-power components will not be kept in a high temperature state all the time, thus avoiding overheating and burning of the high-power components, thereby extending the service life of the high-power components, thereby ensuring the stability and reliability of the high-power pulsed magnetron sputtering power supply.
[0013] 2. Set the forward water inlet close to the reverse water outlet. Set the forward water outlet close to the reverse water inlet. When in use, it can avoid that when the cooling water flows into the forward flow guide pipe through the forward water inlet, the cooling water absorbs the heat generated by the high-power components near the forward water inlet. At this time, the temperature of the cooling water rises, and the heat generated by the high-power components near the forward water outlet is not absorbed sufficiently, and the heat generated by the high-power components near the forward water outlet cannot be effectively taken away, resulting in uneven heat dissipation of the high-power components. At this time, cooling water is injected into the reverse flow guide pipe through the reverse water inlet, and the cooling water in the reverse flow guide pipe can take away the heat of the high-power components near the forward water outlet that is not taken away by the forward flow guide pipe, thereby achieving uniform heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic diagram of the structure of a high-power pulsed magnetron sputtering power supply in an embodiment of the present utility model.
[0015] Figure 2 This is a top cross-sectional view of the heat conducting plate in Example 1 of the present utility model.
[0016] Figure 3 This is a schematic diagram of the cross-sectional structure of the heat conducting plate of the utility model.
[0017] Icon: 1- high-power components, 2- heat conduction plate, 4- bearing surface, 5- forward flow guide pipe, 6- reverse flow guide pipe, 7- forward water inlet, 8- forward water outlet, 9- reverse water inlet, 10- reverse water outlet, 11- heat conduction strip, 12- forward water inlet joint, 13- reverse water inlet joint, 14- forward water outlet joint, 15- reverse water outlet joint, 16- mounting plate, 17- mounting hole. DETAILED DESCRIPTION
[0018] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.
[0019] Example 1
[0020] See Figure 1 、 Figure 2 It is shown that the utility model is a thin film sputtering device based on HIPIMS technology, including a vacuum chamber and a high-power pulse magnetron sputtering system arranged in the vacuum chamber, the high-power pulse magnetron sputtering system including a high-power pulse magnetron sputtering power supply, the vacuum chamber and the high-power pulse magnetron sputtering system are both prior art, and are not described in detail in this embodiment. The high-power pulse magnetron sputtering power supply includes a high-power component 1 and a heat conducting plate 2. The high-power pulse magnetron sputtering power supply also includes other components not shown in the figure. The heat conducting plate 2 can be made of an aluminum plate or other suitable plate. The aluminum plate has better thermal conductivity and can effectively disperse heat conduction to the high power. To transfer heat from the high-power component 1, a bearing surface 4 is provided on the heat conducting plate 2, and the bearing surface 4 is used to install the high-power component 1 and other components. It should be noted that the side on which the high-power component 1 is arranged on the bearing surface 4 is the heating side; a forward flow guide pipe 5 and a reverse flow guide pipe 6 are opened inside the heat conducting plate 2, and the two ends of the forward flow guide pipe 5 are respectively connected to a forward water inlet 7 and a forward water outlet 8, and the two ends of the reverse flow guide pipe 6 are respectively connected to a reverse water inlet 9 and a reverse water outlet 10, and the forward water inlet 7 is arranged on the side of the heat conducting plate 2 close to the reverse water outlet 10, and the forward water outlet 8 is arranged on the side of the heat conducting plate 2 close to the reverse water inlet 9.
[0021] In this solution, when in use, cooling water is injected into the forward water inlet 7 and the reverse water inlet 9 respectively, and the cooling water flows through the forward flow guide pipe 5 and the reverse flow guide pipe 6 respectively, and is finally discharged through the forward water outlet 8 and the reverse water outlet 10 respectively. In this process, the heat generated by the high-power component 1 is heat-conducted through the heat conduction plate 2 to the cooling water, so that the heat is absorbed and taken away by the cooling water, and the high-power component 1 will not be kept in a high-temperature state all the time, thereby avoiding overheating and burning of the high-power component 1, and extending the service life of the high-power component 1. At the same time, other components can also be cooled, thereby ensuring the stability and reliability of the high-power pulsed magnetron sputtering power supply. By setting this structure, the problem of the resistance between the input and output of the high-power diode affecting the high-power diode when the temperature is too high is solved, thereby avoiding affecting the output current and then improving the service life of the diode. By setting the forward flow guide pipe 5 and the reverse flow guide pipe 6, when in use, it is possible to choose whether to use the forward flow guide pipe 5 and the reverse flow guide pipe 6 at the same time to circulate cooling water, thereby achieving different heat conduction effects and improving practicality; the forward water inlet 7 is set close to the reverse water outlet 10, and the forward water outlet 8 is set close to the reverse water inlet 9. When in use, it can be avoided that when the cooling water flows into the forward flow guide pipe 5 through the forward water inlet 7, the cooling water absorbs the heat generated by the high-power component 1 near the forward water inlet 7. When the temperature of the cooling water rises, the heat generated by the high-power components 1 near the forward water outlet 8 is not absorbed sufficiently, and the heat generated by the high-power components 1 near the forward water outlet 8 cannot be effectively taken away, resulting in uneven heat dissipation of the high-power components 1. At this time, cooling water is injected into the reverse flow guide pipe 6 through the reverse water inlet 9. The cooling water in the reverse flow guide pipe 6 can take away the heat of the high-power components 1 near the forward water outlet 8 that is not taken away by the forward flow guide pipe 5, and can also dissipate heat for other components to achieve uniform heat dissipation.
[0022] Example 2
[0023] Based on the above embodiments, see Figure 3 As shown, a plurality of heat-conducting strips 11 with one end facing the axis are provided on the inner walls of the forward flow guide pipe 5 and the reverse flow guide pipe 6 along their paths. In actual use, the heat generated by the high-power component 1 is dispersed through heat conduction of the heat-conducting plate 2. By providing the heat-conducting strips 11, the heat-conducting area in contact with the cooling water is increased, thereby improving the heat dissipation efficiency of the high-power component 1.
[0024] As a preferred embodiment, see Figure 1It is shown that a forward water inlet joint 12 and a reverse water inlet joint 13 are respectively installed at the forward water inlet 7 and the reverse water inlet 9, and a forward water outlet joint 14 and a reverse water outlet joint 15 are respectively installed at the forward water outlet 8 and the reverse water outlet 10. By respectively arranging the forward water inlet joint 12, the reverse water inlet joint 13, the forward water outlet joint 14 and the reverse water outlet joint 15, it is convenient to quickly connect the external water pipe.
[0025] As a preferred embodiment, see Figure 2 As shown, the overall structures of the forward flow guide pipe 5 and the reverse flow guide pipe 6 are both arranged in a serpentine structure, so as to facilitate their uniform distribution inside the heat conducting plate 2.
[0026] As a preferred embodiment, thermal conductive glue is filled between the bearing surface 4 and the high-power component 1. By filling thermal conductive glue between the bearing surface 4 of the heat conducting plate 2 and the high-power component 1, the high-power component 1 and the heat conducting plate 2 are ensured to be firmly installed, and the heat generated by the high-power component 1 can be quickly conducted.
[0027] As a preferred embodiment, a mounting plate 16 is connected to the side of the heat conducting plate 2 away from the high-power component 1 , and a plurality of mounting holes 17 are provided on the mounting plate 16 to facilitate subsequent installation.
[0028] Although the present invention has been described herein with reference to a number of illustrative embodiments thereof, it should be understood that numerous other modifications and implementations may be devised by those skilled in the art that fall within the scope and spirit of the principles disclosed herein. More specifically, within the scope of the present disclosure, the drawings, and the claims, various variations and modifications may be made to the components and / or layout of the subject combination arrangement. In addition to variations and modifications to the components and / or layout, other uses will also be apparent to those skilled in the art.
Claims
1. A thin film sputtering device based on HIPIMS technology, comprising a vacuum chamber and a high-power pulsed magnetron sputtering system disposed in the vacuum chamber, wherein the high-power pulsed magnetron sputtering system includes a high-power pulsed magnetron sputtering power supply, characterized in that: The high-power pulsed magnetron sputtering power supply comprises a high-power component (1) and a heat conducting plate (2), wherein a bearing surface (4) is provided on the heat conducting plate (2), and the bearing surface (4) is used to install the high-power component (1); a forward flow guide pipe (5) and a reverse flow guide pipe (6) are provided inside the heat conducting plate (2), and the two ends of the forward flow guide pipe (5) are respectively connected to a forward water inlet (7) and a forward water outlet (8), and the two ends of the reverse flow guide pipe (6) are respectively connected to a reverse water inlet (9) and a reverse water outlet (10), and the forward water inlet (7) is arranged on the side of the heat conducting plate (2) near the reverse water outlet (10), and the forward water outlet (8) is arranged on the side of the heat conducting plate (2) near the reverse water inlet (9).
2. The thin film sputtering device based on HIPIMS technology according to claim 1, characterized in that: The inner walls of the forward flow guide pipe (5) and the reverse flow guide pipe (6) are both provided with a plurality of heat-conducting strips (11) along their paths, one end of which is arranged toward the axis thereof.
3. The thin film sputtering device based on HIPIMS technology according to claim 1, characterized in that: A forward water inlet joint (12) and a reverse water inlet joint (13) are respectively installed at the forward water inlet (7) and the reverse water inlet (9), and a forward water outlet joint (14) and a reverse water outlet joint (15) are respectively installed at the forward water outlet (8) and the reverse water outlet (10).
4. The thin film sputtering device based on HIPIMS technology according to claim 1, characterized in that: The overall structures of the forward flow guide pipe (5) and the reverse flow guide pipe (6) are both arranged in a serpentine structure.
5. The thin film sputtering device based on HIPIMS technology according to claim 1, characterized in that: Thermal conductive glue is filled between the bearing surface (4) and the high-power component (1).