Semiconductor wafer outer diameter detection device

Abstract

The utility model relates to the technical field of semiconductor wafer outer diameter detection, in particular to a semiconductor wafer outer diameter detection device. Comprising a rack, a substrate is fixedly connected to the surface of the upper end of the rack, a supporting plate is installed on one side of the rack, a wafer body is arranged on the upper surface of the substrate, a limiting mechanism is installed on the upper surface of the substrate, the limiting mechanism comprises two fixing frames, the two fixing frames are located at the two ends of the surface of the substrate, and the fixing frames are arranged on the substrate. The lower surface of the fixing frame is fixedly connected with the surface of the base plate, the inner wall of the fixing frame is rotationally connected with a driving shaft, the arc surface of the driving shaft is in threaded connection with a driving ring, the surface of the upper end of the driving ring is fixedly connected with limiting plates, and limiting grooves are formed in the sides, close to each other, of the two limiting plates; the inner wall of the limiting groove abuts against the surface of the wafer body. The semiconductor wafer outer diameter detection device provided by the utility model has the advantage of conveniently and quickly detecting and limiting the outer diameter of the wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafer outer diameter detection, in particular to a semiconductor wafer outer diameter detection device. Background Art

[0002] Semiconductor wafer outer diameter inspection devices are devices used to measure the diameter of semiconductor wafers. In the semiconductor manufacturing process, wafer dimensional accuracy is crucial for subsequent process steps and the performance of the final product. Therefore, outer diameter inspection devices must be highly accurate and reliable, and are common in everyday life.

[0003] Existing technologies include a utility model with a publication number of CN221037217U, which discloses a semiconductor wafer outer diameter detection device. The patent includes a detection box and a size detection mechanism arranged on the upper side of the detection box. The size detection mechanism includes a first limit groove opened at the top of the detection box. The semiconductor wafer outer diameter detection device provided by the utility model clamps the semiconductor wafer by an external clamp. When one end of the external clamp enters the slot corresponding to the first limit groove, the second limit groove and the third limit groove, the semiconductor wafer will be placed. Then, the transparent plate is illuminated by the irradiation component, and the size of the semiconductor wafer is observed. The measurement results are judged visually. If the slot cannot be placed, it is judged as unqualified, while if it is placed in the opposite direction, it is qualified. This not only greatly improves its detection efficiency, but also can cooperate with the feeding inspection process to detect and judge the size of the semiconductor wafer.

[0004] In daily use, it is found that the manufacturing process of semiconductor devices in the existing technology is very complicated, and the dimensional accuracy of the wafer is extremely high. The outer diameter of the wafer directly affects the accuracy of subsequent process steps such as lithography, etching, and deposition. In this process, the outer diameter error of the wafer will affect the performance and yield of the final product, which will make it inconvenient to quickly detect the outer diameter of the wafer. Utility Model Content

[0005] The purpose of the present utility model is to solve the problem in the prior art that the manufacturing process of semiconductor devices is very complicated and the dimensional accuracy of the wafer is extremely high. The outer diameter of the wafer directly affects the accuracy of subsequent process steps such as lithography, etching, and deposition. In this process, the outer diameter error of the wafer will affect the performance and yield of the final product, which will cause the disadvantage of inconvenience in quickly detecting the outer diameter of the wafer.

[0006] In order to solve the above technical problems, the utility model provides a semiconductor wafer outer diameter detection device, comprising: a frame, the upper end surface of the frame is fixedly connected to a substrate, a support plate is installed on one side of the frame, the upper surface of the substrate is provided with a wafer body, the upper surface of the substrate is installed with a limiting mechanism, the limiting mechanism includes two fixed frames, the two fixed frames are located at both ends of the surface of the substrate, the lower surface of the fixed frame is fixedly connected to the surface of the substrate, the inner wall of the fixed frame is rotatably connected to a drive shaft, the arc surface of the drive shaft is threadedly connected to a drive ring, and the drive ring The upper end surface is fixedly connected to a limiting plate, and a limiting groove is provided on the side where the two limiting plates are close to each other, and the inner wall of the limiting groove abuts the surface of the wafer body. The surface of the substrate is fixedly connected to a mounting frame, and the upper inner wall of the mounting frame is fixedly connected to a sliding rod, and the cross-section of the sliding rod is in the shape of a straight line, and a movable ring is slid through both ends of the arc surface of the sliding rod, and a blocking rod is fixedly connected to the lower surface of the movable ring, and the cross-section of the blocking rod is in the shape of an "L", and the ends of the two blocking rods close to each other abut against the side wall of the wafer body, and a scale plate is fixedly connected to the surface of the mounting frame.

[0007] The effect achieved by the above components is: in the process of processing and producing semiconductor wafers, in order to detect the wafer body and ensure the accuracy of the outer diameter of the wafer body, the limiting mechanism can be used for auxiliary operation to locate the position of the wafer body, and then the sliding baffle at the upper end of the mounting frame can be used to perform extrusion detection operations on the outer diameter arc surface of the wafer body.

[0008] Preferably, a sliding groove is provided on the lower surface of the limiting plate, and the inner wall of the sliding groove is slidably connected to the surface of the fixing frame.

[0009] The effect achieved by the above components is that when the position of the limit plate is moved, the slide groove provided on the lower surface of the limit plate can be used for guidance and protection to avoid position deviation.

[0010] Preferably, the arc surfaces at both ends of the sliding rod are covered with springs, and the two ends of the spring are respectively fixedly connected to the inner wall of the mounting frame and the surface of the movable ring. The upper arc surface of the movable ring is threaded with an extrusion shaft, and one end of the extrusion shaft is in contact with the arc surface of the sliding rod.

[0011] The effect achieved by the above components is: during the movement and adjustment of the position of the barrier rod, the extrusion force generated by the spring on the surface of the slide rod can be used for auxiliary limiting. At the same time, when placing the wafer body, it is squeezed and fixed with the help of the extrusion shaft at the upper end of the moving ring.

[0012] Preferably, a movable frame is fixedly connected to the position of the baffle plate on the surface of the blocking rod, and a designated block is fixedly connected to the inner wall of the movable frame. The cross section of the designated block is in a pointed cone shape.

[0013] The effect achieved by the above components is that during the movement of the blocking rod, the scale plate can be visually observed and detected with the help of the moving frame and the designated block.

[0014] Preferably, a bearing mechanism is provided on the upper surface of the support plate, and the bearing mechanism includes a bearing frame, the lower surface of the bearing frame is in contact with the surface of the support plate, and the two side surfaces of the bearing frame are fixedly connected with connecting plates, and the cross-section of the connecting plate is "L"-shaped, and the position of the side wall of the frame corresponding to the connecting plate is fixedly connected with a connecting block, and the cross-section of the connecting block is "U"-shaped, and the inner wall of the connecting block is plugged into the surface of the connecting plate, and the connecting block and the surface of the connecting plate slide through the same positioning rod, and the arc surface of the positioning rod is sleeved with a tension spring, and the two ends of the tension spring are respectively fixedly connected to the positioning rod and the connecting block.

[0015] The effect achieved by the above components is: when the outer diameter of a large number of wafer bodies is detected, the wafer bodies can be collected and protected with the help of a carrying mechanism. The carrying frame is placed on the surface of the support plate, and then the connecting plates fixed on both sides of the carrying frame are plugged and fixed with the connecting blocks on the side wall surface of the rack, so that the position of the entire carrying frame can be effectively and conveniently limited and protected.

[0016] Preferably, a plurality of card frames are fixedly connected to both sides of the inner wall of the carrier frame, the cross section of the card frame is "U"-shaped, and the inner wall size of the card frame is adapted to the cross-sectional size of the wafer body.

[0017] The effect achieved by the above components is: with the help of the card frame fixed on the inner wall of the carrier frame, the wafer body can be inserted and limited, avoiding more wafer bodies from being squeezed, bumped and damaged.

[0018] Preferably, guide plates are fixedly connected to the surface of the support plate at positions corresponding to both sides of the carrying frame, the cross section of the guide plates is "L"-shaped, and the inner wall of the guide plates abuts against the surface of the carrying frame.

[0019] The effect achieved by the above components is that when the carrying frame and the support plate are brought into contact, auxiliary positioning and protection can be performed with the help of the guide plate on the surface of the support plate.

[0020] Compared with related technologies, the semiconductor wafer outer diameter detection device provided by the present invention has the following beneficial effects:

[0021] The utility model provides a semiconductor wafer outer diameter detection device, which achieves the purpose of squeezing and fixing the position of the wafer body by operating a limit mechanism, and at the same time, with the help of a movable ring sliding on the surface of the mounting frame and a blocking rod, the blocking rod is matched with a scale plate on the surface of the mounting frame, so that the outer diameter of the wafer body can be detected conveniently.

[0022] By operating the carrying mechanism, the wafer body is placed and carried. At the same time, the connecting plates fixed on both sides of the carrying frame are plugged into the connecting blocks on the side walls of the rack, and then the positioning rods are used for plugging and fixing. At this time, the entire carrying frame can be easily and quickly abutted and limited with the support plate, which is convenient for collecting and carrying the wafer body. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic structural diagram of a semiconductor wafer outer diameter detection device provided by the utility model;

[0024] Figure 2 for Figure 1 A schematic diagram of a partial structure of the three-dimensional structure shown;

[0025] Figure 3 for Figure 3 The structural diagram of the limiting mechanism shown;

[0026] Figure 4 for Figure 2 The enlarged structural diagram of point A is shown;

[0027] Figure 5 for Figure 1 The structural diagram of the carrying mechanism shown;

[0028] Figure 6 for Figure 5 The structural diagram of the supporting mechanism is shown.

[0029] Numbers in the figure: 1. Frame; 2. Base plate; 3. Support plate; 4. Limiting mechanism; 401. Fixed frame; 402. Drive shaft; 403. Limiting plate; 404. Drive ring; 405. Slide groove; 406. Limiting groove; 407. Mounting frame; 408. Slide rod; 409. Spring; 410. Moving ring; 411. Extrusion shaft; 412. Scale plate; 413. Stop rod; 414. Moving frame; 415. Designated block; 5. Carrying mechanism; 51. Carrying frame; 52. Card frame; 53. Connecting plate; 54. Positioning rod; 55. Tension spring; 56. Connecting block; 57. Guide plate; 6. Wafer body. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0031] The specific implementation of the present invention is described in detail below with reference to specific embodiments.

[0032] See also Figures 1 to 6A semiconductor wafer outer diameter detection device provided by an embodiment of the present invention includes: a frame 1, a substrate 2 is fixedly connected to the upper end surface of the frame 1, a support plate 3 is installed on one side of the frame 1, a wafer body 6 is provided on the upper surface of the substrate 2, a limiting mechanism 4 is installed on the upper surface of the substrate 2, and a bearing mechanism 5 is provided on the upper surface of the support plate 3.

[0033] In the embodiments of the present invention, please refer to Figure 3 and Figure 4 The limiting mechanism 4 includes two fixed frames 401, which are located at both ends of the surface of the substrate 2. The lower surface of the fixed frame 401 is fixedly connected to the surface of the substrate 2. The inner wall of the fixed frame 401 is rotatably connected to the driving shaft 402, and the arc surface of the driving shaft 402 is threadedly connected to the driving ring 404. The upper end surface of the driving ring 404 is fixedly connected to the limiting plate 403. A limiting groove 406 is provided on the side where the two limiting plates 403 are close to each other. The inner wall of the limiting groove 406 abuts against the surface of the wafer body 6. The surface of the substrate 2 is fixedly connected to the mounting frame 407, and the inner wall of the upper end of the mounting frame 407 is fixedly connected to a sliding rod 408. The cross-section of the sliding rod 408 is in the shape of a straight line. Both ends of the arc surface of the sliding rod 408 are slidably penetrated by a moving ring 410. The lower surface of the moving ring 410 is fixedly connected to a blocking rod 413. The cross section of the rod 413 is "L"-shaped, and the ends of the two blocking rods 413 close to each other abut against the side wall of the wafer body 6. The surface of the mounting frame 407 is fixedly connected to the scale plate 412, and the lower surface of the limit plate 403 is provided with a slide groove 405. The inner wall of the slide groove 405 is slidably connected to the surface of the fixed frame 401. The arc surfaces at both ends of the slide rod 408 are covered with springs 409. The two ends of the spring 409 are respectively fixedly connected to the inner wall of the mounting frame 407 and the surface of the moving ring 410. The upper end arc surface of the moving ring 410 is threaded with an extrusion shaft 411, and one end of the extrusion shaft 411 abuts against the arc surface of the slide rod 408. The position of the blocking rod 413 surface corresponding to the scale plate 412 is fixedly connected to the moving frame 414, and the inner wall of the moving frame 414 is fixedly connected to the designated block 415. The cross section of the designated block 415 is conical.

[0034] In the embodiments of the present invention, please refer to Figure 5 and Figure 6The carrying mechanism 5 includes a carrying frame 51. The lower surface of the carrying frame 51 abuts against the surface of the support plate 3. The two side surfaces of the carrying frame 51 are fixedly connected with connecting plates 53. The cross section of the connecting plate 53 is "L" shaped. The side wall of the frame 1 is fixedly connected with a connecting block 56 corresponding to the position of the connecting plate 53. The cross section of the connecting block 56 is "U" shaped. The inner wall of the connecting block 56 is plugged into the surface of the connecting plate 53. The connecting block 56 and the surface of the connecting plate 53 slide through the same positioning rod 54. The positioning rod 5 4 is covered with a tension spring 55, and the two ends of the tension spring 55 are fixedly connected to the positioning rod 54 and the connecting block 56 respectively. A number of card frames 52 are fixedly connected to both sides of the inner wall of the carrier frame 51. The cross section of the card frame 52 is "U"-shaped, and the inner wall size of the card frame 52 is adapted to the cross-sectional size of the wafer body 6. The surface of the support plate 3 is fixedly connected to the position corresponding to the two sides of the carrier frame 51 with a guide plate 57. The cross section of the guide plate 57 is "L"-shaped, and the inner wall of the guide plate 57 abuts against the surface of the carrier frame 51;

[0035] The working principle of a semiconductor wafer outer diameter detection device provided by the present invention is as follows: in the process of detecting the outer diameter of the semiconductor wafer, the wafer body 6 is first placed in the limiting groove 406 opened on the surface of the limiting plate 403, and the driving shaft 402 on the inner wall of the fixed frame 401 on the surface of the substrate 2 is rotated to allow the driving ring 404 threadedly connected to the arc surface of the driving shaft 402 to slide, thereby driving the limiting plate 403 at the upper end of the driving ring 404 to move its position. At this time, the limiting plate 403 will squeeze and limit the wafer body 6, and the moving ring 410 sliding on the arc surface of the sliding rod 408 on the inner wall of the upper end of the mounting frame 407 and the blocking rod 413 are moved, so that the bottom end of the blocking rod 413 is in contact with the arc surface of the side wall of the wafer body 6, and then the outer diameter of the wafer body 6 is observed with the help of the scale on the surface of the mounting frame 407, which is convenient for use in the detection operation.

[0036] During the process of detecting the outer diameter of the wafer body 6, in order to facilitate the placement and collection of the wafer body 6, the carrier frame 51 can be used for auxiliary support. First, the carrier frame 51 is placed on the surface of the support plate 3, and the guide plates 57 on both sides of the surface of the support plate 3 limit the carrier frame 51. Then, the connecting plates 53 fixed on both sides of the carrier frame 51 are plugged into the connecting blocks 56 on the side walls of the frame 1, and at the same time, the positioning rod 54 is pulled to limit the positioning rod 54 with the extrusion force generated by the tension spring 55. At this time, the entire connecting plate 53 and the connecting block 56 will be fixed, and the carrier frame 51 cannot be offset. Then, the wafer body 6 is plugged in and protected with the help of the card frame 52 in the carrier frame 51.

[0037] The circuits and controls involved in the present invention are all prior art and will not be described in detail here.

[0038] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A semiconductor wafer outer diameter detection device, characterized in that: include: A frame (1), the upper end surface of the frame (1) is fixedly connected to a substrate (2), a support plate (3) is installed on one side of the frame (1), a wafer body (6) is provided on the upper surface of the substrate (2), a limiting mechanism (4) is installed on the upper surface of the substrate (2), the limiting mechanism (4) comprises two fixed frames (401), the two fixed frames (401) are located at both ends of the surface of the substrate (2), the lower surface of the fixed frame (401) is fixedly connected to the surface of the substrate (2), the inner wall of the fixed frame (401) is rotatably connected to a driving shaft (402), the arc surface of the driving shaft (402) is threadedly connected to a driving ring (404), the upper end surface of the driving ring (404) is fixedly connected to a limiting plate (403), the two limiting frames (401) are located at both ends of the surface of the substrate (2), the lower surface of the fixed frame (401) is fixedly connected to the surface of the substrate (2), the inner wall of the fixed frame (401) is rotatably connected to the driving shaft (402), the arc surface of the driving shaft (402) is threadedly connected to the driving ring (404), the upper end surface of the driving ring (404) is fixedly connected to the limiting plate (403), and the two limiting frames (401) are fixedly connected to the upper surface of the driving ring (404). A limiting groove (406) is provided on one side of the positioning plates (403) close to each other, and the inner wall of the limiting groove (406) abuts against the surface of the wafer body (6). The surface of the substrate (2) is fixedly connected with a mounting frame (407), and the inner wall of the upper end of the mounting frame (407) is fixedly connected with a slide bar (408), and the cross section of the slide bar (408) is in the shape of a straight line. Both ends of the arc surface of the slide bar (408) are slidably penetrated by a moving ring (410), and the lower surface of the moving ring (410) is fixedly connected with a blocking rod (413), and the cross section of the blocking rod (413) is in the shape of an "L". The ends of the two blocking rods (413) close to each other abut against the side wall of the wafer body (6), and the surface of the mounting frame (407) is fixedly connected with a scale plate (412).

2. The semiconductor wafer outer diameter detection device according to claim 1, characterized in that: A sliding groove (405) is provided on the lower surface of the limiting plate (403), and the inner wall of the sliding groove (405) is slidably connected to the surface of the fixing frame (401).

3. The semiconductor wafer outer diameter detection device according to claim 1, characterized in that: The arc surfaces at both ends of the slide rod (408) are both covered with springs (409), and the two ends of the spring (409) are fixedly connected to the inner wall of the installation frame (407) and the surface of the moving ring (410) respectively. The upper arc surface of the moving ring (410) is threaded with an extrusion shaft (411), and one end of the extrusion shaft (411) is in contact with the arc surface of the slide rod (408).

4. The semiconductor wafer outer diameter detection device according to claim 1, characterized in that: A movable frame (414) is fixedly connected to the surface of the blocking rod (413) at a position corresponding to the scale plate (412), and a designated block (415) is fixedly connected to the inner wall of the movable frame (414). The cross section of the designated block (415) is in a pointed cone shape.

5. The semiconductor wafer outer diameter detection device according to claim 1, characterized in that: The upper surface of the support plate (3) is provided with a bearing mechanism (5), and the bearing mechanism (5) includes a bearing frame (51). The lower surface of the bearing frame (51) is in contact with the surface of the support plate (3). The two side surfaces of the bearing frame (51) are fixedly connected with connecting plates (53), and the cross section of the connecting plate (53) is "L"-shaped. The side wall of the frame (1) is fixedly connected with a connecting block (56) at a position corresponding to the connecting plate (53). The cross section of the connecting block (56) is "U"-shaped. The inner wall of the connecting block (56) is plugged into the surface of the connecting plate (53). The connecting block (56) and the surface of the connecting plate (53) are slidably penetrated by the same positioning rod (54). The arc surface of the positioning rod (54) is covered with a tension spring (55), and the two ends of the tension spring (55) are respectively fixedly connected to the positioning rod (54) and the connecting block (56).

6. The semiconductor wafer outer diameter detection device according to claim 5, characterized in that: A plurality of card frames (52) are fixedly connected to both sides of the inner wall of the carrier frame (51), the cross section of the card frame (52) is "U"-shaped, and the inner wall size of the card frame (52) is compatible with the cross-sectional size of the wafer body (6).

7. The semiconductor wafer outer diameter detection device according to claim 5, characterized in that: The surface of the support plate (3) is fixedly connected to positions on both sides of the bearing frame (51), and the cross section of the guide plate (57) is L-shaped, and the inner wall of the guide plate (57) abuts against the surface of the bearing frame (51).

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