Device for high and low temperature experiment of test equipment

Abstract

The utility model discloses a device for high and low temperature experiments of test equipment, which relates to the technical field of high and low temperature experiments and comprises a thermal insulation frame and a storage assembly. A PLC is installed on the front side of the thermal insulation frame, a refrigeration assembly is installed on the upper side of the thermal insulation frame, a heating assembly is installed on the lower side of the thermal insulation frame, and a sealing assembly is installed in the thermal insulation frame; the storage assembly comprises a rotating plate, a thermal insulation column, a placement block, a blocking cover and a first motor, the rotating plate is rotationally connected to the interior of the thermal insulation frame, the thermal insulation column is fixed to the upper end of the rotating plate, a groove is formed in the upper end of the thermal insulation column, the placement block is fixed to the interior of the groove, and the blocking cover is in threaded connection to the upper end of the circumferential surface of the thermal insulation column. A first motor is installed on the front side of the thermal insulation frame, an output shaft of the first motor is fixed to the front side of the rotating plate, experiment energy consumption can be reduced, and meanwhile the temperature of a sample can be rapidly switched.

Description

Technical Field

[0001] The utility model relates to the technical field of high and low temperature experiments, in particular to a device for high and low temperature experiments of testing equipment. Background Art

[0002] The performance of electronic devices varies at different temperatures. Therefore, high and low temperature tests are required to simulate their performance in different ambient temperatures to verify their stability under environmental changes, that is, whether they can continue to work and maintain their performance at a certain operating temperature.

[0003] Existing high and low temperature experimental devices have heating and cooling in the same space, which will greatly increase energy loss. It also takes longer to change the temperature when heating or cooling, which will reduce experimental efficiency. In addition, it is impossible to quickly switch the temperature of the sample and cannot test the performance changes of electronic equipment when the temperature drops suddenly. To this end, we propose a device for testing high and low temperature experiments of equipment. Utility Model Content

[0004] The technical problem to be solved by the present invention is to overcome the existing defects and provide a device for high and low temperature experiments of testing equipment, which can reduce experimental energy consumption and can quickly switch the temperature of the sample, and can effectively solve the problems in the background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a device for testing high and low temperature experiments of equipment, comprising a temperature insulation frame and a storage assembly;

[0006] Insulation frame: A PLC controller is installed on the front side, a refrigeration component is installed on the upper side of the insulation frame, a heating component is installed on the lower side of the insulation frame, and a sealing component is installed inside the insulation frame;

[0007] Storage assembly: includes a rotating plate, an insulation column, a placement block, a blocking cover and a first motor. The insulation frame is rotatably connected to the rotating plate inside, the insulation column is fixed to the upper end of the rotating plate, the insulation column has a groove at the upper end, the placement block is fixed inside the groove, the upper end of the circumferential surface of the insulation column is threadedly connected to the blocking cover, the front side of the insulation frame is installed, the output shaft of the first motor is fixed to the front side of the rotating plate, and the storage assembly is provided to store electronic equipment;

[0008] Wherein: the input end of the PLC controller is electrically connected to the output end of the external power supply, and the output end of the PLC controller is electrically connected to the input end of the first motor.

[0009] Furthermore, the sealing assembly includes a storage tank, a moving block, a sealing strip, a bidirectional screw and a second motor. Two corresponding storage tanks are opened on the left and right sides of the interior of the thermal insulation frame wall, and two corresponding strip openings are opened on the left and right sides of the interior of the thermal insulation frame. The interior of the strip opening is slidably connected with a sealing strip, and two corresponding strip grooves are opened on the left and right sides of the rotating plate. The sealing strip is clamped in the interior of the strip groove, and a moving block is fixed on the rear side of the sealing strip. A threaded hole is opened in the middle of the moving block, and the threads of the two threaded holes are opposite. The internal threads of the two threaded holes are connected with a bidirectional screw, and a rotating hole is opened on the rear side of the thermal insulation frame. The bidirectional screw is rotatably connected to the inside of the rotating hole. A second motor is installed on the left side of the thermal insulation frame, and the output shaft of the second motor is fixed to the left end of the bidirectional screw. The input end of the second motor is electrically connected to the output end of the PLC controller. The gap between the rotating plate and the thermal insulation frame is sealed by setting a sealing assembly.

[0010] Furthermore, the refrigeration assembly includes a protective frame, a first temperature sensor, a semiconductor refrigeration plate and a sealing cover. The protective frame is fixed on the upper side of the insulation frame. Two corresponding installation grooves are opened on the left and right sides of the protective frame. The semiconductor refrigeration plate is installed inside the installation groove. The heat dissipation end of the semiconductor refrigeration plate is located outside the installation groove, and the cooling end of the semiconductor refrigeration plate is located inside the installation groove. The first temperature sensor is installed inside the protective frame. The sealing cover is buckled on the upper side of the protective frame. The first temperature sensor is electrically connected to the PLC controller in both directions. The input end of the semiconductor refrigeration plate is electrically connected to the output end of the PLC controller. The interior of the protective frame is cooled by setting the refrigeration assembly.

[0011] Furthermore, the heating assembly includes a fixed box, a second temperature sensor and an electric heating tube. The fixed box is fixed on the lower side of the insulation frame. The second temperature sensor and two corresponding electric heating tubes are installed inside the fixed box. The input end of the electric heating tube is electrically connected to the output end of the PLC controller. The second temperature sensor is electrically connected to the PLC controller in both directions. The interior of the fixed box is heated by setting up the heating assembly.

[0012] Furthermore, an annular groove is opened inside the rotating plate, and an insulating ring is fixed inside the annular groove. The insulating ring is fixed on the circumferential surface of the insulating column. The temperature conduction speed of the rotating plate is reduced by providing the insulating ring.

[0013] Compared with the prior art, the beneficial effects of the present invention are: the device for testing high and low temperature experiments of equipment has the following advantages:

[0014] By setting up semiconductor refrigeration sheets to cool the inside of the protective frame, and by setting up electric heating tubes to heat the inside of the fixed box, the fixed box and the protective frame can simulate high and low temperatures respectively. In this case, during the experiment, high and low temperature experiments can be carried out by simply adjusting the position of the electronic equipment stored on the placement block by controlling the rotation of the rotating plate. This not only reduces the energy consumption of the experiment, but also can quickly switch the temperature of the sample, so that the performance changes of the electronic equipment when the temperature drops suddenly can be tested. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the front structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the storage component structure of the utility model;

[0017] Figure 3 This is a schematic diagram of the sealing component structure of the utility model;

[0018] Figure 4 It is a front sectional view of the utility model.

[0019] In the figure: 1 insulation frame, 2 storage assembly, 21 rotating plate, 22 insulation column, 23 placement block, 24 blocking cover, 25 first motor, 3 sealing assembly, 31 storage tank, 32 moving block, 33 sealing strip, 34 bidirectional screw, 35 second motor, 4 refrigeration assembly, 41 protection frame, 42 first temperature sensor, 43 semiconductor refrigeration plate, 44 sealing cover, 5 heating assembly, 51 fixed box, 52 second temperature sensor, 53 electric heating pipe, 6 insulation ring, 7 PLC controller. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] See also Figure 1-4 ,This embodiment provides a technical solution: a device for testing high and low temperature experiments of equipment, comprising a temperature insulation frame 1 and a storage assembly 2;

[0022] Insulation frame 1: A PLC controller 7 is installed on the front side, a refrigeration component 4 is installed on the upper side of the insulation frame 1, a heating component 5 is installed on the lower side of the insulation frame 1, and a sealing component 3 is installed inside the insulation frame 1. The sealing component 3 includes a storage tank 31, a moving block 32, a sealing strip 33, a bidirectional screw 34 and a second motor 35. Two corresponding storage tanks 31 are opened on the left and right sides of the interior of the insulation frame 1 wall, two corresponding strip openings are opened on the left and right sides of the interior of the insulation frame 1, and the interior of the strip opening is slidably connected with a sealing strip 33. Two corresponding strip grooves are opened on the left and right sides of the rotating plate 21, and the sealing The strip 33 is clamped in the interior of the strip groove, and a moving block 32 is fixed on the rear side of the sealing strip 33. A threaded hole is provided in the middle of the moving block 32. The threads of the two threaded holes are opposite to each other. The internal threads of the two threaded holes are connected with a bidirectional screw 34. A rotating hole is provided on the rear side of the insulation frame 1. The bidirectional screw 34 is rotatably connected to the inside of the rotating hole. A second motor 35 is installed on the left side of the insulation frame 1. The output shaft of the second motor 35 is fixed to the left end of the bidirectional screw 34. The input end of the second motor 35 is electrically connected to the output end of the PLC controller 7. The refrigeration component 4 includes a protective frame 41, a first temperature sensor 42, and a semiconductor Refrigeration plate 43 and sealing cover 44, a protective frame 41 is fixed on the upper side of the insulation frame 1, and two corresponding mounting grooves are provided on the left and right sides of the protective frame 41. A semiconductor refrigeration plate 43 is installed inside the mounting groove. The heat dissipation end of the semiconductor refrigeration plate 43 is located outside the mounting groove, and the cooling end of the semiconductor refrigeration plate 43 is located inside the mounting groove. A first temperature sensor 42 is installed inside the protective frame 41, and a sealing cover 44 is buckled on the upper side of the protective frame 41. The first temperature sensor 42 is bidirectionally electrically connected to the PLC controller 7, and the input end of the semiconductor refrigeration plate 43 is electrically connected to the output end of the PLC controller 7. The heating assembly 5 includes a fixed box 51, a second temperature sensor 52, and an electric heating pipe 53. The fixed box 51 is fixed to the lower side of the insulation frame 1. The second temperature sensor 52 and two corresponding electric heating pipes 53 are installed inside the fixed box 51. The input end of the electric heating pipe 53 is electrically connected to the output end of the PLC controller 7. The second temperature sensor 52 is bidirectionally electrically connected to the PLC controller 7. The interior of the fixed box 51 is heated by the heating assembly 5, the interior of the protective frame 41 is cooled by the cooling assembly 4, and the gap between the rotating plate 21 and the insulation frame 1 is sealed by the sealing assembly 3.

[0023] Storage assembly 2: includes a rotating plate 21, an insulation column 22, a placement block 23, a blocking cover 24 and a first motor 25. The insulation frame 1 is internally rotatably connected to the rotating plate 21. The upper end of the rotating plate 21 is fixed to the insulation column 22. The upper end of the insulation column 22 is provided with a groove. The placement block 23 is fixed inside the groove. The upper end of the circumferential surface of the insulation column 22 is threadedly connected to the blocking cover 24. The front side of the insulation frame 1 is installed with the first motor 25. The output shaft of the first motor 25 is fixed to the front side of the rotating plate 21. The storage assembly 2 is provided to store electronic equipment;

[0024] The input end of the PLC controller 7 is electrically connected to the output end of the external power supply, and the output end of the PLC controller 7 is electrically connected to the input end of the first motor 25 .

[0025] Among them, an annular groove is opened inside the rotating plate 21, and an insulating ring 6 is fixed inside the annular groove. The insulating ring 6 is fixed on the circumferential surface of the insulating column 22. The temperature conduction speed of the rotating plate 21 is reduced by providing the insulating ring 6.

[0026] The working principle of the device for testing high and low temperature experiments of equipment provided by the present invention is as follows: when in use, the electronic device is placed on the top of the placement table 23, and then the blocking cover 24 is rotated to fix the electronic device on the top of the placement block 23, and the sealing cover 44 is covered after fixing, and then the semiconductor refrigeration piece 43 is started to cool the inside of the protection frame 41, and then the electric heating tube 53 is started to heat the inside of the fixed box 51. During the cooling and heating process, the first temperature sensor 42 and the second temperature sensor 52 are continuously used to measure the temperature inside the corresponding protection frame 41 and the fixed box 51, so that the fixed box 51 and the protection frame 41 simulate high temperature and low temperature respectively. During the experiment, high and low temperature experiments can be carried out by adjusting the position of the electronic equipment stored on the placement block 23 only by controlling the rotation of the rotating plate 21. This not only reduces the energy consumption of the experiment, but also can quickly switch the temperature of the sample, so that the performance changes of the electronic equipment when the temperature drops suddenly can be tested. During the test, the second motor 35 can be started to rotate the bidirectional screw 34. The rotation of the bidirectional screw 34 drives the two moving blocks 32 to move. The movement of the two moving blocks 32 drives the two sealing strips 33 to move into the two strip grooves opened on the left and right sides of the rotating plate 21. In this case, the gap between the rotating plate 21 and the insulation frame 1 can be sealed, and after sealing, the stability during the experiment can be improved.

[0027] It is worth noting that the PLC controller 7 disclosed in the above embodiment is specifically a Siemens S7-200 model, the first motor 25 and the second motor 35, the semiconductor refrigeration plate 43 can choose a C1204 multi-stage semiconductor refrigeration plate, the electric heating tube 53 can choose a 19*205-K electric heating tube, the first temperature sensor 42 and the second temperature sensor 52 can choose LSCI-TZ03 laser focusing infrared temperature sensor, which can be freely configured according to the actual application scenario, and the control switch group controls the operation of the first motor 25, the second motor 35, the semiconductor refrigeration plate 43 and the electric heating tube 53 using the method commonly used in the prior art.

[0028] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A device for testing high and low temperature equipment, characterized by: It comprises a thermal insulation frame (1) and a storage component (2); Insulation frame (1): a PLC controller (7) is installed on the front side, a refrigeration component (4) is installed on the upper side of the insulation frame (1), a heating component (5) is installed on the lower side of the insulation frame (1), and a sealing component (3) is installed inside the insulation frame (1); The storage assembly (2) comprises a rotating plate (21), a heat-insulating column (22), a placement block (23), a blocking cover (24) and a first motor (25); the interior of the heat-insulating frame (1) is rotatably connected to the rotating plate (21); the upper end of the rotating plate (21) is fixed with the heat-insulating column (22); the upper end of the heat-insulating column (22) is provided with a groove; the placement block (23) is fixed inside the groove; the upper end of the circumferential surface of the heat-insulating column (22) is threadedly connected to the blocking cover (24); the front side of the heat-insulating frame (1) is installed with the first motor (25); the output shaft of the first motor (25) is fixed to the front side of the rotating plate (21); Wherein: the input end of the PLC controller (7) is electrically connected to the output end of the external power supply, and the output end of the PLC controller (7) is electrically connected to the input end of the first motor (25).

2. The device for high and low temperature testing of a test device according to claim 1, characterized in that: The sealing assembly (3) comprises a storage tank (31), a moving block (32), a sealing strip (33), a bidirectional screw (34) and a second motor (35); two corresponding storage tanks (31) are provided on the left and right sides of the interior of the frame wall of the thermal insulation frame (1); two corresponding strip openings are provided on the left and right sides of the interior of the thermal insulation frame (1); the interior of the strip opening is slidably connected with a sealing strip (33); two corresponding strip grooves are provided on the left and right sides of the rotating plate (21); the sealing strip (33) is clamped in the interior of the strip groove; the sealing strip (33) ) is fixed on the rear side of the heat insulation frame (1), a moving block (32) is provided in the middle of the moving block (32), the threads of the two threaded holes are opposite to each other, and the internal threads of the two threaded holes are connected to a bidirectional screw (34), a rotating hole is provided on the rear side edge of the heat insulation frame (1), and the bidirectional screw (34) is rotatably connected to the inside of the rotating hole, and a second motor (35) is installed on the left side of the heat insulation frame (1), the output shaft of the second motor (35) is fixed to the left end of the bidirectional screw (34), and the input end of the second motor (35) is electrically connected to the output end of the PLC controller (7).

3. The device for high and low temperature testing of a test device according to claim 1, characterized in that: The refrigeration assembly (4) comprises a protective frame (41), a first temperature sensor (42), a semiconductor refrigeration plate (43) and a sealing cover (44); the protective frame (41) is fixed on the upper side of the insulation frame (1); two corresponding mounting grooves are provided on the left and right sides of the protective frame (41); a semiconductor refrigeration plate (43) is installed inside the mounting groove; the heat dissipation end of the semiconductor refrigeration plate (43) is located outside the mounting groove, and the cooling end of the semiconductor refrigeration plate (43) is located inside the mounting groove; the first temperature sensor (42) is installed inside the protective frame (41); the sealing cover (44) is buckled on the upper side of the protective frame (41); the first temperature sensor (42) is bidirectionally electrically connected to the PLC controller (7); the input end of the semiconductor refrigeration plate (43) is electrically connected to the output end of the PLC controller (7).

4. The device for high and low temperature testing of a test device according to claim 1, characterized in that: The heating assembly (5) comprises a fixed box (51), a second temperature sensor (52) and an electric heating pipe (53); the fixed box (51) is fixed to the lower side of the thermal insulation frame (1); the second temperature sensor (52) and two corresponding electric heating pipes (53) are installed inside the fixed box (51); the input end of the electric heating pipe (53) is electrically connected to the output end of the PLC controller (7); and the second temperature sensor (52) is bidirectionally electrically connected to the PLC controller (7).

5. The device for high and low temperature testing of a test device according to claim 1, characterized in that: An annular groove is provided inside the rotating plate (21), an insulating ring (6) is fixed inside the annular groove, and the insulating ring (6) is fixed on the circumferential surface of the insulating column (22).

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