Test device and test system
Through the cooperation of the power control module and the distance sensing module, the power supply of the test module is automatically controlled, which solves the problem of high-voltage surge in the PCBA board testing of portable electronic products, improves test efficiency and yield, and reduces costs.
Patent Information
- Application Number
- CN202422394504.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-10-03
- Estimated Expiration
- 2034-09-29
AI Technical Summary
During the existing PCBA board testing process for portable electronic products, a high-voltage surge may be generated when the test fixture is pressed down, causing parts to burn out, affecting test efficiency and yield. At the same time, existing solutions are complex and costly.
The power control module and distance sensing module are used to automatically control the power supply of the test module by sensing the distance changes between the test module and the work surface. Power is only supplied during testing to avoid the risk of high-voltage pulses.
It improves the test yield, saves labor and production costs, simplifies structural maintenance, and avoids high-voltage surge problems.
Smart Images
Figure CN223413421U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of testing technology, and in particular to a testing device and a testing system. Background Art
[0002] With the rapid development of portable electronic products such as mobile phones, tablets, and e-books, people have put forward higher requirements on product quality. Manufacturers need to conduct more comprehensive testing on products during production to ensure product quality.
[0003] Currently, during the PCBA (Printed Circuit Board Assembly) motherboard testing process of some portable electronic products, some test fixtures are always powered. After the PCBA is placed in the fixture, the power probe contacts the PCBA when the test fixture is pressed down, which may cause a high-voltage surge. For the PCBA, the instantaneous high-voltage surge may cause parts to burn out, greatly reducing test efficiency and increasing the test failure rate.
[0004] In order to solve the above technical problems in the existing technology, the height of the grounding probe is generally increased. When the test fixture is pressed down, the grounding probe contacts the PCBA board before the test probe. However, this design is prone to sinking after repeated use of the grounding probe test. It will also oxidize, and damage is difficult to detect, requiring frequent replacement and maintenance. Moreover, a damaged probe may burn the motherboard, affecting test efficiency and increasing the defect rate.
[0005] In order to solve the above technical problems, the existing technology also has a pressing structure set on the workbench. Through the pressing structure and the trigger circuit coordinated therewith, when testing is required, the pressing structure is manually pressed to trigger the circuit to give a power supply signal, thereby controlling whether to power the test probe; however, this design requires manual operation and needs to be coordinated with a complex trigger circuit structure, which greatly increases labor costs and production costs. Utility Model Content
[0006] Based on this, it is necessary to provide a test device and test system to address the above technical problems, which can not only solve the risk of high-voltage pulses generated when the test fixture is pressed down at the moment of testing, increase the test yield, but also save labor costs and production costs.
[0007] In a first aspect, an embodiment of the present application provides a testing device, comprising a power control module, a testing module, and a distance sensing module;
[0008] The power control module includes a power supply output terminal and an induction signal receiving terminal, and the power supply output terminal is electrically connected to the power input terminal of the test module;
[0009] The distance sensing module includes a sensing signal feedback terminal, which is electrically connected to the sensing signal receiving terminal of the power control module;
[0010] The testing device includes a work surface, a distance sensing module is fixedly mounted on the work surface, and the testing module is located on a side of the distance sensing module away from the work surface;
[0011] In a direction perpendicular to the work surface, the test module approaches the work surface, the sensing signal feedback end of the distance sensing module is a first sensing signal, the sensing signal receiving end of the power control module receives the first sensing signal, and the power output end of the power control module supplies power to the power input end of the test module;
[0012] In a direction perpendicular to the work surface, the test module moves away from the work surface, the sensing signal feedback end of the distance sensing module is a second sensing signal, the sensing signal receiving end of the power control module receives the second sensing signal, and the power supply output end of the power control module stops supplying power to the power input end of the test module.
[0013] In some optional embodiments, the distance sensing module includes a distance sensor, and the distance sensor includes at least a sensing signal feedback terminal, an IO port voltage terminal, and a system voltage terminal.
[0014] In some optional embodiments, the distance sensing module further includes a signal quality detection unit;
[0015] One end of the signal quality detection unit is electrically connected to the power control module, and the other end of the signal quality detection unit is electrically connected to the IO port voltage end.
[0016] In some optional embodiments, the signal quality detection unit includes a first resistor and a second resistor, wherein a first end of the first resistor is electrically connected to the power control module, a second end of the first resistor is electrically connected to a first end of the second resistor, and a second end of the second resistor is electrically connected to a voltage terminal of the IO port;
[0017] The first resistor and the second resistor are both zero-ohm resistors.
[0018] In some optional embodiments, the distance sensing module further includes a filtering unit;
[0019] The filtering unit includes a first capacitor, a second capacitor, and a third capacitor; the first electrode of the first capacitor is electrically connected to the second end of the second resistor, the first electrode of the second capacitor is electrically connected to the system voltage end of the distance sensor; the first electrode of the third capacitor is electrically connected to the interrupt signal end of the distance sensor;
[0020] The second electrode of the first capacitor, the second electrode of the second capacitor, and the second electrode of the third capacitor are all grounded.
[0021] In some optional embodiments, the test module includes a test probe.
[0022] In some optional embodiments, the power control module includes a plurality of power output terminals, and the test module includes a plurality of power input terminals; each power output terminal is electrically connected to each power input terminal in a one-to-one correspondence.
[0023] In some optional embodiments, the power control module includes a plurality of power supply units and a plurality of switch units;
[0024] The output end of each power supply unit is electrically connected to the input end of each switch unit in a one-to-one correspondence, the output end of each switch unit is electrically connected to each power supply output end in a one-to-one correspondence, and the control end of each switch unit is electrically connected to the induction signal receiving end.
[0025] In a second aspect, the present application further provides a testing system, which includes the testing device described in the first aspect.
[0026] In some optional embodiments, the test system further includes a host device, and the host device is electrically connected to the power control module of the test apparatus via a serial interface.
[0027] The technical solution provided by the embodiments of the present application has the following advantages compared with the prior art:
[0028] The test device provided in the embodiment of the present application includes a power control module, a test module and a distance sensing module; the sensing signal feedback end of the distance sensing module is electrically connected to the sensing signal receiving end of the power control module, and the power supply output end of the power control module is electrically connected to the power input end of the test module; the test device includes a work surface, the distance sensing module is fixedly installed on the work surface, and the test module is located on a side of the distance sensing module away from the work surface; in a direction perpendicular to the work surface, the test module approaches the work surface, the sensing signal feedback end of the distance sensing module is a first sensing signal, and the power supply output end of the power control module supplies power to the power input end of the test module; in a direction perpendicular to the work surface, the test module moves away from the work surface, the sensing signal feedback end of the distance sensing module is a second sensing signal, and the power supply output end of the power control module stops supplying power to the power input end of the test module. The embodiment of the present application sets a distance sensing module to sense the different distance change states between the test module and the work surface, so that the power control module can supply power to the test module only when the test module needs to test the device to be tested, and stops supplying power to the test module in all other non-test states. This not only avoids the risk of high-voltage pulses generated when the test module is pressed down during testing and increases the test yield, but also saves manufacturing costs because the distance sensing device generally used in the distance sensing module is a common module with a simple structure. The embodiment of the present application sets a distance sensing module, so that the problem of high-voltage surges generated when the test module is pressed down can be solved without increasing the height of the grounding probe, which can save manual maintenance costs. There is no need to set a pressing structure on the workbench. The pressing structure is manually operated and cooperates with the trigger circuit to control whether the test module is powered on. Therefore, manual operation costs can be effectively saved and maintenance is more convenient. Therefore, the test device provided by the embodiment of the present application has the beneficial effect of solving the technical problems raised in the background technology. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] Figure 1 This is a schematic diagram of the structure of the test device provided in an embodiment of the present application;
[0030] Figure 2 yes Figure 1 A side view schematic diagram of the test module and the work surface in a changing state;
[0031] Figure 3 yes Figure 1 A side view schematic diagram of the structure of the test module and the work surface in another changing state;
[0032] Figure 4 yes Figure 1 Schematic diagram of the electrical connection structure of the mid-range sensing module;
[0033] Figure 5 yes Figure 4A schematic diagram of an electrical connection structure of a distance sensor;
[0034] Figure 6 This is another structural diagram of the testing device provided in an embodiment of the present application;
[0035] Figure 7 This is another structural diagram of the testing device provided in an embodiment of the present application;
[0036] Figure 8 This is another structural diagram of the testing device provided in an embodiment of the present application;
[0037] Figure 9 This is a schematic diagram of the structure of the test system provided in the embodiment of the present application;
[0038] Figure 10 This is another structural diagram of the test system provided in an embodiment of the present application. DETAILED DESCRIPTION
[0039] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.
[0040] The test device provided in the embodiment of the present application can place the DUT on a work surface when testing a DUT, such as a PCBA board. The distance sensing module senses that the test module is pressed down toward the work surface, i.e., toward the DUT. Then, the sensing feedback from the distance sensing module controls the power output of the power control module to supply power to the power input of the test module to complete the test of the DUT. When the DUT does not need to be tested or the test of the DUT has been completed, the distance sensing module senses that the test module is lifted away from the work surface, i.e., away from the DUT. Then, the sensing feedback from the distance sensing module controls the power output of the power control module to stop supplying power to the power input of the test module. This not only solves the problem in the prior art that the power input of the test module is always in a power supply state, and when the test module tests the PCBA board, a high voltage surge is generated when the test probe of the test module contacts the PCBA board, thereby burning the PCBA board and affecting the test yield, but also solves the problem in the prior art that the design scheme is complex in structure and has high production and labor costs. The test device provided in the embodiment of the present application can not only avoid the risk of high-voltage pulses generated at the moment when the test fixture is pressed down during testing, thereby increasing the test yield, but also save labor costs and production costs, and is easy to maintain.
[0041] The following is an illustrative description of the test device and test system provided in the embodiments of the present application with reference to the accompanying drawings.
[0042] Please refer to Figure 1-Figure 3 , Figure 1 is a structural diagram of a testing device provided in an embodiment of the present application, Figure 2 yes Figure 1 A side view structural diagram of a changing state of the test module and the work surface. Figure 3 yes Figure 1 A side structural diagram of another changing state of the test module and the work surface, a test device 000 provided in this embodiment includes: a power control module 10, a test module 20 and a distance sensing module 30;
[0043] The power control module 10 includes a power output terminal 101 and an induction signal receiving terminal 102 , and the power output terminal 101 is electrically connected to the power input terminal 201 of the test module 20 ;
[0044] The distance sensing module 30 includes a sensing signal feedback terminal 301 , which is electrically connected to the sensing signal receiving terminal 102 of the power control module 10 ;
[0045] The testing device 000 includes a work surface 00, a distance sensing module 30 is fixedly mounted on the work surface 00, and the testing module 20 is located on a side of the distance sensing module 30 away from the work surface 00;
[0046] In a direction perpendicular to the work surface 00, the test module 20 approaches the work surface 00, the sensing signal feedback terminal 301 of the distance sensing module 30 is a first sensing signal, the sensing signal receiving terminal 102 of the power control module 10 receives the first sensing signal, and the power supply output terminal 101 of the power control module 10 supplies power to the power input terminal 201 of the test module 20;
[0047] In a direction perpendicular to the work surface 00, the test module 20 moves away from the work surface 00, the sensing signal feedback end 301 of the distance sensing module 30 is a second sensing signal, the sensing signal receiving end 102 of the power control module 10 receives the second sensing signal, and the power supply output end 101 of the power control module 10 stops supplying power to the power input end 201 of the test module 20.
[0048] Specifically, the test device 000 provided in this embodiment can be used to perform yield testing on the PCBA motherboard in the device to be tested of a portable electronic product such as a mobile phone to determine whether the device to be tested is qualified. The test device 000 includes a power control module 10, a test module 20 and a distance sensing module 30; wherein, the test device 000 includes a work surface 00, the surface of the work surface 00 can be a flat structure, and the work surface 00 can be used to fix the device to be tested ( Figure 1 (not shown), the distance sensing module 30 can also be fixedly installed on the work surface 00. Optionally, the distance sensing module 30 can be installed on the edge of the work surface 00, thereby avoiding the effect of the test module 20 on the device to be tested. Figure 1 As shown, the work surface 00 can be a relatively large space. When viewed from above the work surface 00 (i.e., in a direction perpendicular to the work surface 00), the test module 20 is located on the side of the distance sensing module 30 away from the work surface 00. Optionally, the test module 20 can be a test fixture. Optionally, the test module 20 can be controlled by a telescopic module such as an air cylinder or an oil cylinder (not shown in the figure), and can be moved closer to the work surface 00 when a test is required, or lifted away from the work surface 00 when a test is not required or after the test is completed. In this embodiment, the position of the device to be tested on the work surface 00 can correspond to the position of the test module 20, so that the test module 20 can better contact the device to be tested when it is pressed down for testing. The distance sensing module 30 of this embodiment is used to sense the distance change between the test module 20 and the work surface 00 (or the device to be tested), and the power control module 10 is used to control whether to provide power to the test module 20 based on the feedback information sensed by the distance sensing module 30.
[0049] The sensing signal feedback terminal 301 of the distance sensing module 30 of this embodiment is electrically connected to the sensing signal receiving terminal 102 of the power control module 10. After the distance sensing module 30 senses the change in distance between the test module 20 and the work surface 00 (or the device to be tested), the sensing signal is transmitted to the sensing signal receiving terminal 102 through the sensing signal feedback terminal 301. The power supply output terminal 101 of the power control module 10 is electrically connected to the power supply input terminal 201 of the test module 20. The power control module 10 controls whether the power supply output terminal 101 provides power to the power supply input terminal 201 according to the induction signal received by the induction signal receiving terminal 102. Therefore, it can be achieved that the power supply output terminal 101 of the power control module 10 supplies power to the power input terminal 201 of the test module 20 only when the test module 20 performs a test operation on the device to be tested. When the test module 20 completes the test operation on the device to be tested or the test module 20 does not need to test the device to be tested, the power supply output terminal 101 of the power control module 10 can stop supplying power to the power input terminal 201 of the test module 20, thereby avoiding the risk of instantaneous high-voltage pulses during testing, which is conducive to improving the test yield.
[0050] like Figure 1 and Figure 2 As shown, when the test device 000 of this embodiment is working, that is, when the test module 20 is required to test the device to be tested 01 on the work surface 00, the test module 20 approaches the work surface 00 in a direction perpendicular to the work surface 00, and the distance between the test module 20 and the work surface 00 changes from far to near (the test module 20 changes from far to near). Figure 2 The position indicated by the dotted line in the figure changes to the position indicated by the solid line. It can be understood that in order to clearly illustrate the position change of the test module 20, Figure 2 The first sensing signal indicates that the distance sensing module 30 senses that the test module 20 is pressed down and approaches the device under test 01 (e.g., Figure 2 The sensing signal receiving terminal 102 of the power control module 10 receives the first sensing signal, i.e., the sensing signal receiving terminal 102 of the power control module 10 receives that the state of the test module 20 is pressed down and close to the device under test 01. At this time, the power supply output terminal 101 of the power control module 10 supplies power to the power input terminal 201 of the test module 20, and the test module 20 can contact the device under test 01 for testing.
[0051] like Figure 1 and Figure 3As shown, when the test device 000 of this embodiment is not working, that is, when the test module 20 is not needed to perform a test operation on the device to be tested 01 on the work surface 00 or the test work has been completed, the test module 20 is moved away from the work surface 00 in a direction perpendicular to the work surface 00, and the distance between the test module 20 and the work surface 00 changes from near to far (the test module 20 is moved from Figure 3 The position indicated by the dotted line in the figure changes to the position indicated by the solid line. It can be understood that in order to clearly illustrate the position change of the test module 20, Figure 3 The second sensing signal indicates that the distance sensing module 30 senses that the test module 20 is lifted and moves away from the device under test 01 (e.g., Figure 3 The sensing signal receiving terminal 102 of the power control module 10 receives the second sensing signal, i.e., the sensing signal receiving terminal 102 of the power control module 10 receives that the test module 20 is in the state of being lifted up and away from the device under test 01. At this time, the power supply output terminal 101 of the power control module 10 stops supplying power to the power input terminal 201 of the test module 20, effectively avoiding the occurrence of high-voltage surges caused by power supply to the test module 20 when the test module 20 is not in contact with the device under test 01, thereby effectively improving the test yield.
[0052] It can be understood that, in this embodiment, the first sensing signal and the second sensing signal sensed by the distance sensing module 30 can both be numerical values, that is, the first sensing signal reflecting the test module 20 approaching the work surface 00 and the second sensing signal reflecting the test module 20 moving away from the work surface 00 can both be numerical values, that is, the distance sensing module 30 can feed back the different states of the distance change between the sensed test module 20 and the work surface 00 to the sensing signal feedback terminal 301 of the distance sensing module 30 in a numerically different manner, and the output is to the power control module 10, so as to facilitate the analysis of the power control module 10 and control whether to output power to the test module 20.
[0053] The test device 000 of this embodiment includes a power control module 10, a test module 20, and a distance sensing module 30; the sensing signal feedback terminal 301 of the distance sensing module 30 is electrically connected to the sensing signal receiving terminal 102 of the power control module 10, and the power output terminal 101 of the power control module 10 is electrically connected to the power input terminal 201 of the test module 20; the test device 000 includes a work surface 00, the distance sensing module 30 is fixedly mounted on the work surface 00, and the test module 20 is located on a side of the distance sensing module 30 away from the work surface 00; In the direction perpendicular to the work surface 00, the test module 20 approaches the work surface 00, the sensing signal feedback end 301 of the distance sensing module 30 is a first sensing signal, and the power supply output end 101 of the power control module 10 supplies power to the power input end 201 of the test module 20; in the direction perpendicular to the work surface 00, the test module 20 moves away from the work surface 00, the sensing signal feedback end 301 of the distance sensing module 30 is a second sensing signal, and the power supply output end 101 of the power control module 10 stops supplying power to the power input end 201 of the test module 20. In the embodiment of the present application, by setting a distance sensing module 30 to sense the different distance change states between the test module 20 and the work surface 00, the power control module 10 can supply power to the test module 20 only when the test module 20 needs to test the device to be tested, and the power supply to the test module 20 is stopped in all other non-test states. This not only avoids the risk of high-voltage pulses generated when the test module is pressed down during testing and increases the test yield, but also saves manufacturing costs because the distance sensing device generally used in the distance sensing module 30 is a common module with a simple structure. In the embodiment of the present application, by setting a distance sensing module 30, the problem of high-voltage surges generated when the test module is pressed down can be solved without increasing the height of the grounding probe, which can save labor maintenance costs. There is no need to set a pressing structure on the workbench. The pressing structure is manually operated and cooperates with the trigger circuit to control whether to power the test module. Therefore, it can effectively save labor operation costs and make maintenance more convenient.
[0054] It should be noted that the module structure included in the test device in the embodiment of the present application is only a simple schematic diagram and does not represent its actual product structure. During specific implementation, the product structure design can be carried out according to actual production needs. This embodiment does not limit this, and it only needs to be able to meet the electrical connection effect and beneficial effects set in this embodiment.
[0055] In some optional embodiments, please refer to Figure 1-Figure 3 and Figure 4 、 Figure 5 , Figure 4 yes Figure 1 Schematic diagram of the electrical connection structure of the mid-range sensing module. Figure 5 yes Figure 4Schematic diagram of an electrical connection structure of a distance sensor in FIG. In this embodiment, the distance sensing module 30 includes a distance sensor 302, which includes at least a sensing signal feedback terminal 301, an IO port voltage terminal 3022, and a system voltage terminal 3023. Optionally, the distance sensor 302 in this embodiment can be a distance sensor chip such as STK33562. The sensing signal feedback terminal 301 of the distance sensor 302 can be the SCL and / or SDA pins of the STK33562 chip, the IO port voltage terminal 3022 can be the VDD pin of the STK33562 chip, and the system voltage terminal 3023 can be the LEDA pin of the STK33562 chip. Among them, the sensing signal feedback terminal 301 of the distance sensor 302 is used to output the sensing signal to the sensing signal receiving terminal 102 of the power control module 10 (the figure of this embodiment is used as an example to illustrate that the distance sensor 302 includes two sensing signal feedback terminals 301 and the power control module 10 includes two sensing signal receiving terminals 102); the IO port voltage terminal 3022 of the distance sensor 302 is used to provide the IO port voltage (chip interface voltage) of the distance sensor 302. Optionally, the IO port voltage of the distance sensor 302 can be output through the power control module 10 (IO port voltage VIO18_PMU, the specific value depends on the model and design of the chip), that is, the power control module 10 can be electrically connected to the IO port voltage terminal 3022 of the distance sensor 302 to provide the IO port voltage for the distance sensor 302. The system voltage terminal 3023 of the distance sensor 302 is used to provide a system power supply voltage for the distance sensor 302 (a chip system power supply voltage VSYS, which is used to provide a working power supply voltage for the internal circuit of the chip). Optionally, the system power supply voltage of the distance sensor 302 can be output through the power control module 10, that is, the power control module 10 can be electrically connected to the system voltage terminal 3023 of the distance sensor 302 to provide a system power supply voltage for the distance sensor 302.
[0056] It can be understood that the figure of this embodiment only uses the STK33562 chip as an example for illustration. In specific implementation, the distance sensor 302 can also be other distance sensor chips. It only needs to meet the requirements that the distance sensing module 30 using the distance sensor chip can sense the distance change between the test module 20 and the work surface 00 and feed back to the power control module 10. This embodiment does not limit this.
[0057] In some optional embodiments, please continue to refer to Figure 1-Figure 5 ,In this embodiment, the distance sensing module 30 further includes a signal quality detection unit 303;
[0058] One end of the signal quality detection unit 303 is electrically connected to the power control module 10 , and the other end of the signal quality detection unit 303 is electrically connected to the IO port voltage terminal 3022 .
[0059] Optionally, the signal quality detection unit 303 includes a first resistor R1 and a second resistor R2, wherein a first end of the first resistor R1 is electrically connected to the power control module 10, a second end of the first resistor R1 is electrically connected to a first end of the second resistor R2, and a second end of the second resistor R2 is electrically connected to the IO port voltage terminal 3022;
[0060] The first resistor R1 and the second resistor R2 are both zero-ohm resistors.
[0061] This embodiment illustrates the provision of a signal quality detection unit 303 within the distance sensing module 30. The signal quality detection unit 303 comprises two zero-ohm or near-zero-ohm resistors connected in series: a first resistor R1 and a second resistor R2. These resistors are connected to the IO port voltage terminal 3022 of the distance sensor 302. The chip interface voltage provided by the power control module 10 is input to the distance sensor 302 via the signal quality detection unit 303. The signal quality detection unit 303 is used to test the signal quality within the distance sensing module 20. Both the first resistor R1 and the second resistor R2 are zero-ohm or near-zero-ohm resistors, which can reduce signal attenuation and distortion, thereby improving signal transmission quality.
[0062] It can be understood that this embodiment is only an example of illustrating that the structure in which the signal quality detection unit 303 can be set is a first resistor R1 and a second resistor R2 connected in series. In specific implementation, the design structure of the signal quality detection unit 303 includes but is not limited to this, and can also be designed as other circuit structures that can achieve testing and improve signal transmission quality. This embodiment will not be described in detail here.
[0063] Further optional, please continue to refer to Figure 1-Figure 5 , in this embodiment, the distance sensing module 30 further includes a filtering unit 304;
[0064] The filtering unit 304 includes a first capacitor C1, a second capacitor C2 and a third capacitor C3; the first electrode of the first capacitor C1 is electrically connected to the second end of the second resistor R2, and the first electrode of the second capacitor C2 is electrically connected to the system voltage terminal 3023 of the distance sensor 302; the first electrode of the third capacitor C3 is electrically connected to the interrupt signal terminal 3024 of the distance sensor 302; wherein, when the distance sensor 302 is selected as the STK33562 chip, the interrupt signal terminal 3024 can be the INT pin of the STK33562 chip, and the INT pin is used to receive interrupt signals generated by external or internal events. The interrupt signal can trigger the STK33562 chip to execute a specific interrupt service program, thereby allowing the STK33562 chip to respond to and process these events while executing the main program.
[0065] The second electrode of the first capacitor C1 , the second electrode of the second capacitor C2 , and the second electrode of the third capacitor C3 are all connected to the ground GND.
[0066] This embodiment illustrates that a filtering unit 304 may also be provided in the distance sensing module 30. The filtering unit 304 may include multiple filter capacitors, each connected to a ground terminal GND and a node where filtering is required to prevent signal interference. For example, the filtering unit 304 may include a first capacitor C1, a second capacitor C2, and a third capacitor C3. The first electrode of the first capacitor C1 is electrically connected to the second end of the second resistor R2, the first electrode of the second capacitor C2 is electrically connected to the system voltage terminal 3023 of the distance sensor 302, and the first electrode of the third capacitor C3 is electrically connected to the interrupt signal terminal 3024 of the distance sensor 302. The filtering unit 304 including the first capacitor C1, the second capacitor C2, and the third capacitor C3 in this embodiment is used to filter out clutter interference in the power supply and signal during operation of the distance sensing module 30, thereby improving signal transmission quality.
[0067] It can be understood that this embodiment is only an example of the structure that the filtering unit 304 can be set up. In specific implementation, the design structure of the filtering unit 304 includes but is not limited to this. It can also be designed as other circuit connection structures that can filter out clutter interference in the power supply and signal. This embodiment will not be described in detail here.
[0068] In some optional embodiments, please continue to refer to Figure 1-Figure 5 In this embodiment, the test module 20 includes a test probe 200. When the test device 000 performs a yield test on the device under test 01, the device under test 01 is placed on the work surface 00. After the test module 20 is pressed down toward the work surface 00, the test probe 200 contacts the device under test 01, thereby achieving a yield test on the device under test 01.
[0069] In some optional embodiments, please refer to Figure 4 、 Figure 5 and Figure 6 , Figure 6 This is another structural diagram of the test device provided in an embodiment of the present application. In this embodiment, the power control module 10 includes multiple power output terminals 101, and the test module 20 includes multiple power input terminals 201; each power output terminal 101 is electrically connected to each power input terminal 201 in a one-to-one correspondence.
[0070] Optionally, the power control module 10 includes a plurality of sensing signal receiving terminals 102 , and the distance sensing module 30 includes a plurality of sensing signal feedback terminals 301 , and each sensing signal feedback terminal 301 is electrically connected to each sensing signal receiving terminal 102 in a one-to-one correspondence.
[0071] It is understandable that the Figure 6 In the description, the power control module 10 includes two power output terminals 101 and two sensing signal receiving terminals 102, namely, a first power output terminal 1011, a second power output terminal 1012, a first sensing signal receiving terminal 1021, and a second sensing signal receiving terminal 1022; the test module 20 includes two power input terminals 201, namely, a first power input terminal 2011 and a second power input terminal 2012; and the distance sensing module 30 includes two sensing signal feedback terminals 301, namely, a first sensing signal feedback terminal 3011 and a second sensing signal feedback terminal 3012. The first power output terminal 1011 is electrically connected to the first power input terminal 2011, the second power output terminal 1012 is electrically connected to the second power input terminal 2012, the first sensing signal feedback terminal 3011 is electrically connected to the first sensing signal receiving terminal 1021, and the second sensing signal feedback terminal 3012 is electrically connected to the second sensing signal receiving terminal 1022.
[0072] Optional, such as Figure 5 and Figure 6 As shown, in this embodiment, the two sensing signal feedback terminals 301 of the distance sensing module 30 and the two sensing signal receiving terminals 102 of the power control module 10 can be electrically connected through an I2C serial bus. The I2C serial bus generally has two signal lines, one is a bidirectional data line SDA, and the other is a clock line SCL. The two sensing signal feedback terminals 301 of the distance sensing module 30 and the two sensing signal receiving terminals 102 of the power control module 10 are electrically connected through the I2C serial bus. The hardware structure is simple, which is conducive to simplifying wiring, reducing system costs, and improving system reliability.
[0073] When the test module 20 needs to perform a test operation on the device to be tested, the distance sensing module 30 senses that the test module 20 is approaching the work surface 00, and the distance between the test module 20 and the work surface 00 changes from far to near. The first sensing signal feedback terminal 3011 transmits the sensed first sensing signal to the first sensing signal receiving terminal 1021. After the first sensing signal receiving terminal 1021 receives the first sensing signal, the power control module 10 controls the first power supply output terminal 1011 to provide VBUS voltage (generally 5V) to the first power input terminal 2011 of the test module 20, thereby providing VBUS voltage to a test probe 200 of the test module 20. Similarly, the second sensing signal feedback terminal 3012 transmits the sensed first sensing signal to the second sensing signal receiving terminal 1022. After the second sensing signal receiving terminal 1022 receives the first sensing signal, the power control module 10 controls the second power supply output terminal 1012 to provide VBAT voltage (generally 4V) to the second power input terminal 2012 of the test module 20, thereby providing VBAT voltage to another test probe 200 of the test module 20, thereby avoiding the risk of high-voltage pulses generated by the instantaneous pressure reduction of the test module during testing, increasing the test yield, and realizing the yield detection of the device to be tested.
[0074] In some optional embodiments, please refer to Figure 4 、 Figure 5 and Figure 7 , Figure 7 is another structural diagram of the test device provided in an embodiment of the present application. In this embodiment, the power control module 10 includes a plurality of power supply units 103 and a plurality of switch units 104;
[0075] The output end of each power supply unit 103 is electrically connected to the input end of each switch unit 104 in a one-to-one correspondence, the output end of each switch unit 104 is electrically connected to each power supply output end 101 in a one-to-one correspondence, and the control end of each switch unit 104 is electrically connected to the induction signal receiving end 102.
[0076] It is understandable that the Figure 7In the figure, the power control module 10 includes two power supply output terminals 101 and two induction signal receiving terminals 102, namely the first power supply output terminal 1011, the second power supply output terminal 1012, the first induction signal receiving terminal 1021, and the second induction signal receiving terminal 1022; the test module 20 includes two power input terminals 201, namely the first power input terminal 2011 and the second power input terminal 2012; the distance sensing module 30 includes two induction signal feedback terminals 301, namely the first induction signal feedback terminal 3011 and the second induction signal feedback terminal 3012; the power control module 10 includes two power supply units 103 and two switch units 104, namely the first power supply unit 1031, the second power supply unit 1032, the first switch unit 1041, and the second switch unit 1042. The first sensing signal feedback terminal 3011 is electrically connected to the first sensing signal receiving terminal 1021, which is electrically connected to the control terminal of the first switch unit 1041. The output terminal of the first power supply unit 1031 is electrically connected to the input terminal of the first switch unit 1041, which is electrically connected to the first power output terminal 1011, which is electrically connected to the first power input terminal 2011. The second sensing signal feedback terminal 3012 is electrically connected to the second sensing signal receiving terminal 1022, which is electrically connected to the control terminal of the second switch unit 1042. The output terminal of the second power supply unit 1032 is electrically connected to the input terminal of the second switch unit 1042, which is electrically connected to the second power output terminal 1012, which is electrically connected to the second power input terminal 2012.
[0077] When the test module 20 needs to perform a test operation on the device to be tested, the distance sensing module 30 senses that the test module 20 is approaching the work surface 00, and the distance between the test module 20 and the work surface 00 changes from far to near. The first sensing signal feedback end 3011 transmits the sensed first sensing signal to the first sensing signal receiving end 1021. After the first sensing signal receiving end 1021 receives the first sensing signal, the control end of the first switching unit 1041 is used to control the first switching unit 1041 to be in a conductive state. The output end of the first power supply unit 1031 transmits the VBUS voltage to the first power supply output end 1011. The first power supply output end 1011 provides the VBUS voltage to the first power input end 2011 of the test module 20, thereby providing the VBUS voltage to a test probe 200 of the test module 20. Similarly, the second sensing signal feedback terminal 3012 transmits the sensed first sensing signal to the second sensing signal receiving terminal 1022. After receiving the first sensing signal, the second sensing signal receiving terminal 1022 controls the second switch unit 1042 to be in an on state through the control terminal of the second switch unit 1042. The output terminal of the second power supply unit 1032 transmits the VBAT voltage to the second power supply output terminal 1012. The second power supply output terminal 1012 provides the VBAT voltage to the second power input terminal 2012 of the test module 20, thereby providing the VBAT voltage to another test probe 200 of the test module 20.
[0078] When the test module 20 does not need to perform a test operation on the device to be tested, the distance sensing module 30 senses that the test module 20 is moving away from the work surface 00, and the distance between the test module 20 and the work surface 00 changes from near to far. Then, the first sensing signal feedback end 3011 transmits the sensed second sensing signal to the first sensing signal receiving end 1021. After the first sensing signal receiving end 1021 receives the first sensing signal, the first switching unit 1041 is controlled to be in a cut-off state through the control end of the first switching unit 1041. The output end of the first power supply unit 1031 stops transmitting the VBUS voltage to the first power supply output end 1011. The first power supply output end 1011 stops providing the VBUS voltage to the first power input end 2011 of the test module 20, and a test probe 200 of the test module 20 is not powered. Similarly, the second sensing signal feedback terminal 3012 transmits the sensed second sensing signal to the second sensing signal receiving terminal 1022. After receiving the second sensing signal, the second sensing signal receiving terminal 1022 controls the second switch unit 1042 to be in a cut-off state through the control terminal of the second switch unit 1042. The output terminal of the second power supply unit 1032 stops transmitting the VBAT voltage to the second power supply output terminal 1012. The second power supply output terminal 1012 stops providing the VBAT voltage to the second power supply input terminal 2012 of the test module 20. The other test probe 200 of the test module 20 is not powered. Therefore, by independently controlling the power supply of the test module 20, the risk of high-voltage pulses generated when the test module is pressed down at the moment of testing can be avoided, thereby increasing the test yield and achieving yield detection of the device to be tested.
[0079] It can be understood that this embodiment does not limit the specific structure of the switch unit 104 included in the power control module 10. It can be a simple structure with a switching effect such as a switching transistor. It only needs to be able to achieve conduction or cutoff between the power supply unit and the power supply output end under the control of the sensing signal provided by the sensing signal receiving end. During specific implementation, the setting can be selected according to actual needs.
[0080] In some optional embodiments, please refer to Figure 1-Figure 5 and Figure 8 , Figure 8 This is another structural schematic diagram of the test device provided in an embodiment of the present application. In this embodiment, the test device 000 also includes an anti-static module 40. The power supply output terminal 101 of the power control module 10 is electrically connected to the power input terminal 201 of the test module 20 through the anti-static module 40. By setting the anti-static module 40, damage to the test probe 200 of the test module 20 due to static electricity can be avoided.
[0081] It can be understood that this embodiment does not limit the specific structure of the anti-static module 40. The anti-static module 40 can adopt the anti-static circuit board structure that has been technically mature in the relevant technology and can be directly installed between the power supply output terminal 101 of the power control module 10 of the test device 000 and the power input terminal 201 of the test module 20.
[0082] Please refer to Figures 1-8 and Figure 9 , Figure 9 It is a structural diagram of the test system provided in an embodiment of the present application. The embodiment of the present application also provides a test system 111, which includes the test device 000 described in the above embodiments. Since the test system 111 includes the test device 000 described in the above embodiments, it has the same or similar beneficial effects, which will not be described one by one here.
[0083] In some optional embodiments, please refer to Figures 1-8 and Figure 10 , Figure 10 This is another structural diagram of the test system provided by the embodiment of the present application. The test system 111 provided by this embodiment includes the test device 000 in the above embodiments and also includes a host device 001. Optionally, the host device 001 can be a computer or other structure. The host device 001 is electrically connected to the power control module 10 of the test device 000 through a serial interface. Optionally, combined with Figure 8 and Figure 10 As shown, the host device 001 can be electrically connected to the first power supply unit 1031 and the second power supply unit 1032 of the power control module 10 of the test device 000 via a serial interface. In this embodiment, the host device 001 is electrically connected to the power control module 10 of the test device 000 via a serial interface, which simplifies the communication line and can greatly reduce costs.
[0084] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0085] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.
Claims
1. A testing device, characterized in that: include: Power control module, test module and distance sensing module; The power control module includes a power supply output terminal and an induction signal receiving terminal, and the power supply output terminal is electrically connected to the power input terminal of the test module; The distance sensing module includes a sensing signal feedback terminal, which is electrically connected to the sensing signal receiving terminal of the power control module; The testing device includes a work surface, the distance sensing module is fixedly mounted on the work surface, and the testing module is located on a side of the distance sensing module away from the work surface; In a direction perpendicular to the work surface, the test module approaches the work surface, the sensing signal feedback end of the distance sensing module is a first sensing signal, the sensing signal receiving end of the power control module receives the first sensing signal, and the power supply output end of the power control module supplies power to the power input end of the test module; In a direction perpendicular to the work surface, the test module moves away from the work surface, the sensing signal feedback end of the distance sensing module is a second sensing signal, the sensing signal receiving end of the power control module receives the second sensing signal, and the power supply output end of the power control module stops supplying power to the power input end of the test module.
2. The testing device according to claim 1, characterized in that The distance sensing module includes a distance sensor, and the distance sensor includes at least the sensing signal feedback terminal, an IO port voltage terminal, and a system voltage terminal.
3. The testing device according to claim 2, characterized in that The distance sensing module further includes a signal quality detection unit; One end of the signal quality detection unit is electrically connected to the power control module, and the other end of the signal quality detection unit is electrically connected to the IO port voltage terminal.
4. The testing device according to claim 3, characterized in that: The signal quality detection unit includes a first resistor and a second resistor, wherein a first end of the first resistor is electrically connected to the power control module, a second end of the first resistor is electrically connected to a first end of the second resistor, and a second end of the second resistor is electrically connected to a voltage terminal of the IO port; The first resistor and the second resistor are both zero-ohm resistors.
5. The testing device according to claim 4, characterized in that: The distance sensing module further includes a filtering unit; The filtering unit includes a first capacitor, a second capacitor, and a third capacitor; a first electrode of the first capacitor is electrically connected to the second end of the second resistor, a first electrode of the second capacitor is electrically connected to the system voltage end of the distance sensor; a first electrode of the third capacitor is electrically connected to the interrupt signal end of the distance sensor; The second electrode of the first capacitor, the second electrode of the second capacitor, and the second electrode of the third capacitor are all grounded.
6. The testing device according to claim 1, wherein: The test module includes a test probe.
7. The testing device according to claim 1, characterized in that The power control module includes a plurality of the power output terminals, and the test module includes a plurality of the power input terminals; each of the power output terminals is electrically connected to each of the power input terminals in a one-to-one correspondence.
8. The testing device according to claim 7, characterized in that: The power control module includes multiple power supply units and multiple switch units; The output end of each power supply unit is electrically connected to the input end of each switch unit in a one-to-one correspondence, the output end of each switch unit is electrically connected to each power supply output end in a one-to-one correspondence, and the control end of each switch unit is electrically connected to the induction signal receiving end.
9. A testing system, characterized in that: The test device comprises the test device according to any one of claims 1 to 8.
10. The test system according to claim 9, characterized in that: A host device is also included, and the host device is electrically connected to the power control module of the testing device through a serial interface.