Optical wafer imprinting colloid removing equipment

Abstract

The utility model provides an optical wafer imprint colloid removing device. The optical wafer imprint colloid removing device comprises a conveying unit, a spraying unit, a scrubbing unit, a cleaning unit and a drying unit. The spraying unit, the scrubbing unit, the cleaning unit and the drying unit are arranged above the conveying unit, and the conveying unit makes contact with the bottom face, provided with a plated functional film, of the to-be-processed optical wafer. The conveying unit is used for sequentially conveying the top surface, with the imprinting colloid, of the to-be-treated optical wafer into the spraying unit for spraying and wetting, the scrubbing unit for scrubbing, the cleaning unit for washing and the drying unit for drying treatment, so that the to-be-treated optical wafer meets the requirement of reutilization; according to the method, the functional film on the optical wafer to be processed does not lose efficacy, the optical wafer to be processed does not need to be re-plated with the functional film subsequently, the failed functional film on the optical wafer does not need to be removed at a high temperature by adopting a strong alkaline oxide solvent, the optical wafer to be processed does not need to be polished, and the use amount of a cleaning solvent is small; a large amount of waste liquid is not generated.

Description

Technical Field

[0001] The utility model belongs to the technical field of AR diffraction optical waveguides, and in particular relates to an optical wafer imprint colloid removal device. Background Art

[0002] Augmented reality (AR) technology refers to the use of certain technical means to provide users with additional information in the real world (the so-called "enhancement"). This technology organically combines images in the virtual world and scenes in the real world, and deeply integrates the calculated information with the real world to provide users with richer information and immersive experience.

[0003] Augmented reality technology can be implemented through many hardware platforms, the most immersive of which is wearable augmented reality devices, namely AR glasses.

[0004] At present, the more mature AR glasses technology solutions are mainly divided into prism solutions, birdbath solutions, free-form surface solutions, off-axis holographic lens solutions and diffraction optical waveguide solutions.

[0005] The following are examples of existing methods for preparing diffractive optical waveguides:

[0006] 1. A functional film is coated on one side of the optical wafer, which has the effects of increasing transmittance and reducing reflection.

[0007] 2. A nanoimprinted grating structure on the opposite side of the optical wafer, specifically comprising:

[0008] 1. Prepare an imprint master with a preset grating structure.

[0009] 2. The grating structure of the imprint master is transferred to the soft film through the nanoimprint process, and the inverse structure of the grating structure is obtained on the soft film, thereby obtaining a diffraction optical waveguide.

[0010] Specifically, the embossing glue is evenly spin-coated on the embossing master, the soft film substrate is bonded to the embossing master, and pressure is applied to fill the embossing glue into the grating structure of the embossing master, and the inverse structure of the grating structure is obtained on the embossing glue. The embossing glue with the inverse structure of the grating structure is transferred to the soft film substrate by ultraviolet light curing and demolding, thereby obtaining a soft film with the inverse structure of the grating structure.

[0011] 3. The inverse structure of the grating structure on the soft film is transferred to the optical wafer through the nanoimprint process to obtain an optical wafer with a grating structure, thereby obtaining a diffraction optical waveguide.

[0012] Specifically, a tackifier and product glue are spin-coated on the optical wafer in sequence, a soft film with a grating structure inverse structure is bonded to the product glue on the optical wafer, pressure is applied to fill the product glue into the grating structure inverse structure of the soft film, a grating structure is obtained on the product glue, and ultraviolet light curing and demolding are used to separate the soft film with a grating structure inverse structure from the product glue with a grating structure to obtain an optical wafer with a grating structure, thereby obtaining a diffraction optical waveguide.

[0013] In the actual process of preparing diffraction optical waveguides, it often happens that the nanoimprinted grating structure on the optical wafer cannot meet the usage requirements. Therefore, how to remove the imprinted colloid of the nanoimprinted grating structure on the optical wafer to achieve the reuse of the existing optical wafer is an urgent problem to be solved in this field.

[0014] In response to the above problems, the existing treatment method is: immersing the optical wafer with the imprinted colloid that does not meet the use requirements in an acidic high oxide solvent for oxidation treatment. The acidic high oxide solvent will damage the imprinted colloid and the functional film set on the optical wafer at the same time, causing the functional film on the optical wafer to fail. Therefore, it is further necessary to use a strong alkaline oxide solvent to remove the failed functional film on the optical wafer at high temperature. Since the strong alkaline oxide will cause the roughness of the optical wafer surface to change, it is necessary to use a polishing machine to polish the optical wafer again to make the current optical wafer meet the requirements for reuse.

[0015] The existing processing method has the following defects:

[0016] 1. Acidic high oxide solvents will damage both the imprint colloid and the functional film set on the optical wafer, causing the functional film on the optical wafer to fail. The processed optical wafer will need to be re-coated with the functional film.

[0017] 2. The existing treatment method generates a large amount of waste liquid due to the use of a large amount of acidic high-oxide solvents and strong alkaline oxide solvents, which makes waste liquid treatment more difficult.

[0018] 3. Use a strong alkaline oxide solvent to remove the failed functional film on the optical wafer at high temperature. The strong alkaline oxide causes the roughness of the optical wafer surface to change. The optical wafer needs to be polished and cleaned to meet the requirements of reuse. Utility Model Content

[0019] In order to overcome the defects of the prior art, the utility model provides an optical wafer imprint colloid removal device.

[0020] The utility model is achieved through the following technical solutions:

[0021] The utility model provides an optical wafer imprint colloid removal device, comprising a conveying unit, a spraying unit, a scrubbing unit, a cleaning unit and a drying unit;

[0022] The spray unit, scrubbing unit, cleaning unit and drying unit are arranged above the conveying unit;

[0023] The conveying unit contacts the bottom surface of the optical wafer to be processed with the functional film, and sequentially delivers the top surface of the optical wafer to be processed with the imprinted colloid to the spraying unit, the scrubbing unit, the cleaning unit and the drying unit.

[0024] Furthermore, the conveying unit includes a conveyor belt and a conveying film layer;

[0025] The bottom surface of the transmission film layer is adhered to the transmission belt, and the top surface of the transmission film layer contacts the bottom surface of the optical wafer to be processed which is coated with a functional film.

[0026] Furthermore, the conveying unit further comprises a conveying film layer loading mechanism;

[0027] The film layer feeding mechanism includes a first driving motor and a feeding roller;

[0028] The first drive motor is connected to the feeding roller;

[0029] One end of the conveying film layer is arranged on the feeding roller, and the other end of the conveying film layer is adhered to the conveyor belt.

[0030] Furthermore, a plurality of adhesive protective films are provided at intervals on the top surface of the transmission film layer;

[0031] The shape of each adhesive protective film is consistent with the shape of the optical wafer to be processed, the size of each adhesive protective film is not larger than the size of the optical wafer to be processed, and the distance between adjacent adhesive protective films is equal to the diameter of the optical wafer to be processed.

[0032] Furthermore, the spray unit includes a spray chamber, a first delivery pipe and a first nozzle;

[0033] A first delivery pipe is provided inside the spray chamber, one end of the first delivery pipe is connected to the spray solvent storage unit through a first delivery pump, and a plurality of spray solvent outlets are provided at intervals at the other end of the first delivery pipe, each spray solvent outlet is provided with a first nozzle.

[0034] Furthermore, the scrubbing unit includes a wiping component unwinding mechanism, a wiping component wetting mechanism, a wiping component driving mechanism, and a wiping component rewinding mechanism which are arranged in sequence;

[0035] The wiping component unwinding mechanism is close to the spraying unit, and the wiping component rewinding mechanism is close to the cleaning unit;

[0036] The unwinding end of the wiping component is arranged on the wiping component unwinding mechanism, and the winding end of the wiping component is arranged on the wiping component winding mechanism;

[0037] The wiping component is provided with a first pressing roller on the top surface close to the unwinding mechanism of the wiping component, and a second pressing roller on the top surface close to the rewinding mechanism of the wiping component. The bottom surface of the wiping component can contact the top surface of the optical wafer to be processed with the embossed colloid through the first pressing roller and the second pressing roller.

[0038] Furthermore, the wiping component unwinding mechanism includes a second driving motor and an unwinding roller;

[0039] The second driving motor is connected to the unwinding roller, and the unwinding end of the wiping member is arranged on the unwinding roller;

[0040] The wiping component winding mechanism includes a third driving motor and a winding roller;

[0041] The third driving motor is connected to the winding roller, and the winding end of the wiping component is arranged on the winding roller.

[0042] Furthermore, the wiping component infiltration mechanism includes a wiping component infiltration chamber, a second delivery pipe and a second nozzle;

[0043] A second delivery pipe is provided inside the wiping component infiltration chamber, one end of the second delivery pipe is connected to the infiltration solvent storage unit via a second delivery pump, and the other end of the second delivery pipe is provided with a plurality of infiltration solvent outlets, each of which is provided with a second nozzle;

[0044] The wiping component driving mechanism includes a fourth driving motor, a transmission plate and a friction plate;

[0045] One side of the transmission plate is connected to the fourth driving motor, and a plurality of friction plates are arranged at intervals on the other side of the transmission plate, and the friction plates are in contact with the top surface of the wiping component.

[0046] Furthermore, the cleaning unit includes a cleaning chamber, a third delivery pipe and a third nozzle;

[0047] A third delivery pipe is provided inside the cleaning chamber, one end of the third delivery pipe is connected to the cleaning solvent storage unit through a third delivery pump, and the other end of the third delivery pipe is provided with multiple cleaning solvent outlets, each of which is provided with a third nozzle.

[0048] Furthermore, the drying unit includes a drying chamber, a fourth conveying pipe and an air knife;

[0049] A fourth delivery pipe is provided inside the drying chamber, one end of the fourth delivery pipe is connected to the dry gas storage unit via a fourth delivery pump, and an air knife is provided at the other end of the fourth delivery pipe.

[0050] Furthermore, it also includes a protective film layer feeding unit, and the protective film layer feeding unit is arranged above the conveying unit;

[0051] The protective film layer feeding unit includes a fifth driving motor, a feeding roller, and a protective film layer;

[0052] The fifth driving motor is connected to the feeding roller;

[0053] One end of the protective film layer is arranged on the feeding roller, and the other end of the protective film layer is adhered to the top surface of the optical wafer to be processed through a third pressing roller.

[0054] Compared with the prior art, the technical solution of the utility model has the following beneficial effects:

[0055] The utility model provides an optical wafer imprint colloid removal device, comprising a conveying unit, a spraying unit, a scrubbing unit, a cleaning unit, and a drying unit. The spraying unit, the scrubbing unit, the cleaning unit, and the drying unit are arranged above the conveying unit, and the conveying unit contacts the bottom surface of the optical wafer to be processed that is coated with a functional film. The conveying unit sequentially sends the top surface of the optical wafer to be processed that is coated with the imprint colloid to the spraying unit for wetting, the scrubbing unit for scrubbing, the cleaning unit for rinsing, and the drying unit for drying, so that the optical wafer to be processed can meet the requirements of being reused, and compared with the existing processing method, the functional film on the optical wafer to be processed will not be invalidated, so that there is no need to re-coat the functional film on the optical wafer to be processed, there is no need to use a strong alkaline oxide solvent to remove the invalid functional film on the optical wafer at high temperature, and there is no need to polish the optical wafer to be processed, and the amount of cleaning solvent used is small, and a large amount of waste liquid will not be generated. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0057] Figure 1 This is a schematic diagram of the overall structure of the optical wafer imprint colloid removal device of the present invention;

[0058] Figure 2It is a structural diagram of the transmission unit;

[0059] Figure 3 It is a structural diagram of the spray unit;

[0060] Figure 4 A schematic diagram of the structure of a scrubbing unit with a pressure roller;

[0061] Figure 5 It is a structural diagram of the cleaning unit;

[0062] Figure 6 It is a structural schematic diagram of the drying unit;

[0063] Figure 7 This is a schematic diagram of the structure of the protective film layer feeding unit with a pressure roller.

[0064] Among them, 1-transmission unit, 1-1-conveyor belt, 1-2-transmission film layer, 1-3-transmission film layer loading mechanism, 2-spraying unit, 2-1-spraying chamber, 2-2-first conveying pipe, 2-3-first nozzle, 3-scrubbing unit, 3-1-wiping component unwinding mechanism, 3-2-wiping component infiltration mechanism, 3-2-1-wiping component infiltration chamber, 3-2-2-second conveying pipe, 3-2-3-second nozzle, 3-3-wiping component Driving mechanism, 3-4-wiping component winding mechanism, 3-5-wiping component, 3-6-first pressure roller, 3-7-second pressure roller, 4-cleaning unit, 4-1-cleaning chamber, 4-2-third conveying pipe, 4-3-third nozzle, 5-drying unit, 5-1-drying chamber, 5-2-fourth conveying pipe, 5-3-air knife, 6-protective film layer feeding unit, 6-1-protective film layer feeding mechanism, 6-2-protective film layer, 6-3-third pressure roller. DETAILED DESCRIPTION

[0065] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0066] In this document, the terms "first", "second" and other similar words are not intended to imply any order, quantity and importance, but are merely used to distinguish different elements. In this document, the terms "one", "an" and other similar words are not intended to indicate that there is only one of the things described, but rather that the relevant description is only for one of the things described, and the things described may have one or more. In this document, the terms "comprise", "include" and other similar words are intended to indicate logical relationships, and cannot be regarded as indicating relationships in spatial structure. For example, "A includes B" is intended to indicate that B logically belongs to A, and does not mean that B is spatially located inside A. In addition, the meanings of the terms "comprise", "include" and other similar words should be regarded as open, not closed. For example, "A includes B" is intended to indicate that B belongs to A, but B does not necessarily constitute the whole of A, and A may also include other elements such as C, D, and E.

[0067] In this document, the terms "embodiment," "present embodiment," "preferred embodiment," and "one embodiment" do not imply that the description applies only to a specific embodiment, but rather that the description may also apply to one or more other embodiments. Those skilled in the art should understand that any description of a particular embodiment herein may be substituted, combined, or otherwise combined with the description of one or more other embodiments. New embodiments resulting from such substitution, combination, or other combination are readily conceivable by those skilled in the art and fall within the scope of protection of this utility model.

[0068] In the description herein, “a plurality of” means at least two, for example, two, three, etc., unless otherwise clearly and specifically defined.

[0069] like Figure 1 As shown, the utility model provides an optical wafer imprint colloid removal device, which includes a conveying unit 1, a spraying unit 2, a scrubbing unit 3, a cleaning unit 4, a drying unit 5 and a protective film layer feeding unit 6.

[0070] The spray unit 2 , the scrubbing unit 3 , the cleaning unit 4 , the drying unit 5 and the protective film layer feeding unit 6 are arranged above the conveying unit 1 .

[0071] The conveying unit contacts the bottom surface of the optical wafer to be processed, which is coated with a functional film. The conveying unit sequentially transports the top surface of the optical wafer to be processed, which is coated with the imprinted colloid, to the spraying unit for spraying and wetting, the scrubbing unit for scrubbing, the cleaning unit for rinsing, the drying unit for drying, and the protective film feeding unit for coating. This ensures that the optical wafer to be processed meets the requirements for reuse. Compared with existing processing methods, the functional film on the optical wafer to be processed will not be deactivated, so there is no need to re-coat the functional film on the optical wafer to be processed, there is no need to use a strong alkaline oxide solvent to remove the deactivated functional film on the optical wafer at high temperature, and there is no need to polish the optical wafer to be processed. In addition, the amount of cleaning solvent used is small, and no large amount of waste liquid is generated.

[0072] For example, Figure 2 As shown, the above-mentioned conveying unit 1 includes a conveying belt 1-1, a conveying film layer 1-2 and a conveying film layer loading mechanism 1-3.

[0073] The bottom surface of the transmission film layer is adhered to the transmission belt, and the top surface of the transmission film layer contacts the bottom surface of the optical wafer to be processed which is coated with the functional film.

[0074] An example of a film layer feeding mechanism includes a first driving motor and a feeding roller.

[0075] The first driving motor is connected to the feeding roller. One end of the conveying film layer is arranged on the feeding roller, and the other end of the conveying film layer is adhered to the conveyor belt.

[0076] The first drive motor drives the loading roller to rotate to unwind the conveying film layer. During the conveying process, the conveyor belt drives the bottom surface of the unwound conveying film layer to adhere to the conveyor belt, and the top surface of the conveying film layer contacts the bottom surface of the optical wafer to be processed with the coated functional film.

[0077] The film layer is automatically transported on the conveyor belt through the film layer loading mechanism.

[0078] The above-mentioned conveying film layer preferably adopts a non-sticky film, so as to avoid the subsequent scrubbing burden of the sticky conveying film layer by the scrubbing unit. When the conveying film layer adopts a non-sticky film, the bottom surface of the non-sticky film can be bonded to the sticky conveyor belt. The non-sticky film can adopt the existing PET film.

[0079] As a preferred embodiment, a plurality of adhesive protective films are disposed on the top surface of the conveying film layer at intervals.

[0080] The shape of each adhesive protective film is consistent with the shape of the optical wafer to be processed, the size of each adhesive protective film is not larger than the size of the optical wafer to be processed, and the distance between adjacent adhesive protective films is equal to the diameter of the optical wafer to be processed.

[0081] When the transport film layer adopts a non-sticky film, the sticky protective film area set on the top surface of the transport film layer can increase the connection performance between the transport film layer and the bottom surface of the optical wafer to be processed which is coated with a functional film. The size of the sticky protective film is designed to be no larger than the size of the optical wafer to be processed so as to avoid the scrubbing burden of the subsequent scrubbing unit on the sticky protective film. The arrangement of multiple sticky protective films at intervals on the top surface of the transport film layer can improve the transmission efficiency of the conveyor belt to the optical wafer to be processed, thereby improving the processing efficiency of the optical wafer to be processed.

[0082] The above-mentioned adhesive protective film can be an existing adhesive protective film.

[0083] For example, Figure 3 As shown, the spray unit 2 includes a spray chamber 2-1, a first delivery pipe 2-2 and a first nozzle 2-3.

[0084] A first delivery pipe is arranged inside the spray chamber, one end of the first delivery pipe is connected to the spray solvent storage unit through a first delivery pump, and a plurality of spray solvent outlets are arranged at intervals at the other end of the first delivery pipe, each spray solvent outlet is provided with a first nozzle.

[0085] When the conveying unit delivers the top surface of the optical wafer to be processed with the imprinting colloid into the spraying unit, the spray solvent in the spray solvent storage unit is sprayed downward from the inside of the spray chamber through the first delivery pipe and the first nozzle, and the spray solvent sprays and wets the top surface of the optical wafer to be processed with the imprinting colloid.

[0086] The spray solvent herein can be, for example, perchloric acid. The spray solvent storage unit herein can be a spray solvent storage tank. The first delivery pump herein can be powered by direct pressurization of an impeller pump or by pressurizing the spray solvent storage unit using compressed air. The first nozzle herein can be an existing nozzle.

[0087] For example, Figure 4 As shown, the scrubbing unit 3 includes a wiping component unwinding mechanism 3-1, a wiping component wetting mechanism 3-2, a wiping component driving mechanism 3-3, and a wiping component rewinding mechanism 3-4 which are arranged in sequence.

[0088] The wiping component unwinding mechanism 3-1 is close to the spraying unit, and the wiping component winding mechanism 3-4 is close to the cleaning unit.

[0089] The unwinding end of the wiping member 3 - 5 is provided on the wiping member unwinding mechanism 3 - 1 , and the winding end of the wiping member 3 - 5 is provided on the wiping member winding mechanism 3 - 4 .

[0090] A first pressing roller 3-6 is provided on the top surface of the wiping component 3-5 near the unwinding mechanism 3-1 of the wiping component, and a second pressing roller 3-7 is provided on the top surface of the wiping component 3-5 near the rewinding mechanism 3-4 of the wiping component. The first pressing roller 3-6 and the second pressing roller 3-7 enable the bottom surface of the wiping component to contact the top surface of the optical wafer to be processed having the embossed colloid.

[0091] When the conveying unit sends the top surface of the optical wafer to be processed with the imprinted colloid into the scrubbing unit, the wiping component unwinding mechanism unwinds the wiping component, and the wiping component rewinding mechanism rewinds the wiping component, and the bottom surface of the wiping component is brought into contact with the top surface of the optical wafer to be processed with the imprinted colloid through the first pressure roller and the second pressure roller. As the wiping component and the top surface of the optical wafer to be processed with the imprinted colloid enter the wiping component wetting mechanism together, the wiping component wetting mechanism sprays solvent downward so that the wiping component in contact with the top surface of the optical wafer to be processed with the imprinted colloid is in a wet state. Then the wiping component in a wet state and the top surface of the optical wafer to be processed with the imprinted colloid enter the wiping component driving mechanism together. The wiping component driving mechanism drives the wiping component in a wet state to frictionally clean the top surface of the optical wafer to be processed with the imprinted colloid, thereby removing the imprinted colloid on the top surface of the optical wafer to be processed.

[0092] Exemplarily, the wiping component unwinding mechanism includes a second drive motor and an unwinding roller, and the wiping component rewinding mechanism includes a third drive motor and a rewinding roller.

[0093] The second driving motor is connected to the unwinding roller, and the unwinding end of the wiping component is arranged on the unwinding roller. The third driving motor is connected to the winding roller, and the winding end of the wiping component is arranged on the winding roller.

[0094] Exemplarily, the wiping component infiltration mechanism includes a wiping component infiltration chamber 3-2-1, a second delivery pipe 3-2-2 and a second nozzle 3-2-3 (such as Figure 4 shown).

[0095] A second delivery pipe is provided inside the wiping component infiltration chamber. One end of the second delivery pipe is connected to the infiltration solvent storage unit through a second delivery pump. The other end of the second delivery pipe is provided with multiple infiltration solvent outlets, each of which is provided with a second nozzle.

[0096] The infiltration solvent is preferably perchloric acid, and the infiltration solvent storage unit can be an infiltration solvent storage tank. The second delivery pump can be powered by an impeller pump directly boosting the pressure or by using compressed air to pressurize the infiltration solvent storage unit. The second nozzle can be an existing nozzle.

[0097] Exemplarily, the wiping component driving mechanism includes a fourth driving motor, a transmission plate and a friction plate.

[0098] One side of the transmission plate is connected to the fourth driving motor, and a plurality of friction plates are arranged at intervals on the other side of the transmission plate, and the friction plates are in contact with the top surface of the wiping component.

[0099] For example, Figure 5 As shown, the cleaning unit 4 includes a cleaning chamber 4-1, a third delivery pipe 4-2 and a third nozzle 4-3.

[0100] A third delivery pipe is provided inside the cleaning chamber, one end of the third delivery pipe is connected to the cleaning solvent storage unit through a third delivery pump, and the other end of the third delivery pipe is provided with multiple cleaning solvent outlets, each of which is provided with a third nozzle.

[0101] When the conveying unit delivers the top surface of the optical wafer to be processed into the cleaning unit, the cleaning solvent in the cleaning solvent storage unit is sprayed downward from the inside of the cleaning chamber through the third delivery pipe and the third nozzle, and the cleaning solvent sprays and cleans the top surface of the optical wafer to be processed.

[0102] The cleaning solvent may be, for example, a two-fluid system consisting of nitrogen and pure water. The cleaning solvent storage unit may be a cleaning solvent storage tank. The third delivery pump may use compressed air to pressurize the cleaning solvent storage unit to generate delivery power, and the third nozzle may be an existing nozzle.

[0103] For example, Figure 6 As shown, the drying unit 5 includes a drying chamber 5-1, a fourth conveying pipe 5-2 and an air knife 5-3.

[0104] A fourth delivery pipeline is provided inside the drying chamber, one end of the fourth delivery pipeline is connected to the dry gas storage unit through a fourth delivery pump, and an air knife is provided at the other end of the fourth delivery pipeline.

[0105] When the conveying unit delivers the top surface of the optical wafer to be processed into the drying unit, the dry gas in the dry gas storage unit is transmitted downward from the inside of the drying chamber through the third delivery pipe and the air knife, and the dry gas dries the top surface of the optical wafer to be processed.

[0106] The dry gas here can be air, the dry gas storage unit can be a dry gas storage tank, the fourth delivery pump here can use compressed air to pressurize the dry gas storage unit to obtain delivery power, and the wind knife here can use an existing wind knife.

[0107] For example, Figure 7 As shown, the protective film layer feeding unit 6 includes the protective film layer feeding mechanism 6 - 1 and the protective film layer 6 - 2 , wherein the protective film layer feeding mechanism example includes a fifth driving motor and a feeding roller.

[0108] The fifth driving motor is connected to the feeding roller.

[0109] One end of the protective film layer 6 - 2 is set on the feeding roller, and the other end of the protective film layer 6 - 2 is bonded to the top surface of the optical wafer to be processed through the third pressing roller 6 - 3 .

[0110] When the conveying unit feeds the top surface of the optical wafer to be processed into the protective film layer feeding unit, the fifth drive motor drives the unwinding roller to rotate to unwind the protective film layer, and the third pressure roller covers the protective film layer on the top surface of the optical wafer to be processed.

[0111] The above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the same. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in the relevant field can still modify or replace the specific implementation methods of the present invention. Any modifications or equivalent replacements that do not depart from the spirit and scope of the present invention are within the scope of protection of the claims of the present invention to be approved.

Claims

1. An optical wafer imprint colloid removal device, characterized in that: It includes a conveying unit, a spraying unit, a scrubbing unit, a cleaning unit and a drying unit; The spray unit, scrubbing unit, cleaning unit and drying unit are arranged above the conveying unit; The conveying unit contacts the bottom surface of the optical wafer to be processed with the functional film, and sequentially delivers the top surface of the optical wafer to be processed with the imprinted colloid to the spraying unit, the scrubbing unit, the cleaning unit and the drying unit.

2. The optical wafer imprint colloid removal device according to claim 1, characterized in that: The conveying unit includes a conveying belt and a conveying film layer; The bottom surface of the transmission film layer is adhered to the transmission belt, and the top surface of the transmission film layer contacts the bottom surface of the optical wafer to be processed which is coated with a functional film.

3. The optical wafer imprint colloid removal device according to claim 2, characterized in that: The conveying unit also includes a conveying film layer loading mechanism; The film layer feeding mechanism includes a first driving motor and a feeding roller; The first drive motor is connected to the feeding roller; One end of the conveying film layer is arranged on the feeding roller, and the other end of the conveying film layer is adhered to the conveyor belt.

4. The optical wafer imprint colloid removal device according to claim 2, characterized in that: A plurality of adhesive protective films are arranged at intervals on the top surface of the transmission film layer; The shape of each adhesive protective film is consistent with the shape of the optical wafer to be processed, the size of each adhesive protective film is not larger than the size of the optical wafer to be processed, and the distance between adjacent adhesive protective films is equal to the diameter of the optical wafer to be processed.

5. The optical wafer imprint colloid removal device according to claim 1, characterized in that: The spray unit includes a spray chamber, a first delivery pipe and a first nozzle; A first delivery pipe is provided inside the spray chamber, one end of the first delivery pipe is connected to the spray solvent storage unit through a first delivery pump, and a plurality of spray solvent outlets are provided at intervals at the other end of the first delivery pipe, each spray solvent outlet is provided with a first nozzle.

6. The optical wafer imprint colloid removal device according to claim 1, characterized in that: The scrubbing unit includes a wiping component unwinding mechanism, a wiping component wetting mechanism, a wiping component driving mechanism, and a wiping component rewinding mechanism which are arranged in sequence; The wiping component unwinding mechanism is close to the spraying unit, and the wiping component rewinding mechanism is close to the cleaning unit; The unwinding end of the wiping component is arranged on the wiping component unwinding mechanism, and the winding end of the wiping component is arranged on the wiping component winding mechanism; The wiping component is provided with a first pressing roller on the top surface close to the unwinding mechanism of the wiping component, and a second pressing roller on the top surface close to the rewinding mechanism of the wiping component. The bottom surface of the wiping component can contact the top surface of the optical wafer to be processed with the embossed colloid through the first pressing roller and the second pressing roller.

7. The optical wafer imprint colloid removal device according to claim 6, characterized in that: The wiping component unwinding mechanism includes a second driving motor and an unwinding roller; The second driving motor is connected to the unwinding roller, and the unwinding end of the wiping member is arranged on the unwinding roller; The wiping component winding mechanism includes a third driving motor and a winding roller; The third driving motor is connected to the winding roller, and the winding end of the wiping component is arranged on the winding roller.

8. The optical wafer imprint colloid removal device according to claim 6, characterized in that: The wiping component infiltration mechanism includes a wiping component infiltration chamber, a second delivery pipe and a second nozzle; A second delivery pipe is provided inside the wiping component infiltration chamber, one end of the second delivery pipe is connected to the infiltration solvent storage unit via a second delivery pump, and the other end of the second delivery pipe is provided with a plurality of infiltration solvent outlets, each of which is provided with a second nozzle; The wiping component driving mechanism includes a fourth driving motor, a transmission plate and a friction plate; One side of the transmission plate is connected to the fourth driving motor, and a plurality of friction plates are arranged at intervals on the other side of the transmission plate, and the friction plates are in contact with the top surface of the wiping component.

9. The optical wafer imprint colloid removal device according to claim 1, characterized in that: The cleaning unit includes a cleaning chamber, a third delivery pipe and a third nozzle; A third delivery pipe is provided inside the cleaning chamber, one end of the third delivery pipe is connected to the cleaning solvent storage unit through a third delivery pump, and the other end of the third delivery pipe is provided with multiple cleaning solvent outlets, each of which is provided with a third nozzle.

10. The optical wafer imprint colloid removal device according to claim 1, characterized in that: The drying unit includes a drying chamber, a fourth conveying pipe and an air knife; A fourth delivery pipe is provided inside the drying chamber, one end of the fourth delivery pipe is connected to the dry gas storage unit via a fourth delivery pump, and an air knife is provided at the other end of the fourth delivery pipe.

11. The optical wafer imprint colloid removal device according to claim 1, characterized in that: It also includes a protective film layer feeding unit, which is arranged above the conveying unit; The protective film layer feeding unit includes a fifth driving motor, a feeding roller, and a protective film layer; The fifth driving motor is connected to the feeding roller; One end of the protective film layer is arranged on the feeding roller, and the other end of the protective film layer is adhered to the top surface of the optical wafer to be processed through a third pressing roller.

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