Thermal management hard disk cartridge and mobile hard disk

Abstract

The utility model discloses a thermal management hard disk cartridge and a mobile hard disk, a hard disk area is formed in the thermal management hard disk cartridge for placing a hard disk; the heat management hard disk box comprises a heat dissipation unit, a heat conduction unit and a heat storage unit, the heat dissipation unit comprises a box body and a cover plate assembly, the cover plate assembly and the box body are detachably arranged, a hard disk area is arranged in the box body, the heat conduction unit comprises at least one heat conduction layer, and the heat conduction layer is arranged in the box body and is adjacent to at least one side of the hard disk area. The heat storage unit comprises at least one heat storage layer, and the heat storage layer is arranged in the box body and is adjacent to the corresponding heat conduction layer and / or the hard disk area. Through the structure, the heat dissipation effect of the heat management hard disk box can be improved, the environment temperature when the hard disk works is reduced, the working performance of the hard disk is guaranteed, the external temperature of the heat management hard disk box is reduced, and the heat management hard disk box is convenient to move or hold.

Description

Technical Field

[0001] The utility model is applied to the technical field of thermal management, in particular to a thermal management hard disk box and a mobile hard disk. Background Art

[0002] Mobile hard drives or mobile hard drive enclosures are currently the best way of portable storage, especially with the rapid development of hard drive technology today. Mobile hard drives or hard drive enclosures with portability, large capacity, and high-speed reading and writing are accepted by consumers in various scenarios, such as photography, office storage, and gaming.

[0003] During high-speed read and write operations, the main control chip and storage devices inside a mobile hard drive heat up rapidly. When the internal temperature reaches the threshold set by the chip or storage devices, read and write speeds may decrease, and the drive may even drop. Furthermore, as a portable consumer electronic product, the surface temperature experience is a key factor in product definition. As the temperature of the internal electronic components rises, the surface temperature of the product also rises. Currently, the measured temperature of mainstream products is around 60°C. For products with a plastic exterior, 60°C is already too hot to touch, while metal exteriors can feel stinging and even pose a risk of burns.

[0004] Therefore, solving the temperature problem of portable mobile storage hard drives and hard drive enclosures is very important for the product. Utility Model Content

[0005] The utility model provides a heat management hard disk box and a mobile hard disk to solve the temperature rise problem of the hard disk.

[0006] In order to solve the above technical problems, the utility model provides a thermal management hard disk box, including: a heat dissipation unit, a heat conduction unit and a heat storage unit, the heat dissipation unit includes a box body and a cover assembly, the cover assembly and the box body are detachable, the hard disk area is arranged in the box body, the heat conduction unit includes at least one heat conductive layer, the heat conductive layer is arranged in the box body, and is adjacent to at least one side of the hard disk area, the heat storage unit includes at least one heat storage layer, the heat storage layer is arranged in the box body, and is adjacent to the corresponding heat conductive layer and / or hard disk area.

[0007] Among them, the thermal management hard disk box also includes a target circuit board, which is arranged in the box body, and a hard disk area is formed on the side of the target circuit board close to the cover assembly for installing the hard disk; the heat conductive layer includes a first heat conductive layer, and the heat storage unit includes a first heat storage layer and a second heat storage layer; the first heat conductive layer and the first heat storage layer are arranged between the side of the target circuit board close to the cover assembly and the cover assembly; a second heat storage layer is also provided on the side of the target circuit board close to the box body, and the second heat storage layer is arranged in contact with the box body on the side away from the target circuit board.

[0008] Among them, the hard disk area is a partial area of ​​the target circuit board on the side close to the cover assembly; another partial area of ​​the target circuit board on the side close to the cover assembly is bonded to the first heat storage layer, and the side of the first heat storage layer away from the target circuit board is bonded to the cover assembly; the side of the hard disk area close to the cover assembly is adjacent to the first heat conductive layer, and the side of the first heat conductive layer away from the hard disk area is bonded to the cover assembly; or the first heat conductive layer is bonded to the first heat storage layer and stacked, the side of the first heat conductive layer away from the first heat storage layer is bonded to the hard disk area and the target circuit board, and the side of the first heat storage layer away from the first heat conductive layer is bonded to the cover assembly.

[0009] The heat-conducting layer further includes a second heat-conducting layer; the second heat-conducting layer is sandwiched and bonded between the second heat storage layer and the target circuit board.

[0010] Among them, the cover plate assembly includes a breathable mechanism, a hydrogel layer and a cover plate stacked in sequence; the cover plate and the box body are detachable; the hydrogel layer is attached to the side of the cover plate away from the box body; and the breathable mechanism is fixedly arranged on the side of the hydrogel layer away from the box body.

[0011] In which, a plurality of fixing holes are provided on the first side surface of the cover plate, a spring is fixedly provided in the fixing hole, and a side of the spring away from the fixing hole is fixedly provided with a fixing ball, wherein a side of the fixing ball away from the spring is exposed; a plurality of protrusions are fixedly provided on the second side surface of the cover plate; the second side surface is opposite to the first side surface; a recessed area is provided on the inner side of the box body at a position corresponding to each fixing hole, and the recessed area is used to engage the fixing ball; a groove is provided on the inner side of the box body at a position corresponding to each protrusion, for engaging the protrusion.

[0012] Among them, the breathable mechanism includes a support plate and a breathable fabric layer; the support plate is fitted on the side of the hydrogel layer away from the cover plate, and multiple hollow areas are provided on the support plate; the breathable fabric is provided on the side of the support plate away from the cover plate, and covers the support plate and the edges of the cover plate to be fixed to the cover plate.

[0013] A heat dissipation pattern is formed on one side of the box body away from the cover plate; the heat dissipation pattern includes one or more of columnar, corrugated, string, fin, convex strip, convex point or convex pattern.

[0014] The heat-conducting layer includes a heat-conducting silicone layer, and the heat storage layer includes a phase change layer.

[0015] In order to solve the above technical problems, the utility model also provides a mobile hard disk, which includes a thermal management hard disk box and a hard disk; the thermal management hard disk box includes any of the above thermal management hard disk boxes; the hard disk is fixedly arranged in the hard disk area of ​​the thermal management hard disk box.

[0016] To address the aforementioned technical issues, the present invention features a thermally managed hard drive enclosure that includes a heat dissipation unit, a heat conduction unit, and a heat storage unit. The heat conduction unit conducts heat to the heat dissipation unit for dissipation or to the heat storage unit for storage; the heat storage unit absorbs heat to lower the ambient temperature; and the heat dissipation unit dissipates the heat to the outside environment. These three units, combined, enhance the enclosure's heat dissipation, lowering the ambient temperature of the hard drive during operation, ensuring the hard drive's performance, while also reducing the enclosure's external temperature for easier movement and handling. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic cross-sectional view of the first embodiment of the thermal management hard disk enclosure provided by the present invention;

[0018] Figure 2 This is a schematic diagram of the exploded structure of the second embodiment of the thermal management hard disk enclosure provided by the present invention;

[0019] Figure 3 This is a schematic cross-sectional view of the second embodiment of the thermal management hard disk enclosure provided by the present invention;

[0020] Figure 4 This is an overall schematic diagram of the second embodiment of the thermal management hard disk enclosure provided by the present invention;

[0021] Figure 5 1 is a bottom view schematic diagram of an embodiment of a first heat conducting layer and a first heat storage layer;

[0022] Figure 6 This is a schematic diagram of the exploded structure of an embodiment of a cover plate assembly;

[0023] Figure 7 is a bottom view schematic diagram of an embodiment of a thermal management hard disk enclosure;

[0024] Figure 8 is a cross-sectional schematic diagram of an embodiment of a cover plate and a box body;

[0025] Figure 9 It is a schematic cross-sectional structural diagram of the third embodiment of the thermal management hard disk enclosure provided by the present invention. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0027] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0028] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features specified as "first" or "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0029] See also Figure 1 , Figure 1 It is a schematic cross-sectional structural diagram of the first embodiment of the thermal management hard disk enclosure provided by the present invention.

[0030] The thermally managed hard drive enclosure 1000 of this embodiment includes a hard drive area 1020 for accommodating a hard drive. The thermally managed hard drive enclosure 1000 of this embodiment refers to a housing structure that does not include a hard drive, including but not limited to a mobile hard drive enclosure, a solid-state hard drive enclosure, or a mechanical hard drive enclosure. Hard drive types include but are not limited to solid-state hard drives, mechanical hard drives, or hybrid hard drives.

[0031] The thermal management hard disk enclosure 1000 specifically includes: a heat dissipation unit 1030, a heat conduction unit 1040, and a heat storage unit 1010. When the thermal management hard disk enclosure 1000 is loaded with a hard disk and is in operation, the hard disk in the hard disk area 1020 generates a heat source. The heat conduction unit 1040 is used to conduct the heat to the heat dissipation unit 1030 for heat dissipation, or to the heat storage unit 1010 for heat storage; the heat storage unit 1010 is used to absorb heat to reduce the ambient temperature; and the heat dissipation unit 1030 is used to diffuse the heat into the external environment. The combination of the above three units improves the heat dissipation effect of the thermal management hard disk enclosure 1000, reduces the ambient temperature of the hard disk during operation, ensures the working performance of the hard disk, and reduces the external temperature of the thermal management hard disk enclosure 1000 to facilitate movement or handling.

[0032] Specifically, the heat dissipation unit 1030 includes a housing 3001 and a cover assembly 1003. The cover assembly 1003 and the housing 3001 are detachable, and the hard disk area 1020 is disposed within the housing 3001. In a specific application scenario, the cover assembly 1003 and the housing 3001 can be configured by silicone locking, screw hinge connection, threaded connection, locking arrangement with a locking member, or riveting, etc., the specific details of which are not limited here.

[0033] The materials of the box body 3001 and the cover assembly 1003 include but are not limited to ordinary plastic or metal shells, such as aluminum alloy, polypropylene or high-density polyethylene, etc.

[0034] The heat transfer unit 1040 includes at least one heat-conducting layer 1041. The heat-conducting layer 1041 is disposed within the housing 3001 and adjacent to at least one side of the hard drive area 1020 to accelerate the conduction of heat within the hard drive area 1020. The heat-conducting layer 1041 includes, but is not limited to, heat-dissipating graphite sheets, thermal grease, aluminum or copper vapor chambers, vacuum chambers (VCs), heat pipes, and other structures.

[0035] The heat storage unit 1010 includes at least one heat storage layer 1011, which is disposed within the enclosure 3001 and adjacent to the corresponding heat conductive layer 1041 and / or hard disk area 1020. The heat storage layer 1011 can temporarily store heat within the heat storage layer 1011, effectively delaying the diffusion of heat to the heat dissipation unit 1030, thereby reducing the outer shell temperature of the thermal management hard disk enclosure 1000.

[0036] Through the above structure, this embodiment of the thermal management hard drive enclosure includes a heat dissipation unit, a heat conduction unit, and a heat storage unit. The heat conduction unit conducts heat to the heat dissipation unit for dissipation or to the heat storage unit for storage; the heat storage unit absorbs heat to lower the ambient temperature; and the heat dissipation unit dissipates heat to the outside environment. These three units, combined, enhance the heat dissipation efficiency of the thermal management hard drive enclosure, lowering the ambient temperature of the hard drive during operation, ensuring the hard drive's performance, and reducing the external temperature of the thermal management hard drive enclosure for easier movement and handling.

[0037] Please see further Figure 2-4 , Figure 2 This is a schematic diagram of the exploded structure of the second embodiment of the thermal management hard disk enclosure provided by the present utility model. Figure 3 This is a cross-sectional structural diagram of the second embodiment of the thermal management hard disk enclosure provided by the present invention. Figure 4 This is a schematic diagram of the second embodiment of the thermal management hard drive enclosure provided by the present invention. The configuration of the heat dissipation unit, heat conduction unit, and heat storage unit in this embodiment is the same as in the previous embodiment. While the above diagram illustrates a hard drive installed in the thermal management hard drive enclosure, this embodiment's thermal management hard drive enclosure and hard drive are removable.

[0038] In some embodiments, the thermal management hard disk enclosure 200 further includes a target circuit board 201, which is used to connect to the hard disk 202 to implement a card reading function for the hard disk 202. The target circuit board 201 is disposed within the enclosure body 301, and a hard disk area 2021 is formed on the side of the target circuit board 201 near the cover assembly 110 for mounting the hard disk 202. When the hard disk 202 is mounted on the hard disk area 2021, the hard disk 202 is connected to the target circuit board 201.

[0039] The heat conducting layer includes a first heat conducting layer 105 , and the heat storage unit includes a first heat storage layer 104 and a second heat storage layer 302 .

[0040] In a specific application scenario, the thermal conductive layer includes a thermal conductive silicone layer. The thermal conductive silicone layer has high thermal conductivity, can quickly conduct heat, and utilizes the characteristics of temperature transfer from high temperature to low temperature to play a role in rapid temperature equalization.

[0041] The heat storage layer includes a phase change layer, which contains a phase change material. This material can be phase change paraffin, phase change acetic acid, crystalline hydrated salts, molten salts, or metal or alloy materials, among others, though these are not specifically defined. The phase change layer primarily contacts the heat conduction unit and the heat dissipation unit. By utilizing the phase change properties of the phase change layer, which absorbs and releases heat through phase change, the heat transferred from the heat conduction layer is temporarily stored in the phase change layer. This effectively slows the spread of heat to the heat dissipation unit of the product housing, thereby reducing the outer shell temperature of the thermally managed hard drive enclosure 200 and the ambient temperature of the hard drive 202. The principle of temperature management in the phase change layer is that when the ambient temperature surrounding the phase change layer exceeds the phase change temperature point of the phase change layer itself, the phase change layer undergoes a phase change. This phase change process is endothermic, absorbing ambient heat. When the ambient temperature surrounding the phase change layer falls below the phase change temperature point, the stored heat is slowly released, thereby utilizing the phase change layer to temporarily "store" thermal energy. The phase change temperature point of the phase change layer and its heat absorption capacity (enthalpy) are physical properties that can be adjusted according to needs.

[0042] The first heat-conducting layer 105 and the first heat storage layer 104 are disposed between the cover assembly 110 and a side of the target circuit board 201 close to the cover assembly 110 .

[0043] In a specific application scenario, please refer to Figure 5 , Figure 5 It is a bottom view schematic diagram of an embodiment of the first heat conducting layer and the first heat storage layer.

[0044] The hard disk area 2021 is a partial area on the side of the target circuit board 201 close to the cover assembly 110. That is, the size of the hard disk 202 is smaller than that of the target circuit board 201. When the hard disk 202 is installed on the hard disk area 2021, it is only attached to a portion of the target circuit board 201. In this case, the first thermal conductive layer 105 and the first heat storage layer 104 can be arranged side by side. Specifically, another partial area on the side of the target circuit board 201 close to the cover assembly 110 is directly attached to the first heat storage layer 104, and the side of the first heat storage layer 104 away from the target circuit board 201 is attached to the cover assembly 110; the side of the hard disk area 2021 close to the cover assembly 110 is adjacent to the first thermal conductive layer 105, and the side of the first thermal conductive layer 105 away from the hard disk area 2021 is attached to the cover assembly 110.

[0045] When the hard disk 202 is installed in the hard disk area 2021 , the side of the hard disk 202 away from the target circuit board 201 is in contact with the first heat conducting layer 105 .

[0046] In other application scenarios, the positions of the first heat-conducting layer 105 and the first heat storage layer 104 can be interchanged based on the above application scenarios, that is, the first heat storage layer 104 is placed adjacent to the hard disk area 2021, and the first heat-conducting layer 105 is placed in contact with the target circuit board 201. The specific setting is based on actual needs and is not limited.

[0047] When the hard disk 202 and the target circuit board 201 are working, heat can enter the first heat storage layer 104 for heat storage, and to a certain extent, be conducted by the first heat storage layer 104 to the cover plate assembly 110 of the heat dissipation unit for heat dissipation. Heat can also be conducted by the first heat conductive layer 105 to the cover plate assembly 110 of the heat dissipation unit for heat dissipation, or conducted to the first heat storage layer 104 for heat storage, thereby reducing the ambient temperature when the hard disk 202 and the target circuit board 201 are working.

[0048] A second heat storage layer 302 is provided on the side of the target circuit board 201 close to the box body 301, and the side of the second heat storage layer 302 away from the target circuit board 201 is arranged in contact with the box body 301. When the hard disk 202 and the target circuit board 201 are working, heat can enter the second heat storage layer 302 for heat storage and be conducted to a certain extent by the second heat storage layer 302 to the box body 301 of the heat dissipation unit for heat dissipation.

[0049] The second heat storage layer 302, first heat conductive layer 105, and first heat storage layer 104 can all be secured within the box body 301 by applying glue. In this embodiment, components other than the heat storage layer do not provide insulation; instead, they function as heat transfer devices. The first heat conductive layer 105 and first heat storage layer 104 are anchored to the cover plate assembly 110, while the second heat storage layer 302 is anchored to the box body 301.

[0050] The above solution utilizes the second heat storage layer 302, the first heat conductive layer 105, and the first heat storage layer 104 to absorb and transfer heat from opposite sides of the target circuit board 201 and the hard disk 202, respectively, thereby improving the heat dissipation efficiency and temperature equalization effect of the target circuit board 201 and the hard disk 202, and ensuring the working performance of the target circuit board 201 and the hard disk 202.

[0051] In some embodiments, please refer to Figure 6 , Figure 6 The cover assembly 110 includes a breathable structure 111, a hydrogel layer 102, and a cover 103 stacked in sequence. The cover 103 and the box body 301 are detachable to facilitate the removal of the hard drive 202.

[0052] The hydrogel layer 102 is attached to the side of the cover plate 103 away from the box body 301 ; the venting mechanism 111 is fixedly disposed on the side of the hydrogel layer 102 away from the box body 301 .

[0053] The ventilation mechanism 111 may be a mechanism with a hollow structure, a breathable fabric, a breathable material layer, etc., which is not limited here.

[0054] The hydrogel layer 102 is a passive heat dissipation layer structure that rapidly dissipates heat through evaporation. By absorbing heat through cold air and volatilizing it, the hydrogel layer 102 achieves efficient and rapid cooling or temperature control. As the heat source cools, it continuously absorbs cold air from the air and replenishes it within the gel layer, enhancing subsequent heat dissipation. Once heat is transferred to the cover plate 103, the hydrogel layer 102 rapidly dissipates heat through evaporation through the breathable structure 111, rapidly dissipating the heat into the outside air.

[0055] In other embodiments, other layer structures with relatively high heat transfer coefficients may be provided in the cover plate assembly 110 to improve the heat dissipation efficiency of the outer surface, which is not specifically limited here.

[0056] In some embodiments, the ventilation mechanism 111 includes a support plate 101 and a breathable fabric layer 100. The support plate 101 is positioned in contact with the side of the hydrogel layer 102 facing away from the cover plate 103. The support plate 101 is provided with a plurality of hollow areas 106. The shapes of the hollow areas 106 include, but are not limited to, holes, squares, triangles, trapezoids, diamonds, or irregular shapes. The hollow areas 106 are provided to ensure an air passage from the hydrogel layer 102 to the outer surface of the breathable fabric layer 100, thereby ensuring effective heat dissipation.

[0057] The breathable fabric layer 100 is disposed on the side of the support plate 101 away from the cover plate 103, and wraps around the edges of the support plate 101 and the cover plate 103 to secure them to the cover plate 103. The breathable fabric layer 100 can be evenly wrapped and secured by applying glue. The wrapping and securing between the breathable fabric layer 100 and the cover plate 103 simultaneously secures the support plate 101 and the hydrogel layer 102 to the cover plate assembly 110.

[0058] The support plate 101 may include, but is not limited to, materials such as a plastic plate and a leather sheet.

[0059] Among them, although the ventilation mechanism 111 has a ventilation function, the setting of the cover 103 can make the interior of the box body 301 waterproof and dustproof, thereby achieving compatibility of efficient heat dissipation and waterproof and dustproof.

[0060] In some embodiments, further reference is made to Figure 7 , Figure 7 This is a bottom view schematic diagram of an embodiment of a thermal management hard disk enclosure.

[0061] A heat dissipation pattern 303 is formed on one side of the box body 301 away from the cover plate 103 ; the heat dissipation pattern 303 includes one or more of columnar, corrugated, string, fin, convex strip, convex point or convex pattern, etc., which is not limited here.

[0062] By setting a heat dissipation pattern 303 on the side of the box body 301 away from the cover 103, the heat dissipation area on this side is increased, the heat dissipation efficiency of the box body 301 is improved, and the thermal management effect of the entire thermal management hard disk box 200 is further improved.

[0063] In some embodiments, a lifting rope 300 is fixed to the outer corner of the box body 301 to facilitate the movement of the thermal management hard disk box 200.

[0064] In some embodiments, the outer side of the box body 301 may also be covered with other hydrogel layers to further improve heat dissipation efficiency.

[0065] In some embodiments, please refer to Figure 8 , Figure 8 It is a cross-sectional schematic diagram of an embodiment of the cover plate and the box body.

[0066] A plurality of fixing holes 404 are provided on the first side surface 407 of the cover plate 103, and a spring 403 is fixedly installed in the fixing hole 404. The side of the spring 403 away from the fixing hole 404 is fixed to the fixing ball 402, wherein the side of the fixing ball 402 away from the spring 403 is exposed; a plurality of protrusions 405 are fixedly installed on the second side surface 408 of the cover plate 103; the second side surface 408 is opposite to the first side surface 407.

[0067] A recessed area 401 is provided on the inner side of the box body 301 at a position corresponding to each fixing hole 404 , and the recessed area 401 is used to engage the fixing ball 402 ; a groove 406 is provided on the inner side of the box body 301 at a position corresponding to each protrusion 405 , and is used to engage the protrusion 405 .

[0068] The number of fixing holes 404, springs 403, fixing balls 402, and recessed areas 401 can be 2, 3, or 4, etc., depending on actual needs and is not limited. The number of protrusions 405 and recesses 406 can be 2, 4, or 7, etc., depending on actual needs and is not limited.

[0069] When the cover 103 is mounted on the box body 301, the protrusion 405 engages in the groove 406, and the fixing ball 402 engages in the recessed area 401. By applying force to the cover 103, the spring 403 can be used to achieve detachability of the cover 103 from the box body 301. The schematic diagram is only for illustrative purposes; in practice, the dimensions of the cover 103 and the box body 301 match.

[0070] In other embodiments, the cover 103 and the box body 301 may be detachably mounted by screws.

[0071] Through the above structure, the thermal management hard disk box of this embodiment is provided with a heat conductive layer on the heat propagation path to accelerate heat transfer, a phase change layer is provided to act as a heat storage unit to absorb heat, and a hydrogel layer is used as a partial heat dissipation unit, and finally the heat is dissipated into the air by heat radiation through the box body and the cover assembly to achieve the purpose of heat dissipation. In this heat transfer path, due to the use of phase change materials and hydrogels, the internal and external temperatures of the mobile hard disk reach the expected effect, thereby improving the uniform temperature heat dissipation effect of the thermal management hard disk box and achieving excellent thermal management effect.

[0072] See further Figure 9 , Figure 9 It is a schematic cross-sectional structural diagram of the third embodiment of the thermal management hard disk enclosure provided by the present invention.

[0073] This embodiment differs from the above-mentioned embodiment only in the stacking structure of the heat-conducting layer and the heat storage layer; other structural features are the same and will not be described in detail.

[0074] The first heat-conducting layer 502 is adhered to and stacked with the first heat storage layer 501. The side of the first heat-conducting layer 502 away from the first heat storage layer 501 is adhered to the hard disk area 503 and the target circuit board 506. The side of the first heat storage layer 501 away from the first heat-conducting layer 502 is adhered to the cover assembly 110.

[0075] That is, the first thermal conductive layer 502, the first heat storage layer 501, and the target circuit board 506 of this embodiment can have the same dimensions. In some embodiments, the positions of the first thermal conductive layer 502 and the first heat storage layer 501 can also be interchanged, that is, the first heat storage layer 501 is adjacent to the hard disk area 503, and the first thermal conductive layer 502 is then positioned in contact with the side of the first heat storage layer 501 away from the hard disk area 503.

[0076] In some embodiments, the heat conductive layer further includes a second heat conductive layer 504; the second heat conductive layer 504 is sandwiched and adhered between the second heat storage layer 505 and the target circuit board 506 to transfer the heat of the target circuit board 506 to the second heat storage layer 505 for heat storage or to the housing.

[0077] When the hard disk and the target circuit board 506 are working, heat can enter the first heat-conducting layer 502 and be transferred by the first heat-conducting layer 502 to the first heat storage layer 501 for heat storage, and to a certain extent, be conducted by the first heat storage layer 501 to the heat dissipation unit for heat dissipation. Heat can also enter the second heat-conducting layer 504 and be transferred by the second heat-conducting layer 504 to the second heat storage layer 505 for heat storage, and to a certain extent, be conducted by the second heat storage layer 505 to the heat dissipation unit for heat dissipation.

[0078] In other embodiments, the heat-conducting layer and the heat storage layer may be provided in other numbers and at different stacking positions based on actual needs, which is not limited here.

[0079] Based on the same concept, the present invention also provides a mobile hard disk, which includes a thermal management hard disk box and a hard disk; the thermal management hard disk box includes the thermal management hard disk box of any of the above embodiments; the hard disk is fixedly arranged in the hard disk area of ​​the thermal management hard disk box.

[0080] The above structure can improve the heat dissipation effect of the mobile hard disk, reduce the ambient temperature of the hard disk when it is working, ensure the working performance of the hard disk, and reduce the external temperature of the mobile hard disk to facilitate moving or holding.

[0081] The above is only an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A thermal management hard disk enclosure, characterized in that: A hard disk area is formed in the thermal management hard disk box to accommodate the hard disk; the thermal management hard disk box includes: A heat dissipation unit, comprising a box body and a cover assembly, wherein the cover assembly and the box body are detachably arranged, and the hard disk area is arranged in the box body; a heat conduction unit, the heat conduction unit comprising at least one heat conduction layer, the heat conduction layer being disposed within the housing and adjacent to at least one side of the hard disk area; A heat storage unit includes at least one heat storage layer, which is arranged in the box body and adjacent to the corresponding heat conductive layer and / or the hard disk area.

2. The thermal management hard disk enclosure according to claim 1, wherein: The thermal management hard disk box further includes a target circuit board, which is disposed in the box body, and a side of the target circuit board close to the cover assembly forms the hard disk area for mounting the hard disk; The heat-conducting layer includes a first heat-conducting layer, and the heat storage unit includes a first heat storage layer and a second heat storage layer; The first heat-conducting layer and the first heat storage layer are arranged between the cover plate assembly and a side of the target circuit board close to the cover plate assembly; A second heat storage layer is further provided on a side of the target circuit board close to the box body, and a side of the second heat storage layer away from the target circuit board is arranged in contact with the box body.

3. The thermal management hard disk enclosure according to claim 2, characterized in that: The hard disk area is a portion of the target circuit board on a side close to the cover assembly; Another portion of the target circuit board's side close to the cover assembly is bonded to the first heat storage layer, and a side of the first heat storage layer away from the target circuit board is bonded to the cover assembly; a side of the hard disk area close to the cover assembly is adjacent to the first heat conductive layer, and a side of the first heat conductive layer away from the hard disk area is bonded to the cover assembly; or The first heat-conducting layer is adhered to and stacked with the first heat storage layer. The side of the first heat-conducting layer away from the first heat storage layer is adhered to the hard disk area and the target circuit board. The side of the first heat storage layer away from the first heat-conducting layer is adhered to the cover assembly.

4. The thermal management hard disk enclosure according to claim 2, wherein: The heat-conducting layer further includes a second heat-conducting layer; The second heat-conducting layer is sandwiched and adhered between the second heat storage layer and the target circuit board.

5. The thermal management hard disk enclosure according to any one of claims 1 to 4, characterized in that: The cover plate assembly includes a breathable structure, a hydrogel layer and a cover plate stacked in sequence; The cover plate and the box body are detachably arranged; The hydrogel layer is attached to a side of the cover away from the box body; The ventilation mechanism is fixedly arranged on a side of the hydrogel layer away from the box body.

6. The thermal management hard disk enclosure according to claim 5, characterized in that: A plurality of fixing holes are provided on a first side surface of the cover plate, a spring is fixedly provided in each of the fixing holes, and a side of the spring away from the fixing holes is fixedly provided with a fixing ball, wherein a side of the fixing ball away from the spring is exposed; a plurality of protrusions are fixedly provided on a second side surface of the cover plate; the second side surface is opposite to the first side surface; A recessed area is provided on the inner side of the box body at a position corresponding to each of the fixing holes, and the recessed area is used to engage the fixing ball; a groove is provided on the inner side of the box body at a position corresponding to each of the protruding pieces, and is used to engage the protruding pieces.

7. The thermal management hard disk enclosure according to claim 5, characterized in that: The ventilation mechanism includes a support plate and a breathable fabric layer; The support plate is arranged in contact with a side of the hydrogel layer away from the cover plate, and a plurality of hollow areas are provided on the support plate; The breathable fabric is arranged on a side of the support plate away from the cover plate, and covers the support plate and the edges around the cover plate to be fixed to the cover plate.

8. The thermal management hard disk enclosure according to any one of claims 1 to 4, characterized in that: A heat dissipation pattern is formed on a side of the box body away from the cover plate; The heat dissipation pattern includes one or more of a columnar pattern, a corrugated pattern, a string of sheets, a fin pattern, a convex strip pattern, a convex point pattern or a convex pattern.

9. The thermal management hard disk enclosure according to any one of claims 1 to 4, characterized in that: The heat-conducting layer includes a heat-conducting silica gel layer, and the heat storage layer includes a phase change layer.

10. A mobile hard disk, characterized in that: The mobile hard disk includes a thermal management hard disk enclosure and a hard disk; the thermal management hard disk enclosure includes the thermal management hard disk enclosure according to any one of claims 1 to 9 above; The hard disk is fixedly arranged in the hard disk area of ​​the thermal management hard disk box.

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