Jig

Abstract

A jig is used for the packaging operation of a semiconductor module, and comprises a base, the interior of the base is provided with a concave part area used for accommodating the semiconductor module, and the interior of the concave part area is provided with a projection used for supporting the first surface of the semiconductor module; a connecting piece; and the pressing plate piece is arranged above the base through the connecting piece and is used for applying pressure to the second surface of the semiconductor module. According to the invention, the warping phenomenon of the semiconductor module can be effectively avoided, so that the flatness of a product is improved, and the product meets corresponding standard requirements.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and more particularly to a fixture. Background Art

[0002] During packaging operations, the requirements for the flatness of semiconductor modules are becoming increasingly stringent, taking into account the requirements for subsequent operations such as machine loading. Therefore, it is crucial to control the flatness of the product during the packaging process.

[0003] Taking the packaging of power device modules as an example, the specific process is: first, the chip is mounted on the packaging substrate, and then the chip / solder / packaging substrate and other materials are firmly welded together through SMT (Surface Mounted Technology) vacuum reflow.

[0004] However, during the high-temperature reflow process, the inconsistent temperatures above and below the semiconductor module cause the packaging substrate to warp, which in turn causes the product's flatness to fail to meet the corresponding specification requirements. Utility Model Content

[0005] The Summary of the Utility Model introduces a series of simplified concepts that will be further described in the Detailed Description of the Implementation Method. The Summary of the Utility Model of this application is not intended to limit the key features and essential technical features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0006] In response to the existing problems, the present application provides a jig for semiconductor module packaging operations, the jig comprising:

[0007] a base, wherein the base is provided with a recessed area for accommodating the semiconductor module, and wherein the recessed area is provided with a protrusion for supporting the first surface of the semiconductor module;

[0008] Connectors;

[0009] A pressing plate member is disposed above the base through the connecting member and is used to apply pressure to the second surface of the semiconductor module.

[0010] In some embodiments of the present application, the recessed area includes a hollowed-out area in a central region and a stepped area around the hollowed-out area, and the protrusion is provided in the stepped area.

[0011] In some embodiments of the present application, the base is provided with a plurality of first fixing holes, and the pressing plate is provided with a plurality of second fixing holes corresponding one-to-one to the first fixing holes.

[0012] There are multiple connecting members, and the first end of each connecting member is detachably disposed in one of the first fixing holes, and the second end of each connecting member is detachably disposed in a second fixing hole corresponding to the first fixing hole.

[0013] In some embodiments of the present application, the connecting member includes a middle portion and a first end portion and a second end portion provided at both ends of the middle portion, and the cross-sectional dimensions of the first end portion and the second end portion are both smaller than the cross-sectional dimensions of the middle portion.

[0014] In some embodiments of the present application, the pressure plate member includes a plurality of openings located in a central area, and a wind blocking member is formed in an area between adjacent openings.

[0015] In some embodiments of the present application, the semiconductor module includes a packaging substrate and a chip, and the packaging substrate and the chip are connected by solder.

[0016] In some embodiments of the present application, the semiconductor module further includes a lead frame, and the lead frame is connected to the package substrate portion outside the chip through solder.

[0017] In some embodiments of the present application, the packaging substrate includes a substrate, a first metal layer disposed on a first surface of the substrate, and a second metal layer disposed on a second surface of the substrate.

[0018] The protrusion is used to contact the first metal layer to support the semiconductor module;

[0019] A portion of the second metal layer is connected to the chip through solder, and a portion of the second metal layer located outside the chip is connected to the lead frame through solder.

[0020] In some embodiments of the present application, the lead frame includes a chip pad and pins arranged around the chip pad, the pins are connected to the packaging substrate portion outside the chip through solder, and after the connection, an empty area is formed between the lead frame and the packaging substrate, and the chip is located in the empty area.

[0021] In some embodiments of the present application, the semiconductor module includes a power semiconductor module.

[0022] According to the fixture of the embodiment of the present application, the contact area between the base and the semiconductor module is reduced through the design of recesses and protrusions, thereby reducing the heat absorption effect of the base on the semiconductor module, so that the temperatures above and below the semiconductor module can be kept relatively consistent during the high-temperature reflow process, thereby effectively avoiding warping of the semiconductor module and improving the flatness of the product to meet the corresponding specification requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The following drawings of the present application are used as part of the present application for understanding the present application. The drawings show embodiments of the present application and their descriptions, which are used to explain the principle of the present application.

[0024] Figure 1 A schematic structural diagram of a fixture according to an embodiment of the present application is shown.

[0025] Figure 2 A schematic structural diagram of a fixture and a semiconductor module disposed therein according to an embodiment of the present application is shown.

[0026] Figure 3 A top view of a base according to an embodiment of the present application is shown.

[0027] Figure 4 A schematic structural diagram of a connector according to an embodiment of the present application is shown.

[0028] Figure 5 A schematic structural diagram of a pressure plate member according to an embodiment of the present application is shown.

[0029] Figure 6 A schematic structural diagram of a semiconductor module according to an embodiment of the present application is shown.

[0030] In the attached figure:

[0031] 110 base;

[0032] 111 concave area;

[0033] 1111 hollow area;

[0034] 1112 step area;

[0035] 112 convex;

[0036] 113 first fixing hole;

[0037] 120 connectors;

[0038] 121 middle part;

[0039] 122 first end portion;

[0040] 123 second end;

[0041] 130 press plate;

[0042] 131 opening;

[0043] 132 wind blocking parts;

[0044] 133 second fixing hole;

[0045] 210 package substrate;

[0046] 211 substrate;

[0047] 212 first metal layer;

[0048] 213 second metal layer;

[0049] 220 chips;

[0050] 230 lead frame;

[0051] 231 chip pad;

[0052] 232 pins;

[0053] 240 solder. DETAILED DESCRIPTION

[0054] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present application. However, it will be apparent to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, some technical features well known in the art are not described in order to avoid confusion with the present application.

[0055] It should be understood that the present application can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to make the disclosure thorough and complete and to fully convey the scope of the present application to those skilled in the art. In the drawings, the dimensions and relative sizes of layers and regions may be exaggerated for clarity. Like reference numerals throughout represent like elements.

[0056] It should be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to," or "coupled to" another element or layer, it may be directly on, adjacent to, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there may be no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer, or part discussed below may be represented as a second element, component, region, layer, or part.

[0057] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," etc., may be used herein for convenience of description to describe the relationship of one element or feature shown in the figures to other elements or features. It should be understood that the spatially relative terms are intended to include different orientations of the device in use and operation in addition to the orientations shown in the figures. For example, if the device in the drawings is flipped, then the elements or features described as "under" or "beneath" or "beneath" the other elements will be oriented as "over" the other elements or features. Thus, the exemplary terms "under" and "under" may include both the upper and lower orientations. The device may be oriented otherwise (rotated 90 degrees or in other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0058] The purpose of the terms used herein is only to describe specific embodiments and is not intended to limit the present application. When used herein, the singular forms "a", "an", and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "comprising" and / or "including", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0059] Taking the packaging of power device modules as an example, the specific process is: first, the chip is mounted on the packaging substrate, and then the chip / solder / packaging substrate and other materials are firmly welded together through SMT (Surface Mounted Technology) vacuum reflow.

[0060] However, during the high-temperature reflow process, the inconsistent temperatures above and below the semiconductor module cause the packaging substrate to warp, which in turn causes the product's flatness to fail to meet the corresponding specification requirements.

[0061] Furthermore, during the high-temperature reflow process, the volatilized solder easily transfers to the bottom of the product, affecting the thermal conductivity of the solder underneath. Furthermore, since the solder becomes sticky after cooling, it is difficult to remove the product after the packaging operation is completed. Furthermore, the solder remaining on the bottom of the product will also affect the product's lifespan.

[0062] In order to solve at least one of the above-mentioned technical problems, the present application provides a jig for packaging semiconductor modules, the jig comprising: a base, the base being provided with a recessed area for accommodating the semiconductor module, the recessed area being provided with a protrusion for supporting the first surface of the semiconductor module; a connecting member; and a pressure plate, the pressure plate being arranged above the base through the connecting member for applying pressure to the second surface of the semiconductor module.

[0063] According to the fixture of the present application, the contact area between the base and the semiconductor module is reduced through the design of recesses and protrusions, thereby reducing the heat absorption effect of the base on the semiconductor module, so that the temperature above and below the semiconductor module can be kept relatively consistent during the high-temperature reflow process, thereby effectively avoiding warping of the semiconductor module and improving the flatness of the product to meet the corresponding specification requirements.

[0064] Moreover, by providing a recessed area in the base for accommodating the semiconductor module, the solder volatilized during the high-temperature reflow process cannot evaporate to the bottom of the product, thereby preventing solder from remaining at the bottom of the product. This not only prevents the thermal conductivity of the solder under the product from being affected, but also makes it easier to remove the product after the packaging operation is completed and increases the product's lifespan.

[0065] In order to thoroughly understand the present application, detailed steps and structures will be provided in the following description to illustrate the technical solution proposed by the present application. The preferred embodiments of the present application are described in detail below. However, in addition to these detailed descriptions, the present application may also have other implementation methods.

[0066] Reference below Figures 1 to 6 A jig according to one embodiment of the present application is described. The jig is used for semiconductor module packaging operations and includes a base 110 having a recessed area 111 for accommodating the semiconductor module, and a protrusion 112 for supporting the first surface of the semiconductor module within the recessed area 111; a connector 120; and a pressure plate 130, which is disposed above the base 110 via the connector 120 and is used to apply pressure to the second surface of the semiconductor module.

[0067] Specifically, during the semiconductor module packaging process, the semiconductor module is first placed on the jig's base 110, ensuring that the semiconductor module aligns with the recessed area 111 on the base 110. Recessed area 111 is provided with protrusions 112, which effectively support the first surface of the semiconductor module. Next, a pressure plate 130 is mounted above the base 110 using connectors 120, enabling pressure to be applied to the second surface of the semiconductor module.

[0068] It is worth noting that the recessed area 111 provided in the base 110 is of great significance. It can prevent the base 110 from directly contacting the first surface of the semiconductor module, so that the base 110 contacts the first surface of the semiconductor module only through the protrusion 112. This design of the recess and protrusion 112 cleverly reduces the contact area between the base 110 and the semiconductor module. During the high-temperature reflow process, the reduction in contact area further reduces the heat absorption effect of the base 110 on the semiconductor module. In this way, during the high-temperature reflow process, the temperature above and below the semiconductor module can be kept relatively consistent. Such temperature consistency can effectively prevent the warping of the semiconductor module, thereby improving the flatness of the product so that it meets the corresponding specification requirements.

[0069] Moreover, a recessed area 111 corresponding to the semiconductor module is provided in the base 110. This prevents the solder 240 volatilized during the high-temperature reflow process from volatilizing to the bottom of the product, thereby preventing the solder 240 from remaining at the bottom of the product. This not only prevents the thermal conductivity of the solder 240 below the product from being affected, but also facilitates the removal of the product after the packaging operation is completed, and is beneficial to increasing the service life of the product.

[0070] In some embodiments, the semiconductor module may include a power semiconductor module (such as an IGBT (insulated gate bipolar transistor) module, a MOSFET (metal oxide semiconductor field effect transistor) module, etc.), a digital semiconductor module (such as a logic gate module, a counter module, etc.) or any other suitable semiconductor module, without limitation.

[0071] In some embodiments, as Figure 6 As shown, the semiconductor module may include a package substrate 210 and a chip 220 , and the package substrate 210 and the chip 220 are connected via solder 240 .

[0072] Taking the semiconductor module being a power semiconductor module as an example, the chip 220 may be an IGBT chip, a SIC chip, or any other suitable chip, without limitation.

[0073] The packaging substrate 210 may include a direct bonded copper (DBC) ceramic substrate, a direct plating copper (DPC) ceramic substrate, an active metal brazing (AMB) ceramic substrate, a laser activated metallization (LAM) ceramic substrate or other types of substrates, without limitation.

[0074] In some embodiments, as Figure 6As shown, the semiconductor module may further include a lead frame 230 , which is connected to a portion of the package substrate 210 outside the chip 220 via solder 240 .

[0075] The lead frame 230 is the skeleton of the semiconductor module and is a frame used to connect the contact points of the chip 220 inside the semiconductor module and the external wires. It acts as a bridge connecting the chip 220 and the external wires.

[0076] In some embodiments, as Figure 6 As shown, the packaging substrate 210 includes a substrate 211, a first metal layer 212 arranged on the first surface of the substrate 211, and a second metal layer 213 arranged on the second surface of the substrate 211. The protrusion 112 is used to contact the first metal layer 212 to support the semiconductor module; part of the second metal layer 213 is connected to the chip 220 through the solder 240, and part of the second metal layer 213 located outside the chip 220 is connected to the lead frame 230 through the solder 240.

[0077] The first metal layer 212 and the second metal layer 213 may be made of copper or any other suitable metal, which is not limited.

[0078] The first metal layer 212 can act as a heat sink to release heat generated during the packaging process. The second metal layer 213 is not fixed and can be divided into different zones, which are used to connect one or more chips 220 and the lead frame 230.

[0079] In some embodiments, as Figure 6 As shown, the lead frame 230 includes a chip pad 231 and pins 232 arranged around the chip pad 231. The pins 232 are connected to the package substrate 210 portion outside the chip 220 through solder 240. After the connection, an empty area is formed between the lead frame 230 and the package substrate 210, and the chip 220 is located in the empty area.

[0080] Specifically, the lead frame 230 mainly consists of two parts: a die pad 231 and a lead finger 232. The die pad 231 provides mechanical support for the chip 220 during the packaging process, while the lead finger 232 is an electrical path connecting the chip 220 to the external wires of the package.

[0081] The pin 232 is connected to the second metal layer 213 of the package substrate 210 outside the chip 220 through solder 240, and an empty space is formed between the lead frame 230 and the package substrate 210 after the connection. The formed empty space can be used to dissipate heat of the semiconductor module during the packaging operation.

[0082] In some embodiments, as Figure 1 As shown, the recessed area 111 includes a hollowed area 1111 located in the central region and a step area 1112 located around the hollowed area 1111 , and the protrusion 112 is provided in the step area 1112 .

[0083] Specifically, the hollow area 1111 can penetrate the base 110 along the thickness direction of the base 110, and a step area 1112 is also formed around the hollow area 1111, and the protrusion 112 is arranged on the step area 1112. When the semiconductor module is placed on the base 110 of the fixture and corresponds to the recessed area 111 of the base 110, the hollow area 1111 can prevent the base 110 from directly contacting the first surface of the semiconductor module, so that the base 110 is in contact with the first surface of the semiconductor module only through the protrusion 112. The reduction in contact area reduces the heat absorption effect of the base 110 on the semiconductor module. In this way, during the high-temperature reflow process, the temperature above and below the semiconductor module can be kept relatively consistent. Such temperature consistency can effectively prevent the semiconductor module from warping, thereby improving the flatness of the product and meeting the corresponding specification requirements.

[0084] Moreover, a hollow area 1111 is provided in the base 110. In this way, the solder 240 volatilized during the high-temperature reflow process cannot volatilize to the bottom of the product, thereby preventing the solder 240 from remaining at the bottom of the product. This not only prevents the thermal conductivity of the solder 240 under the product from being affected, but also makes it convenient to remove the product after the packaging operation is completed, and is also beneficial to improving the service life of the product.

[0085] In some embodiments, the protrusion 112 can be fixedly set on the step area 1112, or a fixing hole can be set on the step area 1112, and the protrusion 112 can be detachably set in the fixing hole, or any other suitable setting method can be adopted, which is not limited.

[0086] In some embodiments, as Figure 3 and Figure 5 As shown, a plurality of first fixing holes 113 are provided on the base 110, a plurality of second fixing holes 133 corresponding one-to-one to the first fixing holes 113 are provided on the pressure plate 130, and the number of connecting members 120 is multiple, and the first end of each connecting member 120 is detachably provided in one of the first fixing holes 113, and the second end of each connecting member 120 is detachably provided in the second fixing hole 133 corresponding to the first fixing hole 113.

[0087] Specifically, the first end of each connecting member 120 can be detachably set in one of the first fixing holes 113, and the second end thereof can be detachably set in the second fixing hole 133 corresponding to the first fixing hole 113. In this way, the pressure plate 130 can be set above the base 110 through the connecting member 120, so that the pressure plate 130 can apply pressure to the lead frame 230 and the packaging substrate 210 to avoid empty welding between the lead frame 230 and the packaging substrate 210.

[0088] In some embodiments, as Figure 4 As shown, the connecting member 120 includes a middle portion 121 and a first end portion 122 and a second end portion 123 provided at both ends of the middle portion 121 . The cross-sectional dimensions of the first end portion 122 and the second end portion 123 are both smaller than the cross-sectional dimension of the middle portion 121 .

[0089] Specifically, the cross-sectional dimensions of the first fixing hole 113 can match the cross-sectional dimensions of the first end portion 122 so that the first end portion 122 can be detachably disposed in the first fixing hole 113; the cross-sectional dimensions of the second fixing hole 133 can match the cross-sectional dimensions of the second end portion 123 so that the second end portion 123 can be detachably disposed in the second fixing hole 133.

[0090] In addition, there is no limitation on the shapes of the first fixing hole 113, the second fixing hole 133, the first end 122, and the second end 123. For example, if the first fixing hole 113 and the second fixing hole 133 are circular fixing holes, and the first end 122 and the second end 123 are cylindrical structures, the first end 122 can be disposed in the first fixing hole 113 and the second end 123 in the second fixing hole 133, so that the pressure plate 130 and the base 110 are detachably connected via the connecting member 120.

[0091] In some embodiments, as Figure 5 As shown, the pressure plate 130 includes a plurality of openings 131 in a central area, and wind blocking members 132 are formed in areas between adjacent openings 131 .

[0092] Specifically, during high-temperature reflow, it is often necessary to fill the fixture cavity with gas. However, this gas can easily directly exert stress on the chip 220, causing the chip 220 to tilt and creating air holes around the solder 240 below the chip 220. In this embodiment, by providing an air blocker 132 on the pressure plate 130, the stress exerted by the gas on the chip 220 can be effectively reduced, preventing the chip 220 from tilting.

[0093] Moreover, the pressure plate 130 can be implemented in a cover style, which can also prevent the solder 240 below the product from shrinking into the product due to the reflow hot air during high-temperature reflow, and avoid the solder 240 remaining at the bottom of the product, which affects the thermal conductivity of the solder 240 below the product.

[0094] To sum up, according to the fixture of the embodiment of the present application, the contact area between the base and the semiconductor module is reduced through the recessed and raised design, thereby reducing the heat absorption effect of the base on the semiconductor module, so that the temperature above and below the semiconductor module can be kept relatively consistent during the high-temperature reflow process, thereby effectively avoiding the warping of the semiconductor module, and thus improving the flatness of the product so that it meets the corresponding specification requirements.

[0095] Moreover, by providing a recessed area in the base for accommodating the semiconductor module, the solder volatilized during the high-temperature reflow process cannot evaporate to the bottom of the product, thereby preventing solder from remaining at the bottom of the product. This not only prevents the thermal conductivity of the solder under the product from being affected, but also makes it easier to remove the product after the packaging operation is completed and increases the product's lifespan.

[0096] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely illustrative and are not intended to limit the scope of the present application. Various changes and modifications may be made therein by those skilled in the art without departing from the scope and spirit of the present application. All such changes and modifications are intended to be included within the scope of the present application as required by the appended claims.

[0097] Similarly, it should be understood that in order to streamline the present application and aid in understanding one or more of the various application aspects, in the description of the exemplary embodiments of the present application, the various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. However, this approach of the present application should not be interpreted as reflecting the intention that the claimed application requires more features than those explicitly recited in each claim. More precisely, as reflected in the corresponding claims, the point of the application is that the corresponding technical problem can be solved with fewer features than all the features of a single disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into the detailed description, with each claim itself serving as a separate embodiment of the present application.

[0098] Furthermore, those skilled in the art will appreciate that although some embodiments described herein include certain features included in other embodiments but not other features, combinations of features from different embodiments are intended to be within the scope of this application and to form different embodiments. For example, in the claims, any of the claimed embodiments may be used in any combination.

[0099] It should be noted that the above embodiments are illustrative rather than limiting of the present application, and that those skilled in the art may devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The use of the words first, second, and third, etc., does not denote any order. These words may be interpreted as designations.

Claims

1. A jig for semiconductor module packaging, characterized in that: The fixtures include: a base, wherein the base is provided with a recessed area for accommodating the semiconductor module, and wherein the recessed area is provided with a protrusion for supporting the first surface of the semiconductor module; Connectors; A pressing plate member is disposed above the base through the connecting member and is used to apply pressure to the second surface of the semiconductor module.

2. The fixture according to claim 1, wherein: The recessed area includes a hollowed area located in a central region and a stepped area located around the hollowed area, and the protrusion is arranged in the stepped area.

3. The fixture according to claim 1, wherein: The base is provided with a plurality of first fixing holes, and the pressing plate is provided with a plurality of second fixing holes corresponding to the first fixing holes one by one. There are multiple connecting members, and the first end of each connecting member is detachably disposed in one of the first fixing holes, and the second end of each connecting member is detachably disposed in a second fixing hole corresponding to the first fixing hole.

4. The fixture according to claim 3, wherein: The connecting member includes a middle portion and a first end portion and a second end portion provided at both ends of the middle portion. The cross-sectional dimensions of the first end portion and the second end portion are both smaller than the cross-sectional dimension of the middle portion.

5. The fixture according to claim 1, wherein: The pressure plate member includes a plurality of openings located in a central area, and wind blocking members are formed in areas between adjacent openings.

6. The jig according to claim 1, wherein: The semiconductor module includes a packaging substrate and a chip, and the packaging substrate and the chip are connected by solder.

7. The fixture according to claim 6, wherein: The semiconductor module further includes a lead frame connected to a portion of the package substrate outside the chip through solder.

8. The fixture according to claim 7, wherein: The packaging substrate includes a substrate, a first metal layer disposed on a first surface of the substrate, and a second metal layer disposed on a second surface of the substrate. The protrusion is used to contact the first metal layer to support the semiconductor module; A portion of the second metal layer is connected to the chip through solder, and a portion of the second metal layer located outside the chip is connected to the lead frame through solder.

9. The fixture according to claim 7, wherein: The lead frame includes a chip pad and pins arranged around the chip pad. The pins are connected to the packaging substrate portion outside the chip through solder, and after the connection, an empty area is formed between the lead frame and the packaging substrate, and the chip is located in the empty area.

10. The fixture according to claim 1, wherein: The semiconductor modules include power semiconductor modules.

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