Clamp for automatically clamping wafer during high-speed rotation

Abstract

The utility model relates to the technical field of semiconductor material processing equipment, and discloses a clamp for automatically clamping a wafer during high-speed rotation, which comprises a buckle assembly and a support ring, a plurality of threaded holes and pin holes are formed in the center of the support ring, the inner sides of the threaded holes are in threaded connection with a main shaft, and the pin holes are in threaded connection with the main shaft. According to the clamp capable of automatically clamping the wafer during high-speed rotation, the threaded hole and the pin hole are formed, so that replacement of the main shaft is facilitated, the clamping blocks are arranged to be eagle-head-shaped, and the lower structures of the clamping blocks are heavy, so that the clamping blocks can more effectively press the wafer when the main shaft rotates at a high speed, and the wafer is prevented from falling off due to centrifugal force; one end of the buckle support is provided with a threaded hole which is connected with the supporting ring, and the grooves are correspondingly connected in a matched manner, thereby facilitating the replacement of the buckle support, and achieving the effects of facilitating the replacement of the clamp according to the actual application scene, and facilitating the fixation of wafers of different sizes.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor material processing equipment, in particular to a clamp which automatically clamps a wafer during high-speed rotation. Background Art

[0002] Wafers are the silicon wafers used to make silicon semiconductor circuits. Their starting material is silicon. High-purity polysilicon is dissolved, doped with silicon seed crystals, and then slowly pulled out to form cylindrical single crystals. The design and manufacture of wafer fixtures and wafer cleaning equipment are crucial for wafer processing. These equipment must not only handle wafers efficiently and accurately, but also possess a high degree of flexibility and compatibility to accommodate the processing needs of diverse semiconductor materials.

[0003] Currently available wafer clamps usually include a main body with a support surface for supporting the wafer body or the film-attached wafer. In order to achieve stable clamping of the wafer, the main body is also equipped with an adsorption part and a pressing part. The adsorption part is driven by air pressure and can adsorb the wafer body when the wafer clamp is in a negative pressure state; while the pressing part is driven by air pressure to press the film-attached wafer when the wafer clamp is in a positive pressure state. This design meets the needs of wafer clamping to a certain extent, but when processing other types of semiconductor materials such as masks, if you want to clean the wafer at the same time as cleaning the mask, if there is no replacement clamp, you need to purchase another corresponding wafer cleaning equipment, which increases the cost of use. Utility Model Content

[0004] The purpose of the present utility model is to provide a clamp that automatically clamps wafers during high-speed rotation, so as to solve the problem raised in the above-mentioned background technology that the existing wafer clamp usually includes a main body, which has a support surface for supporting the wafer body or the film-attached wafer. In order to achieve stable clamping of the wafer, the main body is also equipped with an adsorption part and a pressing part. The adsorption part is driven by air pressure and can adsorb the wafer body when the wafer clamp is in a negative pressure state; and the pressing part is driven by air pressure to press the film-attached wafer when the wafer clamp is in a positive pressure state. This design meets the needs of wafer clamping to a certain extent, but when processing other types of semiconductor materials such as masks, if you want to clean the wafer at the same time as cleaning the mask, if there is no replacement clamp, you need to purchase another corresponding wafer cleaning equipment, which increases the cost of use.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions: a clamp for automatically clamping a wafer during high-speed rotation, comprising a snap assembly and a support ring, a plurality of threaded holes and pin holes are provided at the center of the support ring, the inner side of the threaded hole is threadedly connected to a main shaft, and a silicone gasket is provided on the top of the main shaft.

[0006] Preferably, the snap assembly includes a snap bracket, a hinge pin is installed on the inner side of the snap bracket, a clamping block is installed on the outside of the hinge pin, and intermediate washers are installed at the connection between the clamping block and the hinge pin and the connection between the snap bracket and the hinge pin.

[0007] Preferably, the support ring is configured as a ring structure, the upper surface of the support ring is configured as a horizontal plane, and a wafer is mounted on the top of the support ring.

[0008] Preferably, a fan-shaped hollow is provided on the outside of the support ring, and mounting holes are provided around the support ring.

[0009] Preferably, a circular groove is provided at the center of the lower surface of the support ring, and grooves are evenly provided around the upper surface of the support ring.

[0010] Preferably, the clamping block is configured to be in the shape of an eagle's head, and the upper surface of the clamping bracket is provided with a step.

[0011] Preferably, a threaded hole is provided at one end of the snap bracket, and the position of the threaded hole corresponds to the position of the mounting hole.

[0012] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0013] First, the utility model provides a threaded hole at the center of the support ring for threaded connection with the main shaft to ensure a firm connection between the two, and then uses the pin hole provided to limit the axial position between the support ring and the main shaft, thereby increasing the strength of the support ring driven by the rotating main shaft, and then a silicone gasket is provided on the top of the main shaft. The silicone gasket has good elasticity and wear resistance, can effectively reduce the friction and wear between the main shaft and the support ring, and at the same time play a buffering role, protecting the wafer from vibration and impact, and is easy to fine-tune the gap and height. The threaded hole and the pin hole are provided to facilitate the replacement of the main shaft, and then the wafer is placed on the upper surface of the support ring, and then mounting holes are provided around the support ring for connection with the clip bracket. The clip bracket and the clip are partially disassembled to facilitate the replacement of different clip components, so that the clip component and the support ring are connected, and then the hinge pin provided on the inner side of the clip bracket is used to connect the card block to the clip bracket, so that the card block is within a certain range. The clamping block is set in the shape of an eagle's head, and its lower structure is heavier, so that the clamping block can press the wafer more effectively when the spindle rotates at high speed to prevent the wafer from falling off due to centrifugal force. At the same time, a step is set on the upper surface of the clamping bracket to limit the wafer, so that the wafer can be fixed by the clamping block. A threaded hole is provided at one end of the clamping bracket to connect with the support ring, and the grooves correspond to each other and are connected, which is convenient for replacing the clamping bracket, so that the size of the clamping bracket can be adjusted according to the size requirements of the wafer. When clamping wafers of different sizes, you only need to replace the clamping bracket, so as to achieve the effect of facilitating the replacement of the fixture according to the actual application scenario and facilitating the fixing of wafers of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is the overall structural diagram of the utility model;

[0015] Figure 2 This is a three-dimensional diagram of the buckle assembly of the utility model;

[0016] Among them: 1. Buckle assembly; 2. Support ring; 3. Spindle; 4. Silicone gasket; 5. Wafer; 11. Buckle bracket; 12. Hinge pin; 13. Block; 14. Intermediate washer. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0018] The utility model provides the following technical solutions:

[0019] See also Figure 1 、 Figure 2 A fixture for automatically clamping a wafer during high-speed rotation includes a snap assembly 1 and a support ring 2. A plurality of threaded holes and pin holes are opened at the center of the support ring 2. The inner side of the threaded hole is threadedly connected to a main shaft 3, and a silicone gasket 4 is provided on the top of the main shaft 3.

[0020] Through the above technical solution, a threaded hole is opened at the center of the support ring 2 for threaded connection with the main shaft 3 to ensure a firm connection between the two, and then a pin hole is opened for axial limitation between the support ring 2 and the main shaft 3, thereby increasing the strength of the rotating main shaft 3 to drive the support ring 2, and then a silicone gasket 4 is set on the top of the main shaft 3. The silicone gasket 4 has good elasticity and wear resistance, can effectively reduce the friction and wear between the main shaft 3 and the support ring 2, and play a buffering role at the same time, protecting the wafer 5 from vibration and impact, and is easy to fine-tune the gap and height. The threaded holes and pin holes are opened to facilitate the replacement of the main shaft 3, and then the wafer 5 is placed on the upper surface of the support ring 2, and then mounting holes are opened around the support ring 2 for connecting with the clip bracket 11. The clip bracket 11 is partially disassembled together with the clip to facilitate the replacement of different clip assemblies 1, so that the clip assembly 1 and the support ring 2 are connected, and then the hinge pin 12 provided on the inner side of the clip bracket 11 is used to connect the clip block 13 to the clip bracket 11, so that the clip block 13 is within a certain range. The clamping block 13 is set in the shape of an eagle's head, and its lower structure is heavier, so that the clamping block 13 can more effectively press the wafer 5 when the main shaft 3 rotates at high speed, and prevent the wafer 5 from falling off due to centrifugal force. At the same time, a step is provided on the upper surface of the clamping bracket 11 as a limit for the wafer 5, so that the wafer 5 is fixed by the clamping block 13. A threaded hole is provided at one end of the clamping bracket 11 and is connected to the support ring 2. The grooves correspond to each other and are connected, which is convenient for replacing the clamping bracket 11, so that the size of the clamping bracket 11 can be adjusted according to the size requirements of the wafer 5. When clamping wafers 5 of different sizes, it is only necessary to replace the clamping bracket 11, so as to achieve the effect of facilitating the replacement of the fixture according to the actual application scenario and facilitating the fixing of wafers 5 of different sizes.

[0021] The snap assembly 1 includes a snap bracket 11, a hinge pin 12 is installed on the inner side of the snap bracket 11, a clamping block 13 is installed on the outside of the hinge pin 12, and an intermediate washer 14 is installed at the connection between the clamping block 13 and the hinge pin 12 and the connection between the snap bracket 11 and the hinge pin 12.

[0022] Through the above technical solution, the hinge pin 12 facilitates the connection between the snap bracket 11 and the block 13, and the intermediate washer 14 reduces the friction and wear between the snap bracket 11 and the block 13, thereby extending the service life.

[0023] The support ring 2 is configured as a ring structure, the upper surface of the support ring 2 is configured as a horizontal plane, and a wafer 5 is mounted on the top of the support ring 2 .

[0024] Through the above technical solution, the support ring 2 is configured as a ring structure with a horizontal upper surface, which is convenient for supporting and placing the wafer 5 .

[0025] The outside of the support ring 2 is provided with a fan-shaped hollow, and the support ring 2 is provided with mounting holes around it.

[0026] Through the above technical solution, the support ring 2 is integrally buckled with a fan-shaped hollow, which can reduce the weight and inertia of the main shaft 3 during rotation, and the support ring 2 is conveniently connected to the snap bracket 11 through the mounting holes opened around it.

[0027] A circular groove is provided at the center of the lower surface of the support ring 2 , and grooves are evenly provided around the upper surface of the support ring 2 .

[0028] Through the above technical solution, the circular groove opened at the center of the lower surface of the support ring 2 can leave a nut gap when mating with the main shaft 3, and grooves are evenly opened around the upper surface of the support ring 2 to facilitate assembly with the snap bracket 11.

[0029] The clamping block 13 is configured to be in the shape of an eagle's head, and the upper surface of the clamping bracket 11 is provided with a step.

[0030] Through the above technical solution, the clamping block 13 is set to an eagle head shape, so that the lower structure of the clamping block 13 is heavier. When the main shaft 3 rotates at high speed, it is moved by centrifugal force and the upper end presses the wafer 5. The wafer 5 can be limited by the set steps.

[0031] A threaded hole is formed at one end of the clip bracket 11 , and the position of the threaded hole corresponds to the position of the mounting hole.

[0032] Through the above technical solution, the threaded holes correspond to the positions of the grooves uniformly formed around the surface of the support ring 2, which facilitates the connection and disassembly of the snap bracket 11.

[0033] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit thereof, and the scope is defined by the appended claims and their equivalents.

Claims

1. A fixture for automatically holding a wafer during high-speed rotation, characterized by: It comprises a snap assembly (1) and a support ring (2), wherein a plurality of threaded holes and pin holes are provided at the center of the support ring (2), a main shaft (3) is threadedly connected to the inner side of the threaded hole, and a silicone gasket (4) is provided on the top of the main shaft (3).

2. The fixture for automatically holding a wafer during high-speed rotation according to claim 1, characterized in that: The buckle assembly (1) comprises a buckle bracket (11), a hinge pin (12) is installed on the inner side of the buckle bracket (11), a clamping block (13) is installed on the outer side of the hinge pin (12), and an intermediate washer (14) is installed at the connection between the clamping block (13) and the hinge pin (12) and the connection between the buckle bracket (11) and the hinge pin (12).

3. The fixture for automatically clamping a wafer during high-speed rotation according to claim 1, characterized in that: The support ring (2) is configured as a ring structure, the upper surface of the support ring (2) is configured as a horizontal plane, and a wafer (5) is mounted on the top of the support ring (2).

4. The fixture for automatically clamping a wafer during high-speed rotation according to claim 1, wherein: The support ring (2) is provided with a fan-shaped hollow on its exterior, and mounting holes are provided around the support ring (2).

5. The fixture for automatically clamping a wafer during high-speed rotation according to claim 1, characterized in that: A circular groove is provided at the center of the lower surface of the support ring (2), and grooves are evenly provided around the upper surface of the support ring (2).

6. The fixture for automatically clamping a wafer during high-speed rotation according to claim 2, wherein: The clamping block (13) is configured in an eagle head shape, and the upper surface of the clamping bracket (11) is provided with a step.

7. The fixture for automatically clamping a wafer during high-speed rotation according to claim 2, characterized in that: A threaded hole is provided at one end of the snap bracket (11), and the position of the threaded hole corresponds to the position of the mounting hole.

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