Wafer pushing device

Abstract

The utility model provides a wafer pushing device. The wafer pushing device comprises a first lifting mechanism, a mounting bracket, a magnetic attraction base, a second lifting mechanism and a pushing assembly, the first lifting mechanism is used for driving the mounting bracket to lift. The magnetic attraction base is arranged on the mounting bracket, and a first pushing channel is arranged on the magnetic attraction base; the second lifting mechanism is arranged in the mounting bracket; the pushing assembly comprises a pushing seat, a needle cap and a pushing piece, the pushing seat is fixed to the magnetic attraction base in a magnetic attraction mode, a second pushing channel is formed in the pushing seat, the needle cap is connected to the pushing seat, the pushing piece is arranged in the needle cap, and a pushing hole is formed in the top of the needle cap; the lower end of the pushing piece sequentially penetrates through the second pushing channel and the first pushing channel and then abuts against a movable component of the second lifting mechanism. According to the wafer pushing device provided by the invention, the pushing assembly is magnetically attracted and fixed on the magnetic attraction base, and the pushing piece of the pushing assembly abuts against the second lifting mechanism. When the pushing piece needs to be replaced, only the pushing assembly needs to be removed from the magnetic attraction base, and a new pushing assembly is installed.

Description

Technical Field

[0001] The present application relates to the field of chip packaging equipment, and in particular to a wafer pushing device. Background Art

[0002] During the chip packaging process, the wafer on the blue film needs to be transferred and fixed to the predetermined substrate. To ensure material removal accuracy, the wafer at the corresponding position on the blue film needs to be lifted up using a wafer pushing device. Existing wafer pushing devices have a pushing member (usually a push pin assembly) fixedly connected to the driving end of the pushing drive mechanism. Therefore, if the pushing member is damaged or the current pushing member specifications do not meet the wafer pushing requirements, the pushing drive mechanism and the pushing member need to be replaced as a whole. This complete replacement is labor-intensive, time-consuming, and equipment-intensive. Summary of the Invention

[0003] In order to solve the above technical problems, the present application provides a wafer pushing device, which adopts the following technical solutions:

[0004] A wafer pushing device includes a first lifting mechanism, a mounting bracket, a magnetic base, a second lifting mechanism, and a pushing assembly, wherein:

[0005] The mounting bracket is connected to the movable component of the first lifting mechanism, and the first lifting mechanism is used to drive the mounting bracket to move up and down;

[0006] The magnetic base is arranged on the top of the mounting bracket, and the magnetic base is provided with a first pushing channel which passes through the magnetic base;

[0007] The second lifting mechanism is arranged in the mounting bracket;

[0008] The pushing assembly includes a pushing seat, a needle cap and a pushing piece, wherein the pushing seat is magnetically fixed to the magnetic base, the pushing seat is provided with a second pushing channel that runs vertically through the first pushing channel, the needle cap is connected to the pushing seat, the pushing piece is arranged in the needle cap, and the top of the needle cap is provided with a pushing hole for the pushing piece to pass upward, and the lower end of the pushing piece passes through the second pushing channel and the first pushing channel in sequence and then abuts against the movable part of the second lifting mechanism.

[0009] The wafer pushing device provided by the present application has a pushing assembly that is magnetically fixed to the magnetic base, and a pushing piece of the pushing assembly abuts against the second lifting mechanism. Therefore, when the pushing piece needs to be replaced, it is only necessary to remove the pushing assembly from the magnetic base and replace it with a new one, without having to replace other components such as the second lifting mechanism, thereby improving replacement efficiency and reducing replacement costs.

[0010] In some embodiments, the upper surface of the magnetic base is provided with three support grooves surrounding the circumference of the first pushing channel; the pushing seat is provided with three support pins corresponding to the support grooves one by one, and the support pins are all supported in the corresponding support grooves, and a gap is retained between the lower surface of the pushing seat and the upper surface of the magnetic base.

[0011] The three support pins at the bottom of the push seat are supported in the three support grooves on the magnetic base in a one-to-one correspondence, ensuring that the push seat can be stably fixed to the magnetic base by magnetic attraction. The coordinated positioning of the support grooves and the support pins prevents the push seat from accidentally sliding during the lifting process. Since a gap is retained between the lower surface of the push seat and the upper surface of the magnetic base, it is ensured that the lower ends of the three support pins are in contact with the corresponding support grooves, ensuring that the support surface of the push seat is the plane established by the three points where the lower ends of the three support pins contact the corresponding support grooves. The push seat will not tilt due to other fulcrums, ensuring that the push seat is more stably supported on the magnetic base.

[0012] In some embodiments, the support groove is a V-shaped structure, and the support groove includes a first support slope and a second support slope arranged opposite to each other; the support pin is inserted into the push seat, and the lower end of the support pin forms a hemispherical support portion, which abuts against the first support slope and the second support slope.

[0013] The hemispherical support portion at the lower end of the support pin is supported on the first support slope and the second support slope of the support groove at the same time, reducing the friction between the support pin and the support groove, and ensuring the support stability of the support groove on the support pin, preventing the support pin from shaking.

[0014] In some embodiments, a plurality of first magnets are provided on the magnetic base, and a plurality of second magnets with opposite polarity to the first magnets are provided on the push seat; or, a magnet is provided on one of the magnetic base and the push seat, and the other one is an iron structure.

[0015] By arranging the magnetic base and the push seat, the push seat can be magnetically fixed on the magnetic base.

[0016] In some embodiments, the upper surface of the magnetic base is provided with positioning pins on at least two adjacent side edges, and a gap is retained between the positioning pins and the side edges of the push seat.

[0017] The positioning of the push seat is achieved, ensuring that when the push seat is placed, the second push channel on the push seat is aligned with the first push channel on the magnetic base. At the same time, since a gap is retained between the positioning pin and the side of the push seat, the positioning pin will not interfere with the installation position of the push seat.

[0018] In some embodiments, the mounting bracket includes a base plate, a first connecting plate, a second connecting plate and a support frame, wherein: the base plate is connected to the movable part of the first lifting mechanism; the first connecting plate is adjustably connected to the base plate along a first horizontal direction; the second connecting plate is adjustably connected to the first connecting plate along a second horizontal direction, and the second horizontal direction is perpendicular to the first horizontal direction; the support frame is connected to the second connecting plate, the magnetic base is arranged on the top of the support frame, and the second lifting mechanism is located inside the support frame.

[0019] By setting the mounting bracket, the mounting bracket can adjust the position of the magnetic base on the horizontal plane, ultimately ensuring that the pushing member is at a predetermined pushing position.

[0020] In some embodiments, the second lifting mechanism includes a voice coil motor and a push block, the stator assembly of the voice coil motor is fixedly mounted on the mounting bracket, the movable assembly of the voice coil motor is connected to the stator assembly in a liftable and sliding manner, and the push block is fixedly arranged on the top of the movable assembly; the lower end of the push member abuts against the push block.

[0021] The voice coil motor has a fast response speed, which can improve the pushing efficiency of the pushing member on the wafer.

[0022] In some embodiments, the second lifting mechanism further comprises a blowing block arranged on the mounting bracket, wherein an air cavity connected to a compressed air source is provided in the blowing block, and a blowing hole communicating with the air cavity is provided on one side of the blowing block facing the mover assembly of the voice coil motor.

[0023] By setting the air blowing block, the voice coil motor can be cooled by air blowing, thereby extending the service life of the voice coil motor.

[0024] In some embodiments, the second lifting mechanism also includes a grating scale for measuring the lifting stroke of the movable subassembly of the voice coil motor. The grating scale includes a grating and a reading head. The reading head is fixedly mounted on the mounting bracket. The grating is fixedly mounted on the side of the movable subassembly. The sensing end of the reading head is arranged opposite to the grating.

[0025] By setting a grating ruler, the lifting stroke of the movable component can be accurately measured, and finally the pushing stroke of the pushing member can be accurately controlled to ensure that the pushing member pushes the wafer to a predetermined height.

[0026] In some embodiments, an adsorption hole is further provided on the top of the needle cap; an exhaust interface for connecting an exhaust device is provided on the magnetic base; an exhaust hole for connecting the exhaust interface with the inner cavity of the needle cap is provided on the push seat, and a sealing ring is provided at the junction of the exhaust hole and the exhaust interface. The exhaust device exhausts air from the inner cavity of the needle cap through the exhaust interface and the exhaust hole, so that the adsorption hole generates adsorption force.

[0027] Before the wafer is pushed, the needle cap can absorb the blue film, thereby ensuring that the relative positions of the pushing member and the wafer remain relatively stable, and preventing the wafer from deviating from the pushing member during the pushing process.

[0028] In some embodiments, the needle cap is detachably locked on the ejection seat by a locking ring.

[0029] Ensure that the needle cap is firmly locked on the push seat and facilitate the removal of the needle cap.

[0030] In some embodiments, the pushing member includes a clamp, a pushing rod, a pin mounting seat and a plurality of pins, wherein: the clamp is detachably mounted on the lower end of the pushing rod; the lower end of the pushing rod passes through the second pushing channel and the first pushing channel in sequence and then abuts against the movable component of the second lifting mechanism, and the clamp is used to clamp the limiting pushing rod in the first pushing channel; the pin mounting seat is mounted on the upper end of the pushing rod; a plurality of pins are mounted on the pin mounting seat, and the top of the needle cap is provided with pushing holes corresponding to the pins.

[0031] The design of the ejector facilitates assembly, disassembly, and maintenance. Furthermore, the ejector rod is held in place by a clamp within the first ejector channel, ensuring that its lower end abuts the movable component of the second lifting mechanism. Multiple ejector pins coordinate to lift the wafer, enhancing its stability.

[0032] In some embodiments, the pushing member also includes a pushing guide assembly, which includes a first guide wheel, a second guide wheel and a guide column, wherein: the first guide wheel and the second guide wheel are arranged side by side on the clamp; the upper end of the guide column is fixedly connected to the pushing seat, and the second end of the guide column passes between the first guide wheel and the second guide wheel, and the first guide wheel and the second guide wheel both rest on the guide column.

[0033] The ejector guide assembly guides the lifting and lowering of the clamp and ejector rod, ultimately improving the lifting stability of the ejector pin and ensuring that the ejector pin can accurately pass through the corresponding ejector hole to push the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 Schematic diagram of the structure of the wafer pushing device in the embodiment of the present application;

[0035] Figure 2 This is a schematic structural diagram of the wafer pushing device in one perspective after the first lifting mechanism is omitted in an embodiment of the present application;

[0036] Figure 3 This is a schematic structural diagram of the wafer pushing device in another perspective after the first lifting mechanism is omitted in the embodiment of the present application;

[0037] Figure 4This is a schematic structural diagram of the magnetic base in an embodiment of the present application;

[0038] Figure 5 This is a structural diagram of the second lifting mechanism in an embodiment of the present application;

[0039] Figure 6 This is a schematic structural diagram of the mounting bracket in an embodiment of the present application;

[0040] Figure 7 This is a schematic structural diagram of the first connecting plate in an embodiment of the present application;

[0041] Figure 8 Schematic diagram of the three-dimensional structure of the push assembly in the embodiment of the present application;

[0042] Figure 9 This is a schematic diagram of the disassembled structure of the push assembly in an embodiment of the present application;

[0043] Figure 10 This is a schematic top view of the push assembly in an embodiment of the present application.

[0044] Figures 1 to 10 Included are:

[0045] First lifting mechanism 1;

[0046] Mounting bracket 2: bottom plate 21, first connecting plate 22, second connecting plate 23, support frame 24, first guide slot 25, first waist hole 26, second guide slot 27, second waist hole 28, first protrusion 221, third magnet 222, first magnetic plate 211;

[0047] Magnetic base 3: first pushing channel 31, supporting groove 32, first supporting inclined surface 321, second supporting inclined surface 322, notch 323, air extraction interface 33, first magnet 34, positioning pin 35;

[0048] Second lifting mechanism 4: voice coil motor 41, push block 42, stator 411, mover 412, connecting plate 413, air blowing block 43, grating ruler 44;

[0049] Pushing assembly 5: pushing seat 51, needle cap 52, pushing member 53, second pushing channel 54, pushing hole 55, support pin 56, adsorption hole 57, exhaust hole 58, locking ring 59, clamp 531, pushing rod 532, first guide wheel 533, second guide wheel 534, guide column 535, support part 561. DETAILED DESCRIPTION

[0050] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0051] As described in the background technology section, the pusher of an existing wafer ejection device is fixedly connected to the driving end of the ejection drive mechanism. Therefore, if the pusher is damaged or the current specifications of the pusher do not meet the wafer ejection requirements, the ejection drive mechanism and the pusher must be replaced as a whole. This is labor-intensive and time-consuming, as well as equipment-intensive. If a plug-in method is used, the pusher is inserted into the locating pin on the ejection drive mechanism and needs to be pulled upward when replacing the pusher. Due to the machining accuracy of the pusher or the locating pin, the pusher may be installed with poor precision or become stuck, making it difficult to remove.

[0052] In order to solve this problem, the present application provides a wafer pushing device. Figures 1 to 10 As shown, the wafer pushing device in the embodiment of the present application includes a first lifting mechanism 1, a mounting bracket 2, a magnetic base 3, a second lifting mechanism 4 and a pushing assembly 5, wherein:

[0053] The mounting bracket 2 is connected to the movable component of the first lifting mechanism 1 , and the first lifting mechanism 1 is used to drive the mounting bracket 2 to move up and down.

[0054] The magnetic base 3 is arranged on the top of the mounting bracket 2 , and a first pushing channel 31 penetrating the magnetic base 3 is provided on the magnetic base 3 .

[0055] The second lifting mechanism 3 is disposed in the mounting bracket 2 .

[0056] The pushing assembly 5 includes a pushing seat 51, a needle cap 52 and a pushing piece 53, wherein the pushing seat 51 is magnetically fixed on the magnetic base 3, and the pushing seat 51 is provided with a second pushing channel 54 that passes through the first pushing channel 31 from top to bottom. The needle cap 52 is connected to the pushing seat 51, and the pushing piece 53 is arranged in the needle cap 52. The top of the needle cap 52 is provided with a pushing hole 55 for the pushing piece 53 to pass upward. The lower end of the pushing piece 53 passes through the second pushing channel 54 and the first pushing channel 31 in sequence and then abuts against the movable part of the second lifting mechanism 4.

[0057] The wafer pushing process of the wafer pushing device in the embodiment of the present application is as follows:

[0058] In the initial state, the pushing assembly 5 is located below the blue film and away from the blue film.

[0059] When the wafer needs to be pushed, the first lifting mechanism 1 drives the mounting bracket 2 to rise to a predetermined position, so that the top of the needle cap 52 of the pushing assembly 5 abuts against a predetermined position of the blue film.

[0060] Subsequently, the second lifting mechanism 4 drives the upper end of the pushing member 53 to pass through the pushing hole 55 upward, thereby pushing the wafer located at a predetermined position of the blue film.

[0061] In the wafer ejection device of the present embodiment, the ejection assembly 5 is magnetically fixed to the magnetic base 3, and the lower end of the ejection member 53 of the ejection assembly 5 abuts against the second lifting mechanism. Therefore, when the ejection member 53 needs to be replaced, the ejection assembly 5 only needs to be removed from the magnetic base and replaced with a new one. There is no need to replace other components such as the second lifting mechanism 4, thereby improving replacement efficiency and reducing replacement costs.

[0062] In the embodiment of the present application, the first lifting mechanism 1 can adopt various existing linear drive modules that can drive the mounting bracket 1 to move up and down, such as a cylinder drive module, a screw drive module, etc.

[0063] Alternatively, the lower surface of the push seat 51 contacts the upper surface of the magnetic base 3, and the push seat 51 is magnetically fixed only by the magnetic attraction between the push seat 51 and the magnetic base 3. This arrangement results in the push seat 51 easily sliding relative to the magnetic base 3 during the lifting and pushing process, ultimately causing the push member 53 to interfere with the magnetic base 3, hindering the lifting and lowering of the push member 53.

[0064] To this end, another optional magnetic fixing method is proposed in the embodiment of the present application, such as Figure 4 、 Figure 8 and Figure 9 As shown, optionally, the upper surface of the magnetic base 3 is provided with three support grooves 32 surrounding the first push channel 31. The push seat 51 is provided with three support pins 56 corresponding to the support grooves 32, each support pin 56 being supported in a corresponding support groove 32, and a gap is retained between the lower surface of the push seat 51 and the upper surface of the magnetic base 3.

[0065] The three support pins 56 at the bottom of the push seat 51 are supported in the three support grooves 32 on the magnetic base 3 in a one-to-one correspondence, ensuring that the push seat 51 can be stably magnetically fixed to the magnetic base 3. The cooperation and limitation between the support grooves 32 and the support pins 56 prevent the push seat 51 from sliding relative to the magnetic base 3 during the lifting process.

[0066] In addition, since there is a gap between the lower surface of the push seat 51 and the upper surface of the magnetic base 3, it can be ensured that the lower ends of the three support pins 56 are in contact with the corresponding support grooves 32, thereby ensuring that the support surface of the push seat 51 is the plane established by the three points where the lower ends of the three support pins 56 abut the corresponding support grooves 32. The push seat 51 will not tilt due to other fulcrums, and can ensure that the push seat 51 is more stably supported on the magnetic base 3.

[0067] Optionally, the three supporting grooves 32 on the magnetic base 3 are in the shape of a regular triangle and surround the first pushing channel 31 .

[0068] Optionally, the support groove 32 has a V-shaped structure, and includes a first support slope 321 and a second support slope 322 disposed opposite each other. The support pin 56 is inserted into the push seat 51, and the lower end of the support pin 56 forms a hemispherical support portion 561, which abuts against the first support slope 321 and the second support slope 322. The hemispherical support portion 561 at the lower end of the support pin 56 is supported on both the first support slope 321 and the second support slope 322 of the support groove 32, thereby reducing friction between the support pin 56 and the support groove 32, ensuring the stability of the support of the support pin 56 by the support groove 32, and preventing the support pin 56 from shaking.

[0069] like Figure 4 As shown, optionally, in order to facilitate the preparation of the support groove 32 , a notch 323 is provided between the lower ends of the first support slope 321 and the second support slope 322 .

[0070] In order to make the push seat 51 be magnetically fixed on the magnetic base 3, as shown in FIG. Figure 4 As shown, optionally, the magnetic base 3 is provided with a plurality of first magnets 34, and the push seat 51 is provided with a plurality of second magnets having polarities opposite to those of the first magnets 34. Of course, it is also possible to provide magnets on only one of the magnetic base 3 and the push seat 51, while the other is provided with an iron structure that can be attracted by magnets, or an iron magnetic plate is embedded in the other.

[0071] like Figure 4 As shown, optionally, positioning pins 35 are provided on two adjacent side edges of the upper surface of the magnetic base 3 , and a gap is retained between the positioning pins 35 and the side edges of the push seat 51 .

[0072] By arranging positioning pins 35 on two adjacent side edges of the upper surface of the magnetic base 3, the positioning of the pushing seat 51 can be achieved, and finally, after the pushing seat 51 is magnetically attracted to the magnetic base 3, the second pushing channel 54 on the pushing seat 51 is aligned with the first pushing channel 31 on the magnetic base 3. At the same time, since a gap is retained between the positioning pin 35 and the side edge of the pushing seat 51, the positioning pin 35 will not interfere with the installation position of the pushing seat 51.

[0073] Of course, positioning pins 35 may also be provided on other side edges of the upper surface of the magnetic base 3 .

[0074] like Figure 2 、 Figure 3 and Figure 6As shown, optionally, the mounting bracket 2 includes a base plate 21, a first connecting plate 22, a second connecting plate 23 and a support frame 24, wherein: the base plate 21 is connected to the movable component of the first lifting mechanism 1. The first connecting plate 22 is connected to the base plate 21 in an adjustable position along a first horizontal direction (such as the X direction). The second connecting plate 23 is connected to the first connecting plate 22 in an adjustable position along a second horizontal direction (such as the Y direction), and the second horizontal direction is perpendicular to the first horizontal direction. The support frame 24 is connected to the second connecting plate 23, the magnetic base 3 is arranged on the top of the support frame 24, and the second lifting mechanism 4 is located inside the support frame 24.

[0075] Before performing the wafer pushing operation, the position of the first connecting plate 22 on the base plate 21 and the position of the second connecting plate 23 on the first connecting plate 22 are adjusted according to the position of the wafer to be pushed. In this way, the position of the pushing member 53 in the first and second horizontal directions is adjusted, ultimately ensuring that the pushing member 53 is in the predetermined pushing position. During the wafer removal process, the wafer to be pushed is sequentially moved to the position directly above the pushing position. In this way, the pushing member 53 can accurately push the wafer to be pushed when it rises.

[0076] In order to achieve the sliding guide of the first connecting plate 22, the first connecting plate 22 is prevented from being deviated when the position is adjusted along the first horizontal direction. Figure 6 and Figure 7 As shown, the upper surface of the base plate 21 is provided with a first guide groove 25 extending along the first horizontal direction. Correspondingly, the lower surface of the first connecting plate 22 is provided with a first protrusion 221 extending along the first direction. The first protrusion 221 is slidably mounted in the first guide groove 25. When the first connecting plate 22 is pushed to slide relative to the base plate 21 along the first horizontal direction, the first protrusion 221 cooperates with the first guide groove 25 to guide the sliding of the first connecting plate 22.

[0077] Optionally, the first connecting plate 22 is provided with a first waist hole 26 extending along the first horizontal direction, and the bottom plate 21 is provided with a first screw hole that penetrates the first waist hole 26. After the first connecting plate 22 is slid into place along the first horizontal direction, a fixing screw can be installed into the first waist hole 26 on the first connecting plate 22 and the first screw hole in the bottom plate 21 to fix the first connecting plate 22 to the bottom plate 21.

[0078] Optionally, a third magnet 222 is provided at the bottom of the first connecting plate 22, and correspondingly, a first magnetic plate 211 is embedded on the bottom plate 21. In this way, after the first connecting plate 22 slides into place along the first horizontal direction, the first connecting plate 22 can be magnetically attached to the bottom plate 21, thereby improving the stability of the first connecting plate 22 and preventing the first connecting plate 22 from shaking.

[0079] Similarly, to provide sliding guidance for the second connecting plate 23 and prevent it from deviating during position adjustment along the second horizontal direction, the upper surface of the first connecting plate 22 is optionally provided with a second guide groove 27 extending along the second horizontal direction. Correspondingly, the lower surface of the second connecting plate 23 is provided with a second protrusion extending along the second direction, which is slidably mounted within the second guide groove 27. When the second connecting plate 23 is pushed to slide on the first connecting plate 22 along the second horizontal direction, the second protrusion cooperates with the second guide groove 27 to provide sliding guidance for the second connecting plate 23.

[0080] Optionally, the second connecting plate 23 is provided with a second waist hole 28 extending along the second horizontal direction, and the first connecting plate 22 is provided with a second screw hole that penetrates the second waist hole 28. After the second connecting plate 23 is slid into place along the second horizontal direction, the fixing screws can be installed into the second waist hole 28 on the second connecting plate 23 and the second screw hole on the first connecting plate 22 to fix the second connecting plate 23 to the first connecting plate 22.

[0081] Optionally, a fourth magnet is provided at the bottom of the second connecting plate 23, and a corresponding second magnetic plate is embedded in the first connecting plate 22. Thus, after the second connecting plate 23 slides into place along the second horizontal direction, it can be magnetically attached to the first connecting plate 22, thereby improving the stability of the second connecting plate 23 and preventing it from shaking.

[0082] like Figure 5 As shown, the second lifting mechanism 4 optionally includes a voice coil motor 41 and a push block 42. The stator assembly 411 of the voice coil motor 41 is fixedly mounted on the mounting bracket 2. The movable assembly 412 of the voice coil motor 41 is connected to the stator assembly 411 in a liftable and slidable manner. The push block 42 is fixedly mounted on the top of the movable assembly 412. The lower end of the push member 53 abuts against the push block 42.

[0083] When the mover assembly 412 of the voice coil motor 41 rises, it drives the pushing block 42 to push the pushing member 53 upward. The upper end of the pushing member 53 passes through the pushing hole 55 upward to push the wafer located at a predetermined position of the blue film.

[0084] The voice coil motor 41 has the advantages of high speed and fast response. The voice coil motor 41 is used to drive the pushing member 53 to move, thereby improving the pushing efficiency of the pushing member 53.

[0085] Optionally, a vertical slide rail is provided on the stator assembly 411 , and the mover assembly 412 is slidably connected to the slide rail via a sliding connection plate 413 .

[0086] like Figure 5As shown, optionally, the second lifting mechanism 4 also includes a blowing block 43 arranged on the mounting bracket 2, and an air cavity connected to the compressed air source is provided in the blowing block 43, and a blowing hole connected to the air cavity is provided on the side of the blowing block 43 facing the mover assembly 412 of the voice coil motor 41.

[0087] The air blowing block 43 blows air toward the mover assembly 412 of the voice coil motor 41 through the air blowing holes, thereby cooling the voice coil motor 41 and extending the service life of the voice coil motor.

[0088] Optionally, the second lifting mechanism 4 further includes a grating scale 44 for measuring the lifting stroke of the mover assembly 412 of the voice coil motor 41. The grating scale 44 includes a grating and a reading head. The reading head is fixedly mounted on the mounting bracket 2, the grating is fixedly mounted on the side of the mover assembly 412, and the sensing end of the reading head is positioned opposite the grating. The provision of the grating scale 44 enables precise measurement of the lifting stroke of the mover assembly 412 of the voice coil motor 41, ultimately achieving precise control of the pushing stroke of the pusher 53, ensuring that the pusher 53 pushes the wafer to a predetermined height.

[0089] like Figure 10 As shown, optionally, the top of the needle cap 52 is also provided with an adsorption hole 57. Figure 4 and Figure 8 As shown, the magnetic base 3 is provided with an exhaust interface 33 for connecting the exhaust device, and the push seat 51 is provided with an exhaust hole 58 for connecting the exhaust interface 33 and the inner cavity of the needle cap 52. A sealing ring is provided at the connection between the exhaust hole 58 and the exhaust interface 33. The exhaust device exhausts air from the inner cavity of the needle cap 52 through the exhaust interface 33 and the exhaust hole 58, so that the adsorption hole 57 on the top of the needle cap 52 generates adsorption force.

[0090] Before controlling the pushing member 53 to push the chip, the needle cap 52 in contact with the blue film first absorbs the blue film through the adsorption hole 57, thereby ensuring that the relative position of the pushing member 53 and the chip remains relatively stable, preventing the chip from deviating from the pushing member 53 during the pushing process.

[0091] In order to ensure that the needle cap 52 is firmly locked on the push seat 51 and facilitate the disassembly and assembly of the needle cap 52, as shown in FIG. Figures 8 and 9 As shown, optionally, the needle cap 52 is detachably locked on the ejection seat 51 by a locking ring 59 .

[0092] like Figure 9As shown, the ejector member 53 comprises a clamp 531, an ejector rod 532, an ejector pin mounting seat, and a plurality of ejectors. The clamp 531 is detachably mounted to the lower end of the ejector rod 532. The lower end of the ejector rod 532 passes through the second ejection channel 54 and the first ejection channel 31, then abuts against the movable component of the second lifting mechanism 4. The clamp 531 is used to clamp and limit the ejector rod 532 within the first ejection channel 31. The ejector pin mounting seat is mounted on the upper end of the ejector rod 532. Several ejectors are mounted on the ejector pin mounting seat. The top of the needle cap 52 is provided with ejector holes 55 corresponding to each ejector pin.

[0093] The arrangement of the ejector member 53 facilitates assembly, disassembly, and maintenance of the ejector member 53, such as the replacement of the ejector pins. Furthermore, the ejector rod 532 is clamped and limited by the clamp 531 within the first ejector channel 31, ensuring that the lower end of the ejector rod 532 abuts against the movable component of the second lifting mechanism 4. The coordinated lifting of the wafer by multiple ejector pins improves the stability of the wafer lifting.

[0094] Optionally, the pushing member 53 further includes a pushing guide assembly, which includes a first guide wheel 533, a second guide wheel 534, and a guide post 535. The first guide wheel 533 and the second guide wheel 534 are arranged side by side on the clamp 531. The upper end of the guide post 535 is fixedly connected to the pushing seat 51, and the second end of the guide post 535 passes between the first guide wheel 533 and the second guide wheel 534. The first guide wheel 533 and the second guide wheel 534 both abut against the guide post 535.

[0095] The ejection guide assembly guides the lifting and lowering of the clamp 531 and the ejection rod 532, thereby improving the lifting stability of the ejector pin and ensuring that the ejector pin can accurately pass through the corresponding ejection hole 55 upward to implement the ejection of the wafer.

[0096] The present application has been described above in sufficient detail with certain specificity. Those skilled in the art will understand that the descriptions in the examples are merely illustrative, and that all modifications made without departing from the true spirit and scope of the present application are intended to be within the scope of protection of the present application. The scope of protection claimed in the present application is defined by the claims, not by the description in the examples.

Claims

1. A wafer pushing device, characterized in that: The wafer pushing device includes a first lifting mechanism, a mounting bracket, a magnetic base, a second lifting mechanism and a pushing assembly, wherein: The mounting bracket is connected to the movable component of the first lifting mechanism, and the first lifting mechanism is used to drive the mounting bracket to move up and down; The magnetic base is arranged on the top of the mounting bracket, and the magnetic base is provided with a first pushing channel which passes through the magnetic base; The second lifting mechanism is arranged in the mounting bracket; The pushing assembly includes a pushing seat, a needle cap and a pushing piece, wherein the pushing seat is magnetically fixed to the magnetic base, the pushing seat is provided with a second pushing channel that passes through the first pushing channel in an upper and lower direction, the needle cap is connected to the pushing seat, the pushing piece is arranged in the needle cap, and the top of the needle cap is provided with a pushing hole for the pushing piece to pass upward, and the lower end of the pushing piece passes through the second pushing channel and the first pushing channel in sequence and then abuts against the movable part of the second lifting mechanism.

2. The wafer pushing device according to claim 1, wherein: The upper surface of the magnetic base is provided with three supporting grooves surrounding the first pushing channel; The push seat is provided with three support pins corresponding to the support grooves one by one, and the support pins are all supported in the corresponding support grooves. A gap is retained between the lower surface of the push seat and the upper surface of the magnetic base.

3. The wafer pushing device according to claim 2, wherein: The support groove is a V-shaped structure, and the support groove includes a first support inclined surface and a second support inclined surface arranged opposite to each other; The support pin is inserted into the push seat, and the lower end of the support pin forms a hemispherical support portion, which abuts against the first support inclined surface and the second support inclined surface.

4. The wafer pushing device according to claim 1, wherein: The magnetic base is provided with a plurality of first magnets, and the push seat is provided with a plurality of second magnets with polarities opposite to those of the first magnets; Alternatively, one of the magnetic base and the pushing seat is provided with a magnet, and the other one of the magnetic base and the pushing seat is an iron structure.

5. The wafer pushing device according to claim 1, wherein: The upper surface of the magnetic base is provided with positioning pins on at least two adjacent side edges, and a gap is reserved between the positioning pins and the side edges of the pushing seat.

6. The wafer pushing device according to claim 1, wherein: The mounting bracket includes a base plate, a first connecting plate, a second connecting plate and a support frame, wherein: The bottom plate is connected to the movable component of the first lifting mechanism; The first connecting plate is connected to the bottom plate in an adjustable manner along a first horizontal direction; The second connecting plate is adjustably connected to the first connecting plate along a second horizontal direction, and the second horizontal direction is perpendicular to the first horizontal direction; The support frame is connected to the second connecting plate, the magnetic base is arranged on the top of the support frame, and the second lifting mechanism is located in the support frame.

7. The wafer pushing device according to claim 1, wherein: The second lifting mechanism includes a voice coil motor and a push block, wherein the stator assembly of the voice coil motor is fixedly mounted on the mounting bracket, the movable assembly of the voice coil motor is connected to the stator assembly in a lifting and sliding manner, and the push block is fixedly arranged on the top of the movable assembly; The lower end of the pushing member abuts against the pushing block.

8. The wafer pushing device according to claim 7, wherein: The second lifting mechanism also includes a blowing block arranged on the mounting bracket, wherein an air cavity connected to a compressed air source is provided in the blowing block, and a blowing hole communicating with the air cavity is provided on a side of the blowing block facing the mover assembly of the voice coil motor.

9. The wafer pushing device according to claim 7, wherein: The second lifting mechanism also includes a grating scale for measuring the lifting stroke of the movable subassembly of the voice coil motor. The grating scale includes a grating and a reading head. The reading head is fixedly mounted on the mounting bracket. The grating is fixedly mounted on the side of the movable subassembly. The sensing end of the reading head is arranged opposite to the grating.

10. The wafer pushing device according to claim 1, wherein: The top of the needle cap is also provided with an adsorption hole; The magnetic base is provided with an air extraction interface for connecting to an air extraction device; The push seat is provided with an exhaust hole for connecting the exhaust interface and the inner cavity of the needle cap. A sealing ring is provided at the connection between the exhaust hole and the exhaust interface. The exhaust device exhausts air from the inner cavity of the needle cap through the exhaust interface and the exhaust hole, so that the adsorption hole generates adsorption force.

11. The wafer pushing device according to claim 1, wherein: The needle cap is detachably locked on the pushing seat through a locking ring.

12. The wafer pushing device according to claim 1, wherein: The ejector member includes a clamp, an ejector rod, an ejector mounting seat and a plurality of ejectors, wherein: The clamp is detachably mounted on the lower end of the push rod; The lower end of the pushing rod passes through the second pushing channel and the first pushing channel in sequence and then abuts against the movable component of the second lifting mechanism. The clamp is used to clamp and limit the pushing rod in the first pushing channel. The ejector pin mounting seat is mounted on the upper end of the ejector rod; A plurality of ejectors are mounted on the ejector mounting seat, and the top of the needle cap is provided with ejection holes corresponding one-to-one to the ejectors.

13. The wafer pushing device according to claim 12, wherein: The pushing member further includes a pushing guide assembly, which includes a first guide wheel, a second guide wheel and a guide column, wherein: The first guide wheel and the second guide wheel are arranged side by side on the clamp; The upper end of the guide column is fixedly connected to the push seat, and the second end of the guide column passes between the first guide wheel and the second guide wheel. The first guide wheel and the second guide wheel both rest on the guide column.

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