Enhanced electromagnetic shielding power device packaging structure

Abstract

The utility model discloses an enhanced electromagnetic shielding power device packaging structure, which comprises a shielding shell assembly, a packaging assembly and a power device, and is characterized in that the shielding shell assembly comprises a shielding shell base and a shielding sealing cover; a packaging groove is formed in the shielding shell base, and the packaging assembly is arranged in the packaging groove; the packaging assembly comprises a circuit board, a heat-conducting metal plate and an insulating plate on the heat-conducting metal plate. A shielding metal plate is arranged on the insulating substrate; a plurality of square heat dissipation fins are arranged on the back surface of the shielding metal plate at equal intervals, and the heat dissipation fins are fixedly connected with the back surface of the shielding metal plate; and a copper column is arranged on the shielding metal plate. Compared with a traditional device, the design that the shielding metal plate is combined with the heat dissipation fins can improve the heat management capability of the packaging structure while ensuring the electromagnetic compatibility, and is beneficial to reducing the working temperature of a power device and improving the working efficiency and reliability of the device.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a power device packaging structure with enhanced electromagnetic shielding. Background Art

[0002] In the field of power device packaging, traditional technologies have been able to provide basic packaging functions, including electrical connections, signal transmission, and a certain degree of electromagnetic compatibility and thermal management. However, as electronic devices develop towards higher performance, smaller size, and more demanding operating environments, traditional packaging technologies have gradually exposed some limitations and shortcomings.

[0003] The current existing technology CN218772839U discloses a radio frequency module packaging structure, including a substrate, on which a radio frequency power module, a shielding cover and a supporting shell are arranged. The radio frequency power module is located inside the shielding cover, which is located inside the supporting shell. The upper end of the shielding cover is equidistantly fixedly connected with heat dissipation strips, and the upper end of the supporting shell is provided with a heat dissipation component. The utility model cooperates with a micro motor, fan blades and heat dissipation strips to start the micro motor to drive the fan blades to rotate. The rotating fan blades generate airflow to cool the heat dissipation strips. The cooling heat dissipation strips absorb the heat of the shielding cover, thereby reducing the temperature of the shielding cover, and then absorb the heat emitted by the radio frequency power module, thereby avoiding the power device in the radio frequency module from overheating and affecting the working efficiency of the device.

[0004] However, the above prior art still has the following problems:

[0005] 1. Affect the working efficiency of power devices; the operation of micro motors and fan blades may generate additional electromagnetic interference, which may have an adverse effect on the performance of the RF module.

[0006] 2. Poor reliability; micro motors and fan blades are used to achieve active heat dissipation. These moving parts may increase the unreliability of the cooling system due to wear, failure or maintenance requirements.

[0007] Therefore, it is necessary to provide a power device packaging structure with enhanced electromagnetic shielding to solve the above technical problems. Summary of the Invention

[0008] The utility model overcomes the deficiencies of the prior art and provides a power device packaging structure with enhanced electromagnetic shielding.

[0009] To achieve the above-mentioned object, the technical solution adopted by the present invention is: a power device packaging structure with enhanced electromagnetic shielding, comprising: a shielding shell component, a packaging component arranged on the shielding shell component, and a power device arranged on the packaging component;

[0010] The shielding shell assembly includes: a shielding shell base, and a shielding cover arranged on the shielding shell base;

[0011] The shielding shell base is provided with a packaging groove, and the packaging component is arranged in the packaging groove;

[0012] The packaging assembly includes: a circuit board arranged on the packaging slot, a heat-conducting metal plate arranged on the circuit board, and an insulating plate arranged on the heat-conducting metal plate; a shielding metal plate is arranged on the insulating substrate; a plurality of heat dissipation fins are equidistantly arranged on the back of the shielding metal plate, and a plurality of the heat dissipation fins are square, and a plurality of the heat dissipation fins are fixedly connected to the back of the shielding metal plate; a copper column is arranged on the shielding metal plate, and the copper column is fixedly connected to the base of the shielding shell and the shielding metal plate respectively.

[0013] In a preferred embodiment of the present invention, a base sliding groove is provided on the shielding shell base, and a cover sliding block is provided on the shielding shell cover, and the cover sliding block matches the shape of the base sliding groove.

[0014] In a preferred embodiment of the present invention, a base engaging groove is provided on the base of the shielding shell, and a cover engaging block is provided on the cover of the shielding shell, and the base engaging groove matches the shape of the cover engaging block.

[0015] In a preferred embodiment of the present invention, a base engaging block is provided on the base of the shielding shell, and a cover engaging groove is provided on the cover of the shielding shell, and the base engaging block matches the shape of the cover engaging groove.

[0016] In a preferred embodiment of the present invention, the base engaging block is provided with a cylindrical countersunk hole, and the cover engaging groove is provided with a threaded hole, and the cylindrical countersunk hole corresponds to the position of the threaded hole.

[0017] In a preferred embodiment of the present invention, a plurality of metal leads are provided on the front surface of the heat-conducting metal plate, one end of the plurality of metal leads is welded to the front surface of the heat-conducting metal plate, and the other end is welded to the circuit board.

[0018] In a preferred embodiment of the present invention, one side of the insulating plate is welded to the back side of the heat-conducting metal plate, and the other side is welded to the front side of the shielding metal plate.

[0019] In a preferred embodiment of the present invention, the insulating plate is made of insulating and heat-conductive material.

[0020] In a preferred embodiment of the present invention, the heat-conducting metal plate and the shielding metal plate are both made of copper.

[0021] In a preferred embodiment of the present invention, the packaging groove is filled with a heat-conducting medium, and the heat-conducting medium is a potting glue material.

[0022] The present invention solves the defects in the background technology and has the following beneficial effects:

[0023] (1) The shielding metal plate and the heat-conducting metal plate in the present invention act as electromagnetic shielding during the operation of the entire device. The heat dissipation fins provided on the back of the shielding metal plate improve the heat dissipation efficiency. Compared with conventional devices, the shielding metal plate combined with the heat dissipation fin design of the present invention can improve the thermal management capability of the packaging structure while ensuring electromagnetic compatibility, helping to reduce the operating temperature of the power device and improve the working efficiency and reliability of the device.

[0024] (2) The heat-conducting medium in the present invention is a potting material filled in the packaging slot. This component provides good thermal conductivity and electrical insulation during the operation of the entire device, while also securing and protecting the internal components. Compared with traditional devices, the potting material used in the present invention as a heat-conducting medium can provide more uniform and effective heat conduction, enhancing the stability and reliability of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The present invention is further described below with reference to the accompanying drawings and embodiments;

[0026] Figure 1 It is a three-dimensional structural diagram of a preferred embodiment of the utility model;

[0027] Figure 2 It is a preferred embodiment of the present utility model;

[0028] Figure 3 It is a preferred embodiment of the present utility model;

[0029] In the figure: 1. Shielding shell assembly; 2. Packaging assembly; 3. Power device; 4. Shielding shell base; 5. Shielding cover; 6. Packaging slot; 7. Fitting slot; 8. Circuit board; 9. Heat-conducting metal plate; 10. Insulation plate; 11. Shielding metal plate; 12. Heat sink fins; 13. Copper pillar. DETAILED DESCRIPTION

[0030] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. These drawings are simplified schematic diagrams that only illustrate the basic structure of the present invention in a schematic manner, and therefore only show components related to the present invention.

[0031] like Figure 1As shown, a power device 3 packaging structure with enhanced electromagnetic shielding includes: a shielding shell component 1, a packaging component 2 arranged on the shielding shell component 1, and a power device 3 arranged on the packaging component 2;

[0032] like Figure 2 As shown, the shielded housing assembly 1 includes a shielded housing base 4 and a shielded cover 5 mounted thereon. Together, these two components form the outer protective layer of the package structure. The shielded housing base 4 and the shielded cover 5 achieve a seal through a precise interlocking mechanism and a sliding fit, preventing external electromagnetic interference and protecting the internal power device 3 from environmental factors.

[0033] A packaging groove 6 is provided on the shielding shell base 4, and the packaging component 2 is arranged in the packaging groove 6; the packaging groove 6 provided on the shielding shell base 4 is used to place the packaging component 2 to ensure that the packaging component 2 is stably installed in the shielding shell component 1.

[0034] like Figure 3 As shown, the package assembly 2 includes: a circuit board 8 mounted on the package slot 6; a heat-conducting metal plate 9 mounted on the circuit board 8; and an insulating plate 10 mounted on the heat-conducting metal plate 9; a shielding metal plate 11 mounted on the insulating base; a plurality of square heat sink fins 12 equidistantly disposed on the back of the shielding metal plate 11; and copper pillars 13 mounted on the shielding metal plate 11, which are respectively fixed to the base 4 of the shielding housing and the shielding metal plate 11. The circuit board 8 provides the necessary electrical connections and signal transmission paths for the power device 3. The wiring on the circuit board 8 is designed to optimize electrical performance and reduce signal transmission loss. The shielding metal plate 11 mounted on the insulating plate 10 not only provides electromagnetic shielding but also improves heat dissipation efficiency through the heat sink fins 12 on the back. The copper pillars 13 on the shielding metal plate 11 are fixedly connected to the shielding shell base 4 and the shielding metal plate 11, thereby enhancing the stability of the overall structure; the copper pillars 13 on the shielding metal plate 11 serve as structural members to firmly fix the shielding metal plate 11 on the shielding shell base 4, and at the same time, the copper pillars 13 also serve as a medium for heat conduction, thereby further improving the heat dissipation performance.

[0035] The shielding shell base 4 is provided with a base sliding groove, and the shielding shell cover is provided with a cover sliding block, the cover sliding block and the base sliding groove matching the shape. The base sliding groove on the shielding shell base 4 and the cover sliding block on the shielding shell cover match the shape, achieving a precise sliding fit and facilitating the assembly and disassembly of the shielding shell.

[0036] The shielding shell base 4 is provided with a base fitting groove 7, and the shielding shell cover is provided with a cover fitting block. The base fitting groove 7 on the shielding shell base 4 matches the shape of the cover fitting block on the shielding shell cover to ensure the tight closure of the shielding shell assembly 1.

[0037] The shielding shell base 4 is equipped with a base engagement block, and the shielding shell cover is provided with a cover engagement groove 7. The base engagement block and the cover engagement groove 7 match in shape. The base engagement block has a cylindrical countersunk hole, and the cover engagement groove 7 has a threaded hole. The cylindrical countersunk hole on the base engagement block corresponds to the threaded hole in the cover engagement groove 7, and the shielding shell is securely locked through a threaded connection.

[0038] A plurality of metal leads are provided on the front surface of the heat-conducting metal plate 9. One end of each of the metal leads is welded to the front surface of the heat-conducting metal plate 9, and the other end is welded to the circuit board 8. The metal leads on the front surface of the heat-conducting metal plate 9 are welded to the heat-conducting metal plate 9 at one end, and to the circuit board 8 at the other end, forming an electrical connection, thereby ensuring the electrical performance of the power device 3.

[0039] One side of the insulating plate 10 is welded to the back side of the heat conducting metal plate 9 , and the other side is welded to the front side of the shielding metal plate 11 .

[0040] The insulating plate 10 is made of an insulating and thermally conductive material. Placed on the thermally conductive metal plate 9, it ensures electrical insulation while providing a good heat conduction path. One side of the insulating plate 10 is welded to the thermally conductive metal plate 9, and the other side is welded to the shielding metal plate 11, forming a stable heat conduction structure.

[0041] The heat-conducting metal plate 9 and the shielding metal plate 11 are both made of copper.

[0042] The packaging groove 6 is filled with a heat-conducting medium, which is a potting material. The heat-conducting medium filled in the packaging groove 6 is a potting material, which provides good thermal conductivity and electrical insulation performance, and at the same time plays a role in fixing and protecting the internal components.

[0043] When the present invention is used, the two ends of the metal lead are respectively welded to the circuit board 8 and the heat-conducting metal plate 9, and the front and back sides of the insulating plate 10 are respectively welded to the heat-conducting metal plate 9 and the shielding metal plate 11. The packaging component 2 is placed in the packaging groove 6 on the base 4 of the shielding shell, and the potting material is filled in the packaging groove 6; the cover sliding block slides on the base sliding groove, the cover interlocking block and the base interlocking groove are interlocked with each other, the cover interlocking groove 7 and the base interlocking block are interlocked with each other, and screws are installed at the corresponding cylindrical countersunk holes to achieve shell sealing.

[0044] The above description is based on the ideal embodiment of the present invention. Based on the above description, relevant personnel can make various changes and modifications without departing from the technical scope of the present invention. The technical scope of the present invention is not limited to the content of the specification, but must be determined according to the scope of the claims.

Claims

1. A power device (3) packaging structure with enhanced electromagnetic shielding, comprising: A shielding shell component (1), a packaging component (2) arranged on the shielding shell component (1), and a power device (3) arranged on the packaging component (2), characterized in that: The shielding shell assembly (1) comprises: a shielding shell base (4), and a shielding cover (5) arranged on the shielding shell base (4); A packaging groove (6) is provided on the shielding shell base (4), and the packaging component (2) is arranged in the packaging groove (6); The packaging assembly (2) comprises: a circuit board (8) arranged on the packaging slot (6), a heat-conducting metal plate (9) arranged on the circuit board (8), and an insulating plate (10) arranged on the heat-conducting metal plate (9); a shielding metal plate (11) is arranged on the insulating plate (10); a plurality of heat dissipation fins (12) are equidistantly arranged on the back of the shielding metal plate (11), and the plurality of heat dissipation fins (12) are square, and the plurality of heat dissipation fins (12) are fixedly connected to the back of the shielding metal plate (11); a copper column (13) is arranged on the shielding metal plate (11), and the copper column (13) is fixedly connected to the shielding shell base (4) and the shielding metal plate (11), respectively.

2. The enhanced electromagnetic shielding power device (3) packaging structure according to claim 1, characterized in that: The shielding shell base (4) is provided with a base sliding groove, and the shielding shell cover is provided with a cover sliding block, and the shape of the cover sliding block matches the shape of the base sliding groove.

3. The enhanced electromagnetic shielding power device (3) packaging structure according to claim 1, characterized in that: The shielding shell base (4) is provided with a base engaging groove, and the shielding shell cover is provided with a cover engaging block, and the base engaging groove matches the shape of the cover engaging block.

4. The enhanced electromagnetic shielding power device (3) packaging structure according to claim 1, characterized in that: The shielding shell base (4) is provided with a base interlocking block, and the shielding shell cover is provided with a cover interlocking groove (7), and the base interlocking block matches the shape of the cover interlocking groove (7).

5. The enhanced electromagnetic shielding power device (3) packaging structure according to claim 4, characterized in that: The base engaging block is provided with a cylindrical countersunk hole, and the cover engaging groove (7) is provided with a threaded hole, and the cylindrical countersunk hole corresponds to the position of the threaded hole.

6. The enhanced electromagnetic shielding power device (3) packaging structure according to claim 1, characterized in that: A plurality of metal leads are provided on the front surface of the heat-conducting metal plate (9), one end of the plurality of metal leads is welded to the front surface of the heat-conducting metal plate (9), and the other end is welded to the circuit board (8).

7. The enhanced electromagnetic shielding power device (3) packaging structure according to claim 1, characterized in that: One side of the insulating plate (10) is welded to the back side of the heat-conducting metal plate (9), and the other side is welded to the front side of the shielding metal plate (11).

8. The enhanced electromagnetic shielding power device (3) packaging structure according to claim 1, characterized in that: The insulating plate (10) is made of insulating and heat-conductive material.

9. The enhanced electromagnetic shielding power device (3) packaging structure according to claim 1, characterized in that: The heat-conducting metal plate (9) and the shielding metal plate (11) are both made of copper.

10. The enhanced electromagnetic shielding power device (3) packaging structure according to claim 1, characterized in that: The packaging groove (6) is filled with a heat-conducting medium, and the heat-conducting medium is a potting glue material.

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