Image sensing module, camera module and electronic device

Abstract

The utility model discloses an image sensing module. The image sensing module comprises a circuit substrate, an optical flat plate element, a photosensitive element, a metal bump and an anti-reflection layer, the circuit substrate has an upper surface and a lower surface opposite to each other, an opening surface connecting the upper surface and the lower surface, and an opening located at the opening surface. The optical flat element is fixed on the upper surface. The photosensitive element is arranged on the lower surface. The opening is located between the photosensitive element and the optical flat element. An air gap is formed between the photosensitive element and the optical flat element. The opening surface surrounds the air gap. The metal bump is arranged between the circuit substrate and the photosensitive element, and is electrically connected with the circuit substrate and the photosensitive element. The anti-reflection layer is arranged on the surface of the air gap. The anti-reflection layer comprises a nanometer ridge-shaped structure. The nanometer ridge-shaped structures extend towards the air gaps and are arranged in an irregular mode. The utility model also discloses a camera module with the image sensing module and an electronic device with the camera module.

Description

Technical Field

[0001] The utility model relates to an image sensing module, a camera module and an electronic device, in particular to an image sensing module suitable for the camera module and the electronic device. Background Art

[0002] With the rapid advancement of technology, lenses with high optical quality have become an indispensable part. In addition, the application range of electronic devices equipped with optical lenses has become wider and wider, and the requirements for optical lenses have also become more diverse.

[0003] However, in recent years, traditional optical lenses have struggled to meet the high optical quality demands of the increasingly diverse electronic products. In particular, non-imaging light is easily reflected within the imaging lens, affecting image quality. Therefore, improving the internal structure of imaging lenses to reduce the intensity of non-imaging light reflections and meet the high-standard requirements of today's electronic devices has become a key issue in the field. Utility Model Content

[0004] In view of the above-mentioned problems, the present invention discloses an image sensor module, a camera module and an electronic device, which help to reduce the reflection of non-imaging light, thereby improving the overall optical quality.

[0005] An image sensing module disclosed in one embodiment of the present invention includes a circuit substrate, an optical flat panel element, a photosensitive element, and a plurality of metal bumps. The circuit substrate has an upper surface, a lower surface, an opening surface, and an opening. The upper surface and the lower surface are disposed opposite each other. The opening surface connects the upper surface and the lower surface. The opening is located at the opening surface. The optical flat panel element is fixed to the upper surface of the circuit substrate. The optical flat panel element is disposed corresponding to the opening of the circuit substrate. The photosensitive element is disposed on the lower surface of the circuit substrate. The opening of the circuit substrate is located between the photosensitive element and the optical flat panel element. An air gap is formed between the photosensitive element and the optical flat panel element. The opening surface is disposed around the air gap. The metal bumps are disposed between the circuit substrate and the photosensitive element. Each metal bump is electrically connected to the circuit substrate and the photosensitive element. The image sensing module further includes at least one anti-reflection layer. The at least one anti-reflection layer is disposed on at least one surface in the air gap. The at least one anti-reflection layer includes a plurality of nano-ridge structures. The nano-ridge structures extend from the at least one surface in the air gap to the air gap. The nano-ridge structures are arranged in an irregular pattern.

[0006] Another embodiment of the present invention discloses a camera module comprising a lens module and the aforementioned image sensing module. The image sensing module is disposed on the image side of the lens module.

[0007] Another embodiment of the present invention discloses an electronic device including the aforementioned camera module.

[0008] According to the image sensing module, camera module, and electronic device disclosed in the above embodiments, by electrically connecting the metal bumps to the circuit substrate and the photosensitive element, combined with the design of at least one anti-reflection layer, the electrical connectivity of the image sensing module can be ensured, while meeting the requirements of miniaturization design. At the same time, the loss of optical image signals can be reduced, thereby improving the signal-to-noise ratio of the image and providing good optical imaging quality.

[0009] The above description of the content of the present invention and the following description of the embodiments are intended to demonstrate and explain the principles of the present invention and to provide further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a three-dimensional schematic diagram of a camera module according to the first embodiment of the present invention.

[0011] Figure 2 yes Figure 1 An exploded diagram of the camera module.

[0012] Figure 3 yes Figure 1 A partially cutaway perspective diagram of a camera module.

[0013] Figure 4 yes Figure 1 A side cross-sectional diagram of a camera module.

[0014] Figure 5 yes Figure 4 An enlarged diagram of the AA area of ​​the camera module.

[0015] Figure 6 yes Figure 5 An enlarged diagram of the BB area of ​​the camera module.

[0016] Figure 7 yes Figure 6 A partially enlarged schematic diagram of the camera module.

[0017] Figure 8 yes Figure 5 An enlarged schematic diagram of the CC area of ​​the camera module.

[0018] Figure 9 yes Figure 8 A partially enlarged schematic diagram of the camera module.

[0019] Figure 10 yes Figure 5 An enlarged schematic diagram of the DD area of ​​the camera module.

[0020] Figure 11 yes Figure 10A partially enlarged schematic diagram of the camera module.

[0021] Figure 12 yes Figure 5 An enlarged schematic diagram of the EE area of ​​the camera module.

[0022] Figure 13 It is an exploded schematic diagram of a camera module according to the second embodiment of the present invention.

[0023] Figure 14 FIG. 1 is an exploded schematic diagram of a camera module according to a third embodiment of the present invention.

[0024] Figure 15 It is an exploded schematic diagram of a camera module according to a fourth embodiment of the present invention.

[0025] Figure 16 FIG1 is a schematic side cross-sectional view of a partial area of ​​a camera module according to a fifth embodiment of the present invention.

[0026] Figure 17 yes Figure 16 An enlarged schematic diagram of the FF area of ​​the camera module.

[0027] Figure 18 FIG1 is a schematic side cross-sectional view of a partial area of ​​a camera module according to a sixth embodiment of the present invention.

[0028] Figure 19 yes Figure 18 An enlarged schematic diagram of the GG area of ​​the camera module.

[0029] Figure 20 FIG1 is a schematic side cross-sectional view of a partial area of ​​a camera module according to a seventh embodiment of the present invention.

[0030] Figure 21 yes Figure 20 An enlarged schematic diagram of the HH area of ​​the camera module.

[0031] Figure 22 yes Figure 20 An enlarged schematic diagram of area II of the camera module.

[0032] Figure 23 FIG2 is a side cross-sectional schematic diagram illustrating one configuration of a camera module according to an embodiment of the present invention.

[0033] Figure 24 FIG2 is a side cross-sectional schematic diagram illustrating another configuration of a camera module according to an embodiment of the present invention.

[0034] Figure 25FIG2 is a side cross-sectional schematic diagram illustrating yet another configuration of a camera module according to another embodiment of the present invention.

[0035] Figure 26 FIG2 is a side cross-sectional schematic diagram illustrating yet another configuration of a camera module according to another embodiment of the present invention.

[0036] Figure 27 A schematic three-dimensional diagram of one side of an electronic device according to an eighth embodiment of the present invention is shown.

[0037] Figure 28 Draw Figure 27 A three-dimensional schematic diagram of the other side of the electronic device.

[0038] Figure 29 A schematic diagram illustrating image capture using an ultra-wide-angle camera module.

[0039] Figure 30 A schematic diagram illustrating image capture using a high-pixel camera module is shown.

[0040] Figure 31 A schematic diagram illustrating image capture using a telephoto camera module is shown.

[0041] Figure 32 A schematic three-dimensional diagram of one side of an electronic device according to a ninth embodiment of the present invention is shown.

[0042] Figure 33 FIG. 1 is a perspective diagram of an electronic device according to a tenth embodiment of the present invention.

[0043] Figure 34 Draw Figure 33 A schematic side view of an electronic device.

[0044] Figure 35 Draw Figure 33 A schematic top view of an electronic device.

[0045]

Explanation of symbols

[0046] 1, 2, 3, 4, 5, 6, 7, 1-1, 1-2, 1-3, 1-4, 80, 80a, 80b, 80c, 90, 90a, 90b, 90c, 90d, 90e, 90f, 90g, 90h, 100: Camera module

[0047] 1a: Lens module

[0048] 1b, 2b, 3b, 4b, 5b, 6b, 7b: Image sensing module

[0049] 110, 210, 310, 410, 510, 610, 710: Circuit board

[0050] 111: Upper surface

[0051] 112, 512, 612, 712: lower surface

[0052] 113, 213, 313, 413, 513, 613, 713: Opening surface

[0053] 114, 414: Opening

[0054] 215, 315, 415: matte structure

[0055] 120, 220, 320, 420, 520, 620, 720: Optical flat panel components

[0056] 121, 721: inner side

[0057] 122, 522, 622, 722: outer side

[0058] 130, 230, 330, 430, 530, 630, 730: Photosensitive elements

[0059] 131: Photosensitive surface

[0060] 131a: Microlens array

[0061] 132, 232, 332, 432, 532: outer surface

[0062] 140, 240, 340, 440, 540, 640, 740: metal bumps

[0063] 150, 250, 350, 450, 550, 650, 750: filling elements

[0064] 551, 651, 751: cambered surface

[0065] 160a~160d, 560, 660, 760a~760b: anti-reflection layer

[0066] 161a-161d, 561, 661, 761a-761b: nano-ridge structures

[0067] 162b~162c, 762a~762b: Intermediary layer

[0068] 570, 670: shading element

[0069] 1c, 5c, 6c, 7c: protective layer

[0070] 8, 9, 10: Electronic devices

[0071] 81, 91: Flash module

[0072] 82: Focus assist module

[0073] 83: Image Signal Processor

[0074] 84: Display module

[0075] AA~II: Area

[0076] AG: Air Gap

[0077] BGA: Ball Grid Array Package

[0078] D1: Distance

[0079] D2: Thickness

[0080] EA: Elastic Components

[0081] FPCB: Flexible Printed Circuit Board

[0082] H: Height

[0083] RA: Rolling Component DETAILED DESCRIPTION

[0084] The following detailed description of the features and advantages of the present invention is sufficient to enable any person skilled in the art to understand the technical content of the present invention and implement it accordingly. Based on the disclosure of this specification, the scope of the claims, and the accompanying drawings, any person skilled in the art can easily understand the relevant objectives and advantages of the present invention. The following examples further illustrate the concepts of the present invention in detail but are not intended to limit the scope of the present invention in any way.

[0085] The present invention provides a camera module comprising a lens module and an image sensing module. The lens module is used to allow light to pass through. The image sensing module is disposed on the image side of the lens module.

[0086] The image sensor module may include a circuit substrate, an optical flat panel element, a photosensitive element, a plurality of metal bumps, a filling element, and at least one anti-reflection layer.

[0087] The circuit substrate can be made of materials such as ceramic, aluminum, or polytetrafluoroethylene, but the present invention is not limited thereto. The circuit substrate can have an upper surface, a lower surface, an opening surface, and an opening. The upper surface and the lower surface are disposed opposite each other. The opening surface connects the upper surface and the lower surface. The opening is located at the opening surface.

[0088] The optical plate element may be, for example, a filter, blue glass, or protective glass, but the present invention is not limited thereto. The optical plate element is fixed to the upper surface of the circuit substrate. The optical plate element may be fixed to the circuit substrate, for example, by adhesive, but the present invention is not limited thereto. The optical plate element is disposed corresponding to the opening in the circuit substrate. The optical plate element may have an inner side surface and an outer side surface disposed opposite each other.

[0089] A photosensitive element is disposed on the lower surface of a circuit substrate, and an opening in the circuit substrate is located between the photosensitive element and the optical plate element. An air gap is formed between the photosensitive element and the optical plate element, and the opening surface is disposed around the air gap. The inner side surface of the optical plate element may face the air gap. The boundary of the air gap may be defined by three surfaces: a side of the photosensitive element facing the optical plate element, a side of the optical plate element facing the photosensitive element, and the opening surface, but the present invention is not limited thereto.

[0090] The photosensitive element may have a photosensitive surface and a peripheral surface surrounding the photosensitive surface. The photosensitive surface may be disposed corresponding to the opening of the circuit substrate and is configured to convert optical image signals from light passing through the lens module into electronic signals. A microlens array may be disposed on the photosensitive surface.

[0091] The metal bumps may be, for example, cylindrical, spherical, conical, or hourglass-shaped, but the present invention is not limited thereto. The metal bumps are disposed between the circuit substrate and the photosensitive element, and each metal bump is electrically connected to the circuit substrate and the photosensitive element. The metal bumps may be disposed on at least one side of the outer peripheral surface of the photosensitive element. This ensures the electrical connectivity and miniaturization of the image sensing module, and improves the design margin of the metal bumps. The metal bumps may also be disposed on at least two opposite sides of the outer peripheral surface of the photosensitive element, but the present invention is not limited thereto. The metal bumps may also be disposed around the air gap, but the present invention is not limited thereto.

[0092] The filling element can be arranged between the circuit substrate and the photosensitive element. The filling element can completely cover each metal bump, and the filling element can surround and seal the air gap. Thereby, the photosensitive element can be prevented from being contaminated during the manufacturing process of the image sensing module, and the durability of the metal bump can be improved. The filling element can have at least one curved surface. The at least one curved surface can be, for example, a convex surface or a concave surface, but the present invention is not limited thereto. At least a portion of the filling element can be arranged on the opening surface of the circuit substrate. Thereby, the tightness of the filling element can be improved. The filling element can be made of an opaque material. Thereby, the optical imaging quality can be improved. The filling element can be, for example, a black colloid, or can be made of, for example, an insulating material, but the present invention is not limited thereto.

[0093] The at least one anti-reflection layer is disposed on at least one surface in the air gap. Based on the definition of the air gap boundary, the at least one surface in the air gap can be a surface associated with the side of the photosensitive element facing the optical flat panel element, the side of the optical flat panel element facing the photosensitive element, and the opening surface. Alternatively, the at least one surface can be one of these three surfaces, a surface extending to two of these three surfaces, or a surface extending to all three surfaces, but the present invention is not limited thereto. The at least one anti-reflection layer can be disposed on at least one of the upper surface, lower surface, and opening surface of the circuit substrate. This reduces the likelihood of stray light. The at least one anti-reflection layer can also be disposed on the inner surface of the optical flat panel element. This reduces internal surface reflection within the optical flat panel element. The at least one anti-reflection layer can also be disposed on the outer surface of the optical flat panel element. The at least one anti-reflection layer can also be disposed on at least one of the photosensitive surface and the outer peripheral surface of the photosensitive element. This simplifies the manufacturing process. The at least one anti-reflection layer may also be disposed on the microlens array at the photosensitive surface. The at least one anti-reflection layer may also be disposed on a filling element. The at least one anti-reflection layer may also be disposed on the at least one curved surface of the filling element. This ensures that the filling element has anti-reflection capabilities and improves the design margin of the at least one anti-reflection layer.

[0094] The at least one anti-reflective layer comprises a plurality of nano-ridge structures. The nano-ridge structures may be made of a material such as aluminum oxide, but the present invention is not limited thereto. The nano-ridge structures may also be doped with titanium, vanadium, chromium, tantalum, zirconium, niobium, or oxides of these metals, but the present invention is not limited thereto. The nano-ridge structures extend from the at least one surface at the air gap to the air gap, and the nano-ridge structures are arranged in an irregular pattern.

[0095] In the image sensing module or camera module discussed above, by electrically connecting the metal bumps to the circuit substrate and the photosensitive element, combined with the design of at least one anti-reflection layer, the electrical connectivity of the flip-chip packaged image sensing module provided by the present invention can be ensured, and the miniaturization design can be met. At the same time, the loss of the optical image signal can be reduced, thereby improving the signal-to-noise ratio of the image and providing good optical imaging quality.

[0096] The height of each nano-ridge structure is H, which can meet the following conditions: 25 nanometers ≤ H ≤ 400 nanometers. Thereby, the production efficiency of the image sensing module can be improved. Among them, the following conditions can also be met: 40 nanometers ≤ H ≤ 280 nanometers. Thereby, a better anti-reflection effect can be achieved. Among them, the structural height H of the nano-ridge structure can be the vertical height from the bottom of the nano-ridge structure to the top of the nano-ridge structure when observed from the cross-section (destructive measurement), but the present invention is not limited to this. Among them, when at least three nano-ridge structures are randomly selected for height measurement, the measured height H can meet the above-mentioned condition range, but the present invention is not limited to this.

[0097] The distance between the lower surface of the circuit substrate and the optical flat panel is D1, and the thickness of the air gap is D2, which can satisfy the following condition: 0.25 ≤ D1 / D2 ≤ 0.98. This further meets miniaturization requirements. Furthermore, the following condition can also be satisfied: 0.3 ≤ D1 / D2 ≤ 0.95. This further improves the yield rate of the image sensor module. The air gap thickness can be reduced by etching the circuit substrate, but the present invention is not limited to this.

[0098] The circuit substrate may also include multiple matte structures. These matte structures may be disposed on the opening surface of the circuit substrate, and the matte structures may taper from the opening surface toward the air gap. This design of the matte structures can further reduce interference from stray light and provide improved image recognition capabilities. Each matte structure may, for example, have a pointed or rounded end, but the present invention is not limited thereto.

[0099] The at least one anti-reflection layer may further include an intermediary layer. The intermediary layer may be disposed between the at least one surface at the air gap and the nano-ridge structure. The design of the intermediary layer can improve the coating pass rate. The intermediary layer may be, for example, a single-layer film or a multi-layer film, and may be used for optical anti-reflection, anti-pollution, or as a material matching layer, although the present invention is not limited thereto. The thickness of the intermediary layer may be greater than the height of the nano-ridge structure, but the present invention is not limited thereto. At least one region of the intermediary layer may be exposed to the air gap. This improves the mass production capability of the at least one anti-reflection layer.

[0100] The camera module may also include a protective layer. The protective layer may be made of materials such as colloids, resins, or polymers, but the present invention is not limited thereto. The protective layer may be disposed on the side of the image sensor module facing away from the lens module. This protects the circuit substrate, optical plate element, photosensitive element, metal bumps, filler element, and the at least one anti-reflection layer from external influences.

[0101] The various technical features of the image sensor module and the camera module of the present invention can be configured in combination to achieve corresponding effects.

[0102] Based on the above implementation manner, specific embodiments are presented below and described in detail with reference to the accompanying drawings.

[0103] <First embodiment>

[0104] Please refer to Figures 1 to 12 ,in Figure 1 is a perspective schematic diagram of a camera module according to the first embodiment of the present invention. Figure 2 yes Figure 1 Exploded diagram of the camera module. Figure 3 yes Figure 1 A partially cutaway perspective diagram of a camera module. Figure 4 yes Figure 1 A side cross-sectional schematic diagram of a camera module, Figure 5 yes Figure 4 An enlarged diagram of the AA area of ​​the camera module. Figure 6 yes Figure 5 An enlarged schematic diagram of the BB area of ​​the camera module. Figure 7 yes Figure 6 A partial enlarged schematic diagram of the camera module. Figure 8 yes Figure 5 An enlarged schematic diagram of the CC area of ​​the camera module, Figure 9 yes Figure 8 A partial enlarged schematic diagram of the camera module. Figure 10 yes Figure 5 An enlarged schematic diagram of the DD area of ​​the camera module. Figure 11 yes Figure 10 A partial enlarged schematic diagram of the camera module, and Figure 12 yes Figure 5 An enlarged schematic diagram of the EE area of ​​the camera module.

[0105] In this embodiment, a camera module 1 is provided, including a lens module 1 a , an image sensor module 1 b , and a protective layer 1 c .

[0106] The lens module 1a is used to allow light to pass through. Please note that the appearance or internal structure of the lens module 1a in the drawings is not intended to limit the present invention.

[0107] The image sensor module 1b is disposed on the image side of the lens module 1a and includes a circuit substrate 110, an optical plate element 120, a photosensitive element 130, a plurality of metal bumps 140, a filling element 150, and a plurality of anti-reflection layers 160a-160d.

[0108] The circuit substrate 110 has an upper surface 111, a lower surface 112, an opening surface 113, and an opening 114. The upper surface 111 and the lower surface 112 are disposed opposite each other. The opening surface 113 connects the upper surface 111 and the lower surface 112. The opening 114 is located at the opening surface 113.

[0109] The optical plate element 120 is fixed to the upper surface 111 of the circuit substrate 110. The optical plate element 120 is disposed corresponding to the opening 114 of the circuit substrate 110. The optical plate element 120 has an inner side surface 121 and an outer side surface 122 disposed opposite to each other.

[0110] The photosensitive element 130 is disposed on the lower surface 112 of the circuit substrate 110, such that the opening 114 of the circuit substrate 110 is located between the photosensitive element 130 and the optical plate element 120. The photosensitive element 130 has a photosensitive surface 131 and a peripheral surface 132 surrounding the photosensitive surface 131. The photosensitive surface 131 is disposed corresponding to the opening 114 of the circuit substrate 110 and is used to convert the optical image signal of the light passing through the lens module 1a into an electronic signal. Furthermore, a microlens array 131a is disposed on the photosensitive surface 131.

[0111] An air gap AG is formed between the photosensitive element 130 and the optical plate 120, such that the opening surface 113 surrounds the air gap AG, and the inner side surface 121 of the optical plate 120 faces the air gap AG. It is worth noting that the boundaries of the air gap AG can be defined by three surfaces: the surface of the photosensitive element 130 facing the optical plate 120 (e.g., the photosensitive surface 131 or the outer peripheral surface 132), the surface of the optical plate 120 facing the photosensitive element 130 (e.g., the inner side surface 121), and the opening surface 113, but the present invention is not limited to this. In the drawings, the extent of the air gap AG is represented by dots.

[0112] The distance between the lower surface 112 of the circuit substrate 110 and the optical plate element 120 is D1 , and the thickness of the air gap AG is D2 , which satisfies the following conditions: D1 = 0.31 mm; D2 = 0.4 mm; and D1 / D2 = 0.78.

[0113] Cylindrical metal bumps 140 are disposed between the circuit substrate 110 and the photosensitive element 130, electrically connecting each metal bump 140 to the circuit substrate 110 and the photosensitive element 130. Specifically, the metal bumps 140 are divided into four groups and disposed in four areas on the outer peripheral surface 132 of the photosensitive element 130. Alternatively, the metal bumps 140 are disposed around the air gap AG.

[0114] The filling element 150 is disposed between the circuit substrate 110 and the photosensitive element 130. The filling element 150 completely covers each metal bump 140 and surrounds and closes the air gap AG.

[0115] The anti-reflection layers 160a to 160d are disposed on at least one surface of the air gap AG. Specifically, the anti-reflection layer 160a is disposed on the lower surface 112 and the opening surface 113 of the circuit substrate 110. Figure 5 and Figure 6 The anti-reflection layer 160b is disposed on the inner side 121 of the optical flat plate element 120, as shown in FIG. Figure 5 and Figure 8 The anti-reflection layer 160c is disposed on the microlens array 131a at the photosensitive surface 131 of the photosensitive element 130, as shown in FIG. Figure 5 and Figure 10 The anti-reflection layer 160d is disposed on the filling element 150, as shown. Figure 5 and Figure 12 shown.

[0116] The anti-reflection layer 160a includes a plurality of nano-ridge structures 161a. The nano-ridge structures 161a extend from the lower surface 112 and the opening surface 113 toward the air gap AG, and the nano-ridge structures 161a are arranged in an irregular manner, such as Figure 6 shown.

[0117] The height of each nano-ridge structure 161a is H. When any three nano-ridge structures 161a are randomly selected for height measurement, they satisfy the following conditions: H = 187 nm; 131 nm; and 108 nm. Figure 6 The enlarged schematic diagram of the nano-ridge structure 161a is shown as H from the left to the right. Figure 7 shown.

[0118] The anti-reflection layer 160b includes a plurality of nano-ridge structures 161b and an intermediary layer 162b disposed between the inner side surface 121 and the nano-ridge structures 161b. The nano-ridge structures 161b extend from the intermediary layer 162b toward the air gap AG along the direction from the inner side surface 121 to the air gap AG, and the nano-ridge structures 161b are arranged in an irregular pattern, such as Figure 8 In addition, the thickness of the interposing layer 162b may be greater than the height of the nano-ridge structure 161b, and at least a region of the interposing layer 162b may be exposed to the air gap AG.

[0119] The height of each nano-ridge structure 161b is H. When any three nano-ridge structures 161b are randomly selected for height measurement, they satisfy the following conditions: H = 165 nm; 48 nm; and 86 nm. Figure 8 The enlarged schematic diagram of the nano-ridge structure 161b is shown in FIG. Figure 9 shown.

[0120] The anti-reflection layer 160c includes a plurality of nano-ridge structures 161c and an intermediary layer 162c disposed between the microlens array 131a and the nano-ridge structures 161c. The nano-ridge structures 161c extend from the intermediary layer 162c toward the air gap AG along the direction from the photosensitive surface 131 to the air gap AG, and the nano-ridge structures 161c are arranged in an irregular pattern, such as Figure 10 In addition, the thickness of the interposing layer 162c may be greater than the height of the nano-ridge structure 161c, and at least a region of the interposing layer 162c may be exposed to the air gap AG.

[0121] The height of each nano-ridge structure 161c is H. When any three nano-ridge structures 161c are randomly selected for height measurement, they satisfy the following conditions: H = 32 nm; 99 nm; and 67 nm. Figure 10 The enlarged schematic diagram of the nano-ridge structure 161c is shown as H from the left to the right. Figure 11 shown.

[0122] The anti-reflection layer 160d includes a plurality of nano-ridge structures 161d. The nano-ridge structures 161d extend from the filling element 150 toward the air gap AG, and the nano-ridge structures 161d are arranged in an irregular pattern, such as Figure 12 shown.

[0123] The height of each nano-ridge structure 161d is H. When any three nano-ridge structures 161d are randomly selected for height measurement, they satisfy the following conditions: H = 64 nm; 221 nm; and 161 nm. Figure 12 As shown by H marked from top to bottom.

[0124] The protective layer 1c is disposed on a side of the image sensor module 1b away from the lens module 1a to protect the circuit substrate 110, the optical plate element 120, the photosensitive element 130, the metal bumps 140, the filling element 150 and the anti-reflection layers 160a-160d from external influences.

[0125] <Second embodiment>

[0126] Please refer to Figure 13 , is an exploded schematic diagram of a camera module according to a second embodiment of the present invention.

[0127] In this embodiment, a camera module 2 is provided, comprising a lens module (not shown), an image sensor module 2b, and a protective layer (not shown) arranged in sequence.

[0128] Image sensor module 2b includes a circuit substrate 210, an optical plate 220, a photosensitive element 230, a plurality of metal bumps 240, a filling element 250, and a plurality of anti-reflection layers (not separately labeled). The circuit substrate 210, optical plate 220, photosensitive element 230, metal bumps 240, filling element 250, and anti-reflection layers of image sensor module 2b are similar to the circuit substrate 110, optical plate 120, photosensitive element 130, metal bumps 140, filling element 150, and anti-reflection layers 160a-160d of image sensor module 1b of the first embodiment, respectively. Only the differences are described below.

[0129] The circuit substrate 210 further has a plurality of matte structures 215. The matte structures 215 are disposed on the opening surface 213 of the circuit substrate 210. Each matte structure 215 tapers from the opening surface 213 toward the air gap AG and has a rounded end.

[0130] The metal bumps 240 are divided into two groups and arranged in two rows on opposite sides of the outer peripheral surface 232 of the photosensitive element 230. Furthermore, the photosensitive element 230 and the filling element 250 also have different structures than the photosensitive element 130 and the filling element 150, corresponding to the arrangement of the metal bumps 240.

[0131] <Third embodiment>

[0132] Please refer to Figure 14 , is an exploded schematic diagram of a camera module according to a third embodiment of the present invention.

[0133] In this embodiment, a camera module 3 is provided, which includes a lens module (not shown), an image sensor module 3b and a protective layer (not shown) arranged in sequence.

[0134] Image sensor module 3b includes a circuit substrate 310, an optical plate element 320, a photosensitive element 330, a plurality of metal bumps 340, a filling element 350, and a plurality of anti-reflection layers (not separately labeled). The circuit substrate 310, optical plate element 320, photosensitive element 330, metal bumps 340, filling element 350, and anti-reflection layers of image sensor module 3b are similar to the circuit substrate 110, optical plate element 120, photosensitive element 130, metal bumps 140, filling element 150, and anti-reflection layers 160a-160d of image sensor module 1b of the first embodiment, respectively. Only the differences are described below.

[0135] The circuit substrate 310 further has a plurality of matte structures 315. The matte structures 315 are disposed on the opening surface 313 of the circuit substrate 310. Each matte structure 315 tapers from the opening surface 313 toward the air gap AG and has a pointed end.

[0136] The metal bumps 340 are divided into four groups and are disposed off-center in four areas on the outer peripheral surface 332 of the photosensitive element 330. Furthermore, the photosensitive element 330 and the filling element 350 also have different structures from the photosensitive element 130 and the filling element 150 corresponding to the arrangement of the metal bumps 340.

[0137] <Fourth embodiment>

[0138] Please refer to Figure 15 , is an exploded schematic diagram of a camera module according to a fourth embodiment of the present invention.

[0139] In this embodiment, a camera module 4 is provided, which includes a lens module (not shown), an image sensor module 4b and a protective layer (not shown) arranged in sequence.

[0140] Image sensor module 4b includes a circuit substrate 410, an optical plate element 420, a photosensitive element 430, a plurality of metal bumps 440, a filling element 450, and a plurality of anti-reflection layers (not separately labeled). The circuit substrate 410, optical plate element 420, photosensitive element 430, metal bumps 440, filling element 450, and anti-reflection layers of image sensor module 4b are similar to the circuit substrate 110, optical plate element 120, photosensitive element 130, metal bumps 140, filling element 150, and anti-reflection layers 160a-160d of image sensor module 1b of the first embodiment, respectively. Only the differences are described below.

[0141] The circuit substrate 410 has a stepped structure at the opening 414. The circuit substrate 410 also has a plurality of matte structures 415. The matte structures 415 are disposed on the opening surface 413 of one of the stepped structures of the circuit substrate 410. Each matte structure 415 tapers from the opening surface 413 toward the air gap AG, with a rounded end.

[0142] The metal bumps 440 are divided into two groups and arranged in two staggered rows on opposite sides of the outer surface 432 of the photosensitive element 430. Furthermore, the photosensitive element 430 and the filling element 450 also correspond to the arrangement of the metal bumps 440 and have different structures from the photosensitive element 130 and the filling element 150.

[0143] <Fifth embodiment>

[0144] Please refer to Figures 16 and 17 ,in Figure 16 is a side cross-sectional schematic diagram of a partial area of ​​a camera module according to a fifth embodiment of the present invention, and Figure 17 yes Figure 16 An enlarged schematic diagram of the FF area of ​​the camera module.

[0145] In this embodiment, a camera module 5 is provided, comprising a lens module (not shown), an image sensing module 5b, and a protective layer 5c, which are sequentially arranged.

[0146] Image sensor module 5b includes a circuit substrate 510, an optical plate element 520, a photosensitive element 530, a plurality of metal bumps 540, a filling element 550, and an anti-reflection layer 560. The circuit substrate 510, optical plate element 520, photosensitive element 530, metal bumps 540, filling element 550, and anti-reflection layer 560 of image sensor module 5b are similar to the circuit substrate 110, optical plate element 120, photosensitive element 130, metal bumps 140, filling element 150, and anti-reflection layers 160a-160d of image sensor module 1b of the first embodiment, respectively. Only the differences are described below.

[0147] The opening surface 513 of the circuit substrate 510 is an inclined surface facing the optical flat plate element 520. The metal bump 540 is tapered. The filling element 550 has a plurality of arc surfaces 551, and the arc surfaces 551 are concave.

[0148] The distance between the lower surface 512 of the circuit substrate 510 and the optical plate element 520 is D1 , and the thickness of the air gap AG is D2 , which satisfies the following conditions: D1 = 0.31 mm; D2 = 0.4 mm; and D1 / D2 = 0.78.

[0149] The anti-reflection layer 560 is disposed on the outer peripheral surface 532 of the photosensitive element 530. Figure 16 and Figure 17 As shown. The anti-reflection layer 560 includes a plurality of nano-ridge structures 561. The nano-ridge structures 561 extend from the outer peripheral surface 532 toward the air gap AG, and the nano-ridge structures 561 are arranged in an irregular form, as shown in FIG. Figure 17 shown.

[0150] The height of each nano-ridge structure 561 is H. When any three nano-ridge structures 561 are randomly selected for height measurement, the following conditions are met: H = 129 nm; 75 nm; and 145 nm. Figure 17 As shown by the H marked from left to right.

[0151] The image sensor module 5b further includes a light shielding element 570. The light shielding element 570 is disposed on the outer side surface 522 of the optical plate element 520. The light shielding element 570 has an inclined surface facing away from the optical plate element 520. The light shielding element 570 is used to block part of the light from the lens module.

[0152] <Sixth embodiment>

[0153] Please refer to Figures 18 and 19 ,in Figure 18 is a side cross-sectional schematic diagram of a partial area of ​​a camera module according to a sixth embodiment of the present invention, and Figure 19 yes Figure 18 An enlarged schematic diagram of the GG area of ​​the camera module.

[0154] In this embodiment, a camera module 6 is provided, comprising a lens module (not shown), an image sensing module 6b, and a protective layer 6c, which are sequentially arranged.

[0155] Image sensor module 6b includes a circuit substrate 610, an optical plate element 620, a photosensitive element 630, a plurality of metal bumps 640, a filling element 650, and an anti-reflection layer 660. The circuit substrate 610, optical plate element 620, photosensitive element 630, metal bumps 640, filling element 650, and anti-reflection layer 660 of image sensor module 6b are similar to the circuit substrate 110, optical plate element 120, photosensitive element 130, metal bumps 140, filling element 150, and anti-reflection layers 160a-160d of image sensor module 1b of the first embodiment, respectively. Only the differences are described below.

[0156] The opening surface 613 of the circuit substrate 610 is an inclined surface facing the photosensitive element 630 . The metal bump 640 is spherical. The filling element 650 has a curved surface 651 . The curved surface 651 is concave and faces the optical flat plate element 620 .

[0157] The distance between the lower surface 612 of the circuit substrate 610 and the optical plate element 620 is D1 , and the thickness of the air gap AG is D2 , which satisfies the following conditions: D1 = 0.16 mm; D2 = 0.25 mm; and D1 / D2 = 0.64.

[0158] The anti-reflection layer 660 is disposed on the arc surface 651 of the filling element 650. Figure 18 and Figure 19 The anti-reflection layer 660 includes a plurality of nano-ridge structures 661. The nano-ridge structures 661 extend from the arc surface 651 toward the air gap AG, and the nano-ridge structures 661 are arranged in an irregular manner, as shown in FIG. Figure 19 shown.

[0159] The height of each nano-ridge structure 661 is H. When any three nano-ridge structures 661 are randomly selected for height measurement, the following conditions are satisfied: H = 111 nm; 50 nm; and 189 nm. Figure 19 As shown by the H marked from left to right.

[0160] The image sensor module 6b further includes a light shielding element 670. The light shielding element 670 is disposed on the outer side surface 622 of the optical plate element 620. The light shielding element 670 is used to shield part of the light from the lens module.

[0161] <Seventh embodiment>

[0162] Please refer to Figures 20 to 22 ,in Figure 20 FIG2 is a side cross-sectional schematic diagram of a partial area of ​​a camera module according to a seventh embodiment of the present invention. Figure 21 yes Figure 20 An enlarged schematic diagram of the HH area of ​​the camera module, and Figure 22 yes Figure 20 An enlarged schematic diagram of area II of the camera module.

[0163] In this embodiment, a camera module 7 is provided, which includes a lens module (not shown), an image sensor module 7b, and a protective layer 7c arranged in sequence.

[0164] The image sensor module 7b includes a circuit substrate 710, an optical plate element 720, a photosensitive element 730, a plurality of metal bumps 740, a filling element 750, and a plurality of anti-reflection layers 760a-760b. The circuit substrate 710, optical plate element 720, photosensitive element 730, metal bumps 740, filling element 750, and anti-reflection layers 760a-760b of the image sensor module 7b are similar to the circuit substrate 110, optical plate element 120, photosensitive element 130, metal bumps 140, filling element 150, and anti-reflection layers 160a-160d of the image sensor module 1b of the first embodiment, respectively. Only the differences are described below.

[0165] The metal bump 740 is hourglass-shaped. At least a portion of the filling element 750 is disposed on the opening surface 713 of the circuit substrate 710. The filling element 750 has a curved surface 751. The curved surface 751 is convex and faces the optical plate element 720.

[0166] The distance between the lower surface 712 of the circuit substrate 710 and the optical plate element 720 is D1 , and the thickness of the air gap AG is D2 , which satisfies the following conditions: D1 = 0.11 mm; D2 = 0.26 mm; and D1 / D2 = 0.42.

[0167] The anti-reflection layer 760a is disposed on the outer side 722 of the optical flat plate element 720. Figure 20 and Figure 21 The anti-reflection layer 760b is disposed on the inner side 721 of the optical flat plate element 720, as shown in FIG. Figure 20 and Figure 22 shown.

[0168] The anti-reflection layer 760a includes a plurality of nano-ridge structures 761a and an intermediate layer 762a disposed between the outer surface 722 and the nano-ridge structures 761a. The nano-ridge structures 761a extend from the intermediate layer 762a away from the outer surface 722, and the nano-ridge structures 761a are arranged in an irregular pattern, such as Figure 21 In addition, the thickness of the intermediary layer 762a may be greater than the height of the nano-ridge structure 761a.

[0169] The height of each nano-ridge structure 761a is H. When any three nano-ridge structures 761a are randomly selected for height measurement, they satisfy the following conditions: H = 82 nm; 194 nm; and 150 nm. Figure 21 As shown by the H marked from left to right.

[0170] The anti-reflection layer 760b includes a plurality of nano-ridge structures 761b and an intermediary layer 762b disposed between the inner side surface 721 and the nano-ridge structures 761b. The nano-ridge structures 761b extend from the intermediary layer 762b toward the air gap AG along the direction from the inner side surface 721 to the air gap AG, and the nano-ridge structures 761b are arranged in an irregular pattern, such as Figure 22 In addition, the thickness of the interposing layer 762b may be greater than the height of the nano-ridge structure 761b, and at least a region of the interposing layer 762b may be exposed to the air gap AG.

[0171] The height of each nano-ridge structure 761b is H. When any three nano-ridge structures 761b are randomly selected for height measurement, they satisfy the following conditions: H = 150 nm; 131 nm; and 93 nm. Figure 22 As shown by the H marked from left to right.

[0172] <Varied Configuration of Camera Module>

[0173] The camera module 1 of the present invention, in addition to Figure 4 In addition to the configuration shown, other configurations are also possible.

[0174] Please refer to Figure 23 , is a side cross-sectional diagram illustrating one configuration of a camera module according to an embodiment of the present invention. Figure 23As shown, the camera module 1 - 1 may also configure a ball grid array package (BGA) in the image sensor module 1 b.

[0175] In the configuration of camera module 1 - 1 , the distance between the lower surface 112 of the circuit substrate 110 and the optical plate element 120 is D1 , and the thickness of the air gap AG is D2 , which satisfies the following conditions: D1 = 0.21 mm; D2 = 0.4 mm; and D1 / D2 = 0.53. However, the present invention is not limited thereto.

[0176] Please refer to Figure 24 , is a side cross-sectional schematic diagram illustrating another configuration of a camera module according to an embodiment of the present invention. Figure 24 As shown, the camera module 1 - 2 may also be configured with a flexible printed circuit board (FPCB) in the image sensor module 1 b.

[0177] In the configuration of camera module 1-2, the distance between the lower surface 112 of circuit substrate 110 and optical plate element 120 is D1, and the thickness of air gap AG is D2, which satisfies the following conditions: D1 = 0.31 mm; D2 = 0.48 mm; and D1 / D2 = 0.65. However, the present invention is not limited to this.

[0178] Please refer to Figure 25 , is a side cross-sectional schematic diagram illustrating another configuration of a camera module according to another embodiment of the present invention. Figure 25 As shown, the camera modules 1 - 3 may also configure a rolling assembly RA (rolling assembly) on the image sensing module 1 b to provide the image sensing module 1 b with at least one degree of freedom of movement.

[0179] In the configuration of camera modules 1-3, the distance between the lower surface 112 of the circuit substrate 110 and the optical plate element 120 is D1, and the thickness of the air gap AG is D2, which satisfies the following conditions: D1 = 0.16 mm; D2 = 0.25 mm; and D1 / D2 = 0.64. However, the present invention is not limited to this.

[0180] Please refer to Figure 26 , is a side cross-sectional schematic diagram illustrating yet another configuration of a camera module according to another embodiment of the present invention. Figure 26 As shown, the camera modules 1 - 4 may also configure an elastic element EA (elastic assembly) on the image sensing module 1 b to provide the image sensing module 1 b with at least one degree of freedom of movement.

[0181] In the configuration of camera modules 1-4, the distance between the lower surface 112 of the circuit substrate 110 and the optical plate element 120 is D1, and the thickness of the air gap AG is D2, which satisfies the following conditions: D1 = 0.16 mm; D2 = 0.25 mm; and D1 / D2 = 0.64. However, the present invention is not limited to this.

[0182] The above-mentioned modified configuration is not limited to the camera module 1 of the first embodiment, but may also be applied to the camera modules 2 to 7 of the second to seventh embodiments, or may also be applied to other camera modules.

[0183] <Eighth Embodiment>

[0184] Please refer to Figure 27 and Figure 28 ,in Figure 27 A three-dimensional schematic diagram of one side of an electronic device according to an eighth embodiment of the present invention is shown, and Figure 28 Draw Figure 27 A three-dimensional schematic diagram of the other side of the electronic device.

[0185] In this embodiment, the electronic device 8 is a smart phone and includes a plurality of camera modules, a flash module 81 , a focus assist module 82 , an image signal processor 83 , a display module (user interface) 84 , and an image software processor (not shown).

[0186] These camera modules include an ultra-wide-angle camera module 80a, a high-pixel camera module 80b, a telephoto camera module 80c, and a telephoto camera module 80. The camera module 80 is one of the camera modules 1 to 7 and 1-1 to 1-4 of the above-mentioned embodiments.

[0187] The ultra-wide-angle camera module 80a has the function of accommodating multiple views. Figure 29 A schematic diagram of capturing an image using the ultra-wide-angle camera module 80a is shown. The maximum viewing angle (FOV) of the ultra-wide-angle camera module 80a corresponds to Figure 29 perspective.

[0188] The high-pixel camera module 80b has high resolution and low distortion functions. The high-pixel camera module 80b can further capture Figure 29 Part of the image. Figure 30 FIG. 8 is a schematic diagram showing an image captured by a high-pixel camera module 80 b .

[0189] The telephoto camera module 80c and the telephoto camera module 80 have a high magnification function. The telephoto camera module 80c and the telephoto camera module 80 can further capture Figure 30 Part of the image. Figure 31FIG. 1 is a schematic diagram illustrating an image captured by the telephoto camera module 80 c or the telephoto camera module 80 .

[0190] When a user photographs a subject, the electronic device 8 utilizes the ultra-wide-angle camera module 80a, the high-pixel camera module 80b, the telephoto camera module 80c, or the telephoto camera module 80 to focus light and capture an image. The flash module 81 is activated for fill light, and the object distance information provided by the focus assist module 82 is used for rapid focusing. The image signal processor 83 then performs image optimization processing to further enhance the image quality produced by the camera modules while also providing a zoom function. The focus assist module 82 may utilize an infrared or laser focus assist system to achieve rapid focusing. The display module 84 may utilize a touch screen with touch functionality, allowing manual adjustment of the shooting angle, thereby switching between different camera modules, and cooperating with the diverse functions of the image software processor to capture and process images (or a physical capture button may be used for capture). The image processed by the image software processor is displayed on the display module 84.

[0191] Ninth embodiment

[0192] Please refer to Figure 32 , is a schematic three-dimensional diagram illustrating one side of an electronic device according to a ninth embodiment of the present invention.

[0193] In this embodiment, electronic device 9 is a smartphone. Electronic device 9 includes camera modules 90, 90a, 90b, 90c, 90d, 90e, 90f, 90g, 90h, a flash module 91, an image signal processor, a display device, and an image software processor (not shown). Camera modules 90, 90a, 90b, 90c, 90d, 90e, 90f, 90g, and 90h are all located on the same side of electronic device 9, while the display device is located on the other side of electronic device 9. Camera module 90 is one of camera modules 1-7 and 1-1-1-4 described in the aforementioned embodiments.

[0194] Camera module 90 is a telephoto camera module, camera module 90a is a telephoto camera module, camera module 90b is a telephoto camera module, camera module 90c is a telephoto camera module, camera module 90d is a wide-angle camera module, camera module 90e is a wide-angle camera module, camera module 90f is an ultra-wide-angle camera module, camera module 90g is an ultra-wide-angle camera module, and camera module 90h is a Time of Flight (ToF) camera module. In this embodiment, camera modules 90, 90a, 90b, 90c, 90d, 90e, 90f, and 90g have different viewing angles, allowing electronic device 9 to provide different magnifications, achieving an optical zoom effect. Furthermore, camera modules 90a and 90b are also telephoto camera modules equipped with light deflection elements. Furthermore, camera module 90h can obtain depth information from an image. The electronic device 9 described above includes a plurality of camera modules 90, 90a, 90b, 90c, 90d, 90e, 90f, 90g, and 90h, but the number and configuration of the camera modules are not intended to limit the present invention. When a user photographs a subject, the electronic device 9 utilizes camera module 90, camera module 90a, camera module 90b, camera module 90c, camera module 90d, camera module 90e, camera module 90f, camera module 90g, or camera module 90h to focus light and capture an image, activates flash module 91 for fill light, and performs subsequent processing similar to the aforementioned embodiments, which will not be further described here.

[0195] <Tenth embodiment>

[0196] Please refer to Figures 33 to 35 ,in Figure 33 FIG2 is a perspective diagram of an electronic device according to a tenth embodiment of the present invention. Figure 34 Draw Figure 33 A schematic side view of an electronic device, and Figure 35 Draw Figure 33 A schematic top view of an electronic device.

[0197] In this embodiment, the electronic device 10 is a car and includes a plurality of vehicle camera modules 100 . These camera modules 100 are one of the camera modules 1-7 and 1-1-1-4 described above. These camera modules 100 can be used in, for example, panoramic driving assistance systems, driving recorders, and reverse imaging devices.

[0198] like Figure 33As shown, camera modules 100 can be installed around the vehicle, for example, to capture images of the surrounding area, helping to identify road conditions outside the vehicle and thus implement automated assisted driving. Furthermore, the images can be combined into a panoramic view using an image software processor, providing images of the driver's blind spots, allowing the driver to monitor the surrounding area and facilitate driving and parking.

[0199] like Figure 34 As shown, the camera module 100 can be respectively disposed below the left and right rearview mirrors, wherein the viewing angle of the camera module 100 can be 40 degrees to 90 degrees for capturing image information within the left and right lanes.

[0200] like Figure 35 As shown, the camera module 100 can also be arranged, for example, below the left and right rearview mirrors and inside the front and rear windshields, thereby helping the driver to obtain external space information outside the cockpit, providing more viewing angles to reduce blind spots and improve driving safety.

[0201] The camera modules 1 to 7, 1-1 to 1-4 of the present invention are not limited to applications in smartphones, panoramic driving assistance systems, driving recorders, and reversing imaging devices. The camera modules 1 to 7, 1-1 to 1-4 can be applied to various mobile focus systems as needed, and have the characteristics of excellent aberration correction and good imaging quality. For example, the camera modules 1 to 7, 1-1 to 1-4 can be widely used in electronic devices such as three-dimensional (3D) image capture, digital cameras, mobile devices, tablet computers, smart TVs, network monitoring equipment, multi-lens devices, recognition systems, somatosensory game consoles, and wearable devices. The aforementioned electronic devices are merely exemplary examples of the actual application of the present invention and do not limit the scope of application of the camera modules of the present invention.

[0202] Although the present invention is disclosed above with reference to the aforementioned embodiments, they are not intended to limit the present invention. Any person skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to this specification.

Claims

1. An image sensing module, characterized in that: The image sensing module includes: A circuit substrate having: an upper surface; a lower surface, disposed opposite to the upper surface; an open surface connecting the upper surface and the lower surface; and an opening located at the opening surface; an optical flat panel element fixed to the upper surface of the circuit substrate, wherein the optical flat panel element is disposed corresponding to the opening of the circuit substrate; a photosensitive element disposed on the lower surface of the circuit substrate, wherein the opening of the circuit substrate is located between the photosensitive element and the optical flat plate element, an air gap is formed between the photosensitive element and the optical flat plate element, and the opening surface is disposed around the air gap; as well as a plurality of metal bumps disposed between the circuit substrate and the photosensitive element, wherein each of the metal bumps is electrically connected to the circuit substrate and the photosensitive element; The image sensing module further includes at least one anti-reflection layer, which is disposed on at least one surface of the air gap. The at least one anti-reflection layer includes: A plurality of nano-ridge structures extend along a direction from the at least one surface at the air gap to the air gap, wherein the nano-ridge structures are arranged in an irregular manner.

2. The image sensing module according to claim 1, wherein: The height of each of the nano-ridge structures is H, which satisfies the following conditions: 25 nm ≤ H ≤ 400 nm.

3. The image sensing module according to claim 2, wherein: The height of each of the nano-ridge structures is H, which satisfies the following conditions: 40 nm ≤ H ≤ 280 nm.

4. The image sensing module according to claim 1, wherein: The at least one anti-reflection layer further includes an intermediary layer, and the intermediary layer is disposed between the at least one surface at the air gap and the nano-ridge structure.

5. The image sensing module according to claim 4, wherein: At least a region of the interposer is exposed to the air gap.

6. The image sensing module according to claim 1, wherein: The photosensitive element has: a photosensitive surface disposed corresponding to the opening of the circuit substrate, wherein the photosensitive surface is used to convert optical image signals into electronic signals; and an outer peripheral surface, arranged around the photosensitive surface; The at least one anti-reflection layer is disposed on at least one of the photosensitive surface and the peripheral surface of the photosensitive element.

7. The image sensing module according to claim 1, wherein: The at least one anti-reflection layer is disposed on at least one of the upper surface, the lower surface and the opening surface of the circuit substrate.

8. The image sensing module according to claim 1, wherein: The optical plate element has an inner side surface, the inner side surface is disposed toward the air gap, and the at least one anti-reflection layer is disposed on the inner side surface of the optical plate element.

9. The image sensing module according to claim 1, wherein: The image sensing module further includes a filling element, which is disposed between the circuit substrate and the photosensitive element. The filling element completely covers each of the metal bumps and surrounds and closes the air gap.

10. The image sensing module according to claim 9, wherein: The filling element has at least one curved surface, and the at least one anti-reflection layer is disposed on the at least one curved surface.

11. The image sensing module according to claim 9, wherein: At least a portion of the filling element is disposed on the opening surface of the circuit substrate.

12. The image sensing module according to claim 9, wherein: The filling element is light-proof.

13. The image sensing module according to claim 6, wherein: The metal bump is arranged on at least one side of the outer peripheral surface.

14. The image sensing module according to claim 1, wherein: The circuit substrate further has a plurality of matt structures, which are arranged on the opening surface of the circuit substrate and gradually shrink from the opening surface toward the air gap.

15. The image sensing module according to claim 1, wherein: The distance between the lower surface of the circuit substrate and the optical flat plate element is D1, and the thickness of the air gap is D2, which satisfies the following conditions: 0.25≤D1 / D2≤0.

98.

16. The image sensing module according to claim 15, wherein: The distance between the lower surface of the circuit substrate and the optical flat plate element is D1, and the thickness of the air gap is D2, which satisfies the following conditions: 0.3≤D1 / D2≤0.

95.

17. A camera module, characterized in that: The camera module comprises: a lens module; and The image sensing module according to claim 1 is disposed on the image side of the lens module.

18. An electronic device, characterized in that: The electronic device comprises: The camera module according to claim 17.

Images