LED light-emitting device

Abstract

The utility model relates to the technical field of light emitting diode (LED) light emitting, in particular to an LED light emitting device which is characterized in that a groove is formed in a substrate; a plurality of blue light chips are uniformly arranged at the bottom of the groove; the plurality of purple light chips are arranged at the bottom of the groove and surround the plurality of blue light chips; the second fluorescent layer covers the surfaces of the plurality of purple light chips; the first fluorescent layer covers the surfaces of the second fluorescent layer and the plurality of blue light chips; and the first fluorescent layer and the second fluorescent layer are connected with the side wall of the groove through a connecting adhesive layer. According to the utility model, the connecting glue layer is designed between the side wall of the groove and the fluorescent layer, so that the side wall of the groove and the fluorescent layer can be effectively bonded, and the peeling of the fluorescent layer caused by the influence of environmental factors such as cold and hot impact or moisture can be effectively reduced; the power density of the light-emitting device and the corresponding intensity of the light-emitting device are effectively guaranteed, eyesight can be protected, and the overall size is smaller.

Description

Technical Field

[0001] The utility model relates to the technical field of LED lighting, in particular to an LED lighting device. Background Art

[0002] With the continuous advancement of LED technology, the field of light-emitting devices is undergoing a profound transformation. People's demands for light-emitting devices are no longer limited to illumination itself, but are now more focused on their health, efficiency, and adaptability. Especially in the current era of miniaturization and intelligence, the demand for high-power density light-emitting devices is becoming increasingly urgent.

[0003] The blue light content of traditional light-emitting devices is often too high in high color temperature ranges, posing a potential threat to users' eyesight. Prolonged exposure to high-intensity blue light can cause health problems such as retinal damage and vision loss. As the size of various electronic devices and lighting fixtures continues to shrink, the power density requirements for light-emitting devices are also increasing.

[0004] Therefore, how to make the size of lighting fixtures more compact while protecting vision health is a current research direction. Utility Model Content

[0005] (1) Purpose of the utility model

[0006] The purpose of the utility model is to provide an LED lighting device which can protect eyesight and make the size of lighting equipment more miniaturized.

[0007] (2) Technical solution

[0008] In order to solve the above problems, the utility model provides an LED light-emitting device, comprising: a substrate, a connecting adhesive layer, a plurality of blue light chips, a first fluorescent layer, a plurality of purple light chips and a second fluorescent layer;

[0009] The substrate is provided with a groove;

[0010] A plurality of blue light chips are evenly arranged at the bottom of the groove;

[0011] A plurality of the purple light chips are arranged at the bottom of the groove and surround the plurality of the blue light chips;

[0012] The second fluorescent layer covers the surfaces of the plurality of purple light chips;

[0013] The first fluorescent layer covers the second fluorescent layer and the surfaces of the plurality of blue light chips;

[0014] The first fluorescent layer and the second fluorescent layer are connected to the sidewall of the groove through the connecting adhesive layer.

[0015] In another aspect of the present invention, preferably, the groove is in a truncated cone shape, and the bottom area of ​​the groove is smaller than the top area of ​​the groove.

[0016] In another aspect of the present invention, preferably,

[0017] The bottom of the groove is circular, and a plurality of the blue light chips are arranged in a rectangular array.

[0018] In another aspect of the present invention, preferably,

[0019] A plurality of the purple light chips are distributed around the rectangular array.

[0020] In another aspect of the present invention, preferably,

[0021] The first fluorescent layer includes yellow-green fluorescent powder, red fluorescent powder and far-infrared fluorescent powder configured in the first fluorescent layer;

[0022] The yellow-green phosphor emits yellow-green light when receiving excitation light;

[0023] The red phosphor emits red light when receiving the excitation light;

[0024] The far-infrared phosphor emits far-infrared light when receiving excitation light.

[0025] In another aspect of the present invention, preferably, the second fluorescent layer includes a blue-cyan fluorescent powder configured in the second fluorescent layer;

[0026] The blue-cyan phosphor emits blue-cyan light when receiving excitation light.

[0027] In another aspect of the present invention, preferably, the thickness of the connecting adhesive layer is k, and the numerical range of k is 0.8 mm ≤ k ≤ 1.5 mm.

[0028] In another aspect of the present invention, preferably,

[0029] The peak wavelength of the blue light chip is 440-460nm;

[0030] The peak wavelength of the purple light chip is 400-420nm.

[0031] In another aspect of the present invention, preferably, the peak wavelength of the yellow-green phosphor is in the 510-535nm band;

[0032] The peak wavelength of the red phosphor is in the 635-655nm band;

[0033] The peak wavelength of the far-infrared phosphor is in the 690-760nm band.

[0034] In another aspect of the present invention, preferably,

[0035] The peak wavelength of the blue-cyan phosphor is in the 447-495 nm band.

[0036] (3) Beneficial effects

[0037] The above technical solution of the present utility model has the following beneficial technical effects:

[0038] The utility model designs a connecting adhesive layer between the groove side wall and the fluorescent layer, which can effectively bond the groove side wall and the fluorescent layer, so that the light-emitting device can withstand higher power density, and effectively reduces the peeling of the fluorescent layer due to environmental factors such as cold and hot shock or humidity, thereby effectively improving the thermal stability and service life of the light-emitting device; by designing the arrangement of the blue light chip and the purple light chip, the power density of the light-emitting device and the corresponding light-emitting device intensity are effectively guaranteed, which can protect eyesight and make the overall size more miniaturized. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 This is a cross-sectional view of the overall structure of an embodiment of the utility model;

[0040] Figure 2 This is a diagram showing the arrangement and distribution of a blue light chip and four purple light chips according to an embodiment of the present invention;

[0041] Figure 3 This is a diagram showing the arrangement and distribution of a blue light chip and six purple light chips according to an embodiment of the present invention;

[0042] Figure 4 This is a diagram showing the arrangement and distribution of a blue light chip and eight purple light chips according to an embodiment of the present invention;

[0043] Figure 5 This is an emission spectrum diagram of a light emitting device according to an embodiment of the present invention and the prior art;

[0044] Reference numerals:

[0045] 1: Substrate, 2: Connecting adhesive layer, 3: Blue light chip, 4: First phosphor layer, 5: Purple light chip, 6: Second phosphor layer, 1-1: Groove. DETAILED DESCRIPTION

[0046] To make the objectives, technical solutions, and advantages of the present invention more clearly understood, the present invention is further described below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are merely illustrative and are not intended to limit the scope of the present invention. Furthermore, descriptions of known structures and technologies are omitted in the following description to avoid unnecessary confusion regarding the concepts of the present invention.

[0047] The accompanying drawings illustrate schematic diagrams of the structures of embodiments of the present invention. These figures are not drawn to scale; for clarity, some details are exaggerated and some details may be omitted. The shapes of the various regions and layers shown in the figures, as well as their relative sizes and positions, are merely exemplary and may deviate in practice due to manufacturing tolerances or technical limitations. Those skilled in the art may design regions / layers with different shapes, sizes, and relative positions as needed.

[0048] Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0049] In the description of the present invention, it should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0050] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0051] The present invention will be described in more detail below with reference to the accompanying drawings. In each of the accompanying drawings, identical elements are represented by similar reference numerals. For the sake of clarity, the various parts in the accompanying drawings are not drawn to scale.

[0052] Example

[0053] An LED light-emitting device, Figure 1 Shows a cross-sectional view of the overall structure of an embodiment of the utility model; Figure 1 As shown,

[0054] The invention comprises: a substrate 1, a connecting adhesive layer 2, a blue light chip 3, a first fluorescent layer 4, a purple light chip 5 and a second fluorescent layer 6; a groove 1-1 is provided on the substrate 1; the material of the substrate 1 is not limited here.

[0055] The blue light chips 3 are arranged evenly at the bottom of the groove 1-1. The groove 1-1 designed on the substrate 1 not only provides a stable mounting position for the blue light chips 3 and the purple light chips 5, but also optimizes the light emission path through its shape, which may help improve light efficiency and reduce light loss. The blue light chips 3 are evenly distributed at the bottom of the groove 1-1, reducing the occurrence of light spots and dark areas, improving the uniformity and comfort of the lighting. The purple light chips 5 are arranged at the bottom of the groove 1-1, surrounding the blue light chips 3. The second fluorescent layer 6 covers the surface of the purple light chips 5. The first fluorescent layer 4 covers the surface of the second fluorescent layer 6 and the surface of the blue light chips 3. The first fluorescent layer 4 and the second fluorescent layer 6 are connected to the sidewalls of the groove 1-1 via the connecting adhesive layer 2. The connecting adhesive layer 2 not only connects the first and second fluorescent layers 4 and 6 to the sidewalls of the groove 1-1, but also secures and protects the chips. This ensures the structural stability and reliability of the entire device. The connecting adhesive layer 2 can also be made of a light-transmitting material to reduce light loss during transmission and improve light efficiency. The blue and purple chips are controlled by two separate power supplies. The purple chip is located at the edge of the light-emitting device and is controlled separately. This location is away from the high-power area of ​​blue light excitation, and the purple chip is excited with a low current.

[0056] Furthermore, in this embodiment, the groove 1-1 is configured in a truncated cone shape, and the bottom area of ​​the groove 1-1 is smaller than the top area of ​​the groove 1-1. The bottom of the groove 1-1 is configured in a circular shape, and the plurality of blue light chips 3 are arranged in a rectangular array. The plurality of purple light chips 5 are distributed around the rectangular array; Figure 2 This is a diagram showing the arrangement and distribution of a blue light chip and four purple light chips according to an embodiment of the present invention; Figure 3 This is a diagram showing the arrangement and distribution of a blue light chip and six purple light chips according to an embodiment of the present invention;

[0057] Figure 4 This is a diagram showing the arrangement and distribution of a blue light chip and eight purple light chips according to an embodiment of the present invention; Figure 2 、 Figure 3 and Figure 4 As shown, when the bottom of the groove 1-1 is set to a circle, the blue light chip array is set to cover the bottom area of ​​the groove 1-1 to the maximum extent, and the purple light chips 5 are distributed in the position where the rectangular array is not set at the bottom of the groove 1-1 according to different quantities, which is conducive to the overall miniaturization of the light-emitting device.

[0058] Furthermore, in this embodiment, the structure of the first phosphor layer 4 includes yellow-green phosphor, red phosphor, and far-infrared phosphor disposed therein. The yellow-green phosphor is configured to emit yellow-green light when receiving excitation light; the red phosphor is configured to emit red light when receiving excitation light; and the far-infrared phosphor is configured to emit far-red light when receiving excitation light. The peak wavelength of the yellow-green phosphor is in the 510-535nm band; the peak wavelength of the red phosphor is in the 635-655nm band; and the peak wavelength of the far-infrared phosphor is in the 690-760nm band.

[0059] The peak wavelength of the blue light chip 3 is 440-460 nm; the peak wavelength of the purple light chip 5 is 400-420 nm.

[0060] The structure of the second fluorescent layer 6 includes blue-cyan fluorescent powder configured in the second fluorescent layer 6; the blue-cyan fluorescent powder is used to emit blue-cyan light when receiving excitation light; the peak wavelength of the blue-cyan fluorescent powder is in the 447-495nm band.

[0061] The light-emitting device of this embodiment is a high-power density light-emitting device and has good light color performance. The light-emitting device is first required to have a high color rendering index, so the spectrum is required to cover a wide range and have good spectral continuity. The wavelength of the first red phosphor has a great influence on the color rendering index. Considering the connection with the first yellow-green phosphor and the far-red phosphor, the conventional light-emitting device has a serious deficiency after 650nm. Long-wave light with a wavelength between 650-900 nanometers can improve mitochondrial performance. This embodiment supplements the spectrum deficiency of conventional LED light-emitting devices in the 650-780nm band. It can effectively reduce the age-related cell death rate in the retina; it can activate eye cells and promote the normal synthesis of nucleic acids; it can scavenge free radicals, improve and enhance cell function, dilate eye blood vessels, improve blood supply to the ciliary muscle, and improve vision.

[0062] Because far-red, first-red, and first-yellow-green phosphors generally exhibit excellent thermal stability and high conversion efficiency, when excited by blue light, the light-emitting device can withstand greater optical power density. Furthermore, the light-emitting device can also achieve a stronger luminous flux, making it less susceptible to the impact of excessively high power consumption caused by the poor thermal stability of the phosphors. Therefore, the far-red, first-red, and first-yellow-green phosphors are mixed into the phosphor layer above the blue light chip. Since the first-red phosphor's luminous efficiency is significantly reduced when excited by long-wave blue light, the violet light chip is controlled separately to provide a spectrum that supplements the violet range and slightly excites the blue-cyan region, filling the spectral gap in the light-emitting device and improving its color performance. This process generates minimal heat, enabling long-term use.

[0063] Furthermore, in designing the high-power density LED light-emitting device, the biggest problem with high-power density LED light-emitting devices is that during use, when the fluorescent layer is exposed to high temperatures, or low temperatures, humidity, and other environments, the fluorescent adhesive layer may peel off from the inner wall of the bracket. In addition, a whitening agent is added to the glue of the connecting adhesive layer. On the one hand, it can protect the inner wall of the bracket from being damaged by ultraviolet light, and on the other hand, it can improve the light reflection efficiency, allowing more light-emitting devices to be effectively emitted, thereby improving the overall luminous efficiency of the light-emitting device. The numerical range of the thickness k of the connecting adhesive layer is 1.05mm≤k≤1.15mm; the thickness of the connecting adhesive layer needs to be controlled. If the thickness of the connecting adhesive layer is too thin, it cannot perform a good bonding effect. If the thickness of the connecting adhesive layer is too thick, it occupies more area in the groove, reducing the area where the chip of the light-emitting device can be arranged, and the luminous intensity of the light-emitting device becomes lower.

[0064] The light-emitting device of this embodiment produces a selected color temperature ranging from 2700K to 6500K, with an RA of at least 95. The light-emitting device of this embodiment has a relative value n of blue light intensity, n≤0.8; when the selected color temperature is approximately 2700K, n≤0.20; when the selected color temperature is approximately 3000K, n≤0.30; when the selected color temperature is approximately 4000K, n≤0.40; when the selected color temperature is approximately 5000K, n≤0.60; and when the selected color temperature is approximately 6500K, n≤0.80.

[0065] Furthermore, the light-emitting device of this embodiment has a color temperature in the range of 2700-6500K, and a relative spectral intensity value m at 780nm, m≥0.45. When the selected color temperature is approximately 2700K, m≥0.98; when the selected color temperature is approximately 3000K, m≥0.90; when the selected color temperature is approximately 4000K, m≥0.80; when the selected color temperature is approximately 5000K, m≥0.64; and when the selected color temperature is approximately 6500K, m≥0.45.

[0066] This embodiment effectively bonds the groove sidewalls and the fluorescent adhesive layer by designing a connecting adhesive layer between the groove sidewalls and the fluorescent adhesive layer, allowing the light-emitting device to withstand higher power densities and effectively reducing the risk of the fluorescent adhesive layer peeling off due to environmental factors such as thermal shock or humidity, thereby effectively improving the thermal stability and service life of the light-emitting device. By designing a system of blue light + yellow-green + red + far-red light, the power density of the light-emitting device and the corresponding light-emitting device intensity are effectively guaranteed, and the far-red light region is supplemented, resulting in good color rendering in the red portion of the light-emitting device. The low-power violet light + blue-cyan light are then combined to effectively supplement the violet light region, ensuring the width of the spectrum and improving the light color performance of the LED.

[0067] The following describes the high-power LED light-emitting device in detail using several specific embodiments of a 4000K light-emitting device.

[0068] Comparative Example 1:

[0069] A light-emitting device comprises a purple light chip with a peak wavelength of 410 nm, a blue light chip with a peak wavelength of 450 nm, and a fluorescent layer coated on the two chips. The manufacturing process of the light-emitting device is as follows: yellow-green phosphor with a peak wavelength of 520 nm and red phosphor with a peak wavelength of 650 nm are mixed evenly with packaging glue, and then coated on the blue light chip respectively. The package is baked at 80°C for 30 min, 100°C for 30 min, and 150°C for 120 min to obtain the light-emitting device. The photoelectric parameters of the light-emitting device are tested, and the color temperature is 4000K, the color rendering index is 96, the relative intensity value of the blue light at 450 nm of the LED light-emitting device is n=1, and the relative spectral intensity value at 780 nm is m=0.0015. After 100 cycles, including 10 min at 150°C and then 10 min at -18°C, this cycle constitutes one cycle. The device peels off due to thermal shock.

[0070] Comparative Example 2:

[0071] A light-emitting device comprises a light emitting device with a peak wavelength of 410 nm. The manufacturing process comprises: blue phosphor with a peak wavelength of 447 nm, yellow-green phosphor with a peak wavelength of 520 nm, and red phosphor with a peak wavelength of 650 nm are mixed with packaging glue respectively and evenly coated on a blue light chip. The package is baked at 80° C. for 30 min, 100° C. for 30 min, and 150° C. for 120 min to obtain the light-emitting device. The photoelectric parameters of the light-emitting device are tested, and the color temperature is 4000K, the color rendering index is 96, the relative intensity value of the blue light at 450 nm of the LED light-emitting device is n=0.95, and the relative spectral intensity value at 780 nm is m=0.002. After 85 cycles, the device is quickly placed at 150° C. for 10 min and then placed at -18° C. for 10 min, which constitutes one cycle. The device peels off due to thermal shock.

[0072] Comparative Example 3:

[0073] A light-emitting device includes two chips with peak wavelengths of 410nm and 450nm. The manufacturing process is as follows: blue phosphor with a peak wavelength of 447nm; yellow-green phosphor with a peak wavelength of 520nm; and red phosphor with a peak wavelength of 650nm are mixed evenly with packaging glue, and then coated on a blue light chip. The package is baked at 80°C for 30 minutes, 100°C for 30 minutes, and 150°C for 120 minutes to obtain the light-emitting device. The photoelectric parameters of the light-emitting device are tested, and the color temperature is 4000K, the color rendering index is 96, the relative intensity value of the blue light at 450nm of the LED light-emitting device is n=0.8, and the relative spectral intensity value at 780nm is m=0.0018. After 90 cycles, the device is quickly placed at 150°C for 10 minutes and then placed at -18°C for 10 minutes. This constitutes one cycle, and the thermal shock causes peeling.

[0074] Example 1:

[0075] A light-emitting device includes a violet light chip with a peak wavelength of 410nm, a blue light chip with a peak wavelength of 450nm, and a phosphor layer covering the two chips. The manufacturing process is as follows: First, a connecting glue layer is evenly applied along the sidewalls of a groove to a thickness of 1.2mm. The device is then placed in an oven at 150°C for 20 minutes to allow the glue to cure and firmly bond to the groove sidewalls. Next, a mixture of blue phosphor with a peak wavelength of 447nm and encapsulation glue is dotted onto the top of the violet light chip. The device is then placed in an oven at 80°C for 10 minutes, 100°C for 10 minutes, and 150°C for 10 minutes to allow the encapsulation glue surface to cure. Then, the yellow-green phosphor with a peak wavelength of 520nm, the red phosphor with a peak wavelength of 650nm, and the far-red phosphor with a peak wavelength of 798nm were mixed evenly with the encapsulation glue and coated on the blue light chip respectively. The package was baked at 80°C for 30 minutes, 100°C for 30 minutes, and 150°C for 120 minutes to obtain a light-emitting device. Its photoelectric parameters were tested: color temperature 4000K, color rendering index 98, relative value of blue light intensity at 450nm of the light-emitting device n=0.31, relative spectral intensity value m=0.85 at 780nm, and no peeling occurred after 100 cycles of hot and cold shock.

[0076] In Examples 2-14, the preparation method is the same as that in Example 1, except that the parameters are adjusted according to their characteristics.

[0077] The preparation methods and performance test results of Examples 2-14 are shown in Table 1.

[0078] Table 1 Preparation methods and performance test results of Examples 2-18

[0079]

[0080]

[0081]

[0082] By comparing Examples 1-14 with Comparative Examples 1-3, it can be seen that the utility model has better comprehensive luminous performance than conventional LED light-emitting devices, effectively supplements the lack of the light-emitting device in the deep red light region, achieves low blue light, and the light-emitting device's resistance to cold and heat shock is greatly improved.

[0083] Figure 5 : is an emission spectrum diagram of a light emitting device according to an embodiment of the present invention and the prior art; Figure 5As shown, by comparing Example 1 with Comparative Example 1, the light-emitting device of the present invention significantly reduces the blue light intensity compared to a conventional blue-light-excited full-spectrum light-emitting device. The relative intensity is reduced from nearly 1 to 0.31, effectively compensating for the red light component. Furthermore, at the same optical power density, the device exhibits superior aging performance.

[0084] By comparing Examples 1, 11-14 with Comparative Examples 2 and 3, it can be seen that the light-emitting device of the present invention has better aging performance than the conventional purple light-excited full-spectrum light-emitting device at the same light power density. In Comparative Example 2, the conventional purple light full spectrum began to peel off after 85 cycles of cold and hot shocks, while the light-emitting device of the present invention can still withstand 110 cycles of cold and hot shocks when the light power density is twice that of the conventional one. This is because the conventional purple light full spectrum requires a large amount of blue powder to fill the blue spectrum position and stimulate subsequent yellow-green light and red light. In this process, the amount of powder used is greatly increased, the conversion efficiency of the light-emitting device is reduced, and the heat generated cannot be discharged as quickly as possible, so the ability to withstand cold and hot shocks is low. In Comparative Example 3, the blue light chip and the purple light chip were not separated. Affected by the performance disadvantage of the purple light chip, the performance of the blue light chip was not fully utilized, and because the half-peak width of both were narrow, the light color parameters were low. In this invention, the violet light portion requires only minimal electrical power to excite a small amount of blue powder. Subsequent light intensity is primarily contributed by the blue chip stimulating the yellow, green, and red powders. This process improves efficiency and reduces heat. Furthermore, the adhesive layer provides a strong connection, further reducing the possibility of peeling.

[0085] The peak wavelength of violet chip 5 is 400-420nm, while the peak wavelength of blue chip 3 is 440-460nm. Considering the excitation wavelength of phosphors, the violet band optimally excites red phosphor around 380nm. However, due to the current situation where 380nm chips are mostly vertical chips, their shorter wavelength, lower energy, and low technological maturity result in inherently lower brightness. Chips in the 400-420nm band are technologically mature and offer higher brightness. While their excitation efficiency is slightly lower than that of the 380nm band, their actual performance is significantly better. Furthermore, the lower wavelength of violet light can cause greater damage to silicone. The violet chip 5 band is 400-420nm. Yellow-green phosphor is optimally excited around 445nm, and chips in this band are more mature. Therefore, the peak wavelength of blue chip 3 is 440-460nm.

[0086] The preparation methods of Examples 15-18 are the same as those of Example 1, except that the parameters are adjusted according to their characteristics.

[0087] The preparation methods and performance test results of Examples 15-18 are shown in Table 2.

[0088] Table 2 Preparation methods and performance test results of Comparative Examples 1, 4-7 and Examples 15-18

[0089]

[0090]

[0091] At 2700K and a color rendering index of 98, the light-emitting device of the present invention had a relative spectral intensity of only 0.13 at 450nm. However, the corresponding relative spectral intensity at 780nm reached 0.984. At an optical power density of 1, it did not crack after 130 cycles of thermal shock. In contrast, the light-emitting device of Comparative Example 4 had a relative spectral intensity of 0.29 at 2700K and a color rendering index of 97. However, the corresponding relative spectral intensity at 780nm was only 0.043. Furthermore, at an optical power density of 1, it cracked after 90 cycles of thermal shock.

[0092] At 3000K and a color rendering index of 98, the light-emitting device of the present invention has a relative spectral intensity of only 0.19 at 450nm. However, the corresponding relative spectral intensity at 780nm reaches 0.92. At an optical power density of 1, it exhibits no cracking after 130 cycles of thermal shock. In contrast, the light-emitting device of Comparative Example 5 has a relative spectral intensity of 0.48 at 3000K and a color rendering index of 97. However, the corresponding relative spectral intensity at 780nm is only 0.042. Furthermore, at an optical power density of 1, it exhibits cracking after 90 cycles of thermal shock.

[0093] The light emitting device of the present invention has a relative spectral intensity of only 0.31 at 4000K and a color rendering index of 98 at 450nm. However, the corresponding relative spectral intensity at 780nm can reach 0.85. Moreover, when the light power density is 1, no cracking occurs after 130 cycles of thermal shock. Figure 5 As shown in the figure, the relative spectral intensity at 450nm is 0.94, while the corresponding relative spectral intensity at 780nm is only 0.039. When the optical power density is 1, cracking occurs after 90 cycles of thermal shock.

[0094] At 5000K and a color rendering index of 98, the light-emitting device of the present invention had a relative spectral intensity of 0.54 at 450nm. The corresponding relative spectral intensity at 780nm was 0.67. At a light power density of 1, it did not crack after 130 cycles of thermal shock. In contrast, the light-emitting device of Comparative Example 6 had a relative spectral intensity of 1.0 at 5000K and a color rendering index of 97. At 780nm, the corresponding relative spectral intensity was only 0.019. Furthermore, at a light power density of 1, it cracked after 90 cycles of thermal shock.

[0095] The light-emitting device designed in this utility model has a relative spectral intensity of 0.71 at 450nm at 6500K and a color rendering index of 98. The corresponding relative spectral intensity at 780nm is 0.48. At a light power density of 1, it exhibits no cracking after 130 cycles of thermal shock. In contrast, the light-emitting device in Comparative Example 7 has a relative spectral intensity of 1.0 at 450nm at 6500K and a color rendering index of 97. However, the corresponding relative spectral intensity at 780nm is only 0.011. Furthermore, at a light power density of 1, it exhibits cracking after 90 cycles of thermal shock.

[0096] It should be understood that the above-described specific embodiments of the present invention are merely illustrative of or explanation of the principles of the present invention and do not constitute limitations of the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention shall be included within the scope of protection of the present invention. In addition, the appended claims of the present invention are intended to cover all variations and modifications that fall within the scope and metes and bounds of the appended claims, or equivalents thereof.

[0097] While the above description does not provide detailed technical details regarding patterning and etching of each layer, those skilled in the art will appreciate that various conventional methods can be used to form layers, regions, and the like in desired shapes. Furthermore, those skilled in the art may devise methods that differ from those described above to achieve the same structure.

[0098] The present invention has been described above with reference to its embodiments. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of the present invention. The scope of the present invention is defined by the appended claims and their equivalents. Those skilled in the art may make various substitutions and modifications without departing from the scope of the present invention, and such substitutions and modifications are intended to fall within the scope of the present invention.

[0099] Although the embodiments of the present invention have been described in detail, it should be understood that the various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the invention.

[0100] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will readily appreciate that other variations or modifications based on the above descriptions are possible. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. An LED light-emitting device, characterized in that: include: A substrate (1), a connecting adhesive layer (2), a plurality of blue light chips (3), a first fluorescent layer (4), a plurality of purple light chips (5) and a second fluorescent layer (6); The substrate (1) is provided with a groove (1-1); A plurality of blue light chips (3) are evenly arranged at the bottom of the groove (1-1); A plurality of purple light chips (5) are arranged at the bottom of the groove (1-1) and are arranged around a plurality of blue light chips (3); The second fluorescent layer (6) covers the surfaces of the plurality of purple light chips (5); The first fluorescent layer (4) covers the second fluorescent layer (6) and the surfaces of the plurality of blue light chips (3); The first fluorescent layer (4) and the second fluorescent layer (6) are connected to the side wall of the groove (1-1) via the connecting adhesive layer (2).

2. The LED lighting device according to claim 1, wherein: The groove (1-1) is in a truncated cone shape, and the bottom area of ​​the groove (1-1) is smaller than the top area of ​​the groove (1-1).

3. The LED lighting device according to claim 1, wherein: The bottom of the groove (1-1) is circular, and a plurality of the blue light chips (3) are arranged in a rectangular array.

4. The LED lighting device according to claim 3, characterized in that: A plurality of the purple light chips (5) are distributed around the rectangular array.

5. The LED lighting device according to claim 1, wherein: The first fluorescent layer (4) includes yellow-green fluorescent powder, red fluorescent powder and far-infrared fluorescent powder arranged in the first fluorescent layer (4); The yellow-green phosphor emits yellow-green light when receiving excitation light; The red phosphor emits red light when receiving the excitation light; The far-infrared phosphor emits far-infrared light when receiving excitation light.

6. The LED lighting device according to claim 1, wherein: The second fluorescent layer (6) includes blue-cyan fluorescent powder configured in the second fluorescent layer (6); The blue-cyan phosphor emits blue-cyan light when receiving excitation light.

7. The LED lighting device according to claim 1, characterized in that: The thickness of the connecting adhesive layer (2) is k, and the value range of k is 0.8mm≤k≤1.5mm.

8. The LED lighting device according to claim 1, wherein: The peak wavelength of the blue light chip (3) is 440-460nm; The peak wavelength of the purple light chip (5) is 400-420nm.

9. The LED lighting device according to claim 5, characterized in that: The peak wavelength of the yellow-green phosphor is in the 510-535nm band; The peak wavelength of the red phosphor is in the 635-655nm band; The peak wavelength of the far-infrared phosphor is in the 690-760nm band.

10. The LED lighting device according to claim 6, characterized in that: The peak wavelength of the blue-cyan phosphor is in the 447-495 nm band.

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