Multi-angle curing light source and illumination curing device

Abstract

The utility model discloses a multi-angle curing light source and an illumination curing device, the multi-angle curing light source comprises a shell, a light source assembly and two reflectors, the shell is provided with a mounting cavity, the surface of the shell is provided with a curing through groove communicated with the mounting cavity, and the curing through groove penetrates through the shell along the length direction of the shell; the light source assembly is installed in the installation cavity, and the illumination end face of the light source assembly is arranged towards a groove opening of the curing through groove. The two reflectors are installed in the installation cavity and located on the two sides of the light source assembly, one ends of the two reflectors are adjacent to the light source assembly, the other ends of the two reflectors extend in the direction close to each other in the illumination direction of the light source assembly, and the mirror faces of the two reflectors are used for reflecting light emitted by the light source assembly; therefore, the end face of the silicon wafer and the side faces of the two adjacent edges can be synchronously irradiated at the same time by adopting one light source assembly, the edges of the silicon wafer can be quickly cured, the curing efficiency is improved, the curing time is shortened, and the productivity is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the solidification technical field of light source especially relates to a multi -angle solidification light source. BACKGROUND

[0002] The silicon wafer is a kind of sheet object manufactured with silicon as material, mainly used for manufacturing semiconductor devices and integrated circuits;Silicon wafer occupies an important position in electronic industry, its manufacturing process includes high-purity polycrystalline silicon is drawn into single crystal silicon in single crystal furnace, then is made through cutting, grinding and polishing etc.;Silicon wafer has good stability, strong processing characteristics, makes it in irreplaceable position in the field of semiconductor devices, in addition, silicon wafer is also widely used in the manufacture of solar cells, can convert sunlight into electrical energy, has important significance to promote the development of renewable energy.

[0003] The edge treatment of the existing silicon wafer after cutting and grinding is an important link, the edge of the just cut silicon wafer is sharp right angle, and the right angle edge is easy to break due to its hard and brittle material characteristics, and heat stress, rupture, edge collapse and other quality defects can be generated in subsequent process, therefore, in order to ensure the quality of silicon wafer, the edge of silicon wafer needs to be cured by light;The positions needing curing generally include the end face at the edge of silicon wafer and the two edge side surfaces adjacent to the end face, however, direct light source irradiation on the end face cannot radiate light to the two edge side surfaces well, and the curing efficiency is low, and increasing light sources on the two edge side surfaces will lead to cost increase, which is not conducive to the setting of curing light source, therefore, improvement is needed. UTILITY MODEL CONTENT

[0004] The main purpose of the utility model is to provide a multi -angle solidification light source, solve the problem that light source cannot simultaneously carry out light curing on the end face of silicon wafer and the two edge side surfaces adjacent to the end face in the related technology.

[0005] To achieve the above object, the utility model provides a multi -angle solidification light source, comprising:

[0006] The shell has a mounting cavity, the shell surface is provided with a curing through slot communicated with the mounting cavity, and the curing through slot is provided through the shell along the length direction of the shell;

[0007] The light source assembly is installed in the mounting cavity, and the light irradiation end face of the light source assembly is provided with the slot opening of the curing through slot;

[0008] Two reflectors are installed in the installation cavity and located on both sides of the light source assembly. One end of the two reflectors is adjacent to the light source assembly, and the other ends of the two reflectors are extended in a direction close to each other along the illumination direction of the light source assembly. The mirror surfaces of the two reflectors are used to reflect the light emitted by the light source assembly.

[0009] In some embodiments, the shell is arranged in a long strip shape, the curing groove passes through both ends of the shell in the length direction, and two mounting holes are arranged through both ends of the shell in the length direction, and the two mounting holes are used to be plugged in and matched with the two reflectors.

[0010] In some embodiments, two fixing blocks are provided at both ends of the shell in the length direction, and the two fixing blocks are connected to the shell and respectively at least partially cover the corresponding mounting holes.

[0011] In some embodiments, the light source assembly includes a circuit light board and a heat sink block, the circuit light board is mounted on the heat sink block, and two ends of the heat sink block are connected to the cavity wall of the mounting cavity.

[0012] In some embodiments, the light source assembly also includes a mounting bracket and a dust-proof glass sheet. The two ends of the mounting bracket are connected to the cavity wall of the mounting cavity and are located between the circuit light board and the curing groove. The dust-proof glass sheet is arranged on the mounting bracket to isolate the circuit light board from the curing groove.

[0013] In some embodiments, at least one ventilation hole is provided on an end face of the shell facing away from the curing slot, and the multi-angle curing light source further includes at least one cooling fan, each cooling fan is respectively connected to the shell and located at the corresponding ventilation hole.

[0014] In some embodiments, a vent hole communicating with the mounting cavity is further provided on the surface of the shell, and the multi-angle curing light source further includes an air pump, and an air supply pipe of the air pump is communicated with the vent hole.

[0015] In some embodiments, an air outlet groove is provided on an end surface of the shell facing away from the vent hole, and the air outlet groove is communicated with the installation cavity.

[0016] In some embodiments, the multi-angle curing light source further includes a limiting baffle, which is slidably mounted on the surface of the housing and is used to slidably cover the curing slot.

[0017] The present utility model also provides a light curing device, which includes a conveying device and two multi-angle curing light sources as described above, the two multi-angle curing light sources are located on both sides of the conveying device, and the curing grooves of the two multi-angle curing light sources are arranged opposite to each other. The conveying device is used to convey the cured sheet, and the two ends of the cured sheet extend into the curing grooves of the two multi-angle curing light sources.

[0018] The beneficial effects of the technical solution of this utility model are:

[0019] The multi-angle curing light source of the present invention is provided with a curing groove on its shell, and a light source component and two reflectors are provided in the shell. The light emitted by the light source component can directly illuminate the end face of the silicon wafer inserted into the curing groove, and at the same time be reflected by the two reflectors to illuminate the two edge sides of the end face of the silicon wafer located in the curing groove. In this way, a light source component can be used to simultaneously illuminate the end face of the silicon wafer and the two adjacent edge sides, so that the edge of the silicon wafer can be cured quickly, the curing efficiency is improved, and the curing time is shortened, thereby increasing production capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic structural diagram of a multi-angle curing light source according to an embodiment of the present utility model;

[0021] Figure 2 This is an exploded view of the structure of the multi-angle curing light source according to an embodiment of the present utility model;

[0022] Figure 3 This is a structural schematic diagram of a multi-angle curing light source from another perspective of an embodiment of the utility model;

[0023] Figure 4 This is a cross-sectional schematic diagram of a multi-angle curing light source according to an embodiment of the present invention;

[0024] Figure 5 This is a schematic structural diagram of a light curing device according to an embodiment of the present invention.

[0025] Description of Figure Numbers:

[0026] 100. Shell; 110. Mounting cavity; 120. Curing groove; 130. Mounting hole; 140. Fixing block; 150. Ventilation hole; 160. Air vent; 170. Air outlet groove; 180. Air valve; 200. Light source assembly; 210. Circuit light board; 220. Heat sink; 230. Mounting bracket; 240. Dust-proof glass sheet; 300. Reflector; 400. Cooling fan; 500. Limit baffle; 10. Multi-angle curing light source; 20. Silicon wafer. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the schemes in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. In addition, the descriptions of "first", "second", etc. in the present invention are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features.

[0028] In view of the technical defects in the related art, the present invention provides a multi-angle curing light source 10. Figures 1 to 4 The multi-angle curing light source 10 includes a shell 100, a light source assembly 200, and two reflectors 300. The shell 100 serves as a carrier of the multi-angle curing light source 10. It can be manufactured by injection molding, or it can be constructed by using a plate, or it can be formed by bending and welding sheet metal. The specific molding method of the shell 100 is not specifically limited here. The shell 100 has an installation cavity 110. The surface of the shell 100 is provided with a curing groove 120 connected to the installation cavity 110. The curing groove 120 is provided along the length direction of the shell 100 and passes through the shell 100; that is, the curing groove 120 connects the two end faces of the shell 100 in the length direction. It should be noted that the width of the curing groove 120 is greater than the thickness of the silicon wafer 20 whose edge needs to be cured, so that the edge of the silicon wafer 20 can be inserted into the curing groove 120.

[0029] The light source assembly 200 is installed in the installation cavity 110, and the illumination end of the light source assembly 200 is arranged to face the notch of the curing groove 120; the light source assembly 200 provides illumination, and the type of lamp emitted by the light source assembly 200 can be an LED lamp, an incandescent lamp, a fluorescent lamp or other light that can emit light to cure the edge of the silicon wafer 20; further, two reflectors 300 are installed in the installation cavity 110 and are located on both sides of the light source assembly 200, one end of the two reflectors 300 is adjacent to the light source assembly 200, and the other ends of the two reflectors 300 are extended along the illumination direction of the light source assembly 200 in a direction close to each other, and the mirror surface of the two reflectors 300 is used to reflect the light emitted by the light source assembly 200. With such an arrangement, the light emitted by the light source assembly 200 can be reflected by the two reflectors 300 to the two edge sides of the silicon wafer 20 located in the curing groove 120, and the light source assembly 200 directly irradiates the end face of the silicon wafer 20, so that a light source assembly 200 can simultaneously irradiate the two edge sides and the end face of the silicon wafer 20.

[0030] It is worth noting that the silicon wafer 20 is generally in the shape of a long side plate with a large span. In this embodiment, in order to enable the multi-angle curing light source 10 to cure the edge of the silicon wafer 20 more quickly, the shell 100 of the multi-angle curing light source 10 is set in a long strip shape, and the light source assembly 200 and the two reflectors 300 set in the shell 100 are also set in a long strip shape, which facilitates the multi-angle curing light source 10 to cure the edge of the silicon wafer 20 located in the curing groove 120. The longer multi-angle curing light source 10 can shorten the edge curing time of the large-area silicon wafer 20.

[0031] Through the above technical solution, a curing groove 120 is provided on the shell 100 of the multi-angle curing light source 10, and a light source assembly 200 and two reflectors 300 are provided in the shell 100. The light emitted by the light source assembly 200 can directly illuminate the end face of the silicon wafer 20 extending into the curing groove 120, and at the same time be reflected by the two reflectors 300, and can illuminate the two edge sides of the end face of the silicon wafer 20 located in the curing groove 120; in this way, by using a light source assembly 200, the end face of the silicon wafer 20 and the two adjacent edge sides can be synchronously irradiated, the edge of the silicon wafer 20 can be quickly cured, the curing efficiency is improved, and the curing time is shortened, thereby improving production capacity.

[0032] In this embodiment, the housing 100 is arranged in an elongated strip shape, and the curing groove 120 runs through both ends of the housing 100 in the longitudinal direction. In order to facilitate the installation of the two reflectors 300 in the installation cavity 110, two installation holes 130 are provided at both ends of the housing 100 in the longitudinal direction. The two installation holes 130 are used to plug and cooperate with the two reflectors 300. In this arrangement, when the two reflectors 300 need to be installed, the two reflectors 300 can be inserted from the outside of the housing 100 through the installation holes 130 at one end of the housing 100. After passing through the corresponding installation holes 130, the reflectors 300 extend into the installation cavity 110 and then extend from the installation holes 130 at the other end of the housing 100. In this way, both ends of the reflectors 300 are plugged into the two ends of the housing 100 in the longitudinal direction, which facilitates the installation of the reflectors 300 on the housing 100.

[0033] To prevent the reflector 300 from detaching from the housing 100, in this embodiment, two fixing blocks 140 are provided at each end of the housing 100 in the longitudinal direction. The two fixing blocks 140 are connected to the housing 100 and each at least partially covers the corresponding mounting hole 130. In other words, both ends of each reflector 300 are restrained by the fixing blocks 140 at both ends of the housing 100, thereby preventing the reflector 300 from detaching from the housing 100. It should be noted that the fixing blocks 140 are detachably connected to the housing 100, such as by a snap-fit ​​connection or screw-lock connection, to facilitate subsequent removal and maintenance of the reflector 300.

[0034] In some embodiments, the light source assembly 200 includes a circuit light board 210 and a heat sink 220. The circuit light board 210 is mounted on the heat sink 220, and both ends of the heat sink 220 are connected to the walls of the mounting cavity 110. This allows the circuit light board 210 to dissipate heat more quickly when the light source assembly 200 is in operation for extended periods of time, thereby preventing the circuit light board 210 from generating excessive heat and potentially shortening its service life.

[0035] Furthermore, in this embodiment, at least one ventilation hole 150 is provided on one end surface of the housing 100 facing away from the curing slot 120. The multi-angle curing light source 10 also includes at least one cooling fan 400. Each cooling fan 400 is connected to the housing 100 and positioned at a corresponding ventilation hole 150. The addition of the cooling fans 400 improves air circulation within the mounting cavity 110, thereby accelerating heat dissipation from the heat sink 220 and further accelerating the removal of heat generated by the circuit light board 210 during operation.

[0036] Furthermore, to prevent dust from entering the circuit light board 210 from the silicon wafer 20 while the multi-angle curing light source 10 is operating, thereby reducing the service life of the circuit light board 210, in this embodiment, the light source assembly 200 further includes a mounting bracket 230 and a dustproof glass sheet 240. Both ends of the mounting bracket 230 are connected to the cavity wall of the mounting cavity 110 and are located between the circuit light board 210 and the curing slot 120. The dustproof glass sheet 240 is provided on the mounting bracket 230 to isolate the circuit light board 210 from the curing slot 120. By isolating the circuit light board 210 from the curing slot 120 with the dustproof glass sheet 240, a reduction in the service life of the circuit light board 210 due to excessive dust can be avoided.

[0037] During actual use, glue may be added to the edge of the silicon wafer 20 to bond with various materials such as glass or other silicon wafers 20 to achieve specific technical and application requirements. During the adhesive curing process, the glue will release gases. These gases are mainly released by the raw materials in the glue formula under certain conditions. In order to prevent the gases released by the glue from remaining on the silicon wafer 20, in this embodiment, the surface of the housing 100 is further provided with a vent hole 160 connected to the mounting cavity 110. The multi-angle curing light source 10 also includes an air pump (not shown), and the air supply pipe of the air pump is connected to the vent hole 160. When the air pump is working, it can transfer air from the air supply pipe to the vent hole 160. The air blown out of the vent hole 160 can carry away the gases released by the glue. Furthermore, in this embodiment, an air outlet groove 170 is provided on the end surface of the housing 100 facing away from the vent hole 160. The air outlet groove 170 is connected to the mounting cavity 110. In this way, the gas released from the glue can be pumped from the inside of the installation cavity 110 to the outside of the installation cavity 110 by the air pump.

[0038] In addition, in this embodiment, an air valve 180 is provided between the air delivery pipe of the air pump and the air vent 160 , and the staff can open or close the air valve 180 to open or close the gas.

[0039] Because the thickness of the silicon wafer 20 to be cured varies, it is necessary to limit the position of the silicon wafer 20 when the edge of the silicon wafer 20 extends into the curing groove 120. Therefore, in this embodiment, the multi-angle curing light source 10 further includes a limiting baffle 500. The limiting baffle 500 is slidably mounted on the surface of the housing 100 and is used to slidably cover the curing groove 120. In this way, by adjusting the limiting baffle 500, the silicon wafer 20 can be limited in the thickness direction. In this embodiment, the limit baffle 500 is set in the shape of a long strip, and sliding grooves are set through both ends of the limit baffle 500. The extension direction of the sliding groove is perpendicular to the length direction of the limit baffle 500. The shell 100 is provided with threaded holes at the positions relative to the two sliding grooves. The relative fixation of the limit baffle 500 and the shell 100 can be released or locked by locking the screws with the threaded holes. When the slot width of the curing slot 120 needs to be adjusted, the two screws are loosened, and the position of the limit baffle 500 is slid to adjust. After adjusting to limit the silicon wafer 20, the two screws are tightened again, thereby completing the limitation of the silicon wafer 20 in the thickness direction by the limit baffle 500.

[0040] See also Figure 5 The present invention also provides a light-curing device, which includes a conveyor (not shown) and two multi-angle curing light sources 10. The two multi-angle curing light sources 10 are located on either side of the conveyor. The curing slots 120 of the two multi-angle curing light sources 10 are arranged opposite each other. The conveyor is used to convey the cured wafer, and the ends of the cured wafer extend into the curing slots 120 of the two multi-angle curing light sources 10. The cured wafer can be a silicon wafer 20, a glass plate, or other sheet or plate-like material requiring edge curing, without specific limitation herein.

[0041] With this arrangement, under the action of the conveying device, both edges of the silicon wafer 20 can simultaneously extend into the curing slots 120 of the two oppositely arranged multi-angle curing light sources 10 for light curing, thereby realizing an automated curing process.

[0042] It should be noted that the conveying device can use a synchronous motor to drive a conveyor belt to convey the silicon wafer 20, or use a motor sprocket synchronous roller to convey the silicon wafer 20, or use other mechanisms that can achieve conveyance to convey the silicon wafer 20, which is not specifically limited here.

[0043] The specific structure of the multi-angle curing light source 10 refers to the above embodiment. Since the light curing device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0044] The above description is only part or preferred embodiments of the present invention. Neither the text nor the drawings can limit the scope of protection of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the overall concept of the present invention, or direct / indirect application in other related technical fields are included in the scope of protection of the present invention.

Claims

1. A multi-angle curing light source, characterized in that: The multi-angle curing light source includes: A housing (100) has an installation cavity (110), a surface of the housing (100) is provided with a curing groove (120) connected to the installation cavity (110), and the curing groove (120) is provided through the housing (100) along the length direction of the housing (100); a light source assembly (200), the light source assembly (200) being installed in the installation cavity (110), with the illumination end of the light source assembly (200) facing the notch of the curing through groove (120); Two reflectors (300), the two reflectors (300) are installed in the installation cavity (110) and located on both sides of the light source assembly (200), one end of the two reflectors (300) is adjacent to the light source assembly (200), and the other ends of the two reflectors (300) are extended in a direction close to each other along the illumination direction of the light source assembly (200), and the mirror surfaces of the two reflectors (300) are used to reflect the light emitted by the light source assembly (200).

2. The multi-angle curing light source according to claim 1, characterized in that: The shell (100) is arranged in a long strip shape, the curing groove (120) passes through both ends of the shell (100) in the length direction, and two mounting holes (130) are arranged through both ends of the shell (100) in the length direction, and the two mounting holes (130) are used for plugging and matching with the two reflectors (300).

3. The multi-angle curing light source according to claim 2, characterized in that: Two fixing blocks (140) are provided at both ends of the shell (100) in the length direction. The two fixing blocks (140) are connected to the shell (100) and respectively at least partially cover the corresponding mounting holes (130).

4. The multi-angle curing light source according to claim 1, characterized in that: The light source assembly (200) comprises a circuit light board (210) and a heat sink (220), wherein the circuit light board (210) is mounted on the heat sink (220), and both ends of the heat sink (220) are connected to the cavity wall of the mounting cavity (110).

5. The multi-angle curing light source according to claim 4, characterized in that: The light source assembly (200) further comprises a mounting bracket (230) and a dustproof glass sheet (240), wherein both ends of the mounting bracket (230) are connected to the cavity wall of the mounting cavity (110) and are located between the circuit light board (210) and the curing groove (120), and the dustproof glass sheet (240) is arranged on the mounting bracket (230) to isolate the circuit light board (210) from the curing groove (120).

6. The multi-angle curing light source according to claim 1, characterized in that: At least one ventilation hole (150) is further provided on an end surface of the shell (100) facing away from the curing slot (120), and the multi-angle curing light source further comprises at least one cooling fan (400), each cooling fan (400) being respectively connected to the shell (100) and located at the corresponding ventilation hole (150).

7. The multi-angle curing light source according to claim 1, characterized in that: The surface of the housing (100) is further provided with a vent hole (160) connected to the mounting cavity (110); the multi-angle curing light source further comprises an air pump, and an air delivery pipe of the air pump is connected to the vent hole (160).

8. The multi-angle curing light source according to claim 7, characterized in that: An air outlet groove (170) is provided on an end surface of the housing (100) facing away from the vent hole (160), and the air outlet groove (170) is communicated with the installation cavity (110).

9. The multi-angle curing light source according to claim 1, characterized in that: The multi-angle curing light source further comprises a limiting baffle (500), wherein the limiting baffle (500) is slidably mounted on the surface of the housing (100), and the limiting baffle (500) is used to slidably cover the curing through slot (120).

10. A light curing device, characterized in that: The light curing device includes a conveying device and two multi-angle curing light sources according to any one of claims 1 to 9, the two multi-angle curing light sources are located on both sides of the conveying device, the curing grooves (120) of the two multi-angle curing light sources are arranged opposite to each other, the conveying device is used to convey the cured sheet, and the two ends of the cured sheet extend into the curing grooves (120) of the two multi-angle curing light sources.

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