Tool for repairing SOP packaging device

Abstract

The utility model discloses a tool for repairing an SOP packaging device, which relates to the technical field of electric fitting technology and comprises a T-shaped solder tip, a T-shaped solder tip, a first lead screw, a second lead screw, a third lead screw, a fourth lead screw, a fifth lead screw and a sixth lead screw, and is characterized in that the front end of the T-shaped solder tip is of a flat shovel-shaped structure, and the rear end of the T-shaped solder tip is of a cylindrical structure; the knife edge of the shovel-shaped structure comprises a ladder-shaped structure, so that the T-shaped solder tip is in full contact with a pin of an SOP (Small Outline Package) device; the cylindrical structure is provided with a blind hole, and the blind hole is used for being connected with a heating core of the electric soldering iron. The provided T-shaped soldering bit is used for repairing the SOP packaging device, a local precise heating mode is adopted, a product to be repaired does not need to be baked to remove moisture, the baking time is shortened by 8-48 hours, the repairing period is greatly shortened, the device taking time is about 1 minute per particle, the device taking efficiency is improved by 500%, peripheral devices of the part to be repaired do not need to be protected or are taken first and then welded, redundant actions are reduced, and the cost is reduced. The damage risk is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electrical equipment technology, in particular to a tool for repairing SOP packaged devices. Background Art

[0002] SOP is a surface mount package with pins extending from both sides of the package in a gull-wing shape. The length of the large device can reach about 40mm and it is a humidity-sensitive device.

[0003] When rework of SOP packaged components, due to the large size of the components and the pins on both sides, conventional soldering irons cannot be used to remove them. A dedicated rework station can only be used. The rework station adopts an overall heating method. Before rework, the entire product to be reworked needs to be dehumidified and baked. The baking conditions are 125°C for 8 to 48 hours, and the device removal time is about 6 minutes per piece. During rework, the components around the reworked area also need to be protected or removed first, and then re-soldered after the SOP packaged component is reworked.

[0004] It can be seen that the traditional rework method has a long cycle and low efficiency due to the lack of suitable tools, and cannot meet the requirements of rapid response. Moreover, if the peripheral devices are not properly protected, there is a risk of damage. Utility Model Content

[0005] In view of the above problems, the present invention provides a tool for rework of SOP packaged devices for overcoming the above problems or at least partially solving the above problems.

[0006] The utility model provides the following solutions:

[0007] A tool for rework of SOP packaged devices, comprising:

[0008] A T-shaped soldering iron tip, wherein the front end of the T-shaped soldering iron tip forms a flat shovel-shaped structure, and the rear end of the T-shaped soldering iron tip forms a cylindrical structure;

[0009] The blade of the spade-shaped structure includes a ladder-shaped structure, so that the T-shaped soldering iron tip can fully contact the pins of the SOP package device;

[0010] The cylindrical structure is provided with a blind hole, and the blind hole is used to be connected to the heating core of the electric soldering iron.

[0011] Preferably, the inner diameter of the blind hole is larger than the outer diameter of the heating core at room temperature; and the inner diameter of the blind hole is equal to the outer diameter of the heating core after power is turned on for heating.

[0012] Preferably, an anti-oxidation layer is formed on the outside of the T-shaped soldering iron tip by an electroplating process.

[0013] Preferably, the anti-oxidation layer includes a nickel-plated layer.

[0014] Preferably, the thickness of the nickel plating layer is 6 to 8 microns.

[0015] Preferably, the T-shaped soldering iron tip is made of copper.

[0016] According to the specific embodiments provided by the present invention, the present invention discloses the following technical effects:

[0017] The embodiment of the present application provides a tool for repairing SOP packaged devices, which uses a provided T-shaped soldering iron tip to repair SOP packaged devices. It adopts a local precision heating method. The product to be repaired does not need to be baked to remove moisture, which reduces the baking time by 8 to 48 hours, greatly shortens the repair cycle, and takes about 1 minute per device, which increases the efficiency of taking out devices by 500%. The devices around the part to be repaired do not need to be protected or taken out first and then soldered, which reduces unnecessary actions and reduces the risk of damage.

[0018] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be derived from these drawings without inventive effort.

[0020] Figure 1 This is a top view of a tool for rework of an SOP packaged device provided by an embodiment of the present utility model;

[0021] Figure 2 This is a side view of a tool for rework of SOP packaged devices provided by an embodiment of the present utility model;

[0022] Figure 3 The utility model is a cross-sectional view of a tool for repairing an SOP packaged device provided in an embodiment of the present invention.

[0023] In the figure: a T-shaped soldering iron tip 1, a spade-shaped structure 11, a cutting edge 111, a cylindrical structure 12, and a blind hole 121. DETAILED DESCRIPTION

[0024] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present invention.

[0025] See also Figure 1 , is a SOP package device rework tool provided by the embodiment of the utility model, such as Figure 1 As shown, the tooling may include:

[0026] A T-shaped soldering iron tip 1, wherein the front end of the T-shaped soldering iron tip 1 forms a flat shovel-shaped structure 11, and the rear end of the T-shaped soldering iron tip 1 forms a cylindrical structure 12;

[0027] The blade 111 of the spade-shaped structure 11 includes a ladder-shaped structure, so that the T-shaped soldering iron tip 1 can fully contact the pins of the SOP package device;

[0028] The cylindrical structure 12 is provided with a blind hole 121 , and the blind hole 121 is used to achieve close connection with the heating core of the electric soldering iron.

[0029] The tooling for rework of SOP packaged devices provided in the embodiment of the present application selects metal materials with good thermal conductivity and wear resistance, designs and manufactures a T-shaped soldering iron tip, and installs the soldering iron tip on the electric soldering iron heating core. The temperature is quickly transferred from the electric soldering iron heating core to the cutting edge of the T-shaped soldering iron tip. The cutting edge of the soldering iron tip can simultaneously contact the pins on both sides of the SOP packaged device, thereby achieving synchronous heating and removing the device.

[0030] In order to ensure that the T-shaped soldering iron tip can be smoothly connected to the heating core of the electric soldering iron, and at the same time ensure stability during use after the connection, the embodiment of the present application can provide that the inner diameter of the blind hole 121 is larger than the outer diameter of the heating core at room temperature; the inner diameter of the blind hole 121 is equal to the outer diameter of the heating core after power is turned on for heating.

[0031] To prevent oxidation of the T-shaped soldering iron tip after prolonged use, embodiments of the present application may provide an anti-oxidation layer formed on the exterior of the T-shaped soldering iron tip 1 using an electroplating process. Furthermore, the anti-oxidation layer includes a nickel plating layer. Furthermore, the nickel plating layer has a thickness of 6 to 8 microns.

[0032] In order to improve the electrical conductivity, heating performance and wear resistance of the T-shaped soldering iron tip, the embodiment of the present application may provide that the material of the T-shaped soldering iron tip 1 is copper.

[0033] The T-shaped soldering iron tip provided in the embodiment of the present application is made of copper material with good thermal conductivity and good wear resistance; the front end of the T-shaped soldering iron tip 1 is a flat shovel-shaped structure, and the rear end is a cylindrical shape. Figure 1 、 Figure 2 As shown. The rear cylindrical structure is designed with a blind hole 121 for installing the soldering iron tip. The soldering iron tip blade is designed to be trapezoidal to ensure good contact between the T-shaped soldering iron tip and the SOP package device pins. Figure 3The design of blind hole 121's dimensions is crucial. Its diameter is slightly larger than the heater core's, ensuring the T-shaped tip 1 can be easily installed on the heater core at room temperature. When the soldering iron is powered on, thermal expansion and contraction ensure close contact between the T-shaped tip 1 and the heater core, preventing the tip from falling off and ensuring good heat transfer. The T-shaped tip 1 is electroplated with nickel, with a thickness of 6 to 8 μm, to prevent metal oxidation. After processing, the temperature loss rate of the T-shaped tip is verified, and the soldering iron temperature is set to meet soldering requirements.

[0034] When in use, tin the pins of the device to be repaired; use two "T-shaped" soldering iron tips to heat the pins on both sides of the device at the same time, so that the solder on the pins on both sides of the device melts simultaneously, and remove the device after the tin on the pins melts.

[0035] In summary, the SOP packaged device rework tool provided in this application uses the provided T-shaped soldering iron tip to rework the SOP packaged device, which is a local precision heating method. The product to be repaired does not need to be baked to remove moisture, reducing the baking time by 8 to 48 hours, greatly shortening the rework cycle, and the device retrieval time is about 1 minute per device, and the device retrieval efficiency is increased by 500%. The devices around the part to be repaired do not need to be protected or removed first and then soldered, reducing unnecessary actions and reducing the risk of damage.

[0036] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0037] The above description is only a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention are included in the scope of protection of the present invention.

Claims

1. A tool for rework of SOP packaged devices, characterized in that: include: A T-shaped soldering iron tip, wherein the front end of the T-shaped soldering iron tip forms a flat shovel-shaped structure, and the rear end of the T-shaped soldering iron tip forms a cylindrical structure; The blade of the spade-shaped structure includes a ladder-shaped structure, so that the T-shaped soldering iron tip can fully contact the pins of the SOP package device; The cylindrical structure is provided with a blind hole, and the blind hole is used to be connected to the heating core of the electric soldering iron.

2. The SOP packaged device rework tool according to claim 1, characterized in that: The inner diameter of the blind hole is larger than the outer diameter of the heating core at room temperature; the inner diameter of the blind hole is equal to the outer diameter of the heating core after power is turned on for heating.

3. The SOP packaged device rework tool according to claim 1, characterized in that: The outer portion of the T-shaped soldering iron tip is provided with an anti-oxidation layer by adopting an electroplating process.

4. The SOP packaged device rework tool according to claim 3, characterized in that: The anti-oxidation layer includes a nickel plating layer.

5. The SOP packaged device rework tool according to claim 4, characterized in that: The thickness of the nickel plating layer is 6 to 8 microns.

6. The SOP packaged device rework tool according to claim 1, characterized in that: The material of the T-shaped soldering iron tip is copper.

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