Positioning and fixing adhesive tape for cutting PCB (Printed Circuit Board)

Abstract

The utility model discloses a positioning and fixing adhesive tape for cutting a printed circuit board (PCB), which comprises an annular polyimide (PI) layer, a first acrylic acid adhesive layer coated on the upper end surface of the PI layer and a second acrylic acid adhesive layer coated on the lower end surface of the PI layer, the first acrylic adhesive is provided with a first through hole corresponding to the upper end of the first hole, and the second acrylic adhesive is provided with a second through hole corresponding to the lower end of the first hole. According to the PCB sheet, the PI layer is used as the base material layer to play a supporting role, and the first acrylic acid adhesive layer and the second acrylic acid adhesive layer play a bonding role, so that the PCB is fixed on the sheet, the stability of the PCB in each manufacturing process can be ensured, the problem of transfer of the PCB among the manufacturing processes can also be ensured, and the processing precision of the PCB is effectively ensured. And the whole adhesive tape is annular, so that the efficiency of positioning and bonding the four edges of the PCB is high.

Description

Technical Field

[0001] The utility model relates to the field of adhesive tapes, in particular to a positioning and fixing adhesive tape for cutting PCB boards. Background Art

[0002] PCB boards, or printed circuit boards, are cut into their final shape based on the needs. The cut PCB boards are then coated with a protective layer and tested. Existing PCB boards are fixed with jigs during cutting, but the PCB boards are not necessarily stable on the jigs. Furthermore, the PCBs may experience slight shaking during the transitions between processes. For this reason, many manufacturers have attempted to use tape to secure the PCBs to be processed on special insulating sheets for processing. Existing tapes are in the form of strips, which can only be used to position and bond the four sides of the PCB in batches, resulting in low bonding efficiency. Furthermore, when bonding to the PCB, the edges of the PCB need to be positioned, which can easily lead to the tape being misaligned and scrapped.

[0003] In view of this, it is necessary to provide a positioning and fixing tape for cutting a PCB board. Summary of the Invention

[0004] The utility model provides a positioning and fixing adhesive tape for PCB board cutting, which effectively solves the problems of low efficiency and low accuracy in attaching the existing adhesive tape to the PCB board.

[0005] The technical solution adopted in this utility model is:

[0006] A positioning and fixing tape for cutting PCB boards comprises an annular PI layer, a No. 1 acrylic adhesive layer coated on the upper end surface of the PI layer, and a No. 2 acrylic adhesive layer coated on the lower end surface of the PI layer. The PI layer is provided with through No. 1 holes at each of its four corners. The No. 1 acrylic adhesive layer is provided with a No. 1 through hole corresponding to the upper end of the No. 1 hole, and the No. 2 acrylic adhesive layer is provided with a No. 2 through hole corresponding to the lower end of the No. 1 hole.

[0007] Furthermore, the No. 1 hole is a round hole.

[0008] Furthermore, the thickness of the first acrylic adhesive layer and the second acrylic adhesive layer are both in the range of 0.02 mm to 0.05 mm.

[0009] Furthermore, the diameters of the No. 1 hole, the No. 1 through hole and the No. 2 through hole are all in the range of 2 mm to 5 mm.

[0010] Furthermore, the thickness of the PI layer ranges from 0.015 mm to 0.090 mm.

[0011] The beneficial effects of the utility model include utilizing the PI layer as a base material for support, and using the first and second acrylic adhesive layers for bonding, thereby securing the PCB to the sheet. This ensures the stability of the PCB throughout the various manufacturing processes, while also facilitating transfers between processes and effectively ensuring PCB processing accuracy. Furthermore, the entire tape is loop-shaped, providing efficient positioning and bonding of the four edges of the PCB. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a cross-sectional view of the positioning and fixing tape for PCB board cutting provided in an embodiment of the present application.

[0013] Figure 2 This is an exploded view of the positioning and fixing tape for PCB board cutting provided in an embodiment of the present application in conjunction with the PCB board.

[0014] Markings in the figure are: 1, PI layer; 2, No. 1 acrylic adhesive layer; 3, No. 2 acrylic adhesive layer; 101, No. 1 hole; 201, No. 1 through hole; 301, No. 2 through hole; 100, positioning hole; 4, PCB board; 401, reference hole. DETAILED DESCRIPTION

[0015] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0016] like Figure 1 and Figure 2 As shown, an embodiment of the present application provides a positioning and fixing tape for PCB board cutting, whose structure includes an annular PI layer 1, a No. 1 acrylic adhesive layer 2 coated on the upper end surface of the PI layer 1, and a No. 2 acrylic adhesive layer 3 coated on the lower end surface of the PI layer 1. The four corners of the PI layer 1 are each provided with a through No. 1 hole 101, the No. 1 acrylic adhesive is provided with a No. 1 through hole 201 corresponding to the upper end of the No. 1 hole 101, and the No. 2 acrylic adhesive layer 3 is provided with a No. 2 through hole 301 corresponding to the lower end of the No. 1 hole 101.

[0017] It should be noted that the four corners of the PCB board 4 are provided with reference holes 401. After the PCB board 4 is cut, it needs to be coated with a protective layer and other processes. Hole 101, through hole 101, and through hole 201 together form the positioning hole 100 of the tape of this application.

[0018] In actual use, after aligning the No. 1 through hole 201 with the reference hole 401, the lower end surface of the PCB board 4 is bonded to the No. 1 acrylic adhesive layer 2, and the positioning column on the sheet used to support the PCB board 4 is cooperated so that the positioning column passes through the positioning hole 100 of the tape of this application, and then the No. 2 acrylic adhesive layer 3 is bonded to the sheet selected on the PCB board 4 production line.

[0019] In this design, PI layer 1 serves as a base material for support, while acrylic adhesive layers 2 and 3 provide bonding, securing PCB 4 to the sheet. This ensures the stability of PCB 4 throughout the various manufacturing processes and facilitates transfer between processes, effectively guaranteeing the processing accuracy of PCB 4. Furthermore, the entire tape is in a loop, providing efficient positioning and bonding of all four sides of PCB 4.

[0020] Specifically: the No. 1 hole 101 is a round hole.

[0021] In the above design, hole No. 101 is a circular hole, and through hole No. 1 201 and through hole No. 2 301 correspond to the upper and lower ends of hole No. 1 101 respectively. Therefore, through hole No. 1 201 and through hole No. 2 301 are also circular holes, which can effectively position with the PCB.

[0022] Specifically, the thickness of the first acrylic adhesive layer 2 and the second acrylic adhesive layer 3 are both in the range of 0.02 mm to 0.05 mm.

[0023] In the above design, the thickness of the first acrylic adhesive layer 2 and the second acrylic adhesive layer 3 is set to 0.02mm~0.05mm, and the temperature resistance can meet 260℃ / 30min without yellowing, brittleness or loss of adhesion. The thickness of a single layer can be 0.02-0.05mm, and the peel force is greater than 1000gf / inch.

[0024] Specifically, the diameters of the No. 1 hole 101 , the No. 1 through hole 201 and the No. 2 through hole 301 are all in the range of 2 mm to 5 mm.

[0025] Specifically, the thickness of the PI layer 1 ranges from 0.015 mm to 0.090 mm.

[0026] In the above design, PI is the base material, which has certain strength and support. The tensile strength is greater than 50MPa, and the elastic modulus can reach 3GPa. It can effectively meet the strength requirements at a thickness of 0.015mm to 0.090mm.

[0027] To further explain in detail, it should be understood that the above is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A positioning and fixing tape for PCB board cutting, characterized by: The invention comprises an annular PI layer (1), a No. 1 acrylic adhesive layer (2) coated on the upper end surface of the PI layer (1), and a No. 2 acrylic adhesive layer (3) coated on the lower end surface of the PI layer (1), wherein the four corners of the PI layer (1) are each provided with a No. 1 through hole (101), the No. 1 acrylic adhesive is provided with a No. 1 through hole (201) corresponding to the upper end of the No. 1 hole (101), and the No. 2 acrylic adhesive layer (3) is provided with a No. 2 through hole (301) corresponding to the lower end of the No. 1 hole (101).

2. The positioning and fixing tape for PCB board cutting according to claim 1, characterized in that: The No. 1 hole (101) is a round hole.

3. The positioning and fixing tape for PCB board cutting according to claim 1, characterized in that: The thickness of the first acrylic adhesive layer (2) and the second acrylic adhesive layer (3) both range from 0.02 mm to 0.05 mm.

4. The positioning and fixing tape for PCB board cutting according to claim 1, characterized in that: The diameters of the No. 1 hole (101), the No. 1 through hole (201) and the No. 2 through hole (301) are all in the range of 2 mm to 5 mm.

5. The positioning and fixing tape for PCB board cutting according to claim 1, characterized in that: The thickness of the PI layer (1) ranges from 0.015 mm to 0.090 mm.

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